Wafer reflow device and reflow soldering machine table
By designing a wafer reflow device and utilizing a positioning mechanism and an infrared heater, the problems of wafer jitter and contamination during reflow soldering were solved, thereby improving the bonding of the solder layers and the soldering quality.
Patent Information
- Application Number
- CN202520171641.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-24
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-01-24
AI Technical Summary
In traditional reflow soldering, the wafer is prone to vibration on the conveyor belt, resulting in poor bonding of the solder layers. At the same time, the exposed wafer on the conveyor belt is easily contaminated by flux, affecting the soldering quality.
Design a wafer reflow device including a wafer placement box, a transport track and multiple pedestals. The pedestals are provided with preheating, heating and cooling grooves. Combined with a positioning mechanism, the wafer is stably positioned in each groove. Infrared heaters are used for uniform heating, and the wafer is fixed with adhesive film to reduce contamination.
It effectively reduces solder layer bonding problems caused by wafer jitter and reduces flux residue contamination of the wafer, thus improving reflow soldering quality.
Smart Images
Figure CN223833618U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of reflow soldering technology, and more specifically, to a wafer reflow device and a reflow soldering machine. Background Technology
[0002] With the rapid development of the semiconductor industry, wafer microbump structures primarily utilize electroplating to form a metal layer (copper / tin layer) on the wafer pad surface, followed by reflow soldering using a reflow soldering machine, resulting in a solder ball structure. Traditional reflow structures typically place the wafer on a conveyor belt for heating and reflow. Because the conveyor belt needs to be transported along a specific direction, the wafer's position cannot be stably fixed during heating, leading to wafer jitter. This jitter can easily result in poor solder layer adhesion. Furthermore, placing the wafer bare on the conveyor belt allows flux residue on the belt to easily contaminate the wafer, affecting the quality of the reflow soldering. Utility Model Content
[0003] The purpose of this invention is to provide a wafer reflow apparatus and a reflow soldering machine that can improve the bonding of the solder layer and reduce wafer contamination caused by flux residue, thereby improving the quality of wafer reflow soldering.
[0004] The embodiments of this utility model can be implemented as follows:
[0005] In a first aspect, this utility model provides a wafer reflow apparatus, including a wafer placement box, a transport track, and a preheating platform, a reflow platform, and a cooling platform arranged sequentially. The preheating platform is provided with a preheating groove, the reflow platform is provided with a heating groove, and the cooling platform is provided with a cooling groove. The edges of the preheating groove, the heating groove, and the cooling groove are all provided with a first positioning mechanism. The transport track passes sequentially through the preheating platform, the reflow platform, and the cooling platform. The wafer placement box is slidably disposed on the transport track and configured to pass sequentially along the transport track through the preheating groove, the heating groove, and the cooling groove. The edge of the wafer placement box is provided with a second positioning mechanism, which is configured to cooperate with the first positioning mechanism to position the wafer placement box at the preheating groove, the heating groove, or the cooling groove.
[0006] In an optional embodiment, the first positioning mechanism includes a positioning lifting shaft, and the second positioning mechanism includes a positioning hole, wherein the positioning lifting shaft is configured to move up and down and is correspondingly engaged in the positioning hole.
[0007] In an optional embodiment, the wafer placement box is provided with a wafer placement slot for accommodating the wafer, the positioning hole is provided on both sides of the wafer placement slot, and the positioning lifting shaft is provided on both sides of the preheating groove, both sides of the heating groove and both sides of the cooling groove.
[0008] In an optional embodiment, the wafer placement slot is disposed on the bottom side of the wafer placement box, and the opening of the wafer placement slot faces downward, so that the wafer is accommodated in the preheating groove, the heating groove, or the cooling groove, and the wafer placement slot is configured to fix and bond the wafer using an adhesive film.
[0009] In an optional embodiment, an infrared heater is provided in the reflow stage, the infrared heater being located at the bottom of the heating groove and configured to be spaced apart from the wafer.
[0010] In an optional embodiment, there are two transport tracks, which are arranged in parallel and located on both sides of the preheating groove, the heating groove, and the cooling groove. The two sides of the wafer placement box are slidably engaged with the two transport tracks respectively.
