Water retaining structure and wafer cleaning device
By designing a staggered water-blocking structure within the wafer cleaning device, splashed and suspended cleaning fluid is collected, solving the problem of cleaning fluid dripping and contaminating the wafer, and achieving a highly efficient cleaning process.
Patent Information
- Application Number
- CN202520157777.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-23
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-01-23
AI Technical Summary
In existing wafer cleaning equipment, the cleaning solution is prone to splashing and adhering to the inner wall of the equipment under centrifugal force during the cleaning process, causing the cleaning solution to drip onto the wafer surface, resulting in contamination and reduced work efficiency.
A water-blocking structure is designed, including a first water-blocking groove and a second water-blocking groove, which are staggered and set on the inner wall of the wafer cleaning device to collect splashed and suspended cleaning liquid and prevent it from dripping onto the wafer surface.
It effectively prevents cleaning fluid from dripping onto the wafer surface, reduces the number of cleaning cycles, improves work efficiency, and avoids wafer contamination.
Smart Images
Figure CN223832958U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a water-blocking structure and a wafer cleaning device. Background Technology
[0002] In the semiconductor wafer manufacturing process, the wafers need to be trimmed and polished to remove defects on the surface and edges, achieving the required flatness and smoothness. This polishing process generates a large amount of debris and dirt, necessitating cleaning of the polished wafers and drying of the surface to ensure they are dry and free of contaminants.
[0003] Existing wafer cleaning equipment typically involves spraying deionized water onto the wafer surface to rinse away impurities, while simultaneously introducing ozone gas to enhance the cleaning effect. The wafer is then spun dry and removed from the cleaning unit, completing the cleaning process. However, when using this type of equipment, some cleaning solution splashes and adheres to the inner wall of the cleaning unit due to centrifugal force. When the wafer is removed, the residual cleaning solution drips onto the wafer surface, causing contamination and requiring re-cleaning, thus reducing efficiency. Utility Model Content
[0004] The purpose of this invention is to provide a water-blocking structure and a wafer cleaning device that can effectively prevent residual cleaning fluid from dripping onto the wafer surface while thoroughly cleaning the wafer, thus avoiding wafer contamination, reducing the number of cleaning cycles, and improving work efficiency.
[0005] To achieve the above objectives, the present invention adopts the following technical solution:
[0006] In a first aspect, a water-blocking structure is provided, configured to be disposed within a wafer cleaning apparatus. The wafer cleaning apparatus includes a main housing and a first door. An installation chamber is disposed within the main housing, and an outlet communicating with the installation chamber is provided on the side wall of the main housing. The installation chamber is configured for cleaning wafers. The first door is vertically and elliptably disposed within the installation chamber to block or open the outlet. The water-blocking structure includes:
[0007] A first water-blocking groove is disposed on the inner wall of the main housing. The first water-blocking groove is higher than the upper end of the outlet, and the opening of the first water-blocking groove faces upward.
[0008] The second water baffle is disposed on the inner wall of the main housing. The second water baffle is lower than the first water baffle and higher than the upper end of the outlet. The opening of the second water baffle faces upward. The second water baffle is disposed relative to the first water baffle and close to the center of the installation chamber.
[0009] Optionally, the water-blocking structure further includes a first water-blocking plate, a second water-blocking plate, and a third water-blocking plate. One end of the first water-blocking plate is connected to the inner wall of the main housing, and the other end is connected to the second water-blocking plate. The second water-blocking plate extends vertically. The inner wall of the main housing, the first water-blocking plate, and the second water-blocking plate form the first water-blocking groove. The third water-blocking plate is disposed at the end of the second water-blocking plate away from the first water-blocking plate. The third water-blocking plate and the second water-blocking plate form the second water-blocking groove.
[0010] Optionally, the first end of the second baffle is provided with the first water flow notch, the second baffle is inclined relative to the horizontal direction, and the first end of the second baffle is located at the lower end;
[0011] The third water baffle is provided with the second water flow notch at its first end. The third water baffle is inclined relative to the horizontal direction, and the first end of the third water baffle is located at the lower end.
[0012] Optionally, both the second and third baffles extend vertically at an inclined angle, with the first water flow notch located at the lower end of the second baffle and the second water flow notch located at the lower end of the third baffle.
[0013] Optionally, the water-blocking structure further includes a fourth water-blocking plate, which is disposed at the end of the third water-blocking plate away from the second water-blocking plate and extends vertically. The second water-blocking plate, the third water-blocking plate, and the fourth water-blocking plate are arranged to form the second water-blocking groove.
[0014] Optionally, the water-blocking structure further includes a water-blocking component, which is disposed at the upper end of the first door body. The water-blocking component and the first door body form a third water-blocking groove. When the first door body blocks the outlet, the third water-blocking groove is disposed relative to the second water-blocking groove and close to the center of the installation chamber.
