Electronic equipment

Abstract

The utility model belongs to the field of electronic equipment, and discloses electronic equipment which comprises a shell, a rear cover, gum and a heating piece. The rear cover is arranged on the shell in a covering manner; the back glue is adhered between the shell and the rear cover; and the heating piece is arranged between the shell and the back adhesive or between the back adhesive and the rear cover and is used for heating the back adhesive. According to the utility model, the heating element is arranged between the back adhesive and the shell or between the back adhesive and the rear cover, the heating element can heat the back adhesive, when the electronic equipment needs to be maintained, the back adhesive can be heated through the heating element, so that the viscosity is reduced after the back adhesive is softened, the rear cover can be easily detached from the shell after the back adhesive is softened, and the maintenance cost is reduced. According to the invention, the self-dismounting function of the electronic equipment is realized, so that the electronic equipment is changed from a manner of dismounting the electronic equipment by using specific heating equipment into a simple manner that the electronic equipment can be dismounted by a user, and the convenience of dismounting and maintaining the electronic equipment by an individual user is improved.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment technology, and more particularly to an electronic device. Background Technology

[0002] Electronic devices are electrical devices composed of electronic components. They generally include a front casing, a back cover, and the electronic components. The electronic components are housed within the cavity formed by the front casing and the back cover, which are typically bonded together with adhesive. When repairing electronic devices, the adhesive needs to be heated to remove the back cover. Currently, when disassembling electronic devices for repair, professionals need to use specific heating equipment to soften the adhesive and reduce its stickiness before disassembly. This disassembly method does not meet the latest EU regulations requiring mobile devices to be self-disassembly and self-repairable. Therefore, it is necessary to design an electronic device that can achieve self-disassembly. Utility Model Content

[0003] The purpose of this application is to provide an electronic device with a self-disassembling back cover to improve the convenience of personal repair for users.

[0004] The technical solution provided in this application is as follows:

[0005] An electronic device, comprising:

[0006] case;

[0007] The rear cover is fitted onto the housing.

[0008] Adhesive backing is used to bond the housing and the back cover together.

[0009] A heating element is disposed between the housing and the adhesive backing or between the adhesive backing and the back cover, for heating the adhesive backing.

[0010] In some embodiments, the adhesive backing and the heating element are both frame-shaped structures, and the heating element is positioned directly opposite the adhesive backing.

[0011] In some embodiments, the width of each side of the heating element is smaller than the width of each side corresponding to the adhesive backing.

[0012] In some embodiments, a motherboard is also included, the motherboard being disposed on the side of the housing away from the rear cover;

[0013] The heating element is electrically connected to the main board.

[0014] In some embodiments, a battery is also included, and the housing has a mounting hole that extends through the housing along the direction from the motherboard to the rear cover, and the battery is disposed in the mounting hole and electrically connected to the motherboard.

[0015] In some embodiments, the housing includes a base plate and a frame, the frame being arranged around the edge of the base plate, and a first chamber being formed on one side of the base plate and a second chamber being formed on the other side of the base plate. The heating element and the adhesive backing are sequentially disposed on the base plate and located within the first chamber, and the rear cover is disposed on the first chamber.

[0016] The motherboard is disposed in the second cavity, and the mounting holes are disposed on the base plate.

[0017] In some embodiments, the base plate has a mounting groove on the side near the first chamber, the mounting groove is arranged along the circumference of the base plate, and the heating element is disposed in the mounting groove.

[0018] In some embodiments, the projection of the heating element on the base plate does not coincide with the projection of the motherboard on the base plate.

[0019] In some embodiments, the base plate is provided with a through hole, and the heating element is provided with an electrical connection portion, which passes through the through hole and is electrically connected to the main board.

[0020] In some embodiments, the heating element is a conductive copper film.

[0021] The technical advantage of this application is that a heating element is provided between the adhesive backing and the housing or between the adhesive backing and the back cover. The heating element can heat the adhesive backing. When the electronic device needs to be repaired, the adhesive backing can be heated by the heating element to soften it and reduce its stickiness. After the adhesive backing is softened, the back cover can be more easily removed from the housing, realizing the self-disassembly function of the electronic device. This transforms the way electronic devices are disassembled from a method that requires specific heating equipment to a simple method that users can disassemble themselves, thereby improving the convenience of disassembly and repair for individual users. Attached Figure Description

[0022] The present application will be further described in detail below with reference to the accompanying drawings and specific embodiments:

[0023] Figure 1 This is an exploded view of an electronic device provided in a specific embodiment of this application;

[0024] Figure 2 This is a schematic diagram of the structure of an electronic device from one perspective, provided in a specific embodiment of this application;

[0025] Figure 3 yes Figure 2 A schematic diagram of the electronic device shown after the back cover has been removed;

[0026] Figure 4 yes Figure 3A schematic diagram of the electronic device shown after the adhesive backing has been removed;

[0027] Figure 5 yes Figure 4 Enlarged view of point A in the middle;

[0028] Figure 6 yes Figure 4 A partial structural diagram of the electronic device shown in the image after the heating element has been removed;

[0029] Figure 7 This is a schematic diagram of the structure of an electronic device provided in a specific embodiment of this application from another perspective.

