Coating film cutting device and sputtering machine table

Abstract

The utility model provides a coating film cutting device and a sputtering machine table, and relates to the technical field of semiconductor equipment. The coating film cutting device comprises a first mold, a second mold and a carrying disc, wherein the first mold is provided with an adsorption part and a cutting part; the second mold is provided with a first jacking mechanism, a cutting platform and a film covering belt, and the film covering belt is laid on the cutting platform. A wafer to be cut is mounted on the film covering belt; the first jacking mechanism is connected with the cutting platform. The carrying disc is arranged on the film covering belt; the adsorption part can adsorb the carrying disc in a power-on state. When the first mold and the second mold are in a mold closing state, the cutting part can cut and separate the to-be-cut wafer; the cutting platform can enable the film covering belt to be broken under the action of the first jacking mechanism; the adsorption part adsorbs the carrying disc and can transfer the broken film covering belt and the cut and separated wafer on the film covering belt together. Film coating, cutting and transferring can be achieved, and the sputtering efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a coating and cutting device and a sputtering machine. Background Technology

[0002] With the rapid development of the semiconductor industry, an electromagnetic shielding layer is typically formed outside the package structure to prevent interference with chip operation. The fabrication process for this electromagnetic shielding layer usually utilizes sputtering. The traditional sputtering process involves placing the wafer on a dicing film to cut it into individual products, and then using a mounting process to attach these individual products onto the sputtered coating. The sputtered coating protects the solder balls at the bottom of the chip, preventing short circuits caused by metal sputtering between the solder balls. This sputtering process requires chip flipping to replace the adhesive layer, which can easily lead to residual adhesive. Furthermore, during wafer reconstruction, the spacing between adjacent chips is not fixed, which can easily cause uneven metal layer sputtering. Utility Model Content

[0003] The purpose of this invention is to provide a coating cutting device and a sputtering machine that eliminates the need to replace the coating adhesive layer, avoiding residual adhesive problems during replacement and saving on coating usage. Furthermore, it helps improve sputtering efficiency and sputtering uniformity.

[0004] In a first aspect, this utility model provides a coating cutting device, comprising:

[0005] The first mold is provided with an adsorption part and a cutting part;

[0006] The second mold is provided with a first lifting mechanism, a cutting platform, and a coating tape. The coating tape is laid on the cutting platform. The wafer to be cut is mounted on the coating tape. The first lifting mechanism is connected to the cutting platform.

[0007] A carrier disk is disposed on the coated tape; the adsorption part is capable of adsorbing the carrier disk when energized.

[0008] When the first mold and the second mold are in the closed state, the cutting part can cut and separate the wafer to be cut; the cutting platform can cause the coating tape to break under the action of the first lifting mechanism; the adsorption part can adsorb the carrier plate and transfer the broken coating tape and the cut and separated wafer on the coating tape together.

[0009] In an optional embodiment, the first mold includes a pressing rod, which is disposed opposite to the cutting platform; the end of the pressing rod facing the second mold is provided with the adsorption part and the cutting part; the adsorption part is disposed around the cutting part.

[0010] In an optional embodiment, the cutting section includes a rotating shaft rotatably connected to the pressing rod, and a cutting disk is provided on the rotating shaft for cutting the wafer.

[0011] In an optional embodiment, the rotating shaft includes a first segment, a second segment, and a third segment connected in sequence, with the first segment and the third segment arranged opposite to each other; the first segment and the third segment are rotatably connected to the pressing rod respectively; and the cutting disc is disposed on the second segment.

[0012] In an optional embodiment, the pressing rod is provided with two opposing fixed posts, and the first segment and the third segment are rotatably connected to the fixed posts respectively.

[0013] In an optional implementation, a plurality of cutting discs are included, the plurality of cutting discs being spaced apart on the second segment.

[0014] In an optional embodiment, the first mold further includes a second lifting mechanism connected to the pressing rod.