[0015] Optionally, the water-blocking component includes a horizontal plate and a vertical plate. The horizontal plate is vertically disposed on the side wall at the upper end of the first door body, and the vertical plate extends vertically and is disposed at the end of the horizontal plate away from the first door body. The horizontal plate and the vertical plate surround to form a third water-blocking groove.
[0016] Optionally, when the first door is in the closed state, the horizontal plate abuts against the lower end of the second baffle plate.
[0017] Secondly, a wafer cleaning apparatus is provided, including a main housing and a first door. The main housing has an installation chamber, and the side wall of the main housing has an outlet communicating with the installation chamber. The installation chamber is configured for cleaning wafers. The first door is vertically and vertically disposed in the installation chamber to block or open the outlet. The installation chamber has a water-blocking structure as described above on the upper side of the outlet.
[0018] Optionally, the wafer cleaning device further includes a second door, a third door, and an exhaust pipe. The main housing is provided with an opening channel communicating with the mounting chamber. The second door is movably disposed on the outer side of the main housing and can block the outer end of the opening channel. The third door is movably disposed on the inner side of the main housing and can block the inner end of the opening channel. The second door, the third door, and the opening channel can jointly form an exhaust cavity. The exhaust pipe is disposed on the outer side of the main housing. One end of the exhaust pipe communicates with the exhaust cavity, and the other end is configured to communicate with a gas recovery and processing device.
[0019] The beneficial effects of this utility model are:
[0020] This invention provides a water-blocking structure and a wafer cleaning device. The wafer cleaning device includes a main housing and a first door. An installation chamber is provided within the main housing, and an outlet communicating with the installation chamber is opened on the side wall of the main housing. The first door can block or open the outlet. Placing the wafer in the installation chamber allows for thorough cleaning. The water-blocking structure, located within the main housing of the wafer cleaning device, includes a first water-blocking groove and a second water-blocking groove. Because the second water-blocking groove is positioned closer to the center of the installation chamber than the first water-blocking groove (i.e., the first and second water-blocking grooves are horizontally offset), the receiving range of the cleaning fluid can be expanded. During wafer cleaning, some of the cleaning fluid used to clean the wafer splashes towards the inner wall of the main housing under centrifugal force. Some of the splashed cleaning fluid adheres to the inner wall of the main housing, while the remaining portion may not adhere but temporarily float in the space near the inner wall of the main housing. The adhering cleaning fluid flows along the inner wall of the main housing and is collected by the first baffle tank. Cleaning fluid that is not adhering to the inner wall of the main housing but is temporarily suspended in the space near the inner wall will drip into the second baffle tank under gravity. After wafer cleaning is completed, the wafer is removed through the extraction port. During removal, any splashed cleaning fluid is collected by the first and second baffle tanks and therefore will not drip onto the wafer, effectively preventing wafer contamination, reducing the number of cleaning cycles, and improving work efficiency. Attached Figure Description
[0021] Figure 1This is a schematic diagram of the structure of the wafer cleaning device provided in this embodiment of the utility model;
[0022] Figure 2 This is an exploded view of the wafer cleaning apparatus provided in this embodiment of the present invention;
[0023] Figure 3 This is a cross-sectional view of the main housing provided in an embodiment of the present utility model;
[0024] Figure 4 yes Figure 3 Enlarged view of point A in the middle;
[0025] Figure 5 This is an exploded view of the second housing provided in an embodiment of this utility model.
[0026] In the picture:
[0027] 11. Main housing; 111. Opening channel; 112. Outlet; 113. Installation chamber; 114. First housing; 115. Second housing; 12. Second door; 13. Third door; 14. First door; 16. Exhaust pipe; 17. Third drive mechanism; 18. Exhaust channel;
[0028] 2. Rotating unit; 21. Second drive mechanism; 22. Mounting base; 221. Base; 222. Flange; 223. Clamping element;
[0029] 3. Limiting component; 31. First drive mechanism; 32. Limiting pressure plate;
[0030] 5. Protective components; 51. Fourth drive mechanism; 52. Protective cover;
[0031] 6. Air supply filter assembly;
[0032] 7. Water-blocking structure; 71. First water-blocking channel; 711. First water-blocking plate; 712. Second water-blocking plate; 72. Second water-blocking channel; 721. Third water-blocking plate; 722. Fourth water-blocking plate; 73. Third water-blocking channel; 731. Water-blocking component. Detailed Implementation
[0033] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.
[0034] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0035] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0036] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0037] Example 1
[0038] This embodiment provides a water-blocking structure configured to be installed within a wafer cleaning apparatus. For example... Figures 1 to 5 As shown, the wafer cleaning device is used to clean wafers. The water-blocking structure 7 can collect the residual cleaning liquid in the wafer cleaning device, effectively preventing the residual cleaning liquid from dripping onto the surface of the wafer, avoiding wafer contamination, reducing the number of cleaning cycles, and improving work efficiency.