[0011] In an optional embodiment, the wafer placement box is provided with sliding lugs on both sides, the sliding lugs are slidably mounted on the two transport tracks, and the positioning holes are provided on the sliding lugs.
[0012] In an optional embodiment, the transmission track is rod-shaped, the sliding lug is provided with a groove, the groove is slidably engaged with the transmission track, and the positioning hole is located inside the groove.
[0013] In an optional embodiment, the preheating platform, the reflux platform, and the cooling platform are all provided with transmission channels. The transmission channels are located on both sides of the preheating groove, both sides of the heating groove, and both sides of the cooling groove, and the transmission track is accommodated within the transmission channels.
[0014] Secondly, this utility model provides a reflow soldering machine, including a machine body and a wafer reflow device as described in any of the foregoing embodiments, wherein the preheating platform, the reflow platform and the cooling platform are sequentially and spaced apart on the machine body.
[0015] The beneficial effects of the wafer reflow apparatus and reflow soldering machine provided in this embodiment of the present invention include:
[0016] The wafer reflow apparatus and reflow soldering machine provided in this embodiment of the invention have a preheating groove on the preheating platform, a heating groove on the reflow platform, and a cooling groove on the cooling platform. A first positioning mechanism is provided at the edge of each of the preheating, heating, and cooling grooves. The wafer placement box is slidably mounted on a transport track, and a second positioning mechanism is provided at the edge of the wafer placement box. The first and second positioning mechanisms cooperate to fix the wafer placement box in the preheating, heating, or cooling groove, thereby realizing the preheating, reflow soldering, and cooling processes of the wafer. Compared with the prior art, this invention effectively mitigates the problem of poor wafer soldering layer bonding caused by vibration through the positioning of the wafer placement box. Simultaneously, the use of the wafer placement box to accommodate the wafer effectively reduces wafer contamination caused by solder resist residue. Attached Figure Description
[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of the wafer reflow apparatus provided in this embodiment;
[0019] Figure 2 This is a schematic diagram of the assembly structure of the wafer reflow device provided in this embodiment;
[0020] Figure 3 for Figure 1 A schematic diagram of the assembly structure of the wafer placement box.
[0021] Icons: 100-Wafer reflow device; 110-Wafer placement box; 111-Wafer placement slot; 112-Sliding lug; 113-Slide groove; 120-Transfer track; 121-Transfer channel; 130-Preheating platform; 131-Preheating groove; 140-Reflow platform; 141-Heating groove; 150-Cooling platform; 151-Cooling groove; 160-First positioning mechanism; 161-Positioning hole; 170-Second positioning mechanism; 171-Positioning lifting shaft; 200-Wafer. Detailed Implementation
[0022] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0023] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0024] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0025] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0026] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.
[0027] It should be noted that, where there is no conflict, the features in the embodiments of this utility model can be combined with each other.
[0028] See Figures 1 to 3 This utility model provides a wafer reflow apparatus 100, which can improve the bonding of the solder layer and reduce wafer 200 contamination caused by flux residue, thereby improving the quality of wafer 200 reflow soldering.
[0029] The wafer reflow apparatus 100 provided in this embodiment of the present invention includes a wafer placement box 110, a transport track 120, and a preheating platform 130, a reflow platform 140, and a cooling platform 150 arranged sequentially. The preheating platform 130 has a preheating groove 131, the reflow platform 140 has a heating groove 141, and the cooling platform 150 has a cooling groove 151. A first positioning mechanism 160 is provided at the edge of the preheating groove 131, the edge of the heating groove 141, and the edge of the cooling groove 151. The transport track 120... The wafer placement box 110 passes through the preheating stage 130, the reflow stage 140, and the cooling stage 150. It is slidably disposed on the transport track 120 and configured to pass sequentially through the preheating groove 131, the heating groove 141, and the cooling groove 151 along the transport track 120. The edge of the wafer placement box 110 is provided with a second positioning mechanism 170, which is configured to cooperate with the first positioning mechanism 160 to position the wafer placement box 110 in the preheating groove 131, the heating groove 141, or the cooling groove 151.