[0030] Explanation of icon numbers:

[0031] 100. Housing; 101. Mounting hole; 102. First chamber; 103. Second chamber; 110. Base plate; 111. Mounting groove; 120. Frame; 200. Back cover; 300. Adhesive backing; 400. Heating element; 410. Electrical connection part; 500. Main board; 600. Battery. Detailed Implementation

[0032] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application can also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0033] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the specific implementation methods of this application will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without creative effort.

[0034] To keep the drawings concise, each drawing only schematically shows the parts relevant to this application, and they do not represent the actual structure of the product. Furthermore, for ease of understanding, in some drawings, only one of the components with the same structure or function is schematically shown, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one."

[0035] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0036] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; or they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0037] In the embodiments shown in the accompanying drawings, the directional indications (such as up, down, left, right, front, and back) are relative rather than absolute when describing the structure and movement of the various components, and are not intended to limit the direction of the product during actual use.

[0038] Furthermore, in the description of this application, ordinal numbers, such as "first" and "second," are used only to distinguish related objects and should not be construed as indicating or implying the relative importance or order between related objects.

[0039] In one or more embodiments, this disclosure provides an electronic device. Specifically, the electronic device may be a type of electronic device with a screen, such as a mobile phone, tablet computer, e-reader, laptop computer, cash register, etc.

[0040] In this embodiment, as Figure 1 and Figure 2 As shown, the electronic device includes a housing 100, a back cover 200, an adhesive backing 300, and a heating element 400; the back cover 200 is disposed on the housing 100; the adhesive backing 300 is bonded between the housing 100 and the back cover 200; the heating element 400 is disposed between the housing 100 and the adhesive backing 300 or between the adhesive backing 300 and the back cover 200, and is used to heat the adhesive backing 300.

[0041] The housing 100 is a component used to protect and house the internal electronic components of an electronic device. In this embodiment, the housing 100 is in the shape of a rectangular plate. Of course, in other examples, the housing 100 can also be a square plate, an oblong plate, an elliptical plate, or an irregularly shaped plate. The material of the housing 100 includes, but is not limited to, metal, ceramic, plastic, and any combination of these materials.

[0042] The back cover 200 is fixed to the housing 100 by adhesive 300 to protect the internal electronic components. The material of the back cover 200 includes, but is not limited to, metal, ceramic, plastic, and any combination of these materials. In this embodiment, the material of the back cover 200 may be the same as or different from that of the housing 100.

[0043] In one example, such as Figures 3 to 5As shown, the heating element 400 is located between the adhesive backing 300 and the housing 100. The heating element 400 is positioned corresponding to the adhesive backing 300 and can heat the adhesive backing 300 to soften it. In another example, the heating element 400 can also be positioned between the adhesive backing 300 and the back cover 200, and the heating element 400 can also heat the adhesive backing 300 to soften it.

[0044] In this embodiment, the heating element 400 is a device that generates heat when energized. The heating element 400 can be filamentous or film-like, for example, a heating wire or a heating film. The materials of the heating element 400 include, but are not limited to, graphene, carbon nanotubes, carbon fibers, graphite, metals, and nanomaterials for electrothermal heating. Preferably, in this embodiment, the heating element 400 is a conductive copper film. Conductive copper films not only possess high conductivity, good flexibility, good plasticity, and strong stability, but also have low cost. Applying conductive copper films as heating elements 400 in electronic devices not only has little impact on the cost of the electronic devices but also provides good stability and improves service life.

[0045] Understandably, in this embodiment, the heating element 400 only covers a portion of the area of ​​the adhesive 300 near the housing 100. The area of ​​the adhesive 300 near the housing 100 that is not covered by the heating element 400 needs to be bonded to the housing 100 so that the adhesive 300 can be firmly connected to the housing 100. The other side of the adhesive 300 is bonded to the back cover 200, thereby achieving the bonding of the back cover 200 to the housing 100.