[0015] In an optional embodiment, the cutting platform is provided with a placement platform, which is disposed opposite to the carrier tray.

[0016] In an optional embodiment, the second mold is provided with a clamping part for clamping the coated tape.

[0017] Secondly, the present invention provides a sputtering machine, including a sputtering carrier and a coating cutting device as described in any of the foregoing embodiments, wherein the coating tape is transferred to the sputtering carrier after being broken in the coating cutting device.

[0018] The coating cutting device and sputtering machine provided in this embodiment of the utility model have the following advantages:

[0019] The coating and dicing apparatus provided in this embodiment features a coating tape on a dicing platform. Wafers are placed on the coating tape, and after dicing, the coating tape continues to hold the separated wafers together, facilitating their overall transfer to the sputtering carrier. The coating tape continues to protect the bumps on the bottom of the chips during the sputtering process. The coating tape does not need to be replaced throughout the process, avoiding residual adhesive. It also improves dicing and sputtering efficiency and reduces the amount of coating tape used. Furthermore, the dicing platform can lift the coating tape, causing it to break. Before breakage, the coating tape expands to increase the spacing between chips on the tape, thereby improving subsequent sputtering quality and uniformity.

[0020] The sputtering machine provided in this embodiment includes the above-mentioned coating cutting device, which has high cutting and sputtering efficiency, good sputtering uniformity, and is conducive to improving sputtering quality. Attached Figure Description

[0021] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 A schematic diagram showing the disassembled structure of the coating and cutting device provided in this embodiment of the utility model;

[0023] Figure 2 A schematic diagram of the mold closing structure of the coating and cutting device provided in this embodiment of the utility model;

[0024] Figure 3 A schematic diagram of the pressing rod of the coating cutting device provided in this embodiment of the utility model;

[0025] Figure 4 A schematic diagram of the structure of the cutting platform of the coating cutting device provided in this embodiment of the utility model for cutting the coating tape;

[0026] Figure 5 This is a schematic diagram of the mold opening structure of the coating cutting device provided in this embodiment of the present invention after cutting the coating strip;

[0027] Figure 6 A schematic diagram of the structure for transferring the cut coated tape to the sputtering carrier according to an embodiment of the present invention;

[0028] Figure 7 This is a schematic diagram of the structure of the cut coated tape and the wafer product thereon provided in an embodiment of the present invention.

[0029] Icons: 100-Coating and cutting device; 110-First mold; 111-Upper housing; 112-Pressure rod; 113-Adsorption part; 114-Cutting part; 115-Second lifting mechanism; 120-Rotating shaft; 121-First segment; 122-Second segment; 123-Third segment; 124-Cutting disc; 125-Groove; 126-Fixing column; 130-Second mold; 131-First lifting mechanism; 132-Cutting platform; 133-Placement platform; 134-Clamping part; 140-Coating tape; 150-Carrier tray; 210-Wafer; 211-Solder ball; 220-Sputtering carrier; 230-Electromagnetic shielding layer. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0032] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0033] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0034] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0035] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0036] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0037] Combination Figure 1 and Figure 2 The coating cutting device 100 provided in this embodiment can be applied to processes such as wafer 210 cutting and sputtering. It eliminates the need to replace the coating tape 140, avoiding residual adhesive problems during replacement and saving on the amount of coating tape 140 used. Furthermore, it helps improve sputtering efficiency and sputtering uniformity.

