Positioning and cutting device for wafer processing

Abstract

The utility model discloses a wafer processing positioning cutting device which comprises a supporting plate, a driving assembly, a transmission assembly, a mounting frame, a half gear, a cutter, a toothed plate and a limiting assembly, during cutting, a wafer is placed in a placing groove, the limiting assembly limits and fixes the wafer, the cutting stability is improved, and the cutting efficiency is improved. The driving assembly drives the half gear to rotate and drives the transmission assembly to operate at the same time, the half gear rotates to mesh with the toothed plate to drive the toothed plate to move downwards, at the moment, the spring is stretched to generate elastic force, the toothed plate moves downwards to drive the cutter at the bottom to move downwards to cut the wafer at the bottom, and when the half gear is disengaged from the toothed plate, under the action of the elastic force, the cutter is driven to cut the wafer. When one wafer is not cut, the toothed plate resets to drive the cutter to be away from the wafer, in the process that the cutter is away from the wafer, the transmission assembly drives the supporting rod to rotate, the supporting rod rotates to drive the containing table to rotate, the other wafer which is not cut rotates to the bottom of the cutter, the cutter can cut the wafer conveniently, and the cutting efficiency and quality are improved.

Description

Technical Field

[0001] This utility model relates to a cutting device, specifically a wafer processing positioning and cutting device. Background Technology

[0002] After the wafer undergoes the preceding processes to complete chip fabrication, it still needs to be diced to separate the chips from the wafer before final packaging. This requires a dicing device to separate the chips after wafer processing. However, existing wafer dicing devices lack an effective positioning and clamping mechanism, making the wafer prone to movement during dicing, which is not stable and reliable, thus affecting dicing efficiency and quality. Furthermore, the dicing process requires manual switching on and off of the dicing power supply to change the wafer to be diced, which is time-consuming and labor-intensive. Therefore, it is necessary to design a wafer processing positioning and dicing device to solve this problem. Utility Model Content

[0003] The purpose of this invention is to provide a wafer processing positioning and cutting device to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A wafer processing positioning and cutting device includes a support plate, a mounting frame mounted on the support plate, a support rod rotatably mounted on the support plate, a processing table connected to the end of the support plate away from the support plate, a placement groove mounted on the processing table, a limit component set in the placement groove, a telescopic tube mounted on the mounting frame, a toothed plate mounted on the end of the telescopic tube away from the mounting frame, a half gear meshing on one side of the toothed plate, and a cutter mounted on the bottom of the toothed plate.

[0006] A drive assembly is mounted on the mounting bracket, and the drive assembly is connected to the half gear.

[0007] The mounting bracket is equipped with a transmission assembly, one end of which is connected to the drive assembly and the other end of which is connected to the support rod.

[0008] A spring is fitted onto the telescopic tube, with one end of the spring connected to the mounting bracket and the other end connected to the toothed plate.

[0009] As a further embodiment of this utility model: the drive assembly includes a drive component, which is mounted on a mounting bracket, and a drive shaft is mounted on the output end of the drive component, with a half gear mounted on the drive shaft.

[0010] As a further embodiment of this utility model: the transmission assembly includes a driven shaft, one end of which is rotatably connected to the mounting bracket, and the other end is connected to a half-bevel gear, one side of which is meshed with a driven gear, and the driven gear is mounted on a support rod;

[0011] A connecting unit is installed on the drive shaft, and the end of the connecting unit away from the drive shaft is connected to the driven shaft.

[0012] As a further embodiment of this utility model: the limiting component includes a telescopic member, one end of which is connected to the side wall of the placement groove, and the other end is connected to a limiting plate.

