Door body structure and wafer cleaning device

Abstract

The utility model belongs to the technical field of semiconductor equipment, and discloses a door body structure and a wafer cleaning device. The wafer cleaning device comprises a main shell, a mounting cavity is formed in the main shell, and an opening channel communicated with the mounting cavity is formed in the side wall of the main shell. The door body structure comprises a first door body and a second door body. The first door body is configured to be arranged on the outer side face of the main shell in a liftable mode and can block the outer end of the open channel. The second door body is configured to be arranged on the inner side face of the main shell in a lifting mode and can block the inner end of the open channel. The first door body, the second door body and the opening channel can jointly define a guide-out cavity. And the exhaust pipe is arranged on the outer side of the main shell, one end of the exhaust pipe is communicated with the guide-out cavity, and the other end of the exhaust pipe is communicated with gas recovery treatment equipment. According to the wafer cleaning device, wafers can be fully cleaned, gas leakage can be effectively prevented by arranging the door body structure, and the body health of workers is prevented from being affected.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a gate structure and a wafer cleaning device. Background Technology

[0002] In the semiconductor wafer manufacturing process, the wafers need to be trimmed and polished to remove defects on the surface and edges, achieving the required flatness and smoothness. This polishing process generates a large amount of debris and dirt, necessitating cleaning of the polished wafers and drying of the surface to ensure they are dry and free of contaminants.

[0003] In existing technology, when cleaning wafers, the wafer is placed into the cleaning device through an opening, and then the door of the cleaning device is closed to seal the opening. The cleaning device is equipped with nozzles that spray deionized water onto the wafer surface to rinse it and remove impurities. At the same time, ozone gas is introduced into the cleaning device to enhance the cleaning effect. Afterward, the wafer is spun dry, the door is opened, and the wafer is removed from the cleaning device through the outlet, thus completing the wafer cleaning process.

[0004] However, the door panels of this type of cleaning device typically have poor sealing performance for openings, leaving gaps between the door panel and the openings. These gaps can cause ozone leakage, affecting the health of on-site workers. Utility Model Content

[0005] The purpose of this invention is to provide a door structure and a wafer cleaning device that can effectively prevent gas leakage while thoroughly cleaning the wafer, thus avoiding any impact on the health of the workers.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] In a first aspect, a gate structure is provided, configured for sealing a wafer cleaning apparatus, the wafer cleaning apparatus including a main housing, a mounting chamber disposed within the main housing, and an opening channel communicating with the mounting chamber on a side wall of the main housing, the mounting chamber being configured for cleaning wafers, the gate structure comprising:

[0008] A first door is configured to be vertically mounted on the outer side of the main housing and capable of blocking the outer end of the opening channel;

[0009] The second door is configured to be liftably disposed on the inner side of the main housing and can block the inner end of the opening channel. The first door, the second door and the opening channel can together form an outlet cavity.

[0010] An exhaust duct is configured to be located on the outside of the main housing, with one end of the exhaust duct configured to communicate with the outlet cavity and the other end configured to communicate with the gas recovery and processing equipment.

[0011] Optionally, the door structure further includes a sealing element, which is disposed on the side of the first door facing the opening channel and is arranged along the circumference of the first door. When the first door blocks the opening channel, the sealing element seals against the opening channel.

[0012] Optionally, the door structure further includes a sealing element configured to be arranged circumferentially along the opening channel, wherein when the first door blocks the opening channel, the first door and the sealing element make sealing contact.

[0013] Optionally, the door structure further includes an exhaust channel, which is located on the outside of the main housing, with one end of the exhaust channel connected to the outlet cavity and the other end configured to connect to the exhaust pipe.

[0014] Optionally, the door structure further includes a drive unit, which includes a first drive mechanism, a support base plate, a connecting rod, and a first connecting sleeve. The first drive mechanism is disposed on the main housing, and its output end is connected to the support base plate. One end of the connecting rod is disposed on the support base plate, and the other end passes through the first connecting sleeve and is fixedly connected to the first connecting sleeve. The first connecting sleeve is disposed on the second door body. The first drive mechanism can drive the second door body to rise and fall sequentially via the support base plate, the connecting rod, and the first connecting sleeve.