[0038] The coating and cutting apparatus 100 includes a first mold 110, a second mold 130, and a carrier tray 150. The first mold 110 is provided with an adsorption section 113 and a cutting section 114. The second mold 130 is provided with a first lifting mechanism 131, a cutting platform 132, and a coating tape 140, which is laid on the cutting platform 132. The coating tape 140 is used to mount the wafer 210 to be cut; the first lifting mechanism 131 is connected to the cutting platform 132. The carrier tray 150 is disposed on the coating tape 140; the adsorption section 113 can adsorb the carrier tray 150 when energized. With the first mold 110 and the second mold 130 in the closed state, the cutting section 114 can cut and separate the wafer 210 to be cut; the cutting platform 132 can cause the coating tape 140 to break under the action of the first lifting mechanism 131; the adsorption section 113 adsorbs the carrier tray 150 and can transfer the broken coating tape 140 and the cut and separated wafer 210 on the coating tape 140 together. By setting the coating tape 140 on the cutting platform 132, the wafer 210 is placed on the coating tape 140. After the wafer 210 is cut, the coating tape 140 still holds the separated wafer 210 together, which is convenient for the whole assembly to be moved to the sputtering carrier 220. The coating tape 140 can still protect the bumps on the bottom of the chip during the sputtering process. There is no need to replace the coating tape 140 during the whole process, avoiding the problem of residual adhesive. It also improves the cutting and sputtering efficiency and reduces the amount of coating tape 140 used. In addition, the cutting platform 132 can lift to cause the coating tape 140 to break. Before the coating tape 140 breaks, the coating tape 140 expands to increase the spacing between chips on the coating tape 140, which is beneficial to improving the subsequent sputtering quality and sputtering uniformity.

[0039] Optionally, the first mold 110 includes an upper housing 111 and a pressing rod 112, with the pressing rod 112 disposed inside the upper housing 111. The pressing rod 112 is disposed opposite to the cutting platform 132. One end of the pressing rod 112 facing the second mold 130 is provided with an adsorption part 113 and a cutting part 114; the adsorption part 113 is disposed around the cutting part 114.

[0040] It is understood that the dicing platform 132 is provided with a coating tape 140, on which the wafer 210 to be diced is placed. The dicing section 114 is set corresponding to the position on the dicing platform 132 where the wafer 210 is placed, and the dicing section 114 can be designed according to the dicing grooves on the wafer 210. The adsorption section 113 can adsorb the carrier disk 150 when the power is on, and can release the carrier disk 150 when the power is off.

[0041] Combination Figure 3 Optionally, the cutting section 114 includes a rotating shaft 120 rotatably connected to the pressing rod 112, and a cutting disk 124 is provided on the rotating shaft 120 for cutting the wafer 210. Optionally, the rotating shaft 120 includes a first segment 121, a second segment 122, and a third segment 123 connected in sequence, with the first segment 121 and the third segment 123 arranged opposite to each other; the first segment 121 and the third segment 123 are rotatably connected to the pressing rod 112 respectively; the cutting disk 124 is provided on the second segment 122.

[0042] In this embodiment, to improve cutting efficiency, multiple cutting disks 124 are designed and spaced apart on the second segment 122. The positions of the cutting disks 124 correspond to the cutting tracks on the wafer 210.

[0043] Optionally, the pressing rod 112 is provided with two opposing fixed posts 126, and the first segment 121 and the third segment 123 are rotatably connected to the fixed posts 126 respectively. It can be understood that the pressing rod 112 has a groove 125, and the rotating shaft 120 can rotate within the groove 125 to achieve the flipping of the cutting disk 124. When wafer 210 needs to be cut, the cutting disk 124 flips to a position close to the cutting platform 132. When cutting is not required, the cutting disk 124 flips to a position away from the cutting platform 132.

[0044] Optionally, the first mold 110 also includes a second lifting mechanism 115, which is connected to the pressing rod 112. When cutting is required, the second lifting mechanism 115 drives the pressing rod 112 to move downward, improving the reliability of cutting.

[0045] Optionally, the dicing platform 132 is provided with a placement stage 133, which is disposed opposite to the carrier tray 150. The surface of the placement stage 133 is lower than the surface of the dicing platform 132. The carrier tray 150 is placed on the coating tape 140. When the first mold 110 and the second mold 130 are pressed together, the carrier tray 150 presses the coating tape 140 down onto the placement stage 133. It can be understood that when the dicing platform 132 rises and causes the coating tape 140 to break, it means that the coating tape 140 on the outer periphery of the carrier tray 150 is torn off, that is, the break of the coating tape 140 is located on the side of the carrier tray 150 away from the wafer 210.