[0013] As a further embodiment of this utility model: a sliding groove is provided on the side wall of the mounting frame, and a sliding plate is slidably installed in the sliding groove. The sliding plate is fixedly connected to the toothed plate. A fixing rod is installed on the mounting frame, and a conveying cavity is installed at the end of the fixing rod away from the mounting frame. A water tank is installed on the support plate, and a connecting pipe is installed on the water tank. The end of the connecting pipe away from the water tank is connected to the conveying cavity. A conveying pipe is installed on the conveying cavity, and a nozzle is connected at the end of the conveying pipe away from the conveying cavity. The nozzle is installed on one side of the cutter. A one-way valve is installed on both the connecting pipe and the conveying pipe. A slider is slidably installed in the conveying cavity, and a pressure rod is installed at the bottom of the sliding plate. The end of the pressure rod away from the sliding plate is connected to the slider.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: When dicing a wafer, the wafer is placed in the placement slot, and the telescopic component drives the connected limiting plate to move towards each other to limit and fix the wafer, improving the stability of the wafer. The driving component drives the connected driving shaft to rotate, and the rotation of the driving shaft drives the connected half gear to rotate. When the half gear rotates and meshes with the toothed plate, it drives the toothed plate to move downward. At this time, the spring is stretched to generate elastic force. The downward movement of the toothed plate drives the cutter at the bottom to move downward to cut the wafer at the bottom. When the half gear disengages from the toothed plate, under the action of elastic force, the toothed plate will reset and drive the cutter away from the wafer. During the process of the cutter moving away from the wafer, the rotation of the driving shaft drives the driven shaft to rotate through the connecting unit. The rotation of the driven shaft drives the half cone The gears rotate, and the half-bevel gear intermittently meshes with the driven gear, causing the support rod to rotate intermittently. The support rod then causes the wafer on the placement platform to rotate intermittently, causing another uncut wafer to rotate to the bottom of the cutter, making it easier for the cutter to cut, thus improving cutting efficiency and quality. The toothed plate moves up and down, causing the slide plate to slide back and forth. The slide plate's back and forth movement causes the slider at one end of the pressure rod to slide back and forth in the conveying chamber. The slider's back and forth movement creates a pressure difference in the conveying chamber. When a negative pressure is generated in the conveying chamber, water from the water tank is transported to the conveying chamber through the connecting pipe. Then, the slider's compression forces the water in the conveying chamber to the nozzle through the conveying pipe. The nozzle sprays water onto the cutting area, thus achieving a cooling and dust reduction effect, improving the practicality of the device. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a wafer processing positioning and cutting device.

[0016] Figure 2This is a schematic diagram of the processing stage in a wafer processing positioning and cutting device.

[0017] Figure 3 This is a schematic diagram of the structure of a half gear in a wafer processing positioning and cutting device.

[0018] In the diagram: 1. Support plate; 2. Mounting bracket; 3. Processing table; 4. Placement table; 5. Telescopic component; 6. Limiting plate; 7. Driving component; 8. Drive shaft; 9. Telescopic tube; 10. Spring; 11. Toothed plate; 12. Half gear; 13. Slide plate; 14. Pressure rod; 15. Conveying chamber; 16. Fixing rod; 17. Slider; 18. Nozzle; 19. One-way valve; 20. Connecting pipe; 21. Connecting unit; 22. Driven shaft; 23. Water tank; 24. Driven gear; 25. Half bevel gear; 26. Support rod. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figures 1-3 As an embodiment of this utility model, a wafer processing positioning and cutting device includes a support plate 1, a mounting frame 2 mounted on the support plate 1, a support rod 26 rotatably mounted on the support plate 1, a processing table 3 connected to the end of the support plate 1 away from the support plate 1, a placement groove mounted on the processing table 3, a limit component provided in the placement groove, a telescopic tube 9 mounted on the mounting frame 2, a toothed plate 11 mounted at the end of the telescopic tube 9 away from the mounting frame 2, a half gear 12 meshing on one side of the toothed plate 11, and a cutter mounted at the bottom of the toothed plate 11;

[0021] A drive assembly is mounted on the mounting bracket 2, and the drive assembly is connected to the half gear 12.

[0022] A transmission assembly is installed on the mounting bracket 2. One end of the transmission assembly is connected to the drive assembly, and the other end is connected to the support rod 26.

[0023] A spring 10 is fitted onto the telescopic tube 9. One end of the spring 10 is connected to the mounting bracket 2, and the other end is connected to the toothed plate 11.

[0024] In this embodiment, when dicing the wafer, the wafer is placed in the placement slot and fixed by the installed limiting component to improve the stability of the dicing. The installed drive component drives the half gear 12 to rotate and simultaneously drives the transmission component to operate. When the half gear 12 rotates and meshes with the toothed plate 11, it drives the toothed plate 11 to move downward. At this time, the spring 10 is stretched to generate elastic force. The downward movement of the toothed plate 11 drives the bottom cutter to move downward to cut the wafer at the bottom. When the half gear 12 disengages from the toothed plate 11, the toothed plate 11 will reset under the action of elastic force, driving the cutter away from the wafer. During the process of the cutter moving away from the wafer, the transmission component drives the support rod 26 to rotate. The rotation of the support rod 26 drives the placement stage 4 to rotate, so that another uncut wafer rotates to the bottom of the cutter, so that the cutter can cut it, thereby improving the efficiency and quality of the dicing.

[0025] As an embodiment of the present invention, the drive assembly includes a drive component 7, which is mounted on the mounting bracket 2. A drive shaft 8 is mounted on the output end of the drive component 7, and a half gear 12 is mounted on the drive shaft 8.

