Vapor chamber module and liquid-cooled vapor chamber heat dissipation device comprising vapor chamber module

Abstract

The utility model provides a vapor chamber module and a liquid-cooled vapor chamber heat dissipation device comprising the vapor chamber module. The vapor chamber module comprises a metal upper cover plate and a metal lower cover plate. The heat dissipation outer surface of the metal upper cover plate is provided with a plurality of sheet-shaped heat dissipation structures. The evaporation inner surface of the metal lower cover plate is provided with a plurality of lower grooves arranged in parallel and a plurality of supporting structures protruding among the lower grooves. And the metal upper cover plate and the metal lower cover plate are jointed to form a vapor chamber module. A liquid cooling cover is arranged on the heat dissipation outer surface of the metal upper cover plate of the vapor chamber module to form the liquid cooling type vapor chamber heat dissipation device. The sheet-shaped heat dissipation structures are arranged in the containing space of the liquid cooling cover, so that cooling liquid enters the containing space from the liquid inlet, flows between the sheet-shaped heat dissipation structures and flows out from the liquid outlet.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a heat dissipation plate module and a liquid-cooled heat dissipation device including the heat dissipation plate module. Background Technology

[0002] The explosive growth of generative artificial intelligence (AI) or AI-generated content (AIGC) has significantly increased the demand for high-speed computing power and high-end computing chip modules. The massive amounts of data and processing speeds required by AIGC applications continue to drive the demand for high-end AI servers. High-end AI servers utilize a large number of central processing units (CPUs) and graphics processing units (GPUs), and to meet the high-speed, high-volume computing demands of generative AI (e.g., ChatGPT), the high-end chips they use contain as many as 175 billion transistors. Corresponding to the high efficiency and high power consumption of AI server chips, the resulting large and dense heat sources pose a significant challenge to heat dissipation. For example, in 2018, server processor power consumption was only about 180W to 280W; however, it is currently estimated that this will more than double to over 500W after 2023. For example, in 2022, AMD's Genoa processor, built on a 5nm process, and NVIDIA's A100 chip, a major GPU manufacturer, already consumed up to 400W of power, about 40% to 50% more than the previous generation of processors. In 2023, the Bergamo processor's power consumption will exceed 500W; NVIDIA's new generation of high-end GPUs, the H100 chip, designed specifically for AI servers, has a maximum power consumption of up to 700W. As the number of chips used in servers increases, the power consumption further amplifies, and the complexity of thermal solution module design also increases.

[0003] With the upgrade of next-generation GPUs and CPUs, server computing, AI image generation, and e-sports applications will become the main growth drivers for the heat dissipation industry. From the perspective of server heat dissipation technology, it is mainly divided into air cooling, liquid cooling, and immersion cooling. Currently, mid-range computing servers primarily use air cooling.

[0004] In one type of heat dissipation module, to rapidly diffuse the quickly generated, large-volume, concentrated heat to a larger area of ​​the heat sink, manufacturers have replaced the copper base plate that originally contacted the heat-generating components with a copper vapor chamber. The heat-generating components are attached to the heat-absorbing surface of the vapor chamber, while the heat sink is attached to the heat-dissipating surface of the vapor chamber using thermal paste. When a large amount of heat is rapidly generated from the power components and conducted to the vapor chamber, the working fluid inside the vapor chamber quickly absorbs the heat and vaporizes into steam. Since the other side of the vapor chamber is connected to the heat sink, when the steam rises rapidly and comes into contact with the cooler surface of the heat sink, the steam condenses back into the working fluid, and through this phase-change cycle, it rapidly absorbs and releases a large amount of heat. Compared to the traditional use of a copper base plate, the vapor chamber can more quickly diffuse a large amount of concentrated heat to a larger area of ​​the heat sink, resulting in a larger effective heat dissipation area and faster heat dissipation.

[0005] A vapor chamber heat exchanger utilizes the phase change of the working fluid within its sealed working chamber for rapid heat dissipation, making it the most efficient heat dissipation method currently available. It achieves rapid heat dissipation by leveraging the large amount of latent heat of vaporization involved in the rapid vaporization and condensation process of the working liquid within the near-vacuum chamber. The thermal conductivity of a vapor chamber heat exchanger can reach over 10,000 W / (m²·℃), which is dozens of times higher than that of traditional air convection or liquid convection. When the aforementioned radiator is integrated into the heat dissipation surface of the vapor chamber in a single molding process, the large amount of heat from within the vapor chamber can be quickly and effectively conducted and dispersed to the heat dissipation structure, significantly improving heat dissipation efficiency.

[0006] However, due to the ever-increasing computing power of ChatGPT and higher-end AI servers, their thermal management capabilities must be at least 700W to cope. For example, NVIDIA A100 or H100 AI servers typically feature 4 to 8 GPUs, each generating an additional 300W to 700W of heat, resulting in an estimated total thermal power consumption exceeding 3000W for the entire AI server. Given that traditional air cooling cannot provide such efficient heat dissipation, the industry currently relies heavily on traditional single-phase immersion cooling technology to address the heat dissipation issues of high-density heat-generating server components, but even this still has a 600W upper limit.

[0007] To address the heat dissipation issues of high heat consumption, insufficient heat dissipation capacity, and excessive wattage of high-speed computing components, the introduction of "liquid cooling" technology has become a new trend in heat dissipation solutions. Liquid cooling involves introducing a liquid cooling system into the server. Utilizing the property that liquids conduct heat more easily than gases, the high-density heat generated by the heat-generating components is rapidly transferred to the cooling liquid through the liquid-cooled host. The cooled liquid, having absorbed heat, is then guided to an outdoor cooling tower or heat dissipation module, further dissipating the heat into the atmosphere, achieving rapid cooling and reduced energy consumption.

[0008] Common liquid cooling modules typically consist of a liquid cooling shroud enclosing the heatsink's cooling structure. The shroud and heatsink are then secured together with screws to form a cavity. The shroud has an inlet and an outlet. Coolant enters the cavity through the inlet, flows through the cooling structure, and exits through the outlet, then travels through pipes to an external cooling system to dissipate the heat. This continuous and rapid circulation of the coolant quickly removes the large amount of heat generated by the heat-generating components, achieving rapid heat dissipation. However, when the heatsink's metal base plate contacts the heat-generating components, the lateral thermal conductivity of the metal base plate is limited by its cross-sectional area. The large amount of heat generated by the heatsink cannot be efficiently conducted laterally to the entire metal base plate, causing a large amount of heat to accumulate in the localized area where the heatsink and heat-generating components are in contact. Even with liquid cooling, the improved heat dissipation capacity is significantly limited.