[0039] like Figures 2 to 4As shown, the wafer cleaning apparatus includes a main housing 11 and a first door 14. The main housing 11 has an installation chamber 113, and a take-out port 112 communicating with the installation chamber 113 is provided on the side wall of the main housing 11. The installation chamber 113 is configured for cleaning wafers. The first door 14 is vertically and flexibly disposed within the installation chamber 113 to block or open the take-out port 112. The water-blocking structure 7 includes a first water-blocking groove 71 and a second water-blocking groove 72. The first water-blocking groove 71 is disposed on the inner wall of the main housing 11, and is higher than the upper end of the take-out port 112, with its opening facing upwards. The first water-blocking groove 71 is used to collect cleaning fluid adhering to the inner wall of the main housing 11. Therefore, cleaning fluid adhering to the inner wall of the main housing 11 above the take-out port can flow along the inner wall of the main housing 11 into the first water-blocking groove 71, thereby allowing residual cleaning fluid to be collected by the first water-blocking groove 71. The second water baffle 72 is disposed on the inner wall of the main housing 11. The second water baffle 72 is lower than the first water baffle 71 and higher than the upper end of the outlet 112. The opening of the second water baffle 72 faces upward, and the second water baffle 72 is positioned relative to the first water baffle 71 near the center of the mounting chamber 113. Therefore, the first water baffle 71 and the second water baffle 72 are horizontally offset. By setting the second water baffle 72, the receiving range of the water-blocking structure 7 in the horizontal direction for receiving residual cleaning fluid can be increased, further improving the collection effect of the cleaning fluid and preventing the cleaning fluid from dripping onto the wafer surface, thus avoiding wafer contamination.
[0040] During wafer cleaning, some of the cleaning solution used to clean the wafer splashes towards the inner wall of the main housing 11 under centrifugal force. Some of this splashed cleaning solution adheres to the inner wall of the main housing 11, while some may not adhere but remain temporarily suspended in the space near the inner wall. The adhered cleaning solution flows along the inner wall of the main housing 11 and is collected by the first baffle trough 71; the cleaning solution that is not adhered to the inner wall but is temporarily suspended in the space near the inner wall will drip into the second baffle trough 72 under gravity. After wafer cleaning is completed, the wafer is removed through the removal port 112. During removal, the splashed cleaning solution is collected by the first and second baffle troughs 71 and will not drip onto the wafer, effectively preventing wafer contamination, reducing the number of cleaning cycles, and improving work efficiency.
[0041] It should be noted that the horizontal extension length of the first water baffle 71 and the horizontal extension length of the second water baffle 72 are both greater than or equal to the horizontal extension length of the outlet 112, thereby ensuring that all residual cleaning fluid located above the outlet 112 and within the opening range can be collected, preventing the cleaning fluid from dripping onto the wafer surface and avoiding wafer contamination.
[0042] In this embodiment, the horizontal extension length of the first water-blocking trough 71 and the horizontal extension length of the second water-blocking trough 72 are equal to the horizontal extension length of the outlet 112. In other embodiments, the horizontal extension length of the first water-blocking trough 71 and the horizontal extension length of the second water-blocking trough 72 may be set to be greater than the horizontal extension length of the outlet 112, depending on actual needs; this is not limited here.
[0043] Optionally, such as Figures 2 to 4 As shown, the water-blocking structure 7 includes a first water-blocking plate 711, a second water-blocking plate 712, and a third water-blocking plate 721. One end of the first water-blocking plate 711 is connected to the inner wall of the main housing 11, and the other end is connected to the second water-blocking plate 712. The second water-blocking plate 712 extends vertically and is formed by the inner wall of the main housing 11, the first water-blocking plate 711, and the second water-blocking plate 712. The third water-blocking plate 721 is disposed at the end of the second water-blocking plate 712 away from the first water-blocking plate 711, and the third water-blocking plate 721 and the second water-blocking plate 712 form a second water-blocking groove 72. Both the first water-blocking groove 71 and the second water-blocking groove 72 can collect residual cleaning fluid inside the main housing 11. The attached cleaning fluid will flow along the inner wall of the main housing 11 and be collected by the first water-retaining groove 71. The cleaning fluid that is not attached to the inner wall of the main housing 11 but is temporarily suspended in the space near the inner wall of the main housing 11 will drip into the second water-retaining groove 72 under the action of gravity, or drip and remain on the second water-retaining plate 712, and then flow along the second water-retaining plate 712 into the second water-retaining groove 72. In addition, when the first water-retaining groove 71 is full, some of the overflowing cleaning fluid can also flow along the second water-retaining plate 712 into the second water-retaining groove 72, thereby enhancing the collection effect of the water-retaining structure 7 on the cleaning fluid and effectively preventing the cleaning fluid from dripping.
