Shielding heat dissipation structure and aerosol generating device

Abstract

The utility model discloses a shielding heat dissipation structure and an aerosol generating device, and relates to the technical field of product heat dissipation, the shielding heat dissipation structure comprises a housing, a mounting support, a circuit board assembly and a shielding heat dissipation fin, the housing is provided with a cavity; the mounting bracket is arranged in the accommodating cavity; the circuit board assembly comprises a main board and an adapter plate, the main board and the adapter plate are respectively arranged on two opposite sides of the mounting bracket, and the adapter plate is in heat conduction connection with the main board; the shielding cooling fin is arranged on the side, back to the installation support, of the main board, and the side, back to the main board, of the shielding cooling fin is connected with one side wall of the containing cavity.

Description

TECHNICAL FIELD

[0001] The utility model relates to product heat dissipation technical field, especially shield heat dissipation structure and aerosol generating device. BACKGROUND

[0002] In the existing aerosol generating device and other consumer electronics, in order to guarantee the function stability and electromagnetic radiation safety of product, usually need to carry out heat dissipation and shielding treatment to circuit board.In related art, shielding fin is usually arranged on one side of circuit board, and the heat generated by the heat chip on the circuit board is conducted to the external environment through the shielding fin, but the shielding fin is usually arranged on one side of the circuit board, which is not efficient enough to conduct and dissipate heat from the heat chip, affecting product performance. SUMMARY

[0003] The utility model discloses a shielding heat dissipation structure and aerosol generating device, which aims to improve the heat dissipation and shielding effect of the structure.

[0004] To achieve the above object, the shielding heat dissipation structure provided by the utility model comprises:

[0005] A housing is provided with a cavity;

[0006] A mounting bracket is arranged in the cavity;

[0007] A circuit board assembly comprises a main board and a adapter board, the main board and the adapter board are arranged on opposite sides of the mounting bracket respectively, and the adapter board is in thermal contact with the main board; and

[0008] A shielding fin is arranged on the side of the main board away from the mounting bracket, and the side of the shielding fin away from the main board is connected with a side wall of the cavity.

[0009] The utility model further provides an aerosol generating device, which comprises:

[0010] The shielding heat dissipation structure described above, the housing is provided with an opening communicating with the cavity; and

[0011] A heating body is provided with a third mounting slot, the heating body is arranged in the cavity and electrically connected with the main board, and the slot opening of the third mounting slot is communicated with the opening. BRIEF DESCRIPTION OF DRAWINGS

[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0013] Figure 1 An exploded view of an embodiment of the shielding and heat dissipation structure provided by this utility model;

[0014] Figure 2 A cross-sectional view of an embodiment of the shielding and heat dissipation structure provided by this utility model;

[0015] Figure 3 A cross-sectional view of another embodiment of the shielding and heat dissipation structure of this utility model.

[0016] Explanation of icon numbers:

[0017] 100. Shielded heat dissipation structure; 1. Housing; 11. Cavity; 12. Upper shell; 13. Lower shell; 14. Opening; 2. Mounting bracket; 21. First mounting slot; 22. Mounting through hole; 23. Second mounting slot; 3. Circuit board assembly; 31. Main board; 311. Heating chip; 32. Adapter board; 4. Shielded heat sink; 41. First straight section; 42. Bending section; 43. Second straight section; 5. Thermally conductive silicone pad; 6. Battery; 61. Connecting terminal; 7. First elastic pad; 8. Second elastic pad; 9. Fastener;

[0018] 200. Heating element; 201. Third mounting slot.

[0019] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0021] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0022] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0023] This utility model proposes a shielding and heat dissipation structure 100.

[0024] Please see Figures 1 to 3 In one embodiment of this utility model, the shielding and heat dissipation structure 100 includes a housing 1, a mounting bracket 2, a circuit board assembly 3, and a shielding heat sink 4. The housing 1 has a cavity 11. The mounting bracket 2 is disposed within the cavity 11. The circuit board assembly 3 includes a main board 31 and an adapter board 32. The main board 31 and the adapter board 32 are respectively disposed on opposite sides of the mounting bracket 2. The adapter board 32 is thermally connected to the main board 31. The shielding heat sink 4 is disposed on the side of the main board 31 facing away from the mounting bracket 2. The side of the shielding heat sink 4 facing away from the main board 31 is connected to one side wall of the cavity 11.