[0009] In view of the above problems, the creators of this project replaced the metal base plate of the heat sink with a copper vapor chamber, and integrated the heat sink's heat dissipation structure with the vapor chamber's heat dissipation surface in a one-piece molding process. When the heating element attached to the heat-absorbing surface of the vapor chamber generates a large amount of heat, the heat is quickly conducted to the vapor chamber. At this time, the working fluid existing in the internal space of the vapor chamber quickly absorbs the heat and rapidly vaporizes to form steam. Because the heat dissipation surface of the vapor chamber is connected to the heat sink, when the steam rises rapidly and comes into contact with the cooler metal surface connected to the heat sink, the steam condenses back into the working fluid, and through this liquid-gas-liquid phase change cycle, it quickly absorbs and releases a large amount of heat. Compared with the traditional use of a copper base plate, the vapor chamber can more quickly diffuse a large amount of concentrated heat source to a larger area of ​​the heat sink, thereby obtaining a larger effective heat dissipation area and faster heat dissipation.

[0010] However, even so, because the AI ​​servers contain a larger number of more energy-intensive chip modules, and these AI servers are often set up in the data center with a high density, the ambient temperature is often high. This can easily lead to the air cooling method being unable to effectively dissipate a large amount of heat from the heat sink, making the heat dissipation efficiency of the heat dissipation module insufficient to meet the demand.

[0011] Therefore, in order to further improve the heat dissipation capacity of the heat exchange plate, the inventor of this invention further proposes a liquid-cooled heat exchange plate heat dissipation device, which uses a heat exchange plate that integrates the heat dissipation structure of the heat sink with the heat dissipation surface of the heat exchange plate in an integral molding manner, and adds a liquid cooling cover to cover the heat sink therein, so as to form a liquid-cooled heat exchange plate heat dissipation device. Utility Model Content

[0012] In view of the above problems, the purpose of this utility model is to provide a heat sink module and a liquid-cooled heat sink device including the heat sink module, which is a high-efficiency heat dissipation module structure that integrates the heat sink and the heat sink into one unit. Further, the heat sink module of this utility model is manufactured by integrally molding the heat dissipation structure of the heat sink and the metal top cover plate of the heat sink onto the same metal sheet, thereby eliminating the thermal resistance between the heat sink and the heat sink caused by the low thermal conductivity of thermal paste, thus improving heat dissipation efficiency. At the same time, due to the improved heat dissipation efficiency, the deformation stress caused by temperature between the heat-generating element and the heat sink will also be effectively reduced. The heat sink module provided by this utility model integrates the heat sink and the heat sink into one unit, eliminating the interface that originally existed between the heat sink and the heat sink, thus eliminating the thermal resistance caused by the use of thermal paste.

[0013] This utility model's heat spreader module can be manufactured using metal processing methods such as stamping, extrusion, milling, casting, and forging, or it can be formed from metal sheets / blocks (e.g., copper) through cold forging. Its key feature is that, unlike conventional forging methods, cold forging eliminates the need for preheating and annealing the metal. Therefore, the internal grain structure of cold-forged metal does not suffer from the reduced thermal conductivity caused by annealing, which can lead to porosity and enlarged microstructure. In other words, cold-forged metal, without undergoing a heating process, maintains a relatively dense internal grain structure. Furthermore, the forged metal exhibits improved rigidity and density, and testing shows further increases in its thermal conductivity and thermal diffusivity.

[0014] This utility model provides a heat spreader module, characterized in that it includes:

[0015] A metal top cover includes a heat dissipation outer surface and a condensation inner surface. The heat dissipation outer surface has a plurality of sheet-like heat dissipation structures, and the condensation inner surface has an upper frame around its perimeter. The upper frame has an upper channel groove, and the condensation inner surface has a plurality of upper grooves arranged in parallel with each other.

[0016] A metal lower cover plate includes a heat-absorbing outer surface and an evaporating inner surface. The heat-absorbing outer surface is used to contact at least one heat-generating electronic component. The evaporating inner surface is provided with a lower frame around its perimeter. The lower frame is provided with a lower channel groove. The evaporating inner surface has a plurality of parallel lower grooves and a plurality of support structures protruding between the lower grooves.

[0017] A workspace is an airtight space formed by the upper frame of the upper metal cover and the lower frame of the lower metal cover joining together. The condensing inner surface of the upper metal cover and the evaporating inner surface of the lower metal cover are opposite to each other, and the arrangement of the upper groove and the lower groove can be mapped and overlapped to each other. The plurality of support structures protrude from the evaporating inner surface and abut against the upper groove of the condensing inner surface to support the workspace.

[0018] An air extraction channel is formed by the corresponding engagement of the upper channel groove and the lower channel groove, which is used to extract air from the workspace and seal it after extraction.

[0019] A capillary structure is disposed in the lower groove or in both the upper and lower grooves;

[0020] A working fluid exists in the working space and the capillary structure;

[0021] The metal upper cover plate is integrally formed from the same metal sheet, comprising the plurality of sheet-like heat dissipation structures, and the metal lower cover plate is integrally formed from the same metal sheet, comprising the plurality of support structures.

[0022] The heat spreader module, wherein the upper metal cover and the lower metal cover are made of pure copper.

[0023] The heat spreader module, wherein the working fluid is pure water.

[0024] The aforementioned heat spreader module, wherein: the air pressure in the working space is less than 1x10⁻⁶. -3 torr.

[0025] The heat spreader module, wherein: the heat-absorbing outer surface of the metal lower cover plate has at least one recessed space for accommodating at least one heat-dissipating element.

[0026] The heat spreader module, wherein: there are multiple recessed spaces for accommodating multiple electronic components.

[0027] The heat spreader module, wherein each of the recessed spaces has the same or different shapes and volumes, for simultaneously accommodating a plurality of electronic components of the same or different shapes and volumes.

[0028] The heat spreader module, wherein: the recessed space is recessed from the heat-absorbing outer surface towards the evaporating inner surface but does not protrude from the corresponding evaporating inner surface.

[0029] This utility model also provides a liquid-cooled heat dissipation device with a heat spreader, characterized in that it includes the aforementioned heat spreader module.