[0046] In this embodiment, the heating element 400 is not working when the electronic device is operating normally. When the electronic device needs repair, the heating element 400 can be triggered by pre-designed software within the electronic device. The heating element 400 heats the adhesive 300, softening it and reducing its stickiness. After the adhesive 300 softens, the back cover 200 can be easily removed from the housing 100, realizing the self-disassembly function of the electronic device. This transforms the disassembly of the electronic device from one requiring specific heating equipment to one that can be easily disassembled by the user. It also meets the latest design requirements of the European Union for mobile phones / tablets and other electronic devices, which require users to be able to disassemble and repair them themselves, thus improving the convenience of disassembly and repair for individual users.

[0047] In some embodiments, such as Figure 3 and Figure 4As shown, the adhesive 300 and the heating element 400 are both frame-shaped structures, with the heating element 400 positioned directly opposite the adhesive 300. Both the heating element 400 and the adhesive 300 are frame-shaped structures; for example, if both are rectangular frames, the heating element 400 may include four sides connected end-to-end, and the adhesive 300 also includes four sides connected end-to-end. These four sides can surround the perimeter of the housing 100, preventing interference between the heating element 400 and other electronic components within the electronic device, thus avoiding interference with the normal operation of other electronic components during heating. The heating element 400's position directly opposite the adhesive 300 allows for uniform heating of the adhesive 300, ensuring even heating and facilitating better disassembly.

[0048] The heating element 400 can be a rectangular frame, a circular frame, an elliptical frame, a square frame, etc. Similarly, the adhesive backing 300 can also be a rectangular frame, a circular frame, an elliptical frame, a square frame, etc. It is understood that in this embodiment, the shape of the heating element 400 is the same as the shape of the adhesive backing 300. When the heating element 400 heats the adhesive backing 300, it can heat every area of ​​the adhesive backing 300, making the adhesive backing 300 more evenly heated, thus enabling a more convenient disassembly operation.

[0049] Furthermore, the width of each side of the heating element 400 is smaller than the width of each corresponding side of the adhesive 300, so that each side of the heating element 400 only covers a portion of the corresponding area of ​​the adhesive 300. This allows the area of ​​the adhesive 300 not covered by the heating element 400 to still form a complete frame structure, ensuring that the adhesive 300 and the housing 100 are still bonded through this complete frame structure. This not only improves the bonding strength and stability between the adhesive 300 and the housing 100, ensuring a firm connection between the back cover 200 and the housing 100, but also provides dust and water protection, preventing dust or moisture from entering the electronic device through gaps between the back cover 200 and the housing 100 and affecting the normal operation of electronic components. Optionally, the heating element 400 can be positioned in the middle of the adhesive 300 to avoid it being located at the edge of the adhesive 300, which would affect the bonding strength between the adhesive 300 and the housing 100.

[0050] In some embodiments, such as Figure 1 and Figure 7As shown, the electronic device also includes a motherboard 500, which is located on the side of the housing 100 away from the back cover 200. The heating element 400 is electrically connected to the motherboard 500. The motherboard 500 is a printed circuit board and can be a single-layer, double-layer, or multi-layer design to adapt to different functional requirements and complexity. The motherboard 500 not only controls the normal operation of various electronic components within the electronic device but also controls the operation of the heating element 400, enabling the heating element 400 to heat the adhesive 300 and, after heating the adhesive 300, to stop operating. Furthermore, the heating element 400 is provided with an electrical connection part 410, and the housing 100 has a through hole through which the electrical connection part 410 passes and is electrically connected to the motherboard 500. The electrical connection part 410 can be a wire, conductive sheet, etc.

[0051] Furthermore, such as Figure 1 As shown, the electronic device also includes a battery 600. A mounting hole 101 is provided on the housing 100, extending through the housing 100 from the motherboard 500 to the rear cover 200. The battery 600 is disposed within the mounting hole 101 and electrically connected to the motherboard 500, providing power to the motherboard 500 to ensure its normal operation. Because the battery 600 is installed in the mounting hole 101 on the housing 100, the battery 600 can be easily removed from the housing 100 after the rear cover 200 is removed, allowing for battery replacement.

[0052] In some embodiments, such as Figure 3 , Figure 4 and Figure 7 As shown, the housing 100 includes a base plate 110 and a frame 120. The frame 120 is arranged around the edge of the base plate 110, and a first chamber 102 is formed on one side of the base plate 110, and a second chamber 103 is formed on the other side of the base plate 110. The heating element 400 and the adhesive backing 300 are sequentially arranged on the base plate 110 and located in the first chamber 102. The rear cover 200 is arranged on the first chamber 102. The main board 500 is arranged in the second chamber 103, and the mounting hole 101 is arranged on the base plate 110.