[0025] In this utility model's technical solution, the heat generated by the motherboard 31 is conducted and dissipated to the external environment through the shielding heat sink 4 and the adapter plate 32. The shielding heat sink 4 and the adapter plate 32 not only serve a heat dissipation function but also provide excellent electromagnetic shielding, effectively preventing internal circuits from being affected by external electromagnetic interference and reducing electromagnetic radiation emitted by the device. Furthermore, the adapter plate 32, as an expansion board, can add additional functions or interfaces to the shielding heat dissipation structure 100. By integrating the shielding heat sink 4 and the adapter plate 32 on both sides of the mounting bracket 2, this design saves the extra space required by traditional heat dissipation and shielding solutions, making the entire device more efficient. Compact design, suitable for the miniaturization trend of consumer electronics; effective heat dissipation and shielding help improve product reliability, reduce failures caused by overheating or electromagnetic interference, and extend product lifespan; by setting adapter plates 32 and shielding heat sinks 4 on both sides of the motherboard 31, this utility model can improve the heat transfer efficiency of the motherboard 31, help maintain the motherboard 31 at a suitable operating temperature, and thus improve the heat dissipation and shielding effect of the structure; the adapter plate 32 can realize the functions of shielding and heat dissipation, and can be a double-sided copper-clad PCBA board or a double-sided aluminum-clad PCBA board, this utility model does not limit it.

[0026] To further improve heat dissipation efficiency, please refer to [link / reference]. Figure 1 and Figure 3 In one embodiment of the present invention, the shielding heat dissipation structure 100 includes at least two thermally conductive silicone pads 5, and heat-generating chips 311 are formed on both sides of the motherboard 31. The two sides of one thermally conductive silicone pad 5 are respectively connected to one heat-generating chip 311 and the shielding heat sink 4, and the two sides of the other thermally conductive silicone pad 5 are respectively connected to another heat-generating chip 311 and the adapter plate 32. The thermally conductive silicone pad 5 acts as a heat conduction medium, directly transferring the heat generated by the heat-generating chip 311 on the motherboard 31 to the shielding heat sink 4 and the adapter plate 32. As a thermal interface material, the thermally conductive silicone pad 5 can fill the tiny gaps between the heat-generating chip 311 and the shielding heat sink 4 or adapter plate 32, improving heat conduction efficiency. The thermally conductive silicone pad 5 has a certain degree of elasticity, which can alleviate thermal expansion and contraction caused by temperature changes, protecting electronic components and the motherboard 31 from mechanical stress. The thermally conductive silicone pad 5 typically has good electrical insulation properties, preventing electrical short circuits between the heat-generating chip 311 and the shielding heat sink 4 or adapter plate 32. During the operation of the motherboard 31, the heat generated by the heat-generating chip 311 is first transferred to the thermally conductive silicone pad 5, which is in direct contact with it. The thermally conductive silicone pad 5 then conducts the heat from the heat-generating chip 311 to the shielding heat sink 4 and adapter plate 32. These two components act as heat dissipation media, dissipating heat into the environment. The design of the shielding heat sink 4 and adapter plate 32 allows them to effectively conduct heat away from the thermally conductive silicone pad 5, increasing the heat dissipation area and improving heat dissipation efficiency.

[0027] Specifically, please refer to Figure 1 and Figure 3 In one embodiment of this utility model, the mounting bracket 2 has a first mounting groove 21, and the bottom wall of the first mounting groove 21 has a mounting through hole 22. The motherboard 31 is disposed in the first mounting groove 21, and a thermally conductive silicone pad 5 is disposed in the mounting through hole 22 and connected to the adapter plate 32. The first mounting groove 21 is provided on the mounting bracket 2 to accommodate the motherboard 31, allowing the motherboard 31 to be securely mounted on the bracket, and provides a mounting through hole 22 to allow the thermally conductive silicone pad 5 to pass through and connect to the adapter plate 32. This design helps to fix the thermally conductive silicone pad 5 and allows heat to be conducted from the motherboard 31 to the adapter plate 32. By providing the first mounting groove 21 and the mounting through hole 22 on the mounting bracket 2, and using the thermally conductive silicone pad 5 therein, heat can be conducted from the motherboard 31 to the adapter plate 32 more effectively, improving the overall heat dissipation efficiency.