[0026] In this embodiment, the drive component 7 drives the drive shaft 8 connected to it to rotate. The rotation of the drive shaft 8 drives the half gear 12 connected to it to rotate. When the half gear 12 rotates and meshes with the toothed plate 11, it drives the toothed plate 11 to move downward. At this time, the spring 10 is stretched to generate elastic force. The downward movement of the toothed plate 11 drives the bottom cutter to move downward to cut the bottom wafer. When the half gear 12 disengages from the toothed plate 11, under the action of elastic force, the toothed plate 11 will reset and drive the cutter away from the wafer. During the process of the cutter moving away from the wafer, the drive shaft 8 drives the transmission component to operate. The transmission component drives the support rod 26 to rotate. The rotation of the support rod 26 drives the placement platform 4 to rotate, so that another uncut wafer rotates to the bottom of the cutter so that the cutter can cut it.

[0027] Furthermore, the drive component 7 can be a stepper motor or a servo motor, etc., which will not be described in detail here.

[0028] As an embodiment of the present utility model, the transmission assembly includes a driven shaft 22, one end of which is rotatably connected to the mounting bracket 2, and the other end is connected to a half bevel gear 25. A driven gear 24 is meshed on one side of the half bevel gear 25, and the driven gear 24 is mounted on the support rod 26.

[0029] A connecting unit 21 is installed on the drive shaft 8, and the end of the connecting unit 21 away from the drive shaft 8 is connected to the driven shaft 22.

[0030] In this embodiment, the rotation of the drive shaft 8 drives the driven shaft 22 to rotate via the connecting unit 21. The rotation of the driven shaft 22 drives the half-bevel gear 25 to rotate. The half-bevel gear 25 intermittently meshes with the driven gear 24, causing the support rod 26 to rotate intermittently. The support rod 26 causes the wafers on the placement stage 4 to rotate intermittently, so that multiple wafers to be cut rotate intermittently and orderly to the bottom of the cutter. In conjunction with the reciprocating movement of the cutter, multiple wafers are cut in an orderly manner, thereby improving the cutting efficiency.

[0031] Furthermore, the connecting unit 21 can be a gear set or a pulley set, etc., which will not be described in detail here.

[0032] As an embodiment of the present invention, the limiting component includes a telescopic member 5, one end of which is connected to the side wall of the placement groove, and the other end is connected to a limiting plate 6.

[0033] In this embodiment, one end of the telescopic member 5 is connected to the side wall of the placement slot, and the other end is connected to the limiting plate 6. When the wafer is placed in the placement slot, the telescopic member 5 drives the limiting plate 6 connected to it to move towards each other to limit and fix the wafer, thereby improving the stability of the wafer.

[0034] Furthermore, the telescopic component 5 can be an electric telescopic rod or an electric push rod, etc., which will not be described in detail here.

[0035] As an embodiment of this utility model, a sliding groove is provided on the side wall of the mounting frame 2, and a sliding plate 13 is slidably installed in the sliding groove. The sliding plate 13 is fixedly connected to the toothed plate 11. A fixing rod 16 is installed on the mounting frame 2. A conveying chamber 15 is installed at the end of the fixing rod 16 away from the mounting frame 2. A water tank 23 is installed on the support plate 1. A connecting pipe 20 is installed on the water tank 23. The end of the connecting pipe 20 away from the water tank 23 is connected to the conveying chamber 15. A conveying pipe is installed on the conveying chamber 15. A nozzle 18 is connected at the end of the conveying pipe away from the conveying chamber 15. The nozzle 18 is installed on one side of the cutter. A one-way valve 19 is installed on both the connecting pipe 20 and the conveying pipe. A slider 17 is slidably installed in the conveying chamber 15. A pressure rod 14 is installed at the bottom of the sliding plate 13. The end of the pressure rod 14 away from the sliding plate 13 is connected to the slider 17.

[0036] In this embodiment, the toothed plate 11 intermittently meshes with the half gear 12, and moves up and down reciprocally under the action of the spring 10. The reciprocating movement of the toothed plate 11 drives the sliding plate 13 to slide back and forth. The reciprocating movement of the sliding plate 13 drives the slider 17 at one end of the pressure rod 14 to slide back and forth in the conveying chamber 15. The reciprocating movement of the slider 17 causes a pressure difference to be generated in the conveying chamber 15. When a negative pressure is generated in the conveying chamber 15, water from the water tank 23 is transported to the conveying chamber 15 through the connecting pipe 20. Then, the water in the conveying chamber 15 is transported to the nozzle 18 through the conveying pipe by the squeezing of the slider 17. The nozzle 18 sprays water on the cutting area, which can play a role in cooling and dust reduction, and improve the practicality of the device.