[0030] The wafer reflow apparatus 100 provided in this embodiment of the present invention has a preheating stage 130, a reflow stage 140, and a cooling stage 150 spaced apart on the body of a reflow soldering machine. A transport track 120 connects the preheating stage 130, the reflow stage 140, and the cooling stage 150 in series. The wafer placement box 110 can slide along the transport track 120, passing sequentially through the preheating stage 130, the reflow stage 140, and the cooling stage 150. It should be noted that the preheating stage 130 preheats the wafer 200 on the wafer placement box 110 through a preheating groove 131, the reflow stage 140 heats the wafer 200 through a heating groove 141 to achieve reflow soldering, and the cooling stage 150 cools the wafer 200 through a cooling groove 151.
[0031] Furthermore, in this embodiment, the preheating groove 131, the heating groove 141, and the cooling groove 151 are located in different temperature ranges. The set temperature of the preheating groove 131 is typically below 100°C, enabling wetting between the tin layer and the copper layer. Simultaneously, the set temperature of the heating groove 141 is between 220°C and 250°C, enabling the tin layer on wafer 200 to reflow and solidify into tin balls. The set temperature of the cooling groove 151 is below 60°C, enabling cooling of the metal layer and stress relief. It should be noted that the reflow soldering process and implementation principle can be found in relevant descriptions in the prior art.
[0032] In some embodiments, the first positioning mechanism 160 includes a positioning lifting shaft 171, and the second positioning mechanism 170 includes a positioning hole 161. The positioning lifting shaft 171 is configured to move up and down and is correspondingly engaged in the positioning hole 161. Specifically, the positioning lifting shaft 171 can be driven up and down by a driving component such as a micro motor or a micro cylinder. That is, the preheating stage 130, the reflow stage 140, and the cooling stage 150 are all provided with driving components for driving the positioning lifting shaft 171. In actual operation, the wafer placement box 110 can slide along the transfer track 120 to the preheating stage 130, the reflow stage 140, or the cooling stage 150. When it reaches the target position, the positioning lifting shaft 171 can be lifted by the driving component, so that the positioning lifting shaft 171 is correspondingly engaged in the positioning hole 161, thereby enabling the wafer placement box 110 to be positioned on the preheating stage 130, the reflow stage 140, or the cooling stage 150.
[0033] It should be noted that the driving structure and principle of the positioning lifting shaft 171 in this embodiment can refer to the blue film ejector pin structure in the prior art.
[0034] In other preferred embodiments of the present invention, the first positioning mechanism 160 may also include positioning holes 161, and the second positioning mechanism 170 may also include a positioning lifting shaft 171. That is, the driving component is set inside the wafer placement box 110, which can also achieve the positioning and fixing of the wafer placement box 110.
[0035] In some embodiments, the wafer placement cassette 110 is provided with a wafer placement slot 111 for accommodating the wafer 200. Positioning holes 161 are provided on both sides of the wafer placement slot 111, and positioning lifting shafts 171 are provided on both sides of the preheating groove 131, the heating groove 141, and the cooling groove 151. Specifically, the depth of the wafer placement slot 111 is less than the thickness of the wafer 200, so the wafer 200 can protrude from the wafer placement cassette 110, facilitating the placement and removal of the wafer 200. Simultaneously, the wafer placement cassette 110 is provided with two positioning holes 161, and two positioning lifting shafts 171 are correspondingly fitted into the two positioning holes 161, thereby effectively positioning the wafer placement cassette 110 and preventing it from rotating.
[0036] In some embodiments, a wafer placement slot 111 is disposed on the bottom side of the wafer placement box 110, with the opening of the wafer placement slot 111 facing downwards, so that the wafer 200 is accommodated in the preheating groove 131, the heating groove 141, or the cooling groove 151. The wafer placement slot 111 is configured to fix and bond the wafer 200 using an adhesive film. Specifically, the wafer 200 is fixed and bonded to the wafer placement slot 111 using a back adhesive film, which is a high-temperature resistant adhesive layer. The arrangement of the wafer placement slot 111 can further prevent solder resist from contaminating the surface of the wafer 200.