[0046] Optionally, the second mold 130 is provided with a clamping part 134 for clamping the coated tape 140. This allows the cutting platform 132 to expand the coated tape 140 during movement and then tear it.

[0047] This utility model embodiment also provides a sputtering machine, including a sputtering carrier 220 and the aforementioned coating cutting device 100. After the coating tape 140 is broken in the coating cutting device 100, it is transferred to the sputtering carrier 220 to perform metal sputtering on a single product to form an electromagnetic shielding layer 230.

[0048] The working principle of the coating cutting device 100 provided in this embodiment of the utility model is as follows:

[0049] like Figure 1 As shown, the coating tape 140 is placed above the dicing platform 132, and its outer periphery is clamped and fixed by the clamping part 134 on the second mold 130. The mounting tray 150 is placed on the coating tape 140. Then, the reconstructed and ball-mounted wafer 210 is placed on the coating tape 140, with the wafer 210 directly above the dicing platform 132. The solder balls 211 at the bottom of the wafer 210 are embedded in the coating tape 140, and the coating tape 140 protects the solder balls 211. The coating tape 140 can be a dicing film or an adhesive film, etc., and is not specifically limited here.

[0050] like Figure 2 As shown, the first mold 110 and the second mold 130 close together, and the rotating shaft 120 on the first mold 110 flips, using the dicing disc 124 to cut the wafer 210. It should be noted that the dicing disc 124 only cuts the wafer 210 into individual products; it does not cut the coating tape 140. That is, the multiple individual products after cutting and separation are still bonded together by the coating tape 140.

[0051] It is understandable that the carrier disk 150 can also be first adsorbed onto the adsorption part 113 of the first mold 110. After the first mold 110 and the second mold 130 are closed, the carrier disk 150 is bonded and fixed onto the coating tape 140. Then, the power is turned off, and the adsorption part 113 of the first mold 110 and the carrier disk 150 are separated.

[0052] like Figure 4As shown, after cutting, the rotating shaft 120 flips again, causing the cutting disk 124 to stop cutting the wafer 210. The first lifting mechanism 131 drives the cutting platform 132 to rise, i.e., move towards the first mold 110. Since the periphery of the coating tape 140 is fixed, the cutting platform 132, located in the middle of the coating tape 140, lifts the wafer 210 and the coating tape 140 upwards as a whole. The coating tape 140 expands outwards under force, thereby increasing the distance between the multiple individual products on the coating tape 140. The increased distance between individual products is beneficial to improving the uniformity of sputtering in the subsequent sputtering process. As the cutting platform 132 continues to move upwards, the tensile force on the coating tape 140 continues to increase until the coating tape 140 breaks. It is easy to understand that the fracture surface of the coating tape 140 is located between the carrier disk 150 and the clamping part 134. And during this process, the cutting platform 132 rises, causing the carrier disk 150 to press the coating tape 140 onto the placement stage 133.

[0053] like Figure 5 , Figure 6 As shown, the first mold 110 and the second mold 130 are separated. Then, the adsorption unit 113 moves to the carrier plate 150 again and is powered on to adsorb the carrier plate 150. Since the carrier plate 150 has been bonded and fixed to the coating tape 140, the adsorption unit 113 transfers the coating tape 140 on the cutting platform 132 and the multiple single products on the coating tape 140 to the sputtering carrier 220.

[0054] Combination Figure 7 The coating tape 140 protects the solder balls 211 at the bottom of the individual product and can directly form an electromagnetic shielding layer 230 by metal sputtering on the individual product.

[0055] It should be noted that after the coating tape 140 breaks, other adsorption devices can also be used to adsorb and transfer the carrier disk 150; no specific limitation is made here.

