Carrying table for heating and adsorbing wafer

Abstract

A carrying table for heating and adsorbing wafers relates to the technical field of wafer aging test equipment, and sequentially comprises a heating sucker, a heating sucker gasket, a heating sheet and a heating sheet supporting plate from top to bottom, and a certain number of air exhaust channels extending from the middle to the periphery are arranged in the heating sucker. A certain number of air exhaust holes communicated with the air exhaust channel are formed in the top face, an air exhaust connector communicated with the air exhaust channel is arranged in the middle of the bottom face, and a copolar conductive column is arranged on the side edge of the top face of the heating sucker. According to the utility model, the wafer is adsorbed and fixed through low pressure, the reliability of the device is improved, the protection of the wafer device in the aging test process is ensured, the heating is uniform, the heat loss is less, the operation of testers is facilitated, the test efficiency is improved, and the mass test is realized.

Description

Technical Field

[0001] This utility model relates to the technical field of wafer aging test equipment, and in particular to a stage for heating and adsorbing wafers. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seed crystals, and then slowly pulled out to form a cylindrical single-crystal silicon wafer. After grinding, polishing, and slicing, the silicon crystal ingot forms a silicon wafer. After processes such as photolithography and etching, the wafer needs to undergo testing, one of which is aging testing.

[0003] Wafer aging tests require fixing and heating the wafer. Existing technologies have the following problems: 1. The device has low reliability, the wafer is not stable enough, and the wafer device is easily damaged during the aging test; 2. The device is heated unevenly, heat is easily lost, the test personnel are inconvenient to operate, the test efficiency is low, and it is not suitable for large-scale testing; 3. The device is large in size and occupies a lot of space. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a stage for heating and adsorbing wafers. By fixing the wafers with low-pressure adsorption, the reliability of the device is improved, the protection of the wafer devices during the aging test is ensured, the heating is uniform and the heat loss is small, which makes it easy for testers to operate, improves the test efficiency, and enables large-scale testing.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A stage for heating and adsorbing wafers includes, from top to bottom, a heating chuck, a heating chuck pad, a heating plate, and a heating plate support. The heating chuck has a number of suction channels extending from the center outwards, a number of suction holes communicating with these channels on its top surface, and a suction connector communicating with the suction channels in the center of its bottom surface. A common conductive post is located on the side of the top surface of the heating chuck. When the wafer to be tested is placed on the heating chuck, air flows out from the suction connector through the suction device, creating a negative pressure in the suction channels and suction holes, firmly adsorbing the wafer onto the heating chuck. During aging tests, the heating plate generates heat, which is transferred to the wafer through the heating chuck pad and the heating chuck itself.

[0007] Preferably, the air extraction connector passes through the heating suction cup pad, the heating plate and the heating plate support plate, and the bottom surface is provided with an insulating sealing pad that abuts against and communicates with it.

[0008] Preferably, the insulating sealing gasket has sealing rings on both the upper and lower surfaces to provide a sealing effect.

[0009] Preferably, the bottom of the insulating sealing gasket is provided with a positioning pin, which serves to position and limit the movement, ensuring that the air extraction channels are consistent.

[0010] Preferably, the heating suction cup is made of tungsten-copper alloy, which has good thermal conductivity; the heating suction cup pad is a ceramic sheet, which has good thermal conductivity and insulation properties; the heating element is a mica heating element, which provides uniform heating per unit area, and the central perforation facilitates uniform overall heating; the heating element support plate has heat insulation and reinforcement functions. The stacked structure of the platform can effectively reduce heat loss.

[0011] Preferably, the heating suction cup is provided with a certain number of fixing bolts on its outer periphery, and the platform is fixed by fixing bolts.

[0012] Preferably, the heating suction cup has an insulating block embedded around its outer periphery corresponding to the fixing bolt. The fixing bolt passes through the insulating block, and a heating suction cup support column is fitted at its lower end. The insulating block and the support column are poor conductors of heat, and the support column suspends the platform, thus providing heat insulation.

