Metal oxide semiconductor (MOS) tube weld leg bending tool

Abstract

The utility model discloses a metal oxide semiconductor (MOS) tube welding pin bending tool which comprises a longitudinal bending mechanism used for longitudinally bending MOS tube pins and a transverse bending mechanism used for transversely bending the MOS tube pins, and the longitudinal bending mechanism comprises a longitudinal bending base used for horizontally fixing an MOS tube and a longitudinal bending pressing block used for bending the MOS tube pins downwards. The transverse bending mechanism comprises a transverse bending base used for horizontally fixing the MOS tube and two rotating arms used for bending pins on the two sides of the MOS tube outwards respectively. According to the utility model, the function of converting the MOS pin into a pin with a required specification can be realized.

Description

Technical Field

[0001] This utility model belongs to the field of tooling, and more specifically, it relates to a tooling for bending the solder feet of a MOS transistor. Background Technology

[0002] With the rapid development of science and technology, the development of electrical devices is also rapidly iterating. However, in some application scenarios, due to the fixed state of the equipment, the PCB design cannot be changed, but the electronic components are no longer in production and cannot be purchased. In this case, tooling is needed to convert the available components into components that can be matched with the original PCB. Regarding the problem of how to convert the pins of the purchased MOSFETs into MOSFET pins that meet the soldering requirements of the original PCB, the current method is generally to manually bend the MOSFET pins. However, manual bending is not only lacking in precision, but it is also difficult to ensure that the bending angle is completely consistent each time. Moreover, manual bending is slow and inefficient, especially in batch bending, which will greatly reduce production efficiency. The force applied during manual bending is difficult to control evenly, which can easily lead to unstable quality. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a simple, low-cost, and easy-to-operate MOS tube pin bending fixture that can convert MOS tube pins into pins of the required specifications.

[0004] The objective of this utility model is achieved through the following technical solution.

[0005] The present invention relates to a MOS transistor lead bending fixture, comprising a longitudinal bending mechanism for longitudinal bending of MOS transistor leads and a transverse bending mechanism for transverse bending of MOS transistor leads. The longitudinal bending mechanism comprises a longitudinal bending base for horizontally fixing the MOS transistor and a longitudinal bending block for bending the MOS transistor leads downward. The transverse bending mechanism comprises a transverse bending base for horizontally fixing the MOS transistor and two rotating arms that respectively bend the leads on both sides of the MOS transistor outward.

[0006] Furthermore, the longitudinal bending mechanism is used to perform the first bending of the MOS transistor pins, bending all three pins downwards vertically by 90°; the transverse bending mechanism is used to perform the second bending of the MOS transistor pins after the first bending, bending the two outer pins horizontally to both sides at a certain angle of 0 to 90°.

[0007] Furthermore, one end of the upper surface of the longitudinal bending base is provided with a positioning post for fixing the MOS transistor package portion, and the opposite end is provided with a boss. The top of the boss is provided with a pin groove for fixing the MOS transistor pin portion, and the boss portion is provided with a positioning hole for installing the longitudinal bending pressure block.

[0008] Furthermore, a boss integrally formed with the longitudinal bending block is provided on one side, and a positioning connecting post for connecting the longitudinal bending base is provided at the bottom of the boss.

[0009] Furthermore, the longitudinal bending block has a bending groove on its side for cooperating with the pin groove, and a bending block for bending different lengths of MOS tube pins is longitudinally arranged in the bending groove.

[0010] Furthermore, one end of the upper surface of the transverse bending base is provided with a column for fixing the MOS tube package portion, and the opposite end is provided with a limiting groove for installing and limiting two rotating arms. The limiting groove is provided with two rotating holes for installing the two rotating arms, and the bending angle on both sides of the limiting groove for horizontally rotating and limiting the rotating arms is set to 0 to 90°.

[0011] Furthermore, each of the rotating arms has a rotating connecting post at one end of its bottom for positioning and connecting with the rotating hole, and each of the rotating arms has a pin positioning groove for fixing the pin of the MOS tube along its length from one end.

[0012] Compared with the prior art, the beneficial effects of the technical solution of this utility model are:

[0013] The tooling designed in this utility model can meet the product welding requirements, realize bending at a specified length and angle, and convert the MOS transistor pins of a product that is discontinued into MOS transistor pins that can be matched with PCB soldering, so as to achieve the purpose of correct soldering. It has the characteristics of simple composition, low cost, convenient operation and specialization, and can realize the function of converting MOS pins into pins of required specifications.

[0014] This invention can overcome the problems of insufficient precision, slow bending speed, and low efficiency in manual bending, and can also ensure that the bending angle is completely consistent each time, which will greatly improve production efficiency and increase quality stability. Attached Figure Description

[0015] Figure 1 This is the original MOSFET state diagram.

[0016] Figure 2 This is the state diagram of the MOSFET after two bending transformations.

[0017] Figure 3 This is a schematic diagram of the longitudinal bending base in this utility model.