[0044] In this embodiment, the third baffle plate 721 includes an L-shaped bent plate.
[0045] Optionally, at least one end of the second baffle plate 712 is provided with a first water flow notch. At least one end of the third baffle plate 721 is provided with a second water flow notch. When the cleaning fluid is collected by the first baffle tank 71 and the second baffle tank 72, the cleaning fluid in the first baffle tank 71 will flow along the tank wall of the first baffle tank 71, flow out of the first baffle tank 71 through the first water flow notch, and be received by the main housing 11. The cleaning fluid in the second baffle tank 72 will flow along the tank wall of the second baffle tank 72, flow out of the second baffle tank 72 through the second water flow notch, and be received by the main housing 11, thereby preventing the cleaning fluid from dripping onto the wafer and preventing wafer contamination.
[0046] In this embodiment, a first water flow notch is provided only at one end of the second water baffle 712, and a second water flow notch is provided at one end of the third water baffle 721. In other embodiments, the first water flow notch may be provided at both ends of the second water baffle 712, and the second water flow notch may be provided at both ends of the third water baffle 721, depending on actual needs.
[0047] Optionally, the first end of the second baffle plate 712 is provided with a first water flow notch. The second baffle plate 712 is inclined relative to the horizontal direction, and the first end of the second baffle plate 712 is located at the lower end. The first end of the third baffle plate 721 is provided with a second water flow notch, and the third baffle plate 721 is inclined relative to the horizontal direction, and the first end of the third baffle plate 721 is located at the lower end. Thus, when the cleaning fluid is collected in the first baffle trough 71 and the second baffle trough 72, under the action of gravity, the cleaning fluid will flow from the higher end to the lower end, that is, the cleaning fluid in the first baffle trough 71 will flow to the first end of the second baffle plate 712, and the cleaning fluid in the second baffle trough 72 will flow to the first end of the third baffle plate 721. Then, the cleaning fluid will flow out of the first baffle trough 71 through the first water flow notch of the second baffle plate 712, and out of the second baffle trough 72 through the second water flow notch of the third baffle plate 721. The second baffle plate 712 and the third baffle plate 721 are inclined relative to each other in the horizontal direction, which is conducive to the flow of cleaning fluid along the tank wall and timely discharge of the first baffle tank 71 and the second baffle tank 72. This avoids the cleaning fluid from overflowing and dripping onto the wafer due to slow discharge, thus preventing wafer contamination.
[0048] In some other embodiments, such as Figures 2 to 4 As shown, the third baffle plate 721 includes a flat plate, and the water-blocking structure 7 also includes a fourth baffle plate 722. The fourth baffle plate 722 is disposed at the end of the third baffle plate 721 opposite to the second baffle plate 712, and the fourth baffle plate 722 extends vertically, that is, the third baffle plate 721 and the fourth baffle plate 722 are connected in an L-shape. The second baffle plate 712, the third baffle plate 721, and the fourth baffle plate 722 surround to form a second water-blocking groove 72. By setting the fourth baffle plate 722, the edge of the second water-blocking groove 72 is blocked, thereby preventing the cleaning fluid from dripping from the edge of the second water-blocking groove 72 and avoiding contamination of the wafer.
[0049] Optionally, such as Figures 2 to 4As shown, the wafer cleaning apparatus also includes a water-blocking component 731. The water-blocking component 731 is located at the upper end of the first door body 14, and together with the first door body 14, forms a third water-blocking groove 73. When the first door body 14 blocks the outlet 112, the third water-blocking groove 73 is positioned relative to the second water-blocking groove 72, closer to the center of the mounting chamber 113. Therefore, the first water-blocking groove 71, the second water-blocking groove 72, and the third water-blocking groove 73 are horizontally offset, further increasing the receiving range of the cleaning fluid by the water-blocking structure 7. When cleaning the wafer, some of the cleaning fluid used for cleaning the wafer will splash towards the inner wall of the main housing 11 under centrifugal force. Some of the splashed cleaning fluid will adhere to the inner wall of the main housing 11, while another portion may not adhere to the inner wall of the main housing 11 but will temporarily float within the mounting chamber 113. The attached cleaning fluid will flow along the inner wall of the main housing 11 and be collected by the first water baffle 71. The cleaning fluid that is temporarily suspended in the mounting chamber 113 will drip down under the action of gravity and be collected by the second water baffle 72 and the third water baffle 73. By increasing the receiving range of the cleaning fluid by the water baffle structure 7, the cleaning fluid dripping and contaminating the wafer can be further avoided.
[0050] For example, the water-blocking member 731 includes an L-shaped bent plate.