[0013] Preferably, the heating suction cup has a number of sensor channels on its outer periphery, extending towards the center. Each sensor channel contains a thermocouple sensor, which is equidistantly distributed, for example, three thermocouples, for collecting the temperature of the heating suction cup. The thermocouple sensors are installed by drilling and potting inside the heating suction cup to improve the accuracy of temperature acquisition.

[0014] Preferably, the heating suction cup has an opening on its outer periphery that communicates with the air extraction channel, and a plug is provided inside the opening for processing the air extraction channel. After processing, the plug is installed for sealing.

[0015] Preferably, the bottom of the stage is provided with at least one cable. The cable is used to transmit the current and other signals required for the heating element of the stage to operate.

[0016] The advantages of this invention are: 1. By fixing the wafer with low-pressure adsorption, the reliability of the device is improved, and the protection of the wafer device is ensured during the aging test; 2. The heating is uniform and the heat loss is small, which makes it easy for testers to operate, improves the test efficiency, and enables large-scale testing; 3. The device is small in size, which makes it occupy less space. Attached Figure Description

[0017] Figure 1 The three-dimensional representation of this utility model Figure 1 ;

[0018] Figure 2 This utility model is three-dimensional. Figure 2 ;

[0019] Figure 3 This is an exploded view of the present invention;

[0020] Figure 4 This is a top view of the present invention;

[0021] Figure 5 for Figure 4 Sectional view along the middle AA direction;

[0022] Figure 6 for Figure 5 Sectional view along the BB direction;

[0023] Figure 7 This is a side view of the heating suction cup in this utility model;

[0024] Figure 8 for Figure 7 A cross-sectional view along the CC direction.

[0025] Explanation of key component symbols in the diagram:

[0026] 10. Stage; 11. Heating suction cup; 11.1. Vacuum channel; 11.2. Vacuum port; 11.3. Common conductive post; 11.4. Sensor channel; 11.5. Plug; 12. Heating suction cup gasket; 13. Heating element; 14. Heating element support plate; 15. Vacuum connector; 16. Fixing bolt; 17. Heating suction cup insulating block; 18. Heating suction cup support column; 19. Thermocouple sensor;

[0027] 20. Insulating sealing gasket; 21. Sealing ring; 22. Locating pin;

[0028] 30. Cables. Detailed Implementation

[0029] To more clearly illustrate this utility model, the following description, in conjunction with the accompanying drawings, will provide further details.

[0030] Example 1: As Figure 1-6 As shown, a stage for heating and adsorbing wafers is provided. The stage 10 includes, from top to bottom, a heating suction cup 11, a heating suction cup pad 12, a heating plate 13, and a heating plate support plate 14. The heating suction cup 11 is provided with a certain number of suction channels 11.1 extending from the center to the surrounding area. The top surface is provided with a certain number of suction holes 11.2 communicating with the suction channels 11.1. The bottom surface is provided with a suction connector 15 communicating with the suction channels 11.1. The side of the top surface of the heating suction cup 11 is provided with a common electrode conductive post 11.3.

[0031] Example 2: Combination Figure 2 , Figure 5 and Figure 7-8As shown, based on Embodiment 1, the bottom surface of the air extraction connector 15 is provided with an insulating sealing gasket 20 that abuts against and communicates with it.

[0032] The insulating sealing pad 20 has sealing rings 21 on both the upper and lower sides, and a positioning pin 22 at the bottom.

[0033] Example 3: Combination Figure 1 , Figure 3 and Figure 5 As shown, based on Embodiment 1 or Embodiment 2, the heating suction cup 11 is made of tungsten-copper alloy, which has good thermal conductivity; the heating suction cup pad 12 is a ceramic sheet, which has good thermal conductivity and insulation; the heating element 13 is a mica heating element, which provides uniform heating per unit area, and the central perforation facilitates uniform heating; the heating element support plate 14 has heat insulation and reinforcement functions. The layered structure of the platform 10 can effectively reduce heat loss.