[0018] Figure 4 This is a schematic diagram of the longitudinal bending base and the two MOS transistors assembled in this utility model.

[0019] Figure 5This is a schematic diagram of the longitudinal bending pressure block in this utility model.

[0020] Figure 6 This is a schematic diagram of the longitudinal bending pressure block assembly in this utility model.

[0021] Figure 7 This is a schematic diagram of the first bending and pressing of two MOSFETs using a longitudinal bending mechanism.

[0022] Figure 8 This is a diagram showing the state of the two MOSFETs after their first bend.

[0023] Figure 9 This is a schematic diagram of the transverse bending mechanism in this utility model.

[0024] Figure 10 This is a schematic diagram of the structure of the transverse bending base in this utility model.

[0025] Figure 11 This is a schematic diagram of the structure of the two rotating arms in this utility model.

[0026] Figure 12 This is a schematic diagram of the MOSFET after the first bend installed using a horizontal bending mechanism.

[0027] Figure 13 This is a schematic diagram of the second bend of the MOSFET by the lateral bending mechanism.

[0028] Figure 14 This is a schematic diagram of the finished MOSFET after the second bending.

[0029] Figure 15 This is a diagram illustrating the welding and application of a MOSFET after two bends.

[0030] Reference numerals: 1-MOS transistor; 21-Longitudinal bending base, 211-Positioning post, 212-Pin groove, 213-Positioning hole; 22-Longitudinal bending pressure block, 221-Positioning connecting post, 222-Bending groove, 223-Bending block; 31-Transverse bending base, 311-Post, 312-Limiting groove, 313-Rotation hole; 32-Rotation arm, 321-Rotation connecting post, 322-Pin positioning groove; 4-PCB board. Detailed Implementation

[0031] The present invention will now be further described with reference to the accompanying drawings.

[0032] This utility model proposes a MOSFET pin bending fixture, which can convert MOSFET pins purchased from a discontinued product into MOSFET pins that can be matched with PCB soldering, thus achieving the purpose of correct soldering.

[0033] This utility model discloses a MOSFET lead bending fixture, mainly comprising a longitudinal bending mechanism for longitudinal bending of MOSFET lead 1 and a transverse bending mechanism for transverse bending of MOSFET lead 1. The longitudinal bending mechanism performs the first bending of the MOSFET lead 1, bending all three leads downwards at a specified angle of 90°. The transverse bending mechanism performs a second bending of the MOSFET lead 1 after the first bending; depending on the welding requirements, the outer two leads can be bent horizontally to both sides at an angle of 0–90°, such as 31°. The original MOSFET state is as follows. Figure 1 As shown, the final state of the MOSFET after conversion is as follows: Figure 2 As shown.

[0034] The longitudinal bending mechanism includes a longitudinal bending base 21 for horizontally fixing the MOSFET 1 and a longitudinal bending pressure block 22 for downward bending the pins of the MOSFET 1. Figure 3 As shown, one end of the upper surface of the longitudinal bending base 21 is provided with a positioning post 211 for fixing the package portion of the MOS transistor 1, and the opposite end is provided with a boss integrally formed with it. The top of the boss is provided with a pin groove 212 for fixing the pin portion of the MOS transistor 1, and the boss portion is provided with a positioning hole 213 for installing the longitudinal bending pressure block 22. Here, one positioning post 211 can correspond to a set of pin grooves 212, which are used together to install one MOS transistor 1. Preferably, two sets are provided. For example, if the MOS transistor 1 has three pins, a set of pin grooves 212 contains three grooves. The installation diagram of the MOS transistor is shown in Figure 4. It should be noted that by designing the length of the exposed pins of the MOS transistor 1 after installation, the first bend of the pins of the MOS transistor 1 at a specified size can be achieved.

[0035] like Figure 5 As shown, a boss integrally formed with the longitudinal bending block 22 is provided on one side of the boss. A positioning connecting post 221 integrally formed with the boss is provided at the bottom of the boss. The positioning connecting post 221 corresponds to and engages with the positioning hole 213 of the longitudinal bending base 21, realizing the installation connection between the longitudinal bending base 21 and the longitudinal bending block 22. When installing the longitudinal bending block 22, the pins of the MOS transistor 1 are pressed downwards, bending to 90°. The longitudinal bending base 21 is placed on a horizontal workbench, and then the two MOS transistors 1 are placed in the designated positions (positioning post 211 and corresponding pin slots 212). Then, the longitudinal bending block 22 is pressed... Figure 6 , Figure 7 After pressing as shown, remove the longitudinal bending block 22, and then remove the two MOS transistors 1 for later use.

[0036] Preferably, the longitudinal bending block 22 may also have a longitudinally formed bending groove 222 on its side, with one set of bending grooves 222 corresponding to one set of pin grooves 212. A bending block 223 integrally formed therewith may also be longitudinally arranged within the bending groove 222, allowing for bending of different lengths of the three pins of the MOS transistor 1 according to bending requirements, such as... Figure 8 As shown, the bending block 223 is longitudinally positioned in the middle of the bending groove 222. After the first bending of the pin of MOS transistor 1, the middle pin is shorter and the pins on both sides are longer.