[0030] It also includes a liquid cooling cover, which includes a top and a side wall connected to the top, the side wall surrounding the top to form an accommodating space, and the liquid cooling cover is provided with at least one liquid inlet and at least one liquid outlet, the liquid inlet and the liquid outlet communicating with the accommodating space.

[0031] The liquid cooling cover is attached to the heat dissipation outer surface of the metal upper cover plate, and the sheet-like heat dissipation structure is disposed in the accommodating space so that a cooling liquid enters the accommodating space from the liquid inlet, flows through the sheet-like heat dissipation structure and flows out from the liquid outlet.

[0032] The liquid-cooled heat dissipation device is wherein the liquid inlet and the liquid outlet are located on the same side or different sides of the sidewall.

[0033] The liquid-cooled heat dissipation device includes a plurality of liquid inlets and a plurality of liquid outlets, wherein the plurality of liquid inlets and the plurality of liquid outlets are located on the same side or different sides of the liquid cooling cover.

[0034] The liquid-cooled heat dissipation device includes at least one guide plate in the accommodating space.

[0035] The liquid-cooled heat dissipation device is wherein the liquid cooling cover is joined to the heat dissipation outer surface of the metal upper cover by welding.

[0036] According to an embodiment of this utility model, a liquid-cooled heat dissipation device is provided. A liquid-cooling cover is attached to the heat dissipation outer surface of a metal upper cover plate, and a sheet-like heat dissipation structure is disposed within an accommodating space, forming a sealed liquid-cooled chamber. Cooling liquid can enter the accommodating space through the inlet, flow between the sheet-like heat dissipation structures for accelerated cooling, and then flow out through the outlet. The cooled liquid, after absorbing heat, is guided to an external heat dissipation system via external piping to dissipate heat and cool the liquid, before circulating again. This liquid-cooled heat dissipation device of this utility model is composed of a liquid-cooling cover combined with a heat dissipation plate module (formed by the joining of a metal upper cover plate and a metal lower cover plate). It utilizes liquid cooling through liquid circulation to provide a more efficient heat dissipation solution, improving the problem of poor air-cooled heat dissipation efficiency in high-end servers and large server rooms. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the structure of a heat spreader module according to an embodiment of the present invention.

[0038] Figure 2 This is a side view cross-sectional structural diagram of a heat spreader module according to an embodiment of the present invention.

[0039] Figure 3This is a schematic diagram of the structure of the metal top cover plate of a heat spreader module according to an embodiment of the present invention.

[0040] Figure 4 This is a schematic diagram of the structure of the metal lower cover plate of a heat spreader module according to an embodiment of the present invention.

[0041] Figure 5A This is a schematic diagram of the metal lower cover plate structure of a heat spreader module according to another embodiment of the present invention.

[0042] Figure 5B for Figure 5A A schematic diagram of the AA cross-sectional structure of the embodiment.

[0043] Figure 6A This is a schematic diagram of the metal lower cover plate structure of a heat spreader module according to another embodiment of the present invention.

[0044] Figure 6B for Figure 6A A schematic diagram of the BB cross-sectional structure of the embodiment.

[0045] Figures 7A-7B This is a schematic diagram of the application of the metal lower cover plate of the integrated heat spreader, which is one embodiment of the present invention.

[0046] Figure 8 This is a schematic diagram of the structure of a liquid-cooled heat dissipation plate device according to an embodiment of the present invention.

[0047] Figure 9 This is a side cross-sectional view of a liquid-cooled heat dissipation plate device according to an embodiment of the present invention.

[0048] Figure 10A , Figure 10B These are a perspective view and a front view of the liquid cooling cover of a liquid-cooled heat dissipation device for a liquid-cooled heat spreader according to another embodiment of this utility model.

[0049] Figure 11A , Figure 11B The above are perspective and front view of the liquid cooling cover of the liquid-cooled heat dissipation device for another embodiment of the present invention.

[0050] Figure 12A , Figure 12B The above are perspective and front view of the liquid cooling cover of the liquid-cooled heat dissipation device for another embodiment of the present invention.

[0051] Figure 13 This utility model Figure 9 The liquid-cooled heat sink was replaced with Figure 5B A schematic diagram of the structure of the metal lower cover plate.

[0052] Figure 14This utility model Figure 9 The liquid-cooled heat sink was replaced with Figure 6B A schematic diagram of the structure of the metal lower cover plate.

[0053] Figure 15 This is a schematic diagram of the structure of the metal top cover plate of the heat spreader module according to another embodiment of the present invention.

[0054] Figure 16 This is a schematic diagram of the structure of the metal top cover plate of the heat spreader module according to another embodiment of the present invention.

[0055] Figure 17 This is a schematic diagram of the structure of the metal top cover plate of the heat spreader module in another embodiment of the present invention.

[0056] Explanation of reference numerals in the attached drawings: 10 - Heat sink module; 10A - Liquid-cooled heat sink device; 100, 101, 102, 103, 104 - Metal upper cover plate; 110 - Heat dissipation outer surface; 111, 111A, 111B, 111C - Plate-shaped heat dissipation structure; 112, 113 - Grooves; 120 - Condensation inner surface; 121 - Upper groove; 122 - Upper frame; 123 - Upper channel groove; 200, 200A, 200B, 200C - Metal lower cover plate; 210 - Heat absorption outer... Surface; 211-Working space; 220-Evaporation inner surface; 221-Lower groove; 222-Lower frame; 223-Lower channel groove; 224-Support structure; 225-Recessed space; 300, 310, 320, 330-Liquid cooling cover; 301-Top; 302-Side wall; 303-Accommodation space; 304-Liquid inlet; 305-Liquid outlet; 3201, 3301-Guide plate; 400-Air extraction channel; 500-Capillary structure; 1010-Welding groove; W-Working fluid. Detailed Implementation

[0057] The following description, with reference to the accompanying drawings, illustrates embodiments of the vapor chamber module and the liquid-cooled vapor chamber heat dissipation device including the vapor chamber module of this utility model. For clarity and convenience of illustration, the dimensions and proportions of the components in the drawings may be exaggerated or reduced. In the following description and / or claims, the technical terms used should be interpreted in the sense commonly known and understood by those skilled in the art. For ease of understanding, the same elements in the following embodiments are indicated by the same symbols. In this specification, the term "about" generally refers to an actual value within ±10%, 5%, 1%, or 0.5% of a specific value or range. The term "about" in this utility model represents an actual value falling within the acceptable standard error of the average value, and is considered to be of ordinary skill in the art to which this utility model pertains. Except as otherwise expressly stated, ranges, quantities, values, and percentages used herein are all modified by the term "about". Therefore, unless otherwise stated, the numerical values ​​or parameters disclosed in this utility model specification and accompanying claims are approximate values ​​and may be changed as needed.