[0037] Furthermore, an infrared heater (not shown) is provided within the reflow stage 140. The infrared heater is located at the bottom of the heating groove 141 and is configured to be spaced apart from the wafer 200. Specifically, there can be multiple infrared heaters distributed on the bottom wall of the heating groove 141, enabling uniform heating of the wafer 200. In addition, the wafer 200 and the bottom wall of the heating groove 141 are spaced apart in this application, forming a groove space at the bottom, improving airflow and better achieving uniform heating of the wafer 200. Furthermore, the temperature control means within the preheating groove 131 and the cooling groove 151 can be the conductor-cooled refrigeration element, thereby effectively controlling their temperature.
[0038] In some embodiments, there are two transport tracks 120, which are arranged in parallel and located on both sides of the preheating groove 131, the heating groove 141, and the cooling groove 151. The two sides of the wafer placement box 110 are slidably engaged with the two transport tracks 120 respectively. Specifically, the two transport tracks 120 are parallel to each other, which can support the two sides of the wafer placement box 110, thereby transporting the wafer placement box 110 more smoothly.
[0039] In some embodiments, sliding lugs 112 are provided on both sides of the wafer placement box 110. The sliding lugs 112 are slidably mounted on two transfer tracks, and positioning holes 161 are provided on the sliding lugs 112. Specifically, the sliding lugs 112 are integrally provided on both sides of the wafer placement box 110, and the positioning holes 161 can penetrate through the sliding lugs 112, thereby ensuring that the positioning lifting shaft 171 can fully limit the position of the sliding lugs 112.
[0040] In some embodiments, the transfer track 120 is rod-shaped, and a sliding lug 112 is provided with a groove 113. The groove 113 slidably engages with the transfer track 120, and the positioning hole 161 is located inside the groove 113. Specifically, the groove 113 can be an open semi-circular arc shape, thus allowing the sliding lug 112 to be easily and quickly assembled onto the transfer track 120. Furthermore, the wafer placement cassette 110 can be moved by a robotic arm or slide automatically along the transfer track 120. When moved by a robotic arm, force can be applied to one side of the wafer placement cassette 110, allowing it to slide along the transfer track 120 using the sliding lug 112. When automatic sliding is used, a drive motor can be provided on the wafer placement cassette 110, and the wafer placement cassette 110 can be driven to slide autonomously via rollers or a rack and pinion mechanism.
[0041] In some embodiments, the preheating platform 130, the reflux platform 140, and the cooling platform 150 are all provided with transfer channels 121. The transfer channels 121 are located on both sides of the preheating groove 131, both sides of the heating groove 141, and both sides of the cooling groove 151, and the transfer track 120 is accommodated within the transfer channels 121. Specifically, the width of the transfer channels 121 needs to be slightly larger than the thickness of the sliding lugs 112, so as to avoid interference between the transfer channels 121 and the sliding of the sliding lugs 112.
[0042] This utility model embodiment also provides a reflow soldering machine, including a machine body and the aforementioned wafer reflow device 100. The wafer reflow device 100 includes a wafer placement box 110, a transport track 120, and a preheating platform 130, a reflow platform 140, and a cooling platform 150 arranged sequentially. A preheating groove 131 is provided on the preheating platform 130, a heating groove 141 is provided on the reflow platform 140, and a cooling groove 151 is provided on the cooling platform 150. The edges of the preheating groove 131, the heating groove 141, and the cooling groove 151 are all provided with first positioning... Positioning mechanism 160, transfer track 120 sequentially passes through preheating stage 130, reflow stage 140 and cooling stage 150, wafer placement box 110 is slidably disposed on transfer track 120 and configured to sequentially pass through preheating groove 131, heating groove 141 and cooling groove 151 along transfer track 120, and a second positioning mechanism 170 is provided on the edge of wafer placement box 110, the second positioning mechanism 170 is configured to cooperate with first positioning mechanism 160 to position wafer placement box 110 in preheating groove 131, heating groove 141 or cooling groove 151. Preheating stage 130, reflow stage 140 and cooling stage 150 are sequentially spaced on the machine body.
