Radiator and radiating system
The multi-blade heat sink driven by piezoelectric elements solves the heat dissipation problem of microchips, achieving miniaturization, low noise, and efficient heat dissipation. It is suitable for microchips, simplifies the structure, and reduces power consumption.
Patent Information
- Application Number
- CN202423132239.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-18
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2034-12-18
AI Technical Summary
Existing heat dissipation methods, such as fans, heat spreaders, and liquid cooling, are complex, costly, noisy, or prone to coolant leakage on microchips, making it difficult to effectively solve the heat dissipation needs of microchips.
The multi-blade heat sink driven by piezoelectric elements uses the piezoelectric effect to make the blades vibrate individually, simplifying the structure. It is suitable for micron-level microchips, forming a stable vortex to improve heat dissipation, and the blade operation can be controlled as needed to save energy.
It achieves efficient heat dissipation with miniaturization, low noise, and low power consumption, is suitable for microchips, and has a simple structure, reducing device complexity and cost.
Smart Images
Figure CN223844284U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of radiator technology, and in particular to a radiator and a heat dissipation system. Background Technology
[0002] In recent years, the computing power of microelectronic chips has been continuously increased due to the ongoing demands of the Internet of Things and intelligent systems, leading to a continuous increase in chip power consumption and the generation of more and more heat during operation. To solve this heat dissipation problem, heat sinks are typically installed to dissipate heat.
[0003] There are three main traditional heat dissipation methods. One is forced convection cooling, which uses a fan to force airflow. However, this requires a motor or other equipment to drive the fan, increasing energy consumption and noise. In addition, the fan has a complex structure, large size, and is difficult to miniaturize, making it unsuitable for micron-sized chips. Another method is heat dissipation using a vapor chamber. Vapor chambers have a complex structure, high design and manufacturing costs, and are suitable for cooling large-area chips, but are not very compatible with microchips. The third method is liquid cooling, which requires a sealed piping system and additional equipment such as a circulating pump, increasing system complexity and cost, and posing a risk of coolant leakage.
[0004] Therefore, there is an urgent need to propose a radiator and heat dissipation system to solve the above-mentioned technical problems. Utility Model Content
[0005] According to one aspect of the present invention, a heat sink is provided in which multiple fan blades for heat dissipation are individually driven by the piezoelectric effect, the structure is simple, and it is suitable for microchips at the micrometer level.
[0006] To achieve this objective, the present invention adopts the following technical solution:
[0007] Radiators, including:
[0008] The body has ventilation holes, a connecting part is provided at the center of the ventilation holes, and multiple connecting rods are provided around the connecting part. One end of each connecting rod is connected to the connecting part, and the other end is connected to the inner peripheral wall of the ventilation hole. Each connecting rod has a fan blade on one side.
[0009] A piezoelectric element is provided on each of the fan blades, and the piezoelectric element is used to drive the fan blade to swing around the connecting rod.
[0010] Optionally, the connecting part is provided with a first conductive sheet, and the body is provided with a second conductive sheet corresponding to the piezoelectric sheet in the circumferential direction of the ventilation hole. The body is also provided with a third conductive sheet. One of the positive and negative electrodes of each piezoelectric sheet is electrically connected to the first conductive sheet, and the other is electrically connected to the corresponding second conductive sheet. The third conductive sheet is electrically connected to the first conductive sheet.
[0011] Optionally, the body includes a first end face for contacting the heat dissipation component and a second end face corresponding to the first end face, the ventilation hole penetrates through the first end face and the second end face, and the connecting rod is disposed on the side of the ventilation hole near the second end face and is flush with the second end face.
[0012] Optionally, the area of the fan blade is 25%-70% of the area of the fan shape formed by the two adjacent connecting rods and the inner peripheral wall of the ventilation hole.
[0013] Optionally, the fan blades are four or more.
[0014] Optionally, the thickness of the body is 200μm-750μm.
[0015] Optionally, the piezoelectric sheet has one or more layers.
[0016] Optionally, the piezoelectric element is made of PZT thin film.