[0028] Please see Figure 1 and Figure 2 In one embodiment of this utility model, the shielding heat sink 4 has a first straight section 41, a bent section 42, and a second straight section 43 connected in sequence. The first straight section 41 is connected to the motherboard 31, and the second straight section 43 is connected to one side wall of the cavity 11. The first straight section 41 is the part where the shielding heat sink 4 is directly connected to the motherboard 31, responsible for conducting heat from the motherboard 31 to the shielding heat sink 4. The design of the first straight section 41 should ensure good contact with the motherboard 31 to maximize heat conduction efficiency. The bent section 42 is located between the first straight section 41 and the second straight section 43. The design of the bent section 42 can adapt to spatial layout, increase heat dissipation area, or improve heat flow path, providing additional surface area to help disperse heat and transfer it to the environment more quickly. The second straight section 43 is connected to one side wall of the cavity 11. This section is responsible for conducting heat from the shielding heat sink 4 to the wall of the cavity 11 and then dissipating it to the external environment. The design of the second straight section 43 should consider the contact area with the wall of the cavity 11 and... The heat conduction path optimizes heat dissipation performance. The heat-generating chip 311 on the motherboard 31 generates heat, which is first transferred to the first straight section 41 in contact with it. The heat is then conducted through the first straight section 41 to the bent section 42. The design of the bent section 42 increases the surface area of ​​the heat sink, which helps to disperse the heat. The heat continues to be conducted from the bent section 42 to the second straight section 43, and finally to the wall of the cavity 11, and then dissipates into the external environment. The design of the first straight section 41, the bent section 42 and the second straight section 43 allows the heat sink to better adapt to the internal spatial layout of the device, providing a better heat dissipation solution in a limited space. The design of the shielded heat sink 4 not only helps to dissipate heat, but may also enhance the electromagnetic shielding effect and reduce electromagnetic interference.

[0029] Further, please refer to Figure 1 and Figure 2 In one embodiment of this utility model, the shielding and heat dissipation structure 100 includes a battery 6, the battery 6 having a connection terminal 61, the mounting bracket 2 having a second mounting slot 23, the battery 6 being housed in the second mounting slot 23, and the motherboard 31 having a connection terminal 61, the connection terminal 61 being electrically connected to the motherboard 31. The battery 6, as part of the shielding and heat dissipation structure 100, provides necessary power to the electronic components on the motherboard 31. By opening the second mounting slot 23 on the mounting bracket 2 and housing the battery 6 therein, spatial integration of the battery 6 and the heat dissipation structure is achieved, saving additional installation space. The electrical connection between the battery 6 and the motherboard 31 is achieved through the connection terminal 61, ensuring a stable and reliable electrical connection between the battery 6 and the motherboard 31. The electronic components on the motherboard 31 consume power during operation, which is provided by the battery 6. The battery 6 is placed in the second mounting slot 23, which provides a stable and well-protected position for the battery 6. The connection terminal 61 is responsible for transmitting the power from the battery 6 to the electronic components on the motherboard 31, ensuring their normal operation.

[0030] To prevent the connector 61 from becoming detached from the motherboard 31, please refer to [link / reference needed]. Figure 1 and Figure 2 In one embodiment of this utility model, the shielding and heat dissipation structure 100 includes a first elastic pad 7, which is located between the connecting terminal 61 and the shielding heat sink 4. The first elastic pad 7, through its elastic properties, provides a stable clamping force for the connection between the connecting terminal 61 and the motherboard 31, preventing the connecting terminal 61 from loosening due to vibration or thermal expansion, thus ensuring the reliability of the electrical connection. When the motherboard 31 is in operation, it generates heat, causing the components to expand. The first elastic pad 7 can absorb the minute dimensional changes caused by this thermal expansion, reducing the mechanical pressure on the connecting terminal 61 and the shielding heat sink 4. The first elastic pad 7 ensures a more stable and reliable contact between the connecting terminal 61 and the motherboard 31, thereby improving the stability of the electrical connection.

[0031] To prevent battery 6 from moving, please refer to Figure 1 and Figure 2In one embodiment of this utility model, the shielding and heat dissipation structure 100 includes a second elastic pad 8, which is located between the battery 6 and the shielding heat sink 4. The second elastic pad 8, located between the battery 6 and the shielding heat sink 4, primarily functions to fix the battery 6 and prevent it from moving due to vibration or impact during device operation. During charging and discharging, the battery 6 may generate heat and expand slightly; the second elastic pad 8 can absorb this thermal expansion, reducing pressure on the battery 6 and surrounding components. When the device is subjected to external impact or vibration, the second elastic pad 8 can absorb these impacts, protecting the battery 6 and the shielding heat sink 4 from mechanical damage.

[0032] For easier maintenance and replacement of the internal components of the structure, please refer to [link / reference]. Figure 1 In one embodiment of this utility model, the housing 1 includes an upper shell 12 and a lower shell 13. The upper shell 12 and the lower shell 13 are detachably connected and enclose the cavity 11. The upper shell 12 and the lower shell 13 enclose the cavity 11, which is the core space of the device and is used to accommodate the motherboard 31, the adapter board 32, the shielding heat sink 4, and other electronic components. The housing 1 provides physical protection for the internal electronic components, preventing them from being affected by the external environment, such as dust, moisture, impact, or vibration. The design of the housing 1 can also optimize heat dissipation through material selection and structural design. The upper shell 12 and the lower shell 13 are fixed together by a detachable connection method (such as a buckle, screw, or lock). The detachable design of the housing 1 makes the maintenance and replacement of internal components more convenient.