[0037] The working principle of this utility model is as follows: When dicing a wafer, the wafer is placed in a placement slot. The telescopic component 5 drives the connected limiting plate 6 to move towards each other to limit and fix the wafer, improving its stability. The driving component 7 drives the connected driving shaft 8 to rotate. The rotation of the driving shaft 8 drives the connected half gear 12 to rotate. When the half gear 12 rotates and meshes with the toothed plate 11, it drives the toothed plate 11 to move downward. At this time, the spring 10 is stretched to generate elastic force. The downward movement of the toothed plate 11 drives the cutter at the bottom to move downward to cut the wafer at the bottom. When the half gear 12 disengages from the toothed plate 11, under the action of elastic force, the toothed plate 11 will reset and drive the cutter away from the wafer. During the process of the cutter moving away from the wafer, the rotation of the driving shaft 8 drives the driven shaft 22 to rotate through the connecting unit 21. The rotation of the driven shaft 22 drives the half bevel gear 25 to rotate. 25 intermittently meshes with the driven gear 24, causing the support rod 26 to rotate intermittently. The support rod 26 causes the wafer on the placement stage 4 to rotate intermittently, causing another uncut wafer to rotate to the bottom of the cutter, so that the cutter can cut it, improving the cutting efficiency and quality. The toothed plate 11 moves up and down, causing the slide plate 13 to slide back and forth. The slide plate 13 slides back and forth, causing the slider 17 at one end of the pressure rod 14 to slide back and forth in the conveying chamber 15. The sliding back and forth of the slider 17 causes a pressure difference to be generated in the conveying chamber 15. When a negative pressure is generated in the conveying chamber 15, water from the water tank 23 is transported to the conveying chamber 15 through the connecting pipe 20. Then, the water in the conveying chamber 15 is transported to the nozzle 18 through the conveying pipe by the squeezing of the slider 17. The nozzle 18 sprays water on the cutting area, which can play a role in cooling and dust reduction, improving the practicality of the device.

[0038] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0039] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer processing positioning and cutting device, comprising a support plate, characterized in that, A mounting frame is installed on the support plate, and a support rod is rotatably mounted on the support plate. A processing table is connected to the end of the support plate away from the support plate. A placement groove is installed on the processing table, and a limit component is set in the placement groove. A telescopic tube is installed on the mounting frame, and a toothed plate is installed at the end of the telescopic tube away from the mounting frame. A half gear is engaged on one side of the toothed plate, and a cutter is installed at the bottom of the toothed plate. A drive assembly is mounted on the mounting bracket, and the drive assembly is connected to the half gear. The mounting bracket is equipped with a transmission assembly, one end of which is connected to the drive assembly and the other end of which is connected to the support rod. A spring is fitted onto the telescopic tube, with one end of the spring connected to the mounting bracket and the other end connected to the toothed plate.

2. The wafer processing positioning and cutting device according to claim 1, characterized in that, The drive assembly includes a drive component, which is mounted on a mounting bracket. A drive shaft is mounted on the output end of the drive component, and a half gear is mounted on the drive shaft.

3. The wafer processing positioning and cutting device according to claim 2, characterized in that, The transmission assembly includes a driven shaft, one end of which is rotatably connected to the mounting bracket, and the other end is connected to a half-bevel gear. A driven gear meshes with one side of the half-bevel gear, and the driven gear is mounted on a support rod. A connecting unit is installed on the drive shaft, and the end of the connecting unit away from the drive shaft is connected to the driven shaft.

4. The wafer processing positioning and cutting device according to claim 1, characterized in that, The limiting component includes a telescopic member, one end of which is connected to the side wall of the placement slot, and the other end is connected to a limiting plate.

5. A wafer processing positioning and cutting device according to claim 1, characterized in that, The mounting frame has a sliding groove on its side wall, in which a sliding plate is slidably installed. The sliding plate is fixedly connected to the toothed plate. A fixing rod is installed on the mounting frame, and a conveying chamber is installed at the end of the fixing rod away from the mounting frame. A water tank is installed on the support plate, and a connecting pipe is installed on the water tank. The end of the connecting pipe away from the water tank is connected to the conveying chamber. A conveying pipe is installed on the conveying chamber, and a nozzle is connected at the end of the conveying pipe away from the conveying chamber. The nozzle is installed on one side of the cutter. A one-way valve is installed on both the connecting pipe and the conveying pipe. A slider is slidably installed in the conveying chamber, and a pressure rod is installed at the bottom of the sliding plate. The end of the pressure rod away from the sliding plate is connected to the slider.

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