[0015] Optionally, the drive unit further includes a base, an adjusting column, and a limiting plate. The base and the limiting plate are both mounted on the support base plate, and a movable mounting cavity is formed between the base and the limiting plate. The adjusting column is movably disposed in the movable mounting cavity. One end of the connecting rod passes through the limiting plate and is locked to the adjusting column. When the connecting rod rises, it can drive the adjusting column to abut against the limiting plate. When the connecting rod falls, it can drive the adjusting column to abut against the base.

[0016] Optionally, the drive unit further includes a clamping member, one end of the connecting rod passes through the limiting plate and is inserted into the adjusting column, the side wall of the adjusting column has an insertion hole, the clamping member is threadedly engaged with the insertion hole, and the clamping member can clamp the side wall of the connecting rod.

[0017] Optionally, the drive unit further includes a second connecting sleeve, which is fixed to the inner wall of the main housing, and one end of the connecting rod passes through the second connecting sleeve and is inserted into the first connecting sleeve. The inner diameter of the first connecting sleeve is greater than or equal to the outer diameter of the second connecting sleeve, and the second connecting sleeve has a sleeved state inserted into the first connecting sleeve and a separated state away from the first connecting sleeve.

[0018] Optionally, the length of the first connecting sleeve is equal to the length of the second connecting sleeve, and equal to half the length of the connecting rod.

[0019] In a second aspect, a wafer cleaning apparatus is provided, configured for cleaning wafers, the wafer cleaning apparatus including a main housing, a mounting chamber provided inside the main housing, and an opening channel communicating with the mounting chamber provided on the side wall of the main housing, the mounting chamber being configured for cleaning wafers;

[0020] The wafer cleaning apparatus further includes the door structure described above. The first door is movably disposed on the outer side of the main housing and can block the outer end of the opening channel. The second door is movably disposed on the inner side of the main housing and can block the inner end of the opening channel.

[0021] The beneficial effects of this utility model are:

[0022] This utility model provides a door structure and a wafer cleaning device. The wafer cleaning device includes a main housing with an installation chamber inside. An opening channel communicating with the installation chamber is provided on the side wall of the main housing. The door structure can seal the opening channel of the main housing. The door structure includes a first door, a second door, and an exhaust pipe. When cleaning wafers, the first and second doors are first raised and lowered to open the opening channel, allowing the wafer to be fed into the installation chamber through the opening channel. Then, the first and second doors are raised and lowered again to seal both the outer and inner ends of the opening channel, allowing the wafer cleaning operation to be performed within the installation chamber.

[0023] During wafer cleaning, oxidizing gas needs to be introduced into the mounting chamber. A first and second gate are installed, forming an outlet cavity around the opening channel. During cleaning, some gas overflows from the mounting chamber through the gap between the second gate and the inner wall of the main housing, entering the outlet cavity through the gap between the second gate and the inner end of the opening channel. Since the exhaust pipe connects to the opening channel, the outlet cavity is also connected to the exhaust pipe. The overflowing gas is then drawn to a gas recovery and treatment device for centralized processing, preventing direct leakage from the opening channel and avoiding health risks to on-site personnel. Furthermore, when the exhaust pipe vents the outlet cavity, a negative pressure environment is created. Even if there is a gap between the first gate and the outer wall of the main housing, the gas in the outlet cavity will not leak from that gap. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the wafer cleaning device provided in this embodiment of the utility model;

[0025] Figure 2 This is an exploded view of the wafer cleaning apparatus provided in this embodiment of the present invention;

[0026] Figure 3 This is an exploded view of the second housing provided in an embodiment of the present invention;

[0027] Figure 4 This is a schematic diagram of the structure of the drive unit provided in an embodiment of the present utility model;

[0028] Figure 5 yes Figure 4 Enlarged view of point A in the middle.

[0029] In the picture:

[0030] 11. Main housing; 111. Opening channel; 112. Outlet; 113. Installation chamber; 114. First housing; 115. Second housing; 12. First door; 13. Second door; 14. Third door; 16. Exhaust pipe; 17. Third drive mechanism; 18. Exhaust channel;

[0031] 2. Rotating unit; 21. Fourth drive mechanism; 22. Mounting base; 221. Base; 222. Flange; 223. Clamping element;

[0032] 3. Limiting component; 31. Second drive mechanism; 32. Limiting pressure plate;

[0033] 5. Protective components; 51. Fifth drive mechanism; 52. Protective cover;

[0034] 6. Air supply filter assembly;

[0035] 8. Drive unit; 81. First drive mechanism; 82. Support base plate; 83. Connecting rod; 84. First connecting sleeve; 85. Second connecting sleeve; 86. Base; 87. Adjusting column; 88. Limiting plate; 89. Tightening component. Detailed Implementation

[0036] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0037] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0038] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0039] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0040] Example 1

[0041] This embodiment provides a gate structure configured for sealing a wafer cleaning device. For example... Figures 1 to 5As shown, the door structure can block the wafer cleaning device and effectively prevent gas leakage, thus avoiding any impact on the health of the staff.