[0058] Please see Figures 1 to 4This is a schematic diagram of a heat spreader module 10 according to an embodiment of the present invention. As shown in the figure, the heat spreader module 10 of the present invention includes at least: a metal upper cover plate 100, including a heat dissipation outer surface 110 and a condensation inner surface 120. The heat dissipation outer surface 110 has a plurality of sheet-like heat dissipation structures 111, and the condensation inner surface 120 has an upper frame 122 of appropriate height around its periphery, with an upper channel groove 123 on the upper frame. The condensation inner surface 120 also has a plurality of upper grooves 121 arranged in parallel with each other; a metal lower cover plate 200, including a heat absorption outer surface 210 and an evaporation inner surface 220. The heat absorption outer surface 210 is used to contact at least one heat-dissipating electronic component. The evaporation inner surface 220 has a lower frame 222 of appropriate height around its periphery, with a lower channel groove 223 on the lower frame 222. The evaporation inner surface 220 has a plurality of lower grooves 221 arranged in parallel with each other and a plurality of support structures 224 protruding between the lower grooves 221; a working space 2 11, which is an airtight space formed by the upper frame 122 of the upper metal cover plate 100 and the lower frame 222 of the lower metal cover plate 200. The condensing inner surface 120 of the upper metal cover plate 100 and the evaporating inner surface 220 of the lower metal cover plate 200 are opposite to each other, and the arrangement of the upper groove 121 and the lower groove 221 can be mapped and overlapped to each other. A plurality of support structures 224 protrude from the evaporating inner surface 220 and abut against the upper groove 121 of the condensing inner surface 120 to support the working space 211. The air extraction channel 400 is formed by the corresponding engagement of the upper channel groove 123 and the lower channel groove 223, which can be used to extract air from the working space 211 and seal it after extraction. The capillary structure 500 is disposed in the lower groove 221 or in the upper groove 121 and the lower groove 221. The working fluid W exists in the working space 211 and the capillary structure 500.

[0059] In one embodiment, the upper frame 122 and lower frame 222 of the heat spreader module 10 of the present invention further have a welding groove 1010 for welding the upper metal cover plate 100 and the lower metal cover plate 200 together to form the heat spreader module 10 of the present invention.

[0060] Please see Figure 2 and Figure 3In one embodiment, the shape and sheet-like heat dissipation structure 111 of the metal top cover plate 100 in the heat spreader module 10 of this utility model are integrally formed from the same metal sheet (or metal block) rather than externally attached. In other words, the shape and structure of the metal top cover plate 100 are integrally formed from a single metal sheet (or metal block). Further, the plurality of sheet-like heat dissipation structures 111 on the heat dissipation outer surface 110 of the metal top cover plate 100 in this embodiment are directly formed on the heat dissipation outer surface 110, and are inseparable from the heat dissipation outer surface 110 of the metal top cover plate 100. There are no heterogeneous or homogeneous interfaces between them. This is unlike the common prior art where the heat sink is glued to the heat dissipation surface of the heat spreader with heat dissipation paste, nor is the heat dissipation structure formed on the heat dissipation surface of the heat spreader by welding or sintering. In other words, the heat dissipation plate module of this utility model directly generates the heat dissipation structure on the metal cover plate of the heat dissipation plate, thereby eliminating the heterogeneous interface and its thermal resistance between the heat sink and the heat dissipation plate, and thus improving the heat dissipation efficiency.

[0061] Please see Figure 2 and Figure 4 In one embodiment, the shape and structural features of the metal lower cover plate 200 in the heat spreader module 10 of this invention are integrally formed from the same metal sheet (or metal block). In other words, the plurality of support structures 224 on the evaporation inner surface 220 of the metal lower cover plate 200 of the heat spreader module 10 of this embodiment are directly formed on the evaporation inner surface 220, and are made of the same metal as the evaporation inner surface 220 of the metal lower cover plate 200 and are inseparable. There is no heterogeneous or homogeneous interface, unlike the common prior art which uses a sintering method to sinter the support structures 224 onto the evaporation inner surface 220.

[0062] Generally, the method for manufacturing the one-piece metal upper cover plate 100 and metal lower cover plate 200 of the heat spreader module 10 of this utility model can employ etching or composite processing (e.g., integrating milling and stamping or extrusion processes). The advantage of etching is that it can etch more complex structures, and it is generally used for products that are difficult to manufacture using traditional processing methods. The advantage of composite processing is that it mostly uses mature manufacturing methods, requiring minimal development for production. However, etching is time-consuming and can result in uneven surfaces requiring secondary processing, while composite processing requires more steps and time for manufacturing.

[0063] In one embodiment, the heat spreader module 10 of this invention is manufactured using a cold forging method to create the shape and structure of the upper metal cover plate 100 and the lower metal cover plate 200, followed by CNC machining and cutting processes for finishing. Unlike etching or composite machining processes, cold forging involves placing the metal sheet (or block) to be processed in a master mold, and then continuously forging the metal sheet at room temperature using a male mold to shape it. Those skilled in the art will understand that the cold forging method does not require preheating and softening the metal and annealing as in conventional stamping processes. Therefore, the internal grain structure of the forged metal will not suffer from reduced thermal conductivity due to annealing, which would otherwise result in porosity or enlarged structure. Metals that have undergone cold forging, without experiencing a heating process, can still maintain a fairly dense internal grain structure and reduce internal defects such as porosity. The surface of the forged metal is smoother and has the advantages of improved rigidity and density, and is less prone to deformation. Tests have shown that the thermal conductivity and thermal diffusivity of the forged metal are higher than those before forging. In other words, in this embodiment, the heat dissipation efficiency of the heat spreader module of this invention is higher than that of conventional processes.

[0064] In one embodiment, the metal upper cover plate 100 of the heat dissipation plate module 10 of the present invention is made by cold forging, and then a plurality of sheet-like heat dissipation structures 111 are formed on the heat dissipation outer surface 110 of the metal upper cover plate 100 by CNC machining using cutting or tooth scraping methods.