[0034] Example 4: Combination Figure 1-2 , Figure 4 and Figure 6-8 As shown, based on Embodiment 1, Embodiment 2 or Embodiment 3, the heating suction cup 11 is provided with a certain number of fixing bolts 16 on its outer periphery, and the heating suction cup 11 is embedded with heating suction cup insulating blocks 17 corresponding to the fixing bolts 16 on its outer periphery, with the fixing bolts 16 passing through the heating suction cup insulating blocks 17.

[0035] The lower end of the fixing bolt 16 is fitted with a heating suction cup support column 18.

[0036] Example 5: Combination Figure 5-6 As shown, based on the above embodiment, the heating suction cup 11 has an opening on its outer periphery that communicates with the air extraction channel 11.1, and a plug 11.5 is provided in the opening.

[0037] Example 6: Combination Figure 2 and Figure 7-8 As shown, based on the above embodiment, the heating suction cup 11 is provided with a certain number of sensor channels 11.4 on its outer periphery, and thermocouple sensors 19 are provided in the sensor channels 11.4.

[0038] Example 7: Combination Figure 2 and Figure 5 As shown, based on the above embodiment, the bottom of the platform 10 is provided with at least one cable 30 for the transmission of power and signals of the platform 10.

[0039] The above description is only a specific embodiment of the present utility model, but the structural features of the present utility model are not limited thereto. The present utility model can be used in similar products. Any changes or modifications made by those skilled in the art within the scope of the present utility model are covered by the patent scope of the present utility model.

Claims

1. A stage for heating and adsorbing wafers, characterized in that: The stage (10) includes, from top to bottom, a heating suction cup (11), a heating suction cup pad (12), a heating plate (13), and a heating plate support plate (14). The heating suction cup (11) has a certain number of suction channels (11.1) extending from the center to the surrounding area. The top surface has a certain number of suction holes (11.2) communicating with the suction channels (11.1). The bottom surface has a suction connector (15) communicating with the suction channels (11.1). The side of the top surface of the heating suction cup (11) has a common electrode conductive post (11.3).

2. The stage for heating and adsorbing wafers according to claim 1, characterized in that: The bottom surface of the air extraction connector (15) is provided with an insulating sealing gasket (20) that abuts against and communicates with it.

3. The stage for heating and adsorbing wafers according to claim 2, characterized in that: The insulating sealing pad (20) has sealing rings (21) on both the upper and lower sides, and a positioning pin (22) is provided at the bottom of the insulating sealing pad (20).

4. The stage for heating and adsorbing wafers according to claim 1, characterized in that: The heating suction cup (11) is made of tungsten copper alloy, the heating suction cup pad (12) is a ceramic sheet, and the heating element (13) is a mica heating element.

5. A stage for heating and adsorbing wafers according to claim 1, characterized in that: The heating suction cup (11) has a certain number of fixing bolts (16) on its outer periphery.

6. A stage for heating and adsorbing wafers according to claim 5, characterized in that: The heating suction cup (11) has an insulating block (17) embedded on its outer periphery that corresponds to the fixing bolt (16), and the fixing bolt (16) passes through the heating suction cup insulating block (17).

7. A stage for heating and adsorbing wafers according to claim 6, characterized in that: The lower end of the fixing bolt (16) is fitted with a heating suction cup support column (18).

8. A stage for heating and adsorbing wafers according to claim 1, characterized in that: The heating suction cup (11) has an opening on its outer periphery that communicates with the air extraction channel (11.1), and a plug (11.5) is provided inside the opening.

9. A stage for heating and adsorbing wafers according to claim 1, characterized in that: The heating suction cup (11) has a certain number of sensor channels (11.4) on its outer periphery, and thermocouple sensors (19) are provided in the sensor channels (11.4).

10. A stage for heating and adsorbing wafers according to any one of claims 1-9, characterized in that: The bottom of the platform (10) is provided with at least one cable (30).

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