Suction nozzle structure and mounting equipment

Abstract

The utility model provides a suction nozzle structure and mounting equipment, and relates to the technical field of chip mounting. The suction nozzle structure comprises a mounting part, an adsorption part and a cleaning part. The mounting part is used for being connected with a mounting head. The adsorption part is connected with the mounting part; the adsorption part is provided with adsorption holes which are used as flow channels for adsorbing gas. The cleaning part is telescopically arranged on the periphery of the adsorption part in a sleeving manner, and the cleaning part is used for cleaning the adsorption part. The suction nozzle structure is provided with the cleaning part, so that the adsorption part can be cleaned, and the adsorption efficiency and the adsorption stability are improved.

Description

Technical Field

[0001] This utility model relates to the field of chip mounting technology, and in particular to a nozzle structure and mounting equipment. Background Technology

[0002] With the rapid development of the semiconductor industry, in the chip mounting process of semiconductor device manufacturing, it is necessary to use the nozzles on the mounting head to pick up the chips and mount them onto the substrate. The working principle of nozzle chip mounting is as follows: a vacuum airflow is introduced into the nozzle through the vacuum tube on the machine, thereby realizing the vacuum adsorption of the flip chip by the nozzle. After picking up the flip chip, the nozzle moves to allow the chip to be coated with solder resist, and then the chip is mounted onto the substrate.

[0003] Due to prolonged placement work, solder resist can rise to the nozzle through capillary action, which can easily lead to contamination of the back of the flip chip and a decrease in the nozzle's suction power, resulting in unreliable adhesion and reduced placement reliability. Utility Model Content

[0004] The purpose of this invention is to provide a nozzle structure and mounting equipment that can clean the adsorption part of the nozzle structure, improve adsorption stability, and avoid contamination on the back of flip chips.

[0005] In a first aspect, this utility model provides a suction nozzle structure, comprising:

[0006] The mounting part is used to connect with the placement head;

[0007] An adsorption section is connected to the mounting section; the adsorption section is provided with adsorption holes, which serve as flow channels for adsorbing gas.

[0008] A cleaning section is retractably fitted around the outer periphery of the adsorption section, and the cleaning section is used to clean the adsorption section.

[0009] In an optional embodiment, the mounting portion and the adsorption portion are coaxially arranged, and the adsorption hole passes through the mounting portion and the adsorption portion.

[0010] In an optional embodiment, the cleaning part includes a telescopic rod and a collar connected to the telescopic rod. The collar is sleeved on the adsorption part, and the telescopic rod can drive the collar to move axially along the adsorption part. The telescopic rod is used to connect with the mounting head.

[0011] In an optional embodiment, the telescopic rod is provided with a mounting hole for connecting to the mounting head.

[0012] In an optional embodiment, the telescopic rod has a hollow structure, which is in communication with the surface of the adsorption part, and the hollow structure is used to introduce clean gas.

[0013] In an optional embodiment, the collar includes an annular wall and an annular boss disposed on the inner side of the annular wall. The annular boss is sleeved on the adsorption part, and the inner diameter of the annular boss is adapted to the outer diameter of the adsorption part.

[0014] In an optional embodiment, the telescopic rod is connected to the annular boss.

[0015] In an optional embodiment, the mounting part is provided with a mounting through hole, the telescopic rod passes through the mounting through hole, and one end of the telescopic rod is connected to the collar, while the other end is used to connect to the mounting head.

[0016] In an optional embodiment, the mounting portion and the adsorption portion are made of metal.

[0017] Secondly, this utility model provides a mounting device, including a mounting head and a suction nozzle structure as described in any of the foregoing embodiments, wherein the suction nozzle structure is connected to the mounting head.

[0018] The nozzle structure and mounting equipment provided in this embodiment of the utility model have the following advantages:

[0019] The nozzle structure provided in this embodiment of the invention features a retractable cleaning section that fits around the outer periphery of the adsorption section. After each placement, the cleaning section cleans the adsorption section, ensuring it is clean before the next placement, thus maintaining sufficient adsorption force and improving adsorption stability. This also prevents contaminants on the adsorption section from contaminating the back of the flip chip, thereby improving placement reliability and stability.