[0033] Please see Figure 1 In one embodiment of this utility model, the shielding heat dissipation structure 100 further includes a plurality of fasteners 9. Each fastener 9 is sequentially inserted through the shielding heat sink 4, the motherboard 31, and the mounting bracket 2 to connect the shielding heat sink 4, the motherboard 31, and the mounting bracket 2. The fasteners 9 are used to sequentially pass through the shielding heat sink 4, the motherboard 31, and the mounting bracket 2 to tightly fix these components together, ensuring their stability during equipment operation. By using the fasteners 9, the integrity of the entire shielding heat dissipation structure 100 can be enhanced, preventing component displacement or damage due to vibration or impact. The use of fasteners 9 simplifies the assembly process of the shielding heat dissipation structure 100, allowing multiple components to be fixed in place at once without the need for separate fixing measures. The fasteners 9 also ensure good contact between the shielding heat sink 4 and the motherboard 31, thereby improving heat conduction efficiency and enhancing heat dissipation.

[0034] This utility model also proposes an aerosol generating device, which includes a heating element 200 and a shielding and heat dissipation structure 100. The specific structure of the shielding and heat dissipation structure 100 is as described in the above embodiments. Since this aerosol generating device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here. The housing 1 has an opening 14 communicating with the cavity 11; the heating element 200 has a third mounting groove 201, the heating element 200 is disposed in the cavity 11 and electrically connected to the main board 31, and the groove of the third mounting groove 201 communicates with the opening 14. By providing the third mounting groove 201 and the opening 14, a chemical substance or device for generating aerosols can be inserted into the heating element 200 to generate aerosols.

[0035] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A shielded heat dissipation structure, characterized in that, include: A housing having a cavity; The mounting bracket is disposed within the cavity; A circuit board assembly, comprising a main board and an adapter board, wherein the main board and the adapter board are respectively disposed on opposite sides of the mounting bracket, and the adapter board is thermally connected to the main board; as well as A heat sink is provided on the side of the motherboard facing away from the mounting bracket, and the side of the heat sink facing away from the motherboard is connected to one side wall of the cavity.

2. The shielding and heat dissipation structure as described in claim 1, characterized in that, The shielding and heat dissipation structure includes at least two thermally conductive silicone pads. Heat-generating chips are formed on both sides of the motherboard. One thermally conductive silicone pad is connected to one heat-generating chip and the shielding heat sink on both sides, respectively. The other thermally conductive silicone pad is connected to another heat-generating chip and the adapter board on both sides, respectively.

3. The shielding and heat dissipation structure as described in claim 2, characterized in that, The mounting bracket has a first mounting groove, and the bottom wall of the first mounting groove has a mounting through hole. The main board is located in the first mounting groove, and one of the thermally conductive silicone pads is located in the mounting through hole and connected to the adapter plate.

4. The shielding and heat dissipation structure as described in claim 1, characterized in that, The shielding heat sink has a first straight section, a bent section and a second straight section connected in sequence. The first straight section is connected to the motherboard and the second straight section is connected to one side wall of the cavity.

5. The shielding and heat dissipation structure as described in any one of claims 1 to 4, characterized in that, The shielding and heat dissipation structure includes a battery with a connection terminal. The mounting bracket has a second mounting slot, in which the battery is housed. The connection terminal is electrically connected to the motherboard.

6. The shielding and heat dissipation structure as described in claim 5, characterized in that, The shielding and heat dissipation structure includes a first elastic pad, which is located between the connecting terminal and the shielding heat sink.

7. The shielding and heat dissipation structure as described in claim 5, characterized in that, The shielding and heat dissipation structure includes a second elastic pad, which is located between the battery and the shielding heat sink.

8. The shielding and heat dissipation structure as described in any one of claims 1 to 4, characterized in that, The housing includes an upper shell and a lower shell, which are detachably connected and enclose the cavity.

9. The shielding and heat dissipation structure as described in any one of claims 1 to 4, characterized in that, The shielding and heat dissipation structure also includes a plurality of fasteners, each of which is sequentially inserted through the shielding heat sink, the motherboard, and the mounting bracket to connect the shielding heat sink, the motherboard, and the mounting bracket.

10. An aerosol generating device, characterized in that, include: The shielding and heat dissipation structure as described in any one of claims 1 to 9, wherein the housing has an opening communicating with the cavity; and The heating element has a third mounting slot, is disposed in the cavity, and is electrically connected to the main board. The slot of the third mounting slot communicates with the opening.

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