[0037] like Figure 9 As shown, the lateral bending mechanism includes a lateral bending base 31 for horizontally fixing the MOS transistor 1 and two rotating arms 32 that bend the pins of the MOS transistor 1 outwards respectively.

[0038] like Figure 10 As shown, one end of the upper surface of the transverse bending base 31 is provided with a column 311 for fixing the package portion of the MOS transistor 1, and the other end is provided with a limiting groove 312 for installing and limiting two rotating arms 32. The limiting groove 312 is provided with two rotating holes 313 for installing the two rotating arms 32. The bending angle on both sides of the limiting groove 312 for horizontally rotating and limiting the rotating arms 32 is set to 0 to 90°, for example, 31°.

[0039] like Figure 11 As shown, each of the rotating arms 32 has a rotating connecting post 321 at one end for positioning and connecting with the rotating hole 313. Each rotating arm 32 has a pin positioning groove 322 for fixing the pin of the MOS transistor 1 along its length from one end. Each pin positioning groove 322 is opened from the end where the rotating connecting post 321 is located along the length of the rotating arm 32. Preferably, the two rotating arms 32 can be set to one long and one short for easy rotation.

[0040] like Figure 12 As shown, after the MOS transistor 1 is installed following the first bend, its two side pins are respectively located in the pin positioning grooves 322 of the two rotating arms 32, and the middle pin is located in the gap between the two rotating arms 32. Then, according to... Figure 13 As shown, rotate the two rotating arms 32 horizontally outwards until they can no longer rotate. This will bend the pins of MOSFET 1 horizontally outwards to a specified angle (e.g., 31°). Finally, remove MOSFET 1. Figure 14 As shown, the converted MOSFET is soldered onto PCB board 4 as illustrated. Figure 15 As shown. Currently, there are no bending fixtures for this type of MOSFET on the market. The fixture designed in this invention can meet the product welding requirements and has the characteristics of low cost and specialization.

[0041] Although the present invention has been described above in conjunction with the accompanying drawings, the present invention is not limited to the above description. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims, and all such forms shall fall within the protection scope of the present invention.

Claims

1. A MOSFET lead bending fixture, characterized in that, It includes a longitudinal bending mechanism for longitudinally bending the pins of the MOS transistor (1) and a transverse bending mechanism for laterally bending the pins of the MOS transistor (1). The longitudinal bending mechanism includes a longitudinal bending base (21) for horizontally fixing the MOS transistor (1) and a longitudinal bending pressure block (22) for bending the pins of the MOS transistor (1) downwards. The transverse bending mechanism includes a transverse bending base (31) for horizontally fixing the MOS transistor (1) and two rotating arms (32) for bending the pins of the MOS transistor (1) outwards on both sides respectively.

2. The MOS transistor lead bending fixture according to claim 1, characterized in that, The longitudinal bending mechanism is used to perform the first bending of the pins of the MOS transistor (1), bending all three pins downward vertically by 90°; the transverse bending mechanism is used to perform the second bending of the pins of the MOS transistor (1) after the first bending, bending the two outer pins horizontally to both sides at a certain angle of 0 to 90°.

3. The MOS transistor lead bending fixture according to claim 1, characterized in that, The longitudinal bending base (21) has a positioning post (211) for fixing the package portion of the MOS transistor (1) at one end of its upper surface, and a boss at the other end. The top of the boss has a pin groove (212) for fixing the pin portion of the MOS transistor (1), and the boss has a positioning hole (213) for installing the longitudinal bending pressure block (22).

4. The MOS transistor lead bending fixture according to claim 1, characterized in that, The longitudinal bending block (22) has a boss integrally formed on one side, and the bottom of the boss is provided with a positioning connecting post (221) for connecting the longitudinal bending base (21).

5. The MOS transistor lead bending fixture according to claim 3 or 4, characterized in that, The longitudinal bending block (22) has a bending groove (222) on its side for cooperating with the pin groove (212), and a bending block (223) for bending the pin of the MOS tube (1) to different lengths is arranged in the bending groove (222).

6. The MOS transistor lead bending fixture according to claim 1, characterized in that, One end of the upper surface of the transverse bending base (31) is provided with a column (311) for fixing the package portion of the MOS transistor (1), and the other end is provided with a limiting groove (312) for installing and limiting two rotating arms (32). The limiting groove (312) is provided with two rotating holes (313) for installing the two rotating arms (32). The bending angle on both sides of the limiting groove (312) for horizontally rotating and limiting the rotating arms (32) is set to 0 to 90°.

7. The MOS transistor lead bending fixture according to claim 1, characterized in that, Each of the rotating arms (32) has a rotating connecting post (321) at one end of its bottom for positioning and connecting with the rotating hole (313), and each of the rotating arms (32) has a pin positioning groove (322) for fixing the pin of the MOS tube (1) along its length from one end.

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