[0020] The mounting equipment provided in this embodiment includes the above-mentioned nozzle structure. It can clean the adsorption part before or after each mounting, keeping the adsorption part in a clean state for a long time. The adsorption force will not be reduced due to contamination of the adsorption part, and the back of the flip chip will not be contaminated. Attached Figure Description

[0021] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0022] Figure 1A first-view structural schematic diagram of the suction nozzle structure provided in an embodiment of this utility model;

[0023] Figure 2 A second-view structural schematic diagram of the suction nozzle structure provided in an embodiment of this utility model;

[0024] Figure 3 A first-view structural schematic diagram of the telescopic rod and collar of the suction nozzle structure provided in an embodiment of this utility model;

[0025] Figure 4 A second-view structural schematic diagram of the telescopic rod and collar of the suction nozzle structure provided in an embodiment of this utility model;

[0026] Figure 5 A first-view structural diagram of the suction nozzle structure provided in the embodiment of this utility model in a clean state;

[0027] Figure 6 This is a second-view structural diagram of the suction nozzle structure provided in the embodiment of the present invention in a clean state.

[0028] Icons: 100 - Nozzle structure; 110 - Mounting part; 111 - Mounting protrusion; 120 - Adsorption part; 121 - Adsorption hole; 130 - Cleaning part; 131 - Telescopic rod; 132 - Mounting hole; 133 - Collar; 134 - Annular boss. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0030] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0031] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0032] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0033] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0034] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0035] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0036] This invention provides a nozzle structure for use in mounting equipment. For example, it can be used to mount flip chips onto a substrate. Of course, in addition to picking up chips, this nozzle structure can also pick up other items for pickup and transfer; this is not specifically limited here.

[0037] Combination Figure 1 and Figure 2The nozzle structure 100 includes a mounting portion 110, an adsorption portion 120, and a cleaning portion 130. The mounting portion 110 is connected to the placement head. The adsorption portion 120 is connected to the mounting portion 110; the adsorption portion 120 has adsorption holes 121, which serve as channels for adsorbed gas. The cleaning portion 130 is retractably fitted around the outer periphery of the adsorption portion 120 and is used to clean the adsorption portion 120. Because the cleaning portion 130 is retractably fitted around the outer periphery of the adsorption portion 120, it can clean the adsorption portion 120 after each placement or before each placement. This ensures that the adsorption portion 120 is clean before the next placement, maintaining sufficient adsorption force and improving adsorption stability. It also prevents contaminants on the adsorption portion 120 from contaminating the back of the flip chip, thus improving placement reliability and stability.

[0038] Optionally, the mounting portion 110 and the adsorption portion 120 are coaxially arranged, with the adsorption hole 121 penetrating through both. The vacuum tube of the machine is connected to the mounting portion 110 and communicates with the adsorption hole 121, so that vacuum gas can reach the adsorption hole 121 of the adsorption portion 120 to achieve vacuum adsorption of flip-chip. In this embodiment, both the mounting portion 110 and the adsorption portion 120 are cylindrical, with the outer diameter of the mounting portion 110 being larger than the outer diameter of the adsorption portion 120.

[0039] Optionally, the end of the mounting part 110 away from the adsorption part 120 is also provided with a mounting protrusion 111, through which the adsorption hole 121 passes. The mounting protrusion 111 facilitates connection with the vacuum pipeline of the machine.

[0040] Combination Figure 3 and Figure 4 Optionally, the cleaning unit 130 includes a telescopic rod 131 and a collar 133 connected to the telescopic rod 131. The collar 133 is sleeved on the adsorption unit 120, and the telescopic rod 131 can drive the collar 133 to move axially along the adsorption unit 120. The telescopic rod 131 is used to connect with the placement head.