[0042] like Figures 1 to 2 As shown, the wafer cleaning apparatus includes a main housing 11, a mounting chamber 113 is provided inside the main housing 11, and an opening channel 111 communicating with the mounting chamber 113 is provided on the side wall of the main housing 11. The mounting chamber 113 is configured for cleaning wafers.

[0043] The door structure includes a first door 12, a second door 13, and an exhaust pipe 16. The first door 12 is configured to be liftably mounted on the outer side of the main housing 11 and can block the outer end of the opening channel 111. The second door 12 is configured to be liftably mounted on the inner side of the main housing 11 and can block the inner end of the opening channel 111. The first door 12, the second door 13, and the opening channel 111 can together form an exhaust cavity. The exhaust pipe 16 is configured to be located on the outer side of the main housing 11, with one end of the exhaust pipe 16 configured to communicate with the exhaust cavity and the other end configured to communicate with a gas recovery and processing device.

[0044] When cleaning the wafer, the first gate 12 and the second gate 13 are first raised and lowered to open the opening channel 111, allowing the wafer to be fed into the mounting chamber 113 through the opening channel 111. Then, the first gate 12 and the second gate 13 are raised and lowered again to block both the outer and inner ends of the opening channel 111, allowing the wafer cleaning operation to proceed within the mounting chamber 113. During wafer cleaning, oxidizing gas is introduced into the mounting chamber 113. By configuring the first gate 12 and the second gate 13, they form an exit cavity with the opening channel 111. During the cleaning process, some gas will overflow from the installation chamber 113 through the gap between the inner wall of the second door 13 and the main housing 11, and enter the outlet chamber through the gap between the second door 13 and the inner end of the opening channel 111. Since the exhaust pipe 16 is connected to the opening channel 111, the outlet chamber can be connected to the exhaust pipe 16. The overflowing gas will be drawn by the exhaust pipe 16 to the gas recovery and treatment equipment for centralized treatment, which can prevent gas from leaking directly from the opening channel 111 and avoid affecting the health of on-site personnel. In addition, when the exhaust pipe 16 vents the outlet chamber, a negative pressure environment is formed inside the outlet chamber. At this time, even if there is a gap between the outer wall of the first door 12 and the main housing 11, the gas in the outlet chamber will not leak from the gap.

[0045] In this embodiment, the main housing 11 is composed of a first housing 114 and a second housing 115, which together form an installation chamber 113. The first housing 114 is fastened to the second housing 115, and the connecting bolts pass through the first housing 114 and the second housing 115 and are connected with nuts.

[0046] Optionally, the door structure also includes a sealing element. The sealing element is disposed on the side of the first door 12 facing the opening channel 111 and is arranged circumferentially along the first door 12. When the outer side of the opening channel 111 is blocked, the first door 12 is controlled to rise and fall, so that the first door 12 blocks the outer side of the opening channel 111. At this time, the sealing element and the opening channel 111 are in sealing contact, thereby improving the sealing performance of the outlet cavity.

[0047] In some embodiments, the seal may also be configured to be disposed circumferentially along the opening channel 111. When the first door 12 blocks the opening channel 111, the first door 12 seals against the seal.

[0048] For example, the seal includes a rubber strip. By providing a seal, the airtightness of the first door 12 to the opening channel 111 can be further improved, thereby preventing direct leakage of oxidizing gas and protective gas in the exhaust cavity and avoiding impact on the health of on-site personnel.