[0065] In one embodiment, the lower metal cover plate 200 of the heat spreader module 10 of this invention is manufactured by cold forging. The shape and structural features of the lower metal cover plate 200 are all directly formed on the same metal sheet by cold forging. This includes a plurality of raised support structures 224 on the evaporation inner surface 220 of the lower metal cover plate 200. That is, like the upper metal cover plate 100, the plurality of raised support structures 224 on the evaporation inner surface 220 of the lower metal cover plate 200 are not externally formed or generated by conventional sintering methods, but are integrally forged with the lower metal cover plate. In one embodiment, the plurality of raised support structures 224 are columnar structures.

[0066] In any embodiment, the metal upper cover plate 100 and metal lower cover plate 200 of the heat spreader module 10 of this invention are integrally formed using a metal sheet (e.g., pure copper) with high thermal conductivity and thermal diffusivity by cold forging to form the aforementioned structure. In one embodiment, the metal sheet is pure copper.

[0067] Those skilled in the art will understand that in the above embodiments, when pure copper is used as the material and the metal upper cover plate 100 and metal lower cover plate 200 are manufactured by cold forging, the physical properties of the resulting metal upper cover plate 100 and metal lower cover plate 200, such as Vickers hardness, thermal conductivity, and thermal diffusivity, are higher than those of pure copper material that has not been cold forged, and also higher than those of metal upper cover plate 100 and metal lower cover plate 200 manufactured by other methods (such as etching, stamping, extrusion, or general forging). In other words, when pure copper material is cold forged, it will have higher Vickers hardness, thermal conductivity, and thermal diffusivity, which are different from the material properties obtained by other processing methods.

[0068] In any of the above embodiments, the heat spreader module 10, wherein the metal upper cover plate 100 and the metal lower cover plate 200 are joined together by welding.

[0069] In any of the above embodiments, the working fluid W used in the heat spreader module 10 of this utility model is pure water.

[0070] In any of the above embodiments, the working space 211 of the heat spreader module 10 of this utility model has an air pressure of less than 1x10 after evacuation. -3 torr, 1x10 -4 torr or 1x10 -5 torr.

[0071] Please see Figure 5A and Figure 5B The metal lower cover plate 200A of the heat spreader module of this utility model is described in this embodiment. The shape and structural features of the metal lower cover plate 200A are all formed directly on the same piece of metal by cold forging. This includes the recessed space 225 on the heat-absorbing outer surface 210 of the metal lower cover plate 200A, which is then further processed by CNC machining. Furthermore, in the cold-forged metal lower cover plate 200A, the recessed space 225 on the heat-absorbing outer surface 210 is recessed from the heat-absorbing outer surface 210 towards the evaporation inner surface 220 but does not protrude from the corresponding evaporation inner surface 220. This recess is used to accommodate an electronic component, unlike in a typical stamping process where one side is recessed and the other side has a corresponding protrusion.

[0072] Please see Figure 6A and Figure 6BThe metal lower cover plate 200B is another embodiment of the heat spreader module of this utility model. The heat-absorbing outer surface 210 of the metal lower cover plate 200B further includes a plurality of recessed spaces 225. The plurality of recessed spaces 225 are recessed from the heat-absorbing outer surface 210 toward the evaporation inner surface 220 but do not protrude from the evaporation inner surface 220, and are used to accommodate a plurality of electronic components.

[0073] Please see Figure 7A and Figure 7B This is another embodiment of the integrated heat spreader of this utility model, the metal lower cover plate 200C, as shown in the figure. The plurality of recessed spaces 225 have the same or different shapes and volumes. They can be customized according to the size and shape of each small chip in the chip assembly on the circuit board to simultaneously accommodate various electronic components of the same or different shapes and volumes. For example, an integrated heat spreader that can simultaneously accommodate a 5G server chip assembly (such as...) Figure 7A (As shown in the diagram). When external electronic components are housed in a plurality of recessed spaces 225 of the heat-absorbing outer surface 210, a thermally conductive material with good thermal conductivity can be further added between the electronic components and the heat-absorbing outer surface 210 to reduce the thermal resistance caused by slight unevenness of the contact surface, such as thermal paste or graphite sheet, so that the electronic components can be tightly sealed to the heat-absorbing outer surface 210 and the heat dissipation efficiency can be improved.

[0074] It should be understood that in any embodiment of the integrated heat spreader of this utility model, Figure 1 , Figure 5A , Figure 6A and Figure 7A The metal lower cover plates 200, 200A, 200B, and 200C shown are integrally forged using a cold forging method. In one embodiment, pure copper with a high thermal diffusivity and high thermal conductivity is used for integral forging. Therefore, the resulting pure copper metal lower cover plates have higher hardness and rigidity than those made using conventional processing methods, and are less prone to deformation.

[0075] Please see Figures 8 to 9 and Figures 3 to 4 , Figure 8 This is a schematic diagram of a liquid-cooled heat dissipation device 10A according to an embodiment of the present invention. Figure 9 for Figure 8 A side-view sectional structural diagram. Please refer to [the diagram first]. Figure 8 and Figure 9As shown in the figure, the liquid-cooled heat dissipation device 10A of this utility model includes: a liquid cooling cover 300, a metal upper cover plate 100, and a metal lower cover plate 200. The liquid cooling cover 300 includes: a top 301 and a side wall 302 connected to the top. The side wall 302 surrounds the top 301 to form an accommodating space 303. The liquid cooling cover 300 is provided with at least one liquid inlet 304 and at least one liquid outlet 305, which communicate with the accommodating space 303. In this embodiment, the liquid cooling cover 300 is provided with one liquid inlet 304 and one liquid outlet 305 on opposite sides of the side wall 302. The metal upper cover plate 100 (see [reference]). Figures 8 to 9 and Figure 3 The device includes a heat dissipation outer surface 110 and a condensation inner surface 120. The heat dissipation outer surface 110 has a plurality of sheet-like heat dissipation structures 111, and the condensation inner surface 120 has an upper frame 122 of appropriate height around its perimeter. The upper frame has an upper channel groove 123, and the condensation inner surface 120 has a plurality of upper grooves 121 arranged in parallel with each other. The metal upper cover 100, which includes the sheet-like heat dissipation structures 111, is integrally formed from a single metal sheet. The metal lower cover 200 (see [reference]) Figures 8 to 9 and Figure 4 The upper metal cover 200 includes a heat-absorbing outer surface 210 and an evaporating inner surface 220. The heat-absorbing outer surface 210 is used to contact a heat-releasing electronic component. The evaporating inner surface 220 has a lower frame 222 of appropriate height around its periphery. The lower frame 222 has a lower channel groove 223. The evaporating inner surface 220 has a plurality of parallel lower grooves 221 and a plurality of support structures 224 protruding between the lower grooves 221. The metal lower cover 200, including the support structures 224, is integrally formed from a metal sheet. The upper frame 122 of the metal upper cover 100 and the lower frame 222 of the metal lower cover 200 are joined together to form a working space 211. The condensing inner surface 120 of the 0 and the evaporating inner surface 220 of the metal lower cover plate 200 are opposite to each other, and the arrangement of the upper groove 121 and the lower groove 221 can be mapped and overlapped to each other. A plurality of support structures 224 protrude from the evaporating inner surface 220 and abut against the upper groove 121 of the condensing inner surface 120 to support the working space 211. The evacuation channel 400 is formed by the corresponding engagement of the upper channel groove 123 and the lower channel groove 223, and is used to evacuate the working space 211 and seal it after evacuation. The capillary structure 500 is disposed in the lower groove 221 or in the upper groove 121 and the lower groove 221. The working fluid W exists in the working space 211 and the capillary structure 500. The liquid cooling cover 300 is attached to the heat dissipation outer surface 110 of the metal upper cover plate 100, and the sheet-like heat dissipation structure 111 is disposed in the accommodating space 303 so that the cooling liquid enters the accommodating space 303 from the liquid inlet 304 and flows out from the liquid outlet 305 through the sheet-like heat dissipation structure 111.