[0017] Optionally, multiple connecting rods are arranged at equal intervals along the circumference of the connecting portion.
[0018] According to another aspect of the present invention, the present invention also provides a heat dissipation system, including at least one heat sink as described in any of the above technical solutions, wherein at least one of the heat sinks covers the component to be cooled.
[0019] The beneficial effects of this utility model are:
[0020] This invention provides a heat sink, comprising a body and piezoelectric elements. The body has ventilation holes, with a connecting portion at the center of each hole. Multiple connecting rods are arranged circumferentially around the connecting portion, one end of each rod connected to the connecting portion and the other end connected to the inner wall of the ventilation hole. Each connecting rod has a fan blade, and each fan blade has a piezoelectric element. Power is supplied to the piezoelectric elements via an external power source. When energized, the piezoelectric elements vibrate due to their inherent properties, thereby driving the fan blades to vibrate. The fan blade vibration drives the airflow around the chip to which the heat sink is applied, achieving heat dissipation. This heat dissipation method, where each fan blade is driven to vibrate individually by the piezoelectric element, greatly simplifies the heat sink's structure, allowing for a smaller size suitable for micron-level microchips, while also reducing power consumption and noise. Furthermore, controlling the oscillation relationship of multiple fan blades through the piezoelectric element enables the heat sink to form a stable vortex flow, improving heat dissipation efficiency. This design simplifies the structure while maintaining high heat dissipation performance. In addition, since each fan blade can be driven individually, when the chip's heat dissipation requirements are not high, some fan blades can be controlled to work, thereby saving power.
[0021] This invention also provides a heat dissipation system, including at least one of the aforementioned heat sinks, with the heat sink covering a chip. Because it utilizes the aforementioned heat sink, this heat dissipation system has a smaller overall size, making it suitable for microchips, and provides better heat dissipation. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.
[0023] Figure 1 This is a schematic diagram of the heat sink from one perspective according to Embodiment 1 of this utility model;
[0024] Figure 2 This is a schematic diagram of the radiator structure from another perspective provided in Embodiment 1 of this utility model;
[0025] Figure 3 This is a schematic diagram of the heat dissipation system provided in Embodiment 2 of this utility model.
[0026] In the picture:
[0027] 10. Heat sink; 100. Body; 110. Ventilation hole; 120. Connecting part; 130. Connecting rod; 140. Fan blade; 150. First conductive plate; 160. Second conductive plate; 170. Third conductive plate; 200. Piezoelectric plate; 20. Heat dissipation system. Detailed Implementation
[0028] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.
[0029] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0030] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0031] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0032] Example 1
[0033] This embodiment provides a heat sink in which multiple fan blades for heat dissipation are individually driven by the piezoelectric effect. The structure is simple and suitable for micron-scale microchips.
[0034] Specifically, such as Figure 1 and Figure 2 As shown, the radiator 10 includes a body 100 and a piezoelectric element 200. The body 100 has a ventilation hole 110, and a connecting part 120 is provided at the center of the ventilation hole 110. Multiple connecting rods 130 are provided around the connecting part 120. One end of the connecting rod 130 is connected to the connecting part 120, and the other end is connected to the inner peripheral wall of the ventilation hole 110. Each connecting rod 130 has a fan blade 140 on one side, and each fan blade 140 has a piezoelectric element 200. The piezoelectric element 200 is used to drive the fan blade 140 to swing around the connecting rod 130.
[0035] It is worth noting that piezoelectric sheet 200 is a type of electronic material with piezoelectric properties. Piezoelectric materials typically have a non-centrosymmetric crystal structure, with the crystal cells composed of positive and negative ions. Different positive and negative ions form charge centers, and changes in the crystal structure cause these charge centers to no longer coincide. Microscopically, a polarized electric field is formed within the crystal cells, creating a polarized electric field in the same direction. Macroscopically, the effects of these polarized electric fields are superimposed, resulting in charge accumulation and a potential difference on both sides of the material. Conversely, if an external electric field is applied to both sides of this material, the external electric field interacts with the internal polarized electric field, causing changes in the crystal structure and resulting in material deformation.