[0056] Throughout the process, there is no need to replace the laminating tape 140, saving time and effort and increasing work efficiency. It also avoids the problem of residual adhesive left after tape replacement, and saves laminating tape 140, reducing its usage.

[0057] In summary, the coating cutting device 100 and sputtering machine provided in this embodiment of the present invention have the following beneficial effects:

[0058] The coating and dicing apparatus 100 provided in this embodiment of the invention features a coating tape 140 mounted on a dicing platform 132. Wafers 210 are placed on the coating tape 140. After dicing, the coating tape 140 retains the separated wafers 210 together, facilitating their overall transfer to the sputtering carrier 220. The coating tape 140 continues to protect the bumps on the bottom of the chip during the sputtering process. The coating tape 140 does not need to be replaced throughout the process, avoiding residual adhesive. This also improves dicing and sputtering efficiency and reduces the amount of coating tape 140 used. Furthermore, the dicing platform 132 can lift the coating tape 140, causing it to break. Before the tape breaks, it expands to increase the spacing between chips on the tape, thereby improving subsequent sputtering quality and uniformity.

[0059] The sputtering machine provided in this embodiment includes the above-mentioned coating cutting device 100, which has high cutting and sputtering efficiency, good sputtering uniformity, and is conducive to improving sputtering quality.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Any modifications, equivalent substitutions, improvements, etc., should be included within the protection scope of this utility model.

Claims

1. A coating and cutting device, characterized in that, include: The first mold is provided with an adsorption part and a cutting part; The second mold is provided with a first lifting mechanism, a cutting platform, and a coating tape. The coating tape is laid on the cutting platform. The wafer to be cut is mounted on the coating tape. The first lifting mechanism is connected to the cutting platform. A carrier disk is disposed on the coated tape; the adsorption part is capable of adsorbing the carrier disk when energized. When the first mold and the second mold are in the closed state, the cutting part can cut and separate the wafer to be cut; The cutting platform can cause the coating tape to break under the action of the first lifting mechanism; the adsorption part can adsorb the carrier disk to transfer the broken coating tape and the cut wafers on the coating tape together.

2. The coating and cutting apparatus according to claim 1, characterized in that, The first mold includes a pressing rod, which is disposed opposite to the cutting platform; the end of the pressing rod facing the second mold is provided with the adsorption part and the cutting part; the adsorption part is disposed around the cutting part.

3. The coating and cutting apparatus according to claim 2, characterized in that, The cutting section includes a rotating shaft rotatably connected to the pressing rod, and a cutting disk is provided on the rotating shaft for cutting wafers.

4. The coating and cutting apparatus according to claim 3, characterized in that, The rotating shaft includes a first segment, a second segment, and a third segment connected in sequence, with the first segment and the third segment arranged opposite to each other; the first segment and the third segment are rotatably connected to the pressing rod respectively; the cutting disc is disposed on the second segment.

5. The coating and cutting apparatus according to claim 4, characterized in that, The pressing rod is provided with two opposing fixed posts, and the first segment and the third segment are rotatably connected to the fixed posts respectively.

6. The coating and cutting apparatus according to claim 4, characterized in that, It includes a plurality of cutting discs, which are spaced apart on the second segment.

7. The coating and cutting apparatus according to claim 2, characterized in that, The first mold also includes a second lifting mechanism, which is connected to the pressing rod.

8. The coating and cutting apparatus according to claim 1, characterized in that, The cutting platform is provided with a placement platform, which is positioned opposite to the carrier tray.

9. The coating and cutting apparatus according to any one of claims 1 to 8, characterized in that, The second mold is provided with a clamping part, which is used to clamp the film-coated tape.

10. A sputtering machine, characterized in that, The invention includes a sputtering carrier and a coating cutting apparatus according to any one of claims 1 to 9, wherein the coating tape is transferred to the sputtering carrier after being broken in the coating cutting apparatus.

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