[0053] The first chamber 102 is used to accommodate the heating element 400, the adhesive backing 300, and the back cover 200. The second chamber 103 is used to install the motherboard 500 and electronic components of the electronic device. The screen assembly of the electronic device is mounted on the second chamber 103. The base plate 110 is provided with a mounting hole 101 for installing the battery 600. The size of the mounting hole 101 is adapted to the size of the battery 600. After the back cover 200 is removed from the housing 100, the battery 600 can be removed from the mounting hole 101 of the base plate 110, so as to facilitate the convenient removal and placement of the battery 600.

[0054] Furthermore, such as Figure 6As shown, a mounting groove 111 is provided on the side of the base plate 110 near the first chamber 102. The mounting groove 111 is arranged around the circumference of the base plate 110, and the heating element 400 is disposed in the mounting groove 111. The shape of the mounting groove 111 is the same as the shape of the heating element 400. The width of each side of the mounting groove 111 is adapted to the width of the corresponding side of the heating element 400. The thickness of the heating element 400 can be the same as the depth of the mounting groove 111. After the heating element 400 is installed in the mounting groove 111, the bottom surface of the heating element 400 is in contact with the inner bottom wall of the mounting groove 111, and the top surface of the heating element 400 can be flush with the surface of the base plate 110 so that the heating element 400 does not protrude from the surface of the base plate 110. When the adhesive 300 is installed on the mounting groove 111, it spans across both sides of the mounting groove 111 and contacts the heating element 400. The heating element 400 does not protrude from the surface of the base plate 110, which allows the adhesive 300 to remain flat, thereby increasing the contact area between the adhesive 300 and the base plate 110, and thus increasing the bonding strength between the adhesive 300 and the base plate 110.

[0055] Furthermore, the projection of the heating element 400 on the base plate 110 does not overlap with the projection of the motherboard 500 on the base plate 110 at all. That is, the heating element 400 is arranged around the outside of the motherboard 500, and there is no area on the motherboard 500 opposite to the heating element 400. This ensures that when the heating element 400 heats the adhesive 300, the heat from the heating element 400 will not be excessively conducted to the motherboard 500, so as to avoid the motherboard 500 overheating and affecting the normal operation of the electronic components on the motherboard 500, thereby improving the service life of the electronic equipment.

[0056] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0057] It should be noted that the above embodiments can be freely combined as needed. The above description is only a preferred embodiment of this application. It should be pointed out that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the protection scope of this application.

Claims

1. An electronic device, characterized in that, include: case; The rear cover is installed on the housing. Adhesive backing is used to bond the housing and the back cover together. A heating element is disposed between the housing and the adhesive backing or between the adhesive backing and the back cover, for heating the adhesive backing.

2. The electronic device according to claim 1, characterized in that, The adhesive backing and the heating element are both frame-shaped structures, and the heating element is positioned directly opposite the adhesive backing.

3. An electronic device according to claim 2, characterized in that, The width of each side of the heating element is less than the width of each side of the corresponding adhesive.

4. An electronic device according to any one of claims 1-3, characterized in that, It also includes a motherboard, which is disposed on the side of the housing away from the rear cover; The heating element is electrically connected to the main board.

5. An electronic device according to claim 4, characterized in that, It also includes a battery, and the housing has a mounting hole that extends through the housing along the direction from the motherboard to the rear cover. The battery is disposed in the mounting hole and is electrically connected to the motherboard.

6. An electronic device according to claim 5, characterized in that, The housing includes a base plate and a frame. The frame is arranged around the edge of the base plate and forms a first chamber on one side of the base plate and a second chamber on the other side of the base plate. The heating element and the adhesive backing are sequentially arranged on the base plate and located in the first chamber. The back cover is arranged on the first chamber. The motherboard is disposed in the second cavity, and the mounting holes are disposed on the base plate.

7. An electronic device according to claim 6, characterized in that, The base plate has a mounting groove on the side near the first chamber, the mounting groove is arranged along the circumference of the base plate, and the heating element is disposed in the mounting groove.

8. An electronic device according to claim 6, characterized in that, The projection of the heating element on the base plate does not coincide with the projection of the main board on the base plate.

9. An electronic device according to claim 6, characterized in that, The base plate has a through hole, and the heating element has an electrical connection part, which passes through the through hole and is electrically connected to the main board.

10. An electronic device according to claim 1, characterized in that, The heating element is a conductive copper film.

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