[0051] In other embodiments, the water-blocking member 731 includes a horizontal plate and a vertical plate. The horizontal plate is vertically disposed on the upper side wall of the first door body 14, and the vertical plate extends vertically and is disposed at the end of the horizontal plate away from the first door body 14. The horizontal plate and the vertical plate surround to form a third water-blocking groove 73. When it is necessary to clean the wafer, the first door body 14 is first raised and lowered to open the take-out outlet 112. After the wafer is placed in the mounting chamber 113, the first door body 14 is raised and lowered again to block the take-out outlet 112. At this time, the first door body 14 is in a closed state, and the horizontal plate abuts against the lower end of the second water-blocking plate 712, so that the third water-blocking groove 73 can wrap around the outside of the second water-blocking groove 72. When the second water-blocking groove 72 is full of cleaning fluid, some of the overflowing cleaning fluid can be received by the third water-blocking groove 73, enhancing the collection effect of the cleaning fluid. When the outlet 112 is opened, the first door 14 will move the third water baffle 73 vertically downwards, and the cleaning fluid collected in the third water baffle 73 will be carried away, thereby preventing the cleaning fluid from dripping onto the wafer.
[0052] Example 2
[0053] This embodiment provides a wafer cleaning apparatus, such as... Figures 1 to 3As shown, the wafer cleaning apparatus includes a main housing 11 and a first door 14. A mounting chamber 113 is provided within the main housing 11, and an outlet 112 communicating with the mounting chamber 113 is provided on the side wall of the main housing 11. The mounting chamber is configured for cleaning wafers, and the first door 14 is vertically and flexibly disposed within the mounting chamber 113 to block or open the outlet 112. A water-blocking structure 7, as described above, is provided within the mounting chamber 113 above the outlet 112.
[0054] like Figure 1 and Figure 2 As shown, the wafer cleaning apparatus also includes a second door 12, a third door 13, and an exhaust pipe 16. The second door 12 is vertically and flexibly disposed on the outer side of the main housing 11 and can block the outer end of the opening channel 111. The second door is also vertically and flexibly disposed on the inner side of the main housing 11 and can block the inner end of the opening channel 111. The second door 12, the third door 13, and the opening channel 111 can together form an exhaust cavity. The exhaust pipe 16 is disposed on the outer side of the main housing 11, with one end connected to the exhaust cavity and the other end configured to connect to a gas recovery and processing device.
[0055] When cleaning the wafer, the second gate 12 and the third gate 13 are first raised and lowered to open the opening channel 111, allowing the wafer to be fed into the mounting chamber 113 through the opening channel 111. Then, the second gate 12 and the third gate 13 are raised and lowered again to block both the outer and inner ends of the opening channel 111, allowing the wafer cleaning operation to proceed within the mounting chamber 113. During wafer cleaning, oxidizing gas is introduced into the mounting chamber 113. By setting the second gate 12 and the third gate 13, they form an exit cavity with the opening channel 111. During the cleaning process, some gas will overflow from the installation chamber 113 through the gap between the inner wall of the third door 13 and the main housing 11, and enter the outlet chamber through the gap between the third door 13 and the inner end of the opening channel 111. Since the exhaust pipe 16 is connected to the opening channel 111, the outlet chamber can be connected to the exhaust pipe 16. The overflowing gas will be drawn by the exhaust pipe 16 to the gas recovery and treatment equipment for centralized treatment, which can prevent gas from leaking directly from the opening channel 111 and avoid affecting the health of on-site personnel. In addition, when the exhaust pipe 16 vents the outlet chamber, a negative pressure environment is formed inside the outlet chamber. At this time, even if there is a gap between the outer wall of the second door 12 and the main housing 11, the gas in the outlet chamber will not leak from the gap.
[0056] In this embodiment, the main housing 11 is composed of a first housing 114 and a second housing 115, which together form an installation chamber 113. The first housing 114 is fastened to the second housing 115, and the connecting bolts pass through the first housing 114 and the second housing 115 and are connected with nuts.
[0057] Optionally, such as Figure 1 and Figure 2 As shown, the wafer cleaning apparatus also includes an exhaust duct 18. The exhaust duct 18 is located outside the main housing 11, with one end connected to the outlet cavity and the other end connected to the exhaust pipe 16. When cleaning the wafer, the second door 12 blocks the outer end of the opening channel 111, and the third door 13 blocks the inner end of the opening channel 111. Some oxidizing and protective gases overflow from the mounting chamber 113 and enter the outlet cavity through the gap between the third door 13 and the inner end of the opening channel 111. The outlet cavity is connected to the exhaust pipe 16 via the exhaust duct 18, so this portion of gas will enter the exhaust pipe 16 through the exhaust duct 18. The exhaust pipe 16 then extracts and discharges the overflowing gas to the gas treatment area for centralized gas treatment, preventing direct gas leakage from affecting the health of on-site personnel. Furthermore, the exhaust duct 18 provides a buffer zone for the overflowing gas, facilitating smoother gas extraction and reducing the impact on the system caused by sudden airflow changes.