[0076] It should be understood that after the metal upper cover plate 100 and the metal lower cover plate 200 are joined, they form a heat dissipation plate module. This heat dissipation plate module is an integrated heat dissipation plate module that integrates the sheet-like heat dissipation structure 111 and the metal upper cover plate 100 into one unit.

[0077] It must be stated that, Figure 8 and Figure 9 Due to the adoption of Figure 1 and Figure 2 The same metal upper cover 100 and metal lower cover 200, therefore Figure 9 and Figure 10A , Figure 10B The metal lower cover plate 200 shown is Figure 1 and Figure 2 The metal upper cover plate 100 and the metal lower cover plate 200 shown have the same metallic properties.

[0078] In one embodiment, the upper frame 122 and lower frame 222 of the liquid-cooled heat dissipation device 10A of the present invention further have a welding groove 1010 for welding the upper metal cover plate 100 and the lower metal cover plate 200 together.

[0079] Please see Figure 9 and Figure 3 In one embodiment, the shape and sheet-like heat dissipation structures 111 included in the metal upper cover plate 100 of the liquid-cooled heat dissipation device 10A of this utility model are integrally formed from the same metal sheet (or metal block) rather than externally attached. In other words, the shape and structure of the metal upper cover plate 100 are integrally formed from a single metal sheet (or metal block). Further, the plurality of sheet-like heat dissipation structures 111 on the heat dissipation outer surface 110 of the metal upper cover plate 100 of this embodiment are directly formed on the heat dissipation outer surface 110, and are inseparable from the heat dissipation outer surface 110 of the metal upper cover plate 100. There are no heterogeneous or homogeneous interfaces between them. This is unlike the common prior art where the heat sink is glued to the heat dissipation surface of the heat dissipation plate with heat dissipation paste, nor is the heat dissipation structure formed on the heat dissipation surface of the heat dissipation plate by welding or sintering. In other words, the heat dissipation structure 111 is directly formed on the heat dissipation outer surface 110 of the metal cover plate 100 of the heat sink, thereby eliminating the heterogeneous interface between the heat sink and the heat sink and its thermal resistance, so as to improve the heat dissipation efficiency.

[0080] Please see Figure 9 and Figure 4In one embodiment, the shape and structural features of the metal lower cover plate 200 in the liquid-cooled heat dissipation device 10A of this invention are integrally formed from the same metal sheet (or metal block). In other words, the plurality of support structures 224 on the evaporation inner surface 220 of the metal lower cover plate 200 of this embodiment are directly formed on the evaporation inner surface 220, and are made of the same metal as the evaporation inner surface 220 of the metal lower cover plate 200 and are inseparable. There is no heterogeneous or homogeneous interface, unlike the common prior art where the support structures 224 are sintered onto the evaporation inner surface 220.

[0081] In other words, in any of the above embodiments, the liquid-cooled heat dissipation device 10A, wherein the upper metal cover plate 100 and the lower metal cover plate 200 are joined together by welding.

[0082] In any of the above embodiments, the working fluid W used in the liquid-cooled heat dissipation device 10A of this utility model is pure water.

[0083] In any of the above embodiments, the working space 211 of the liquid-cooled heat dissipation device 10A of this utility model, after being evacuated and sealed via the evacuation channel 400, has an air pressure of less than 1 x 10⁻⁶. -3 torr, 1x10 -4 torr or 1x10 -5 torr. It should be understood that the sealing performed after the above-mentioned evacuation is a generally known technique and is not limited here. For example, the working space 211 can be evacuated to a set pressure through a metal evacuation pipe, and then the evacuation pipe can be pressed, sintered or welded together using a jig to seal it.

[0084] Please see Figure 9 In one embodiment, the liquid-cooled heat dissipation device 10A of the present invention has a liquid cooling cover 300 having at least one liquid inlet 304 and at least one liquid outlet 305, and the liquid inlet 304 and the liquid outlet 305 are disposed on different sides of the side wall, as shown in the figure. In this embodiment, the liquid inlet 304 and the liquid outlet 305 are disposed on opposite sides of the side wall 302.

[0085] Please see Figure 10A , Figure 10B In another embodiment of the liquid-cooled heat dissipation device 10A of this utility model, the liquid cooling cover 310 has at least one liquid inlet 304 and at least one liquid outlet 305, and the liquid inlet 304 and the liquid outlet 305 are disposed on the same side of the side wall 302 of the liquid cooling cover 310.

[0086] It should be understood that, in order to accommodate the arrangement or stacking of server racks, the liquid cooling cover 300 or 310 of the liquid-cooled heat dissipation device 10A of this utility model has at least one liquid inlet 304 and at least one liquid outlet 305, and the liquid inlet 304 and liquid outlet 305 can be set on the same side or different sides of the side wall 302 according to customer needs. In another embodiment, in order to accelerate the flow of cooling liquid and improve cooling efficiency, the number of liquid inlets 304 is two or more, and the number of liquid outlets 305 is also two or more. The number of liquid inlets 304 and the number of liquid outlets 305 can be equal or unequal, and the liquid inlets 304 and liquid outlets 305 can be set on the side wall 302 in a manner that is partly on the same side and partly on different sides, which is not limited here.

