Heat dissipation plate structure and electronic product

Abstract

The utility model discloses a heat dissipation plate structure and an electronic product, and relates to the technical field of electronic products, the heat dissipation plate structure comprises a plate body and a protrusion arranged on the plate body, and a groove is formed in one side, opposite to the plate body, of the protrusion.

Description

Technical Field

[0001] This utility model relates to the field of electronic product technology, and in particular to a heat sink structure and an electronic product. Background Technology

[0002] During the use of electronic products, some components generate heat, thus requiring heat dissipation. Different components have different heat dissipation requirements. Taking speakers as an example, in related technologies, the IC chip on the speaker amplifier board generates a significant amount of heat. Typically, a heat sink is installed to assist in heat dissipation. At the same time, a thermally conductive medium such as thermally conductive silicone or thermally conductive oil is placed between the chip and the heat sink to conduct heat and ensure heat dissipation efficiency. However, the contact surface between the existing heat sink and the thermally conductive medium is usually flat, resulting in limited heat conduction efficiency. Utility Model Content

[0003] The main purpose of this invention is to propose a heat sink structure and electronic product, which aims to increase the contact area between the heat sink structure and the heat-conducting medium and improve the heat transfer efficiency.

[0004] To achieve the above objectives, the heat dissipation plate structure proposed in this utility model includes a plate body and a protrusion provided on the plate body, wherein a groove is formed on the side of the protrusion facing away from the plate body.

[0005] This utility model also proposes an electronic product, which includes the heat sink structure described above. Attached Figure Description

[0006] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0007] Figure 1 A schematic diagram of an embodiment of the heat sink structure provided by this utility model;

[0008] Figure 2 for Figure 1 A schematic diagram of the structure of one embodiment of the central protrusion.

[0009] Explanation of icon numbers:

[0010] 100. Heat sink structure; 1. Plate body; 2. Protrusion; 21. First groove; 22. Second groove; 23. Connecting groove; 3. Connecting part; 4. Heat sink; 41. Heat dissipation hole.

[0011] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0012] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0013] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0014] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0015] This utility model proposes a heat sink structure 100.

[0016] Please see Figure 1 and Figure 2 In one embodiment of the present invention, the heat sink structure 100 includes a plate body 1 and a protrusion 2 provided on the plate body 1, and a groove is formed on the side of the protrusion 2 facing away from the plate body 1.

[0017] The material of the plate body 1 is aluminum, which is a material with high thermal conductivity. Its high thermal conductivity coefficient means that the plate body 1 can quickly absorb the heat transferred by the heat transfer medium and then dissipate it into the surrounding environment. Aluminum has a relatively low density. Using aluminum as the material of the plate body 1 can reduce the weight of electronic products that use heat sink structure 100, which helps to improve the portability of electronic products. In addition, aluminum has a low manufacturing cost.

[0018] The protrusions 2 on the plate body 1 are formed by a stamping process. The stamping process can be continuously produced with high production efficiency. It also facilitates the production of protrusions 2 of different shapes to suit different application scenarios.

[0019] The groove on protrusion 2 is also formed by a stamping process.

[0020] In the technical solution of this utility model, after the board body 1 is installed on the heat-generating component of the electronic product, a heat dissipation medium is filled between the board body 1 and the heat-generating component. Since a protrusion 2 is provided on the board body 1, the sidewall of the protrusion 2 can contact the heat-conducting medium, thereby increasing the contact area between the heat dissipation plate structure 100 and the heat-conducting medium and improving heat conduction efficiency. Furthermore, a groove is formed on the side of the protrusion 2 facing away from the board body 1. The groove increases the contact area between the protrusion 2 and the heat-conducting medium, further increasing the contact area between the heat dissipation plate structure 100 and the heat-conducting medium and improving heat conduction efficiency.

[0021] To enhance heat dissipation, please refer to one embodiment of this utility model. Figure 1 The heat sink structure 100 includes at least two protrusions 2, each protrusion 2 located on the same side of the plate body 1. The sidewall of each protrusion 2 can contact the heat-conducting medium. More protrusions 2 mean a larger contact area between the heat sink structure 100 and the heat-conducting medium, resulting in higher heat transfer efficiency. The number of protrusions 2 can also accommodate different types of heat-generating components. For example, when the heat-generating points of the component are evenly distributed, the protrusions 2 can be evenly distributed on the plate body 1; when the heat-generating points are concentrated, most of the protrusions 2 can be located at the same end of the plate body 1, and then installed corresponding to the heat-generating points of the component, thus ensuring the heat dissipation effect of the heat sink structure 100. Furthermore, an increase in the number of protrusions 2 corresponds to a greater number of grooves, further increasing the contact area between the heat sink structure 100 and the heat-conducting medium and improving heat transfer efficiency.