[0049] In some other embodiments, a sealing element may be provided on the side of the second door 13 facing the opening channel 111. When the inner side of the opening channel 111 is blocked, the sealing element on the second door 13 seals against the inner side of the opening channel 111, improving the sealing performance of the second door 13 to the mounting chamber 113, reducing the amount of oxidizing gas and protective gas overflowing from the mounting chamber 113, thereby reducing the content of oxidizing gas and protective gas in the outlet cavity. Optionally, as... Figures 1 to 3 As shown, the door structure also includes an exhaust channel 18. The exhaust channel 18 is located on the outside of the main housing 11, with one end connected to the outlet cavity and the other end connected to the exhaust pipe 16. When cleaning the wafer, the first door 12 blocks the outer end of the opening channel 111, and the second door 13 blocks the inner end of the opening channel 111. Some oxidizing and protective gases overflow the mounting chamber 113 and enter the outlet cavity through the gap between the second door 13 and the inner end of the opening channel 111. The outlet cavity is connected to the exhaust pipe 16 through the exhaust channel 18, so this part of the gas will enter the exhaust pipe 16 through the exhaust channel 18. The exhaust pipe 16 will then extract and discharge the overflowing gas to the gas treatment area for centralized gas treatment, preventing direct gas leakage from affecting the health of on-site personnel. In addition, by setting up the exhaust channel 18, a buffer zone can be provided for the overflowing gas, which helps to extract the gas more smoothly and reduces the impact on the system caused by sudden airflow changes.

[0050] Optionally, such as Figure 1 , Figure 2 and Figure 4As shown, the door structure also includes a drive unit 8. The drive unit 8 includes a first drive mechanism 81, a support base plate 82, a connecting rod 83, and a first connecting sleeve 84. The first drive mechanism 81 is disposed on the main housing 11, and its output end is connected to the support base plate 82. The first drive mechanism 81 can drive the support base plate 82 to rise and fall vertically. One end of the connecting rod 83 is disposed on the support base plate 82, and the other end passes through the first connecting sleeve 84 and is fixedly connected to the first connecting sleeve 84. The first connecting sleeve 84 is disposed on the second door body 13. The first drive mechanism 81 can sequentially drive the second door body 13 to rise and fall via the support base plate 82, the connecting rod 83, and the first connecting sleeve 84. When it is necessary to block or open the inner end of the opening channel 111, the first drive mechanism 81 is activated, which drives the support base plate 82 to rise and fall vertically. This causes the support base plate 82 to drive the second door body 13 to rise and fall through the connecting rod 83 and the first connecting sleeve 84, thereby blocking or opening the inner end of the opening channel 111. The structure is simple and easy to operate.

[0051] Optionally, such as Figure 4 and Figure 5 As shown, the drive unit 8 also includes a base 86, an adjusting column 87, and a limiting plate 88. Both the base 86 and the limiting plate 88 are mounted on the support base plate 82, forming a movable mounting cavity between them. The adjusting column 87 is movably disposed within the movable mounting cavity, and one end of the connecting rod 83 passes through the limiting plate 88 and locks itself with the adjusting column 87. When the connecting rod 83 rises, it can cause the adjusting column 87 to abut against the limiting plate 88; when the connecting rod 83 falls, it can cause the adjusting column 87 to abut against the base 86.

[0052] When the first drive mechanism 81 drives the support base plate 82 to rise vertically, the support base plate 82 will drive the base 86, the limiting plate 88, the adjusting column 87, and the connecting rod 83 to rise and fall. During this process, since the adjusting column 87 is movably mounted in the movable mounting cavity, the connecting rod 83 will drive the adjusting column 87 to move vertically upward relative to the limiting plate 88, so that the limiting plate 88 abuts against the adjusting column 87. Conversely, when the first drive mechanism 81 drives the support base plate 82 to fall vertically, the connecting rod 83 will drive the adjusting column 87 to move vertically downward relative to the limiting plate 88, so that the base 86 abuts against the adjusting column 87. In addition, movably mounting the adjusting column 87 in the movable mounting cavity can eliminate the machining error of the support base plate 82, avoid jamming caused by the first drive mechanism 81, and reduce the machining cost of the parts.

[0053] Specifically, the base 86 has a vertically extending groove structure, and the adjusting column 87 has a guide protrusion structure that cooperates with the groove structure to limit the lifting direction of the adjusting column 87.

[0054] For example, the first drive mechanism 81 includes a rodless cylinder.

[0055] In this embodiment, as Figure 4 and Figure 5 As shown, the drive unit 8 also includes a clamping member 89. The connecting rod 83 passes through the limiting plate 88 and is inserted into the adjusting column 87. The side wall of the adjusting column 87 has an insertion hole, and the clamping member 89 is threaded into the insertion hole, and the clamping member 89 can clamp the side wall of the connecting rod 83. By setting the clamping member 89, the connecting rod 83 can be locked with the adjusting column 87, and the stability of the structure can be ensured when the first drive mechanism 81 drives the connecting rod 83 to rise and fall.