[0041] Optionally, the telescopic rod 131 is provided with a mounting hole 132 for connecting to the placement head. The mounting hole 132 facilitates quick connection between the telescopic rod 131 and the placement head, and the structure is reliable. It is easy to understand that the placement head and the telescopic rod 131 can be connected by bolts, plugs, or snaps through the mounting hole 132, etc., without specific limitations.

[0042] Optionally, the telescopic rod 131 adopts a hollow structure, which is connected to the surface of the adsorption section 120. The hollow structure is used to introduce clean gas. By designing the telescopic rod 131 as a hollow structure, it can serve both as a connecting part that drives the collar 133 to move and as a channel for clean gas, resulting in a more compact structure.

[0043] Combination Figure 5 and Figure 6 Optionally, the mounting part 110 is provided with a mounting through hole, through which the telescopic rod 131 passes. One end of the telescopic rod 131 is connected to the collar 133, and the other end is used to connect to the placement head. In other words, one end of the telescopic rod 131 is connected to the collar 133, and the other end passes through the mounting through hole of the mounting part 110 and is connected to the placement head. With this configuration, the telescopic rod 131 can drive the collar 133 to move axially and can also introduce cleaning gas into the collar 133.

[0044] It is easy to understand that the inner diameter of the collar 133 is adapted to the outer diameter of the adsorption section 120. The cleaning principle of the collar 133 is that the collar 133 moves axially, and through the contact friction between the inner wall of the collar 133 and the outer peripheral surface of the adsorption section 120, flux and other contaminants on the outer peripheral surface of the adsorption section 120 are removed, achieving a cleaning effect. After the cleaning gas is introduced, the cleaning gas can reach between the collar 133 and the adsorption section 120, which can further improve the cleaning effect.

[0045] Optionally, the collar 133 includes an annular wall and an annular boss 134 disposed on the inner side of the annular wall. The annular boss 134 is sleeved on the adsorption part 120, and the inner diameter of the annular boss 134 is adapted to the outer diameter of the adsorption part 120. This arrangement facilitates the installation of the collar 133 and ensures that the collar 133 and the adsorption part 120 fit together, achieving reliable and effective cleaning of the surface of the adsorption part 120.

[0046] Optionally, the telescopic rod 131 is connected to the annular boss 134. This facilitates the movement of the collar 133 and allows cleaning gas to be introduced between the collar 133 and the adsorption section 120, improving the cleaning effect. It should be understood that the cleaning gas is fluid and has a cleaning effect not only on the outer peripheral surface of the adsorption section 120 but also on the adsorption end face of the adsorption section 120.

[0047] In this embodiment, the cleaning gas can be an inert gas such as nitrogen or argon. It should be noted that the cleaning gas not only cleans the adsorption section 120, but also cools the nozzle, providing rapid cooling and heat dissipation.

[0048] Optionally, the mounting portion 110 and the adsorption portion 120 are made of metal. The mounting portion 110 and the adsorption portion 120 can be integrally formed or separately fixedly connected; no specific limitation is made here. In this embodiment, the mounting portion 110 and the adsorption portion 120 of the suction nozzle structure 100 are respectively made of metal, such as tungsten carbide. Of course, in some other embodiments, the suction nozzle structure 100 can also be made of other materials; no specific limitation is made here.

[0049] This utility model embodiment also provides a mounting device, including a mounting head and the aforementioned suction nozzle structure 100, with the suction nozzle structure 100 connected to the mounting head. Optionally, the mounting device further includes a moving mechanism connected to the mounting head, such as a three-axis motion mechanism. This facilitates the movement of the mounting head in three-dimensional space, realizing the adsorption, transfer, and placement of items. Its mounting principle is as follows:

[0050] The mounting portion 110 of the nozzle structure 100 is connected to the placement head. Taking a flip chip as an example, when a flip chip needs to be picked up, the suction portion 120 moves to the flip chip location, and vacuum gas reaches the suction hole 121 of the suction portion 120, thereby enabling the suction portion 120 to pick up the flip chip. The flip chip is then moved to the flux application area, where it picks up flux, and then moved to the substrate placement position. The flip chip is released to the substrate placement position. During release, the suction portion 120 presses down, releasing the vacuum gas, and the suction force of the suction portion 120 disappears, completing the flip chip placement.