[0058] Optionally, such as Figure 1 and Figure 2 As shown, the wafer cleaning apparatus also includes multiple limiting components 3. These limiting components 3 are horizontally positioned on both sides of the opening channel 111. The limiting components 3 can move towards or away from the opening channel 111 to press or release the second door 12. When the opening channel 111 needs to be blocked, the second door 12 and the third door 13 are raised and lowered, so that the second door 12 blocks the outer end of the opening channel 111, and the third door 13 blocks the inner end. Then, the limiting components 3 are controlled to move towards the opening channel 111, pressing the second door 12, thereby further improving the sealing performance of the second door 12 on the opening channel 111. When the opening channel 111 needs to be opened, the limiting components 3 can be controlled to move away from the opening channel 111, releasing the second door 12. Then, the second door 12 and the third door 13 are raised and lowered again to move them away from the opening channel 111.
[0059] In this embodiment, two limiting components 3 are provided, which are respectively disposed on both sides of the opening channel 111. This allows the pressure pressing the second door 12 to be evenly distributed, ensuring the pressing effect and thus ensuring the sealing of the opening channel 111 by the second door 12. In other embodiments, more than two limiting components 3 may be provided as needed, which is not limited here.
[0060] Optionally, such as Figure 1 and Figure 2As shown, the limiting assembly 3 includes a first drive mechanism 31 and a limiting pressure plate 32. The housing of the first drive mechanism 31 is disposed on the main housing 11, and the output end of the first drive mechanism 31 is connected to the limiting pressure plate 32 for driving the limiting pressure plate 32 to move in a direction close to or away from the opening channel 111. When the opening channel 111 is blocked, the first drive mechanism 31 is activated, and the first drive mechanism 31 drives the limiting pressure plate 32 to move in a direction close to the opening channel 111, so that the first limiting pressure plate 32 presses the second door body 12, thereby enhancing the sealing of the installation chamber 113, preventing the leakage of oxidizing gas and protective gas in the installation chamber 113, preventing environmental pollution, and ensuring the health of the staff.
[0061] When it is necessary to open the opening channel 111, the first drive mechanism 31 drives the limiting pressure plate 32 to move away from the opening channel 111, so that the limiting pressure plate 32 releases the second door 12, thereby enabling the second door 12 to rise and fall vertically and move away from the opening channel 111. Then, the third door 13 is controlled to rise and fall vertically and move away from the opening channel 111, thus opening the channel 111.
[0062] For example, the first drive mechanism 31 includes a cylinder or an electric cylinder, etc.
[0063] Optionally, the wafer cleaning apparatus also includes a seal. The seal is circumferentially arranged around the side of the opening channel 111 facing the second door 12. By providing the seal, the airtightness of the second door 12 to the opening channel 111 can be further improved, thereby preventing direct leakage of oxidizing gas and protective gas in the exhaust cavity and avoiding impact on the health of on-site personnel.
[0064] For example, the seal includes a rubber strip.
[0065] Optionally, such as Figure 1 and Figure 2 As shown, the wafer cleaning apparatus also includes an air supply filter assembly 6. The air supply filter assembly 6 is mounted on the main housing 11 and communicates with the mounting chamber 113. The air supply filter assembly 6 can introduce clean air into the mounting chamber 113. While cleaning the wafer, the air supply filter assembly 6 is activated to introduce air into the mounting chamber 113, and simultaneously filters the introduced air, thereby ensuring that clean air enters the mounting chamber 113. This prevents airborne contaminants from adhering to the wafer surface, avoids increased cleaning time due to wafer contamination, and improves work efficiency.
[0066] In this embodiment, the air supply and filtration assembly 6 includes an air supply fan and a filter that are interconnected.
[0067] like Figure 1 , Figure 2 and Figure 5As shown, the rotating unit 2 includes a second driving mechanism 21 and a mounting base 22. The housing of the second driving mechanism 21 is disposed within the mounting chamber 113, and the output end of the second driving mechanism 21 is connected to the mounting base 22 for transmission. The wafer is disposed on the mounting base 22 and is vertically spaced from the upper surface of the mounting base 22. The second driving mechanism 21 is used to drive the mounting base 22 to rotate around a vertical axis, so that the mounting base 22 clamps the wafer. A cleaning unit is disposed within the mounting chamber 113. The cleaning unit is used to spray cleaning fluid onto the wafer and to introduce oxidizing gas and protective gas into the mounting chamber 113.
[0068] For example, the second drive mechanism 21 includes a rotary motor.