[0056] For example, the clamping member 89 includes a bolt.

[0057] Optionally, the drive unit 8 further includes a second connecting sleeve 85. The second connecting sleeve 85 is fixed to the inner wall of the main housing 11, and one end of the connecting rod 83 passes through the second connecting sleeve 85 and is inserted into the first connecting sleeve 84. The inner diameter of the first connecting sleeve 84 is greater than or equal to the outer diameter of the second connecting sleeve 85. The second connecting sleeve 85 has a fitted state inserted into the first connecting sleeve 84 and a separated state away from the first connecting sleeve 84. The length of the first connecting sleeve 84 is equal to the length of the second connecting sleeve 85 and equal to half the length of the connecting rod 83. Therefore, when the inner end of the opening channel 111 is blocked, the first drive mechanism 81 drives the second door body 13 to rise vertically through the support base plate 82, the connecting rod 83 and the first connecting sleeve 84. During this process, the first connecting sleeve 84 also rises vertically so that the first connecting sleeve 84 gradually separates from the second connecting sleeve 85. At this time, the second connecting sleeve 85 is in a separated state. The first connecting sleeve 84 and the second connecting sleeve 85 are sleeved on the outside of the connecting rod 83, and the connecting rod 83 is completely wrapped, which can protect the connecting rod 83 and prevent the connecting rod 83 from damaging the wafer cleaning environment and avoiding affecting the cleaning effect.

[0058] When the inner end of the opening channel 111 is opened, the first drive mechanism 81 drives the second door body 13 to descend vertically. During this process, the first connecting sleeve 84 also descends vertically so that the first connecting sleeve 84 is gradually fitted onto the outside of the second connecting sleeve 85. Even if the second connecting sleeve 85 can be inserted into the first connecting sleeve 84, the second connecting sleeve 85 is in the fitted state at this time.

[0059] Optionally, such as Figures 1 to 3 As shown, the gate structure also includes a third gate 14. The main housing 11 has an outlet 112, and the third gate 14 can be raised and lowered within the mounting chamber 113 to block or open the outlet 112. After the wafer cleaning is completed, the third gate 14 can be raised and lowered to open the outlet 112 and remove the wafer from the outlet 112.

[0060] It should be noted that in this embodiment, two drive units 8 are provided. One drive unit 8 is connected to the second door 13, and the other drive unit 8 is connected to the third door 14, which is used to drive the second door 13 and the third door 14 to move vertically up and down.

[0061] Optionally, such as Figure 1 and Figure 2 As shown, the door structure also includes multiple limiting components 3. These limiting components 3 are horizontally positioned on both sides of the opening channel 111. The limiting components 3 can move towards or away from the opening channel 111 to press or release the first door body 12. When the opening channel 111 needs to be blocked, the first door body 12 and the second door body 13 are raised or lowered, so that the first door body 12 blocks the outer end of the opening channel 111, and the second door body 13 blocks the inner end. Then, the limiting components 3 are controlled to move towards the opening channel 111, pressing the first door body 12, thereby further improving the sealing performance of the first door body 12 on the opening channel 111. When the opening channel 111 needs to be opened, the limiting components 3 can be controlled to move away from the opening channel 111, releasing the first door body 12. Then, the first door body 12 and the second door body 13 are raised or lowered again to move them away from the opening channel 111.

[0062] In this embodiment, two limiting components 3 are provided, which are respectively disposed on both sides of the opening channel 111. This allows the pressure pressing the first door 12 to be evenly distributed, ensuring the pressing effect and thus ensuring the sealing of the opening channel 111 by the first door 12. In other embodiments, more than two limiting components 3 may be provided as needed, which is not limited here.

[0063] Optionally, such as Figure 1 and Figure 2 As shown, the limiting component 3 includes a second drive mechanism 31 and a limiting pressure plate 32. The housing of the second drive mechanism 31 is disposed on the main housing 11, and the output end of the second drive mechanism 31 is connected to the limiting pressure plate 32 for driving the limiting pressure plate 32 to move in a direction close to or away from the opening channel 111. When the opening channel 111 is blocked, the second drive mechanism 31 is activated, and the second drive mechanism 31 drives the limiting pressure plate 32 to move in a direction close to the opening channel 111, so that the first limiting pressure plate 32 presses against the first door body 12, thereby enhancing the sealing of the installation chamber 113, preventing the leakage of oxidizing gas and protective gas in the installation chamber 113, preventing environmental pollution, and ensuring the health of the staff.