[0036] The inverse piezoelectric effect, a type of piezoelectric effect, refers to the application of an electric field to the polarization direction of a piezoelectric sheet 200 with piezoelectric properties. The electric field controls the deformation of the piezoelectric sheet 200, causing it to undergo mechanical deformation or mechanical pressure in a certain direction.
[0037] Therefore, the heat sink 10 provided in this embodiment supplies power to the piezoelectric element 200 via an external power source. When energized, the piezoelectric element 200 vibrates due to its inherent characteristics, thereby driving the fan blades 140 to vibrate. The vibration of the fan blades 140 drives the airflow around the chip (or other heat-dissipating component) to which the heat sink 10 operates, achieving heat dissipation for the chip. This heat dissipation method, where the piezoelectric element 200 drives each fan blade 140 to vibrate individually, greatly simplifies the structure of the heat sink 10. This allows for a smaller size, suitable for micron-level microchips, while also reducing power consumption and noise. Furthermore, controlling the oscillation relationship of multiple fan blades 140 via the piezoelectric element 200 enables the heat sink 10 to form a stable vortex, improving heat dissipation. While simplifying the structure, it also provides high heat dissipation performance. Additionally, since each fan blade 140 can be driven individually, when the chip's heat dissipation requirements are low, only some fan blades 140 can be controlled to operate, saving energy.
[0038] It is worth noting that along the circumference of the connecting part 120, two adjacent fan blades 140 can start oscillating at the same time interval. This arrangement facilitates the formation of airflow vortices.
[0039] Optionally, the connecting rod 130 can be integrated with the fan blade 140. The connecting rod 130 has a certain elastic deformation capability. During the oscillation of the fan blade 140, the connection between the connecting rod 130 and the fan blade 140 will deform to ensure the reliable oscillation of the fan blade 140.
[0040] Optionally, in one possible embodiment, the body 100, the connecting part 120, the connecting rod 130, and the fan blade 140 are all integral structures and are manufactured using MEMS processing technology.
[0041] Optionally, multiple connecting rods 130 can be arranged at equal intervals along the circumference of the connecting portion 120. This arrangement facilitates both manufacturing and control of the heat dissipation airflow.
[0042] Furthermore, depending on the vibration amplitude requirements of the fan blade 140, a single layer of piezoelectric sheet 200 or multiple layers of piezoelectric sheet 200 can be provided. Optionally, the material of the piezoelectric sheet 200 can be a PZT thin film.
[0043] Further, see also Figure 1 The connecting portion 120 is provided with a first conductive plate 150, and the main body 100 is provided with second conductive plates 160 corresponding to the piezoelectric plates 200 in the circumferential direction of the ventilation holes 110. The main body 100 is also provided with a third conductive plate 170. One of the positive and negative electrodes of each piezoelectric plate 200 is electrically connected to the first conductive plate 150, and the other is electrically connected to the corresponding second conductive plate 160. The third conductive plate 170 is electrically connected to the first conductive plate 150. When the heat sink 10 is in use, the third conductive plate 170 can be connected to the positive electrode, and correspondingly, each second conductive plate 160 is connected to a negative electrode. By providing the first conductive plate 150 on the connecting portion 120, it is convenient to electrically connect each piezoelectric plate 200 to the electrode. By providing the third conductive plate 170 to the first conductive plate 150, the problem of difficult wiring in the middle is solved.
[0044] Optionally, the leads connecting the piezoelectric sheet 200 to the first conductive sheet 150, the leads connecting the piezoelectric sheet 200 to the second conductive sheet 160, and the leads connecting the first conductive sheet 150 to the third conductive sheet 170 can all be fabricated by bonding.