[0087] To further improve the heat dissipation efficiency of the liquid-cooled heat sink 10A of this invention, another embodiment of the liquid cooling cover 320 and 330 is provided. The accommodating space 303 is further provided with at least one guide plate, allowing the cooling liquid to enter the accommodating space 303 from the inlet 304 and be quickly and evenly guided to the space between the plurality of plate-shaped heat dissipation structures 111. This rapidly carries away the heat distributed on the surface of the plate-shaped heat dissipation structures, and then quickly flows out from the outlet 305 to the external heat dissipation system. This avoids turbulence or uneven temperature formation of the cooling liquid within the accommodating space, thereby further improving the heat dissipation efficiency. Please refer to [link to relevant documentation]. Figure 11A , Figure 11B In one embodiment, the liquid cooling cover 320 of the liquid-cooled heat dissipation device 10A of this utility model has an inlet 304 and an outlet 305 respectively disposed on opposite sides of the side wall 302. A pair of guide plates 3201 are respectively disposed at the inlet 304 and outlet 305 within the accommodating space 303. These guide plates 3201 extend outwards from the inlet 304 and outlet 305 in a V-shape. It should be understood that without the guide plates 3201, when the density of the sheet-like heat dissipation structures 111 is high and concentrated in the middle region of the heat dissipation outer surface 110, the flow of the cooling liquid after entering the accommodating space 303 from the inlet 304 will be obstructed by the sheet-like heat dissipation structures and flow to both sides. This will result in a slow flow rate of the cooling liquid between the sheet-like heat dissipation structures 111, leading to a high temperature of the cooling liquid in the middle region that cannot be quickly carried away, thus failing to achieve the high efficiency of liquid cooling. Therefore, by providing a pair of guide plates 3201 at the inlet 304 and outlet 305, the cooling liquid is guided from the inlet 304 to the plate-shaped heat dissipation structure 111 to improve heat dissipation efficiency. Please refer to Figure 12A , Figure 12BIn another embodiment, when the inlet 304 and the outlet 305 are located on the same side of the side wall 302 of the liquid cooling cover 330, a guide plate 3301 can be provided between the inlet 304 and the outlet 305 to ensure that the cooling liquid can flow quickly and evenly between the sheet-like heat dissipation structures 111, quickly remove heat, and flow smoothly out of the outlet 305 to the external heat dissipation system.

[0088] It should be understood that the liquid cooling covers 300, 310, 320, and 330 disclosed in any of the above embodiments are illustrative and not intended to limit the scope of the liquid-cooled heat dissipation device 10A of this utility model. Those skilled in the art to which this utility model pertains, upon referring to the embodiments of this utility model, should be able to set different numbers, positions, sizes, and shapes of the guide plates according to actual application conditions to improve the flow pattern of the cooling liquid, allowing the cooling liquid to flow more smoothly and thus improving heat dissipation efficiency.

[0089] In any of the above embodiments, the liquid-cooled heat dissipation device 10A of the present invention has liquid cooling covers 300, 310, 320 and 330 joined to the heat dissipation outer surface 110 of the metal upper cover plate 100 by welding.

[0090] In any of the above embodiments, the metal upper cover plate 100 and metal lower cover plate 200 in the liquid-cooled heat dissipation device 10A of this utility model can be adopted as follows: Figure 1 Metal upper cover 100, metal lower cover 200, or... Figure 5A , Figure 6A or Figure 7A Replace the metal lower cover plates 200A, 200B, and 200C.

[0091] Please see Figure 13 This is the utility model Figure 9 The metal lower cover plate 200 of the liquid-cooled heat sink 10A is replaced with Figure 5A The metal lower cover plate 200A has a heat-absorbing outer surface 210 with a recessed space 225 for accommodating an electronic component.

[0092] Please see Figure 14 This is the utility model Figure 9 The metal lower cover plate 200 of the liquid-cooled heat sink 10A is replaced with Figure 6A The metal lower cover plate 200B has a heat-absorbing outer surface 210 with a plurality of recessed spaces 225, each recessed space 225 having the same or different shapes and volumes, for accommodating a plurality of electronic components of different shapes or volumes.

[0093] It is understandable that this utility model Figure 9The metal lower cover plate 200 of the liquid-cooled heat sink 10A can be replaced with Figure 7A 200C metal lower cover plate.

[0094] Figure 1 and Figure 8 The metal top cover 100 shown may have multiple sheet-like heat dissipation structures 111 on its heat dissipation outer surface 110, which may have other variations and are not limited to the structure shown. Please refer to... Figures 15 to 17 The illustrated embodiment, wherein, Figure 15 The arrangement direction of the sheet-like heat dissipation structure 111A on the heat dissipation outer surface 110 of the metal top cover 102 shown is the same as... Figure 1 and Figure 8 The sheet-like heat dissipation structures 111 shown are arranged in different directions. Figure 16 The arrangement direction of the sheet-like heat dissipation structure 111B on the heat dissipation outer surface 110 of the metal top cover 103 shown is the same as... Figure 1 and Figure 8 The sheet-like heat dissipation structures 111 shown are arranged in the same direction, but a rectangular groove 112 is formed at approximately the central part of the sheet-like heat dissipation structure 111B by machining (e.g., milling). Figure 17 The arrangement direction of the sheet-like heat dissipation structure 111C on the heat dissipation outer surface 110 of the metal top cover 104 shown is the same as... Figure 1 and Figure 8 The sheet-like heat dissipation structures 111 shown are arranged in the same direction, but two V-shaped grooves 113 are machined (e.g., milled) in the central part of the sheet-like heat dissipation structure 111C. The rectangular grooves 112 and V-shaped grooves 113 described in the above embodiment can also be machined to a depth that is flush with the outer surface 110 of the heat dissipation structure, so that the sheet-like heat dissipation structures 111B and 111C form two or three rows of sheet-like heat dissipation structures respectively.

[0095] The above embodiments illustrate that the shape and orientation of the sheet-like heat dissipation structure of the metal top cover of this utility model are not limited. Figure 1 , Figure 8 , Figures 15 to 17 The sheet-like heat dissipation structures 111, 111A to 111C shown are only illustrative examples, but are not limited to these.