[0064] When it is necessary to open the opening channel 111, the second drive mechanism 31 drives the limiting pressure plate 32 to move away from the opening channel 111, so that the limiting pressure plate 32 releases the first door body 12, thereby enabling the first door body 12 to rise and fall vertically and move away from the opening channel 111. Then, the second door body 13 is controlled to rise and fall vertically and move away from the opening channel 111, thus opening the channel 111.

[0065] For example, the second drive mechanism 31 includes a cylinder or an electric cylinder, etc.

[0066] Optionally, such as Figure 1 and Figure 2 As shown, the door structure also includes a third drive mechanism 17. The housing of the third drive mechanism 17 is disposed on the main housing 11, and the output end of the third drive mechanism 17 is connected to the first door 12 for driving the first door 12 to move vertically. When it is necessary to open or block the opening channel 111, the first drive mechanism 81 and the third drive mechanism 17 are driven simultaneously, so that they respectively drive the second door 13 and the first door 12 to move vertically up and down.

[0067] For example, the third drive mechanism 17 includes a cylinder or an electric cylinder, etc.

[0068] Example 2

[0069] This embodiment provides a wafer cleaning apparatus configured for cleaning wafers. For example... Figures 1 to 2 As shown, the wafer cleaning apparatus includes a main housing 11 and a door structure as described above. A mounting chamber 113 is provided within the main housing 11, and an opening channel 111 communicating with the mounting chamber 113 is provided on the side wall of the main housing 11. The mounting chamber 113 is configured for cleaning wafers; when wafer cleaning is required, the wafer is placed in the mounting chamber 113, and cleaning is performed within the mounting chamber 113. A first door 12 is vertically detachable from the outer side of the main housing 11 and can block the outer end of the opening channel 111. A second door 13 is vertically detachable from the inner side of the main housing 11 and can block the inner end of the opening channel 111.

[0070] The wafer cleaning apparatus also includes a rotating unit 2 and a cleaning unit. Both the rotating unit 2 and the cleaning unit are located in the mounting chamber 113. The rotating unit 2 is used to drive the wafer to rotate, and the cleaning unit is used to spray cleaning fluid onto the wafer and introduce oxidizing gas and protective gas into the mounting chamber 113.

[0071] like Figures 1 to 3As shown, the rotating unit 2 includes a fourth drive mechanism 21 and a mounting base 22. The housing of the fourth drive mechanism 21 is disposed within the mounting chamber 113, and the output end of the fourth drive mechanism 21 is connected to the mounting base 22 for transmission. The wafer is disposed on the mounting base 22 and is vertically spaced from the upper surface of the mounting base 22. The fourth drive mechanism 21 is used to drive the mounting base 22 to rotate around a vertical axis, so that the mounting base 22 clamps the wafer. A cleaning unit is disposed within the mounting chamber 113. The cleaning unit is used to spray cleaning fluid onto the wafer and to introduce oxidizing gas and protective gas into the mounting chamber 113.

[0072] For example, the fourth drive mechanism 21 includes a rotary motor.

[0073] Optionally, such as Figures 1 to 3 As shown, the wafer cleaning apparatus also includes an air supply filter assembly 6. The air supply filter assembly 6 is mounted on the main housing 11 and communicates with the mounting chamber 113. The air supply filter assembly 6 can introduce clean air into the mounting chamber 113. While cleaning the wafer, the air supply filter assembly 6 is activated to introduce air into the mounting chamber 113, and simultaneously filters the introduced air, thereby ensuring that clean air enters the mounting chamber 113. This prevents airborne contaminants from adhering to the wafer surface, avoids increased cleaning time due to wafer contamination, and improves work efficiency.

[0074] In this embodiment, the air supply and filtration assembly 6 includes an air supply fan and a filter that are interconnected.