[0022] Furthermore, in one embodiment of this utility model, please refer to... Figure 2 The protrusion 2 has multiple grooves, each groove communicating with at least one other groove. The increased number of grooves increases the contact area between the protrusion 2 and the heat-conducting medium, thus increasing the contact area between the heat sink structure 100 and the heat-conducting medium, further improving heat transfer efficiency. Furthermore, since each groove communicates with at least one other groove, multiple grooves form a conductive network. After the plate body 1 is installed, the heat-conducting medium between the plate body 1 and the heat-generating component can flow through any groove to other grooves, ensuring that each groove is filled with heat-conducting medium. This allows the heat dissipated by the heat-generating component to be better transferred to the plate body 1 through the heat-conducting medium and then dissipated into the surrounding environment, ensuring efficient heat dissipation.

[0023] Specifically, in one embodiment of this utility model, please refer to Figure 2 The plurality of grooves includes at least two first grooves 21 and at least two second grooves 22. Each first groove 21 extends along a first direction, and each second groove 22 extends along a second direction. The first and second directions are perpendicular, and each first groove 21 communicates with each second groove 22. By designing the plurality of grooves as first grooves 21 extending along the first direction and second grooves 22 extending along the second direction, the plurality of grooves can fill the entire side of the protrusion 2 facing away from the plate body 1 as much as possible. This maximizes the utilization of the area of ​​the side of the protrusion 2 facing away from the plate body 1, thereby maximizing heat dissipation efficiency. Furthermore, both the first grooves 21 and the second grooves 22 extend along a single direction, making it easy to obtain the first grooves 21 and the second grooves 22 through a stamping process, facilitating production. In other embodiments, the plurality of grooves can also be designed to extend along three different directions, or can be configured as grooves of other shapes, such as arc-shaped grooves.

[0024] Furthermore, in one embodiment of this utility model, please refer to... Figure 2 A connecting groove 23 is formed on the protrusion 2, surrounding each first groove 21 and each second groove 22. Both ends of each first groove 21 are connected to the connecting groove 23, and both ends of each second groove 22 are connected to the connecting groove 23. By setting the connecting groove 23, the two ends of each first groove 21 and the two ends of each second groove 22 can be connected. Thus, after the plate body 1 is installed, the heat-conducting medium between the plate body 1 and the heating element can flow not only from the first groove 21 to the second groove 22 through the connection between the first groove 21 and the second groove 22, but also from the end of the first groove 21 to the connecting groove 23, and then from the connecting groove 23 to another first groove 21 or second groove 22. This ensures that the connecting groove 23, the first groove 21, and the second groove 22 can all be filled with heat-conducting medium, allowing the heat dissipated by the heating element to be better transferred to the plate body 1 through the heat-conducting medium and then dissipated into the surrounding environment, ensuring efficient heat dissipation. The connecting groove 23 can be either a circular groove or a square groove. In this embodiment, considering the convenience of heat transfer medium flow, the connecting groove 23 is set as a circular groove.

[0025] To facilitate the filling of the heat-conducting medium, in one embodiment of this utility model, please refer to... Figure 1The protrusion 2 has a top surface and four side surfaces connected in sequence. The top surface is connected to each of the four side surfaces by an arc transition, and the four side surfaces are connected to the plate body 1 by an arc transition. Thus, when the plate body 1 is connected to the heating element, the protrusion 2 on the plate body 1 will compress the heat-conducting medium. The heat-conducting medium will then come into contact with the top surface of the protrusion 2, the side surfaces of the protrusion 2, and the plate body 1. By setting the top surface to be connected to each of the four side surfaces by an arc transition, and the four side surfaces to be connected to the plate body 1 by an arc transition, the heat-conducting medium can easily pass through the top surface and side surfaces of the protrusion 2 to contact the plate body 1. This allows the heat-conducting medium to effectively fill the space between the plate body 1 and the heating element, and the heat dissipated by the heating element can be better transferred to the plate body 1 through the heat-conducting medium and then dissipated into the surrounding environment, ensuring efficient heat dissipation. In another embodiment of this invention, the protrusion 2 has a top surface and a circumferential surface. The top surface is connected to the circumferential surface by an arc transition, and the circumferential surface is connected to the plate body 1 by an arc transition. Similarly, the heat-conducting medium can easily contact the plate body 1 through the top surface and circumferential surface of the protrusion 2, so that the heat-conducting medium can fill the space between the plate body 1 and the heat-generating component. The heat dissipated by the heat-generating component can be better transferred to the plate body 1 through the heat-conducting medium and then dissipated into the surrounding environment, ensuring heat dissipation efficiency.