[0069] Optionally, such as Figure 1 , Figure 2 and Figure 5 As shown, the mounting base 22 includes a base 221, multiple flanges 222, and multiple clamping members 223. The base 221 is drively connected to the output end of the second drive mechanism 21. The multiple flanges 222 are circumferentially spaced on the base 221, and each flange 222 corresponds to one of the multiple clamping members 223. Each clamping member 223 includes a clamping rod and a swing ball. The clamping rod is rotatably mounted on the flange 222, and the swing ball is located at the lower end of the clamping rod. The clamping rod has a locking state that clamps against the wafer and a releasing state that releases the wafer. When cleaning the wafer, the wafer is placed on the flange 222, that is, the edge of the wafer overlaps with the flange 222. At this time, the clamping rod is not clamped to the wafer and the clamping rod is in a released state. Then, the second drive mechanism 21 drives the base 221 to rotate vertically, and then the base 221 drives the flange 222 and the clamping member 223 to rotate vertically. When the clamping member 223 rotates vertically, since the swing ball is set at the lower end of the clamping rod, the upper end of the clamping rod is less heavy than the lower end, so that the clamping rod rotates horizontally, thereby clamping the clamping rod to the edge of the wafer, realizing the clamping of the wafer and preventing the wafer from falling off the mounting base 22 due to rotation.
[0070] In this embodiment, three flanges 222 are provided, and correspondingly three clamping members 223 are provided. The three flanges 222 are evenly spaced circumferentially, so that the clamping force of the clamping rod on the wafer can be evenly distributed, ensuring the wafer clamping effect. In other embodiments, two or more flanges 222 and correspondingly two or more clamping members 223 may be provided as needed, which is not limited here.
[0071] Optionally, such as Figure 1 and Figure 2As shown, the wafer cleaning apparatus also includes a third drive mechanism 17. The housing of the third drive mechanism 17 is mounted on the main housing 11, and the output end of the third drive mechanism 17 is connected to the second door 12 for driving the second door 12 to move vertically. When it is necessary to open or block the outer end of the opening channel 111, the third drive mechanism 17 is driven to drive the second door 12 to move vertically up and down.
[0072] For example, the third drive mechanism 17 includes a cylinder or an electric cylinder, etc.
[0073] Optionally, such as Figure 1 , Figure 2 and Figure 5 As shown, the wafer cleaning apparatus also protects the protective assembly 5. The protective assembly 5 includes a fourth drive mechanism 51 and a protective cover 52. The housing of the fourth drive mechanism 51 is disposed within the mounting chamber 113, and the output end of the fourth drive mechanism 51 is connected to the protective cover 52 for driving the protective cover 52 to move vertically. The protective cover 52 surrounds the mounting base 22 circumferentially, and the protective cover 52 has an enclosing state that covers the mounting base 22 and a separated state that is away from the mounting base 22. When cleaning the wafer, the opening channel 111 needs to be opened first. At the same time, the fourth drive mechanism 51 drives the protective cover 52 to move vertically away from the mounting base 22. At this time, the protective cover 52 is in a separated state, and the outside of the mounting base 22 is unobstructed, making it easy to place the wafer on the mounting base 22. Then, the fourth drive mechanism 51 drives the protective cover 52 to move vertically again, so that it covers the mounting base 22. At this time, the protective cover 52 is in an enclosed state, that is, the mounting base 22 is covered by the protective cover 52. Then, the second drive mechanism 21 drives the mounting base 22 to rotate, and at the same time sprays cleaning fluid onto the wafer for cleaning. At this time, the protective cover 52 can stop the cleaning fluid that is splashed due to rotation, and prevent the cleaning fluid from adhering to the inner wall of the main housing 11. When the wafer is taken out from the second opening 112, the possibility of cleaning fluid dripping onto the wafer is reduced, preventing the wafer from being contaminated, reducing the number of cleaning times, and improving work efficiency.
[0074] For example, the fourth drive mechanism 51 includes a cylinder or an electric cylinder, etc.
[0075] Optionally, the cleaning unit includes a first nozzle and a second nozzle. The first nozzle is disposed within the mounting chamber 113, and its vertical height is higher than that of the base 221. It is used to spray cleaning fluid onto the upper surface of the wafer and to introduce oxidizing gas into the mounting chamber 113. The second nozzle is disposed on the side of the base 221 facing the wafer. It is used to spray cleaning fluid onto the lower surface of the wafer and to introduce protective gas into the mounting chamber 113.
[0076] For example, the oxidizing gas includes ozone, and the protective gas includes nitrogen.
[0077] Optionally, the cleaning unit further includes a rotary drive mechanism, a rotating rod, and a third nozzle. The housing of the rotary drive mechanism is located within the mounting chamber, and the output end of the rotary drive mechanism is connected to the rotating rod for driving the rotating rod to rotate vertically. The third nozzle is located at the end of the rotating rod opposite to the rotary drive mechanism and is used to spray the two fluids onto the wafer. After the cleaning fluid has cleaned the wafer, the rotary drive mechanism is controlled to rotate the rotating rod, while the third nozzle sprays the two fluids onto the wafer, thereby further cleaning the wafer.