[0075] Optionally, such as Figures 1 to 3 As shown, the mounting base 22 includes a base 221, multiple flanges 222, and multiple clamping members 223. The base 221 is drively connected to the output end of the fourth drive mechanism 21. The multiple flanges 222 are circumferentially spaced on the base 221, and each flange 222 corresponds to one of the multiple clamping members 223. Each clamping member 223 includes a clamping rod and a swing ball. The clamping rod is rotatably mounted on the flange 222, and the swing ball is located at the lower end of the clamping rod. The clamping rod has a locking state that clamps against the wafer and a releasing state that releases the wafer. When cleaning the wafer, the wafer is placed on the flange 222, that is, the edge of the wafer overlaps with the flange 222. At this time, the clamping rod is not clamped to the wafer and the clamping rod is in a released state. Then, the fourth drive mechanism 21 drives the base 221 to rotate vertically, and then the base 221 drives the flange 222 and the clamping member 223 to rotate vertically. When the clamping member 223 rotates vertically, since the swing ball is set at the lower end of the clamping rod, the weight of the upper end of the clamping rod is less than that of the lower end, so that the clamping rod rotates horizontally, thereby clamping the clamping rod to the edge of the wafer, realizing the clamping of the wafer and preventing the wafer from falling off the mounting base 22 due to rotation.

[0076] In this embodiment, three flanges 222 are provided, and correspondingly three clamping members 223 are provided. The three flanges 222 are evenly spaced circumferentially, so that the clamping force of the clamping rod on the wafer can be evenly distributed, ensuring the wafer clamping effect. In other embodiments, two or more flanges 222 and correspondingly two or more clamping members 223 may be provided as needed, which is not limited here.

[0077] Optionally, such as Figures 1 to 3 As shown, the wafer cleaning apparatus also protects the protective assembly 5. The protective assembly 5 includes a fifth drive mechanism 51 and a protective cover 52. The housing of the fifth drive mechanism 51 is disposed within the mounting chamber 113, and the output end of the fifth drive mechanism 51 is connected to the protective cover 52 for driving the protective cover 52 to move vertically. The protective cover 52 surrounds the mounting base 22 circumferentially, and has an enclosing state that covers the mounting base 22 and a separated state that is away from the mounting base 22. When cleaning the wafer, the opening channel 111 needs to be opened first. At the same time, the fifth drive mechanism 51 drives the protective cover 52 to move vertically away from the mounting base 22. At this time, the protective cover 52 is in a separated state, and the outside of the mounting base 22 is unobstructed, making it easy to place the wafer on the mounting base 22. Then, the fifth drive mechanism 51 drives the protective cover 52 to move vertically again, so that it covers the mounting base 22. At this time, the protective cover 52 is in an enclosed state, that is, the mounting base 22 is covered by the protective cover 52. Then, the fourth drive mechanism 21 drives the mounting base 22 to rotate, and at the same time sprays cleaning fluid onto the wafer for cleaning. At this time, the protective cover 52 can stop the cleaning fluid that is splashed due to rotation, and prevent the cleaning fluid from adhering to the inner wall of the main housing 11. When the wafer is taken out from the second opening 112, the possibility of cleaning fluid dripping onto the wafer is reduced, preventing the wafer from being contaminated, reducing the number of cleaning times, and improving work efficiency.

[0078] For example, the fifth drive mechanism 51 includes a cylinder or an electric cylinder, etc.

[0079] Optionally, the cleaning unit includes a first nozzle and a second nozzle. The first nozzle is disposed within the mounting chamber 113, and its vertical height is higher than that of the base 221. It is used to spray cleaning fluid onto the upper surface of the wafer and to introduce oxidizing gas into the mounting chamber 113. The second nozzle is disposed on the side of the base 221 facing the wafer. It is used to spray cleaning fluid onto the lower surface of the wafer and to introduce protective gas into the mounting chamber 113.

[0080] For example, the oxidizing gas includes ozone, and the protective gas includes nitrogen.

[0081] Optionally, the cleaning unit further includes a rotary drive mechanism, a rotating rod, and a third nozzle. The housing of the rotary drive mechanism is located within the mounting chamber, and the output end of the rotary drive mechanism is connected to the rotating rod for driving the rotating rod to rotate vertically. The third nozzle is located at the end of the rotating rod opposite to the rotary drive mechanism and is used to spray the two fluids onto the wafer. After the cleaning fluid has cleaned the wafer, the rotary drive mechanism is controlled to rotate the rotating rod, while the third nozzle sprays the two fluids onto the wafer, thereby further cleaning the wafer.