[0051] The placement head is moved to the next flip chip to be placed. During the movement, the telescopic rod 131 is controlled to move downwards, causing the collar 133 to move downwards along the axial direction of the suction section 120. The inner wall of the collar 133 cleans the suction section 120. During cleaning, cleaning gas is introduced into the telescopic rod 131 to enhance the cleaning effect and cool the nozzle structure 100. After cleaning, the telescopic rod 131 is controlled to move in the opposite direction, causing the collar 133 to move closer to the mounting section 110, so as not to obstruct the suction section 120 from adsorbing the flip chip again.

[0052] In summary, the nozzle structure 100 and the mounting equipment provided by this utility model embodiment have the following beneficial effects, including:

[0053] The suction nozzle structure 100 provided in this embodiment of the invention has a cleaning part 130 that is retractably sleeved around the outer periphery of the adsorption part 120. After each placement, the cleaning part 130 can clean the adsorption part 120. This ensures that the adsorption part 120 is clean before the next placement, maintaining sufficient adsorption force and improving adsorption stability. It also prevents contaminants on the adsorption part 120 from contaminating the back of the flip chip, thus improving placement reliability and stability. Passing cleaning gas into the telescopic rod 131 enhances the cleaning effect and also cools the adsorption part 120.

[0054] The mounting equipment provided in this embodiment includes the above-mentioned nozzle structure 100. Before or after each mounting, the adsorption part 120 can be cleaned to keep the adsorption part 120 in a clean state for a long time. The adsorption force will not be reduced due to contamination of the adsorption part 120, and the back side of the flip chip will not be contaminated.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Any modifications, equivalent substitutions, improvements, etc., should be included within the protection scope of this utility model.

Claims

1. A suction nozzle structure, characterized in that, include: The mounting part is used to connect with the placement head; An adsorption section is connected to the mounting section; the adsorption section is provided with adsorption holes, which serve as flow channels for adsorbing gas. A cleaning section is retractably fitted around the outer periphery of the adsorption section, and the cleaning section is used to clean the adsorption section.

2. The suction nozzle structure according to claim 1, characterized in that, The mounting part and the adsorption part are coaxially arranged, and the adsorption hole passes through the mounting part and the adsorption part.

3. The suction nozzle structure according to claim 1, characterized in that, The cleaning unit includes a telescopic rod and a collar connected to the telescopic rod. The collar is sleeved on the adsorption unit, and the telescopic rod can drive the collar to move along the axial direction of the adsorption unit. The telescopic rod is used to connect with the mounting head.

4. The suction nozzle structure according to claim 3, characterized in that, The telescopic rod is provided with mounting holes for connecting to the mounting head.

5. The suction nozzle structure according to claim 3, characterized in that, The telescopic rod has a hollow structure, which is connected to the surface of the adsorption part, and is used to introduce clean gas.

6. The suction nozzle structure according to claim 3, characterized in that, The collar includes an annular wall and an annular boss located inside the annular wall. The annular boss is sleeved on the adsorption part, and the inner diameter of the annular boss is adapted to the outer diameter of the adsorption part.

7. The suction nozzle structure according to claim 6, characterized in that, The telescopic rod is connected to the annular boss.

8. The suction nozzle structure according to claim 3, characterized in that, The mounting part is provided with a mounting through hole, the telescopic rod passes through the mounting through hole, and one end of the telescopic rod is connected to the collar, and the other end is used to connect to the mounting head.

9. The suction nozzle structure according to any one of claims 1 to 8, characterized in that, The mounting part and the adsorption part are made of metal.

10. A mounting device, characterized in that, It includes a placement head and a nozzle structure according to any one of claims 1 to 9, wherein the nozzle structure is connected to the placement head.

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