[0078] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. A water-blocking structure configured to be disposed within a wafer cleaning apparatus, the wafer cleaning apparatus comprising a main housing (11) and a first door (14), wherein the main housing (11) is provided with an installation chamber (113), and the side wall of the main housing (11) is provided with an outlet (112) communicating with the installation chamber (113), the installation chamber being configured for cleaning wafers, and the first door (14) being vertically and vertically disposed within the installation chamber (113) to block or open the outlet (112), characterized in that, The water-blocking structure includes: The first water-blocking groove (71) is disposed on the inner wall of the main housing (11). The first water-blocking groove (71) is higher than the upper end of the outlet (112), and the opening of the first water-blocking groove (71) is set upward. The second water baffle (72) is disposed on the inner wall of the main housing (11). The second water baffle (72) is lower than the first water baffle (71) and higher than the upper end of the outlet (112). The opening of the second water baffle (72) is arranged facing upward. The second water baffle (72) is disposed near the center of the mounting chamber (113) relative to the first water baffle (71).
2. The water-blocking structure according to claim 1, characterized in that, The water-blocking structure (7) further includes a first water-blocking plate (711), a second water-blocking plate (712), and a third water-blocking plate (721). One end of the first water-blocking plate (711) is connected to the inner wall of the main shell (11), and the other end is connected to the second water-blocking plate (712). The second water-blocking plate (712) extends vertically. The inner wall of the main shell (11), the first water-blocking plate (711), and the second water-blocking plate (712) surround to form the first water-blocking groove (71). The third water-blocking plate (721) is disposed at the end of the second water-blocking plate (712) away from the first water-blocking plate (711). The third water-blocking plate (721) and the second water-blocking plate (712) surround to form the second water-blocking groove (72).
3. The water-blocking structure according to claim 2, characterized in that, At least one end of the second water baffle (712) is provided with a first water flow gap, and at least one end of the third water baffle (721) is provided with a second water flow gap.
4. The water-blocking structure according to claim 3, characterized in that, The first end of the second baffle plate (712) is provided with the first water flow notch. The second baffle plate (712) is inclined relative to the horizontal direction, and the first end of the second baffle plate (712) is located at the lower end. The third baffle plate (721) is provided with the second water flow notch at its first end. The third baffle plate (721) is inclined relative to the horizontal direction, and the first end of the third baffle plate (721) is located at the lower end.
5. The water-blocking structure according to claim 2, characterized in that, The water-blocking structure (7) further includes a fourth water-blocking plate (722), which is disposed at the end of the third water-blocking plate (721) away from the second water-blocking plate (712) and extends vertically. The second water-blocking plate (712), the third water-blocking plate (721) and the fourth water-blocking plate (722) surround to form the second water-blocking groove (72).
6. The water-blocking structure according to claim 2, characterized in that, The water-blocking structure also includes a water-blocking component (731), which is disposed at the upper end of the first door body (14). The water-blocking component (731) and the first door body (14) form a third water-blocking groove (73). When the first door body (14) blocks the outlet (112), the third water-blocking groove (73) is disposed near the center of the installation chamber (113) relative to the second water-blocking groove (72).
7. The water-blocking structure according to claim 6, characterized in that, The water-blocking component (731) includes a horizontal plate and a vertical plate. The horizontal plate is vertically disposed on the side wall of the upper end of the first door body (14). The vertical plate extends vertically and is disposed at the end of the horizontal plate away from the first door body (14). The horizontal plate and the vertical plate surround to form a third water-blocking groove (73).
8. The water-blocking structure according to claim 7, characterized in that, When the first door (14) is in the closed state, the horizontal plate abuts against the lower end of the second baffle plate (712).
9. A wafer cleaning apparatus, characterized in that, The wafer cleaning apparatus includes a main housing (11) and a first door (14). The main housing (11) is provided with an installation chamber (113). The side wall of the main housing (11) is provided with an outlet (112) communicating with the installation chamber (113). The installation chamber is configured for cleaning wafers. The first door (14) is vertically and vertically disposed in the installation chamber (113) to block or open the outlet (112). The installation chamber (113) is provided with a water-blocking structure as described in any one of claims 1-8 above the outlet (112).
10. The wafer cleaning apparatus according to claim 9, characterized in that, The wafer cleaning device further includes a second door (12), a third door (13), and an exhaust pipe (16). The main housing (11) is provided with an opening channel (111) communicating with the mounting chamber (113). The second door (12) is movably disposed on the outer side of the main housing (11) and can block the outer end of the opening channel (111). The third door (13) is movably disposed on the inner side of the main housing (11) and can block the inner end of the opening channel (111). The second door (12), the third door (13), and the opening channel (111) can jointly form an exhaust cavity. The exhaust pipe (16) is disposed on the outside of the main housing (11). One end of the exhaust pipe is connected to the exhaust cavity, and the other end is configured to be connected to a gas recovery and processing device.