[0082] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A door structure, characterized in that, Configured for sealing a wafer cleaning device, the wafer cleaning device includes a main housing (11), a mounting chamber (113) is provided inside the main housing (11), and an opening channel (111) communicating with the mounting chamber (113) is provided on the side wall of the main housing (11). The mounting chamber is configured for cleaning wafers, and the door structure includes: The first door (12) is configured to be vertically mounted on the outer side of the main housing (11) and to block the outer end of the opening channel (111); The second door (13) is configured to be liftably disposed on the inner side of the main housing (11) and can block the inner end of the opening channel (111). The first door (12), the second door (13) and the opening channel (111) can jointly form an outlet cavity. An exhaust duct (16) is configured to be located outside the main housing (11), with one end of the exhaust duct configured to communicate with the outlet cavity and the other end configured to communicate with the gas recovery and treatment equipment.

2. The door structure according to claim 1, characterized in that, The door structure also includes a sealing element, which is disposed on the side of the first door (12) facing the opening channel (111) and is disposed along the circumference of the first door (12). When the first door (12) blocks the opening channel (111), the sealing element seals against the opening channel (111).

3. The door structure according to claim 1, characterized in that, The door structure also includes a sealing element, which is configured to be arranged circumferentially along the opening channel (111). When the first door (12) blocks the opening channel (111), the first door (12) and the sealing element are in sealing contact.

4. The door structure according to claim 1, characterized in that, The door structure also includes an exhaust channel (18), which is located outside the main housing (11). One end of the exhaust channel (18) is connected to the outlet cavity, and the other end is configured to be connected to the exhaust pipe (16).

5. The door structure according to claim 1, characterized in that, The door structure also includes a drive unit (8), which includes a first drive mechanism (81), a support base plate (82), a connecting rod (83), and a first connecting sleeve (84). The first drive mechanism (81) is disposed on the main housing (11), and its output end is connected to the support base plate (82) for transmission. One end of the connecting rod (83) is disposed on the support base plate (82), and the other end passes through the first connecting sleeve (84) and is fixedly connected to the first connecting sleeve (84). The first connecting sleeve (84) is disposed on the second door body (13). The first drive mechanism (81) can drive the second door body (13) to rise and fall sequentially via the support base plate (82), the connecting rod (83), and the first connecting sleeve (84).

6. The door structure according to claim 5, characterized in that, The drive unit (8) further includes a base (86), an adjusting column (87), and a limiting plate (88). The base (86) and the limiting plate (88) are both mounted on the support base plate (82), and a movable mounting cavity is formed between the base (86) and the limiting plate (88). The adjusting column (87) is movably disposed in the movable mounting cavity. One end of the connecting rod (83) passes through the limiting plate (88) and is locked with the adjusting column (87). When the connecting rod (83) rises, it can drive the adjusting column (87) to abut against the limiting plate (88). When the connecting rod (83) falls, it can drive the adjusting column (87) to abut against the base (86).

7. The door structure according to claim 6, characterized in that, The drive unit (8) also includes a clamping member (89). One end of the connecting rod (83) passes through the limiting plate (88) and is inserted into the adjusting column (87). The side wall of the adjusting column (87) is provided with an insertion hole. The clamping member (89) is threadedly engaged with the insertion hole, and the clamping member (89) can clamp the side wall of the connecting rod (83).

8. The door structure according to claim 5, characterized in that, The drive unit (8) further includes a second connecting sleeve (85), which is fixed to the inner wall of the main housing (11). One end of the connecting rod (83) passes through the second connecting sleeve (85) and is inserted into the first connecting sleeve (84). The inner diameter of the first connecting sleeve (84) is greater than or equal to the outer diameter of the second connecting sleeve (85). The second connecting sleeve (85) has a sleeved state inserted into the first connecting sleeve (84) and a separated state away from the first connecting sleeve (84).

9. The door structure according to claim 8, characterized in that, The length of the first connecting sleeve (84) is equal to the length of the second connecting sleeve (85) and equal to half the length of the connecting rod (83).

10. A wafer cleaning apparatus configured for cleaning wafers, characterized in that, The wafer cleaning apparatus includes: The main housing (11) has an installation chamber (113) inside it. The side wall of the main housing (11) has an opening channel (111) communicating with the installation chamber (113). The installation chamber is configured for cleaning wafers. The wafer cleaning apparatus further includes a door structure as described in any one of claims 1-9, wherein the first door (12) is movably disposed on the outer side of the main housing (11) and is capable of blocking the outer end of the opening channel (111), and the second door (13) is movably disposed on the inner side of the main housing (11) and is capable of blocking the inner end of the opening channel (111).

Images