[0043] In summary, the wafer reflow apparatus 100 and reflow soldering machine provided in this embodiment of the present invention have a preheating groove 131 on the preheating platform 130, a heating groove 141 on the reflow platform 140, and a cooling groove 151 on the cooling platform 150. A first positioning mechanism 160 is provided at the edge of the preheating groove 131, the edge of the heating groove 141, and the edge of the cooling groove 151. The wafer placement box 110 can be slidably placed on the transfer track 120, and a second positioning mechanism 170 is provided at the edge of the wafer placement box 110. The first positioning mechanism 160 and the second positioning mechanism 170 cooperate to position the wafer placement box 110 in the preheating groove 131, the heating groove 141, or the cooling groove 151, thereby realizing the preheating, reflow soldering, and cooling processes of the wafer 200. Compared to existing technologies, this invention effectively mitigates the problem of poor bonding of the wafer 200 solder layer caused by vibration by positioning the wafer placement box 110. At the same time, by using the wafer placement box 110 to accommodate the wafer 200, the problem of wafer 200 contamination caused by solder resist residue is effectively reduced.
[0044] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.
Claims
1. A wafer reflow apparatus, characterized in that, The device includes a wafer placement box, a transport track, and a preheating stage, a reflow stage, and a cooling stage arranged sequentially. The preheating stage has a preheating groove, the reflow stage has a heating groove, and the cooling stage has a cooling groove. A first positioning mechanism is provided at the edges of the preheating groove, the heating groove, and the cooling groove. The transport track passes sequentially through the preheating stage, the reflow stage, and the cooling stage. The wafer placement box is slidably disposed on the transport track and configured to pass sequentially along the transport track through the preheating groove, the heating groove, and the cooling groove. A second positioning mechanism is provided at the edge of the wafer placement box, configured to cooperate with the first positioning mechanism to position the wafer placement box at the preheating groove, the heating groove, or the cooling groove.
2. The wafer reflow apparatus according to claim 1, characterized in that, The first positioning mechanism includes a positioning lifting shaft, and the second positioning mechanism includes a positioning hole. The positioning lifting shaft is configured to move up and down and is correspondingly engaged in the positioning hole.
3. The wafer reflow apparatus according to claim 2, characterized in that, The wafer placement box is provided with a wafer placement slot for accommodating wafers. The positioning holes are provided on both sides of the wafer placement slot, and the positioning lifting shafts are provided on both sides of the preheating groove, both sides of the heating groove, and both sides of the cooling groove.
4. The wafer reflow apparatus according to claim 3, characterized in that, The wafer placement slot is disposed on the bottom side of the wafer placement box, and the opening of the wafer placement slot faces downward, so that the wafer is accommodated in the preheating groove, the heating groove or the cooling groove, and the wafer placement slot is configured to fix and bond the wafer with an adhesive film.
5. The wafer reflow apparatus according to claim 4, characterized in that, An infrared heater is provided inside the reflow stage. The infrared heater is located at the bottom of the heating groove and is configured to be spaced apart from the wafer.
6. The wafer reflow apparatus according to claim 3, characterized in that, There are two transmission tracks, which are arranged in parallel and located on both sides of the preheating groove, the heating groove, and the cooling groove. The two sides of the wafer placement box are slidably engaged with the two transmission tracks respectively.
7. The wafer reflow apparatus according to claim 6, characterized in that, The wafer placement box has sliding lugs on both sides, which are slidably mounted on the two transmission tracks, and the positioning holes are provided on the sliding lugs.
8. The wafer reflow apparatus according to claim 7, characterized in that, The transmission track is rod-shaped, and the sliding lug is provided with a sliding groove. The sliding groove is slidably fitted onto the transmission track, and the positioning hole is located inside the sliding groove.
9. The wafer reflow apparatus according to claim 6, characterized in that, The preheating platform, the reflux platform, and the cooling platform are all provided with transmission channels. The transmission channels are located on both sides of the preheating groove, both sides of the heating groove, and both sides of the cooling groove. The transmission track is accommodated within the transmission channels.
10. A reflow soldering machine, characterized in that, The device includes a machine body and a wafer reflow apparatus as described in any one of claims 1-9, wherein the preheating platform, the reflow platform, and the cooling platform are sequentially and spaced apart on the machine body.