[0096] The above embodiments are for illustrative purposes only and are not intended to limit the scope of this utility model. Any equivalent modifications or alterations made to the liquid-cooled heat dissipation device based on the above embodiments should still be included within the patent scope of this utility model.

[0097] It is worth mentioning that most existing heat dissipation modules use external heat sinks. This combination adds a thermal resistance at the heat conduction interface before the heat sink, reducing heat dissipation efficiency. The heat spreader module and liquid-cooled heat spreader device including the heat spreader module of this invention integrate the heat spreader's top cover with the heat sink into a single piece, allowing the heat spreader's ultra-high heat dissipation efficiency to no longer be limited by the thermal resistance of the conduction interface. Furthermore, the introduction of a liquid cooling cover allows the already high-efficiency heat spreader to be combined with more efficient liquid cooling, further improving heat dissipation efficiency. In addition, the setup of large server rooms and high-density, high-end chip modules often results in excessively high ambient air temperatures, leading to low air cooling efficiency. The liquid-cooled heat spreader device of this invention incorporates liquid cooling, unaffected by the ambient air temperature of the server room or equipment. Furthermore, the placement and number of liquid inlets and outlets can be changed according to the stacking of equipment or chip modules, making the overall heat dissipation solution more systematic and efficient. Furthermore, the metal upper and lower cover plates of the liquid-cooled heat dissipation device of this utility model can be manufactured by etching or composite processing (e.g., casting, forging, milling, stamping or extrusion), or by cold forging. This makes the material grain structure finer and reduces internal porosity defects. As a result, the material can obtain high strength, deformation resistance and fatigue resistance and other excellent mechanical properties. It can also improve the thermal conductivity and heat diffusion efficiency of the material. The resulting liquid-cooled heat dissipation device will be superior to general heat dissipation modules with similar structures in terms of heat dissipation efficiency, durability and reliability.

[0098] It is evident that this utility model, by breaking through previous technologies, has indeed achieved the desired improved effect, and is not something that would be easily conceived by those skilled in the art. Its progressiveness and practicality clearly meet the application requirements for a utility model patent.

[0099] The above description is merely illustrative and not restrictive. Any equivalent modifications or alterations made without departing from the spirit and scope of this utility model should be included within the protection scope of this utility model.

Claims

1. A heat spreader module, characterized in that, include: A metal top cover includes a heat dissipation outer surface and a condensation inner surface. The heat dissipation outer surface has a plurality of sheet-like heat dissipation structures, and the condensation inner surface has an upper frame around its perimeter. The upper frame has an upper channel groove, and the condensation inner surface has a plurality of upper grooves arranged in parallel with each other. A metal lower cover plate includes a heat-absorbing outer surface and an evaporating inner surface. The heat-absorbing outer surface is used to contact at least one heat-generating electronic component. The evaporating inner surface is provided with a lower frame around its perimeter. The lower frame is provided with a lower channel groove. The evaporating inner surface has a plurality of parallel lower grooves and a plurality of support structures protruding between the lower grooves. A workspace is an airtight space formed by the upper frame of the upper metal cover and the lower frame of the lower metal cover joining together. The condensing inner surface of the upper metal cover and the evaporating inner surface of the lower metal cover are opposite to each other, and the arrangement of the upper groove and the lower groove can be mapped and overlapped to each other. The plurality of support structures protrude from the evaporating inner surface and abut against the upper groove of the condensing inner surface to support the workspace. An air extraction channel is formed by the corresponding engagement of the upper channel groove and the lower channel groove, which is used to extract air from the workspace and seal it after extraction. A capillary structure is disposed in the lower groove or in both the upper and lower grooves; A working fluid exists in the working space and the capillary structure; The metal upper cover plate is integrally formed from the same metal sheet, comprising the plurality of sheet-like heat dissipation structures, and the metal lower cover plate is integrally formed from the same metal sheet, comprising the plurality of support structures.

2. The heat spreader module as described in claim 1, characterized in that: The upper and lower metal covers are made of pure copper.

3. The heat spreader module as described in claim 1, characterized in that: The working fluid is pure water.

4. The heat spreader module as described in claim 1, characterized in that: The air pressure in this workspace is less than 1 x 10⁻⁶. -3 torr.

5. The heat spreader module as described in claim 1, characterized in that: The heat-absorbing outer surface of the metal lower cover has at least one recessed space for accommodating at least one heat-dissipating element.

6. The heat spreader module as described in claim 5, characterized in that: There are multiple recessed spaces to accommodate multiple electronic components.

7. The heat spreader module as described in claim 6, characterized in that: Each of the recessed spaces has the same or different shapes and volumes, and is used to simultaneously accommodate multiple electronic components of the same or different shapes and volumes.

8. The heat spreader module as described in claim 5, characterized in that: The recessed space is recessed from the heat-absorbing outer surface towards the evaporating inner surface, but does not protrude from the corresponding evaporating inner surface.

9. A liquid-cooled heat dissipation device with a heat exchange plate, characterized in that: Including the heat spreader module as described in any one of claims 1 to 8, It also includes a liquid cooling cover, which includes a top and a side wall connected to the top, the side wall surrounding the top to form an accommodating space, and the liquid cooling cover is provided with at least one liquid inlet and at least one liquid outlet, the liquid inlet and the liquid outlet communicating with the accommodating space. The liquid cooling cover is attached to the heat dissipation outer surface of the metal upper cover plate, and the sheet-like heat dissipation structure is disposed in the accommodating space so that a cooling liquid enters the accommodating space from the liquid inlet, flows through the sheet-like heat dissipation structure and flows out from the liquid outlet.

10. The liquid-cooled heat dissipation device as described in claim 9, characterized in that: The inlet and outlet are located on the same side or different sides of the sidewall.

11. The liquid-cooled heat dissipation device as described in claim 9, characterized in that: There are multiple liquid inlets and multiple liquid outlets, and the multiple liquid inlets and multiple liquid outlets are located on the same side or different sides of the liquid cooling cover.

12. The liquid-cooled heat dissipation device as described in claim 9, characterized in that: The accommodating space is equipped with at least one deflector.

13. The liquid-cooled heat dissipation device as described in claim 9, characterized in that: The liquid cooling shield is welded to the heat dissipation outer surface of the metal top cover.

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