[0026] Furthermore, in one embodiment of this utility model, please refer to... Figure 1 The heat sink structure 100 also includes two connecting parts 3, which are located on the same side of the plate body 1. The two connecting parts 3 and the plate body 1 enclose and form a receiving groove for accommodating the heat-conducting medium. The protrusion 2 is located within the receiving groove. The plate body 1 is connected to the heat-generating component through the two connecting parts 3. After the plate body 1 is connected to the heat-generating component, the two connecting parts 3 and the plate body 1 enclose and form the receiving groove, which reduces the gap between the plate body 1 and the heat-generating component. This ensures that the heat-conducting medium is concentrated between the plate body 1 and the heat-generating component, thus guaranteeing heat conduction efficiency.

[0027] To improve heat dissipation, please refer to one embodiment of this utility model. Figure 1 The heat sink structure 100 also includes heat sink 4, which is located on the side of the plate body 1 facing away from the protrusion 2. The design of the heat sink 4 increases the contact area between the heat sink structure 100 and the surrounding environment, thereby improving heat dissipation efficiency. In addition, the heat sink 4 can also work with a cooling fan to accelerate the dissipation of heat from the surface of the heat sink 4 through airflow. The number of heat sinks 4 can be two, three, or more, depending on the actual usage requirements.

[0028] Furthermore, in one embodiment of this utility model, please refer to... Figure 1The heat sink 4 is provided with multiple heat dissipation holes 41, which are spaced apart along the length of the plate body 1. The arrangement of heat dissipation holes 41 can further increase the surface area of ​​the heat sink 4, thereby improving the heat dissipation efficiency; the spaced arrangement of multiple heat dissipation holes 41 can make the heat dissipation points of the heat sink 4 more uniform and can reduce the weight of the heat sink 4.

[0029] This utility model also proposes an electronic product, which includes the above-mentioned heat sink structure 100. The specific structure of the heat sink structure 100 is as described in the above embodiments. Since this electronic product adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0030] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A heat sink structure, characterized in that, It includes a plate body and a protrusion provided on the plate body, wherein a groove is formed on the side of the protrusion facing away from the plate body; The heat sink structure includes at least two protrusions, each of which is located on the same side of the plate body.

2. The heat sink structure as described in claim 1, characterized in that, The protrusion has a plurality of grooves formed thereon, and each groove communicates with at least one other groove.

3. The heat sink structure as described in claim 2, characterized in that, The plurality of grooves include at least two first grooves and at least two second grooves, each of the first grooves extending along a first direction and each of the second grooves extending along a second direction; Wherein, the first direction and the second direction are perpendicular, and each of the first grooves is connected to each of the second grooves.

4. The heat sink structure as described in claim 3, characterized in that, A connecting groove is formed on the protrusion, the connecting groove is arranged around each of the first grooves and each of the second grooves, the two ends of each of the first grooves are respectively connected to the connecting groove, and the two ends of each of the second grooves are respectively connected to the connecting groove.

5. The heat sink structure as described in any one of claims 1 to 4, characterized in that, The protrusion has a top surface and four side surfaces connected in sequence. The top surface is connected to each of the four side surfaces by an arc transition, and the four side surfaces are connected to the plate body by an arc transition; or The protrusion has a top surface and a circumferential surface, the top surface and the circumferential surface are connected by an arc transition, and the circumferential surface is connected by an arc transition to the plate body.

6. The heat sink structure as described in any one of claims 1 to 4, characterized in that, The heat sink structure also includes two connecting parts, which are located on the same side of the plate body. The two connecting parts and the plate body together form a receiving groove, which is used to receive the heat-conducting medium. The protrusion is located in the receiving groove.

7. The heat sink structure as described in any one of claims 1 to 4, characterized in that, The heat sink structure also includes heat sinks, which are located on the side of the plate body facing away from the protrusion.

8. The heat sink structure as described in claim 7, characterized in that, The heat sink has multiple heat dissipation holes, which are spaced apart along the length of the plate body.

9. An electronic product, characterized in that, Includes the heat sink structure as described in any one of claims 1 to 8.

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