[0045] Further, see also Figure 2The main body 100 includes a first end face for contacting the component to be cooled and a second end face corresponding to the first end face. A ventilation hole 110 passes through the first and second end faces. A connecting rod 130 is disposed on the side of the ventilation hole 110 near the second end face and is flush with the second end face. This arrangement, on the one hand, allows the fan blade 140 to be as far away from the component to be cooled as possible, providing more space for the vibration of the fan blade 140, which is beneficial to improving the heat dissipation effect of the radiator 10; on the other hand, it facilitates processing.
[0046] Further, see also Figure 1 In order to increase the air volume generated when the fan blade 140 is oscillating, the area of the fan blade 140 is 25%-70% of the area of the fan shape formed by the inner peripheral walls of the two adjacent connecting rods 130 and the ventilation hole 110.
[0047] Optionally, the fan blades 140 have four or more. In this embodiment, the fan blades 140 have nine.
[0048] Optionally, the thickness of the body 100 is 200μm-750μm. The body 100 is small in size and can be used for heat dissipation of microchips at the micrometer level.
[0049] The heat sink 10 provided in this embodiment has a compact and simple structure, with a volume in the micrometer range, occupying little space, facilitating processing, and promoting mass production. Each fan blade 140 can be independently controlled. By oscillating the multiple fan blades 140, airflow can be driven to generate a cyclone, freeing it from the complex design constraints of achieving stable rotational motion at the micrometer scale. This simplifies the structure and reduces costs. The airflow generated by this heat sink 10 has a variable direction and controllable flow rate, and features low power consumption, low noise, and high compatibility with microelectronic chips.
[0050] Example 2
[0051] This embodiment provides a heat dissipation system 20, including at least one radiator 10 provided in Embodiment 1, with at least one radiator 10 covering the component to be cooled.
[0052] like Figure 3 As shown, in one embodiment, multiple heat sinks 10 are provided, and the multiple heat sinks 10 are arranged in an array. By setting multiple heat sinks 10 to dissipate heat for the same component to be cooled, the heat dissipation performance of the heat dissipation system 20 is improved.
[0053] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. A radiator, characterized in that, include: The body (100) has a ventilation hole (110) on it. A connecting part (120) is provided at the center of the ventilation hole (110). Multiple connecting rods (130) are provided around the connecting part (120). One end of the connecting rod (130) is connected to the connecting part (120), and the other end is connected to the inner peripheral wall of the ventilation hole (110). Each connecting rod (130) has a fan blade (140) on one side. A piezoelectric element (200) is provided on each of the fan blades (140), and the piezoelectric element (200) is used to drive the fan blades (140) to swing around the connecting rod (130).
2. The radiator according to claim 1, characterized in that, The connecting part (120) is provided with a first conductive sheet (150), and the body (100) is provided with a second conductive sheet (160) corresponding to the piezoelectric sheet (200) in the circumferential direction of the ventilation hole (110). The body (100) is also provided with a third conductive sheet (170). One of the positive and negative electrodes of each piezoelectric sheet (200) is electrically connected to the first conductive sheet (150), and the other is electrically connected to the corresponding second conductive sheet (160). The third conductive sheet (170) is electrically connected to the first conductive sheet (150).
3. The radiator according to claim 1, characterized in that, The body (100) includes a first end face for contacting the heat dissipation component and a second end face corresponding to the first end face. The ventilation hole (110) passes through the first end face and the second end face. The connecting rod (130) is disposed on the side of the ventilation hole (110) near the second end face and is flush with the second end face.
4. The radiator according to claim 1, characterized in that, The area of the fan blade (140) is 25%-70% of the area of the fan shape formed by the inner peripheral walls of the two adjacent connecting rods (130) and the ventilation hole (110).
5. The radiator according to claim 1, characterized in that, The number of fan blades (140) is greater than or equal to 4.
6. The radiator according to claim 1, characterized in that, The thickness of the body (100) is 200μm-750μm.
7. The radiator according to claim 1, characterized in that, The piezoelectric sheet (200) has one or more layers.
8. The radiator according to claim 1, characterized in that, The piezoelectric element (200) is made of PZT thin film.
9. The radiator according to any one of claims 1-8, characterized in that, Multiple connecting rods (130) are arranged at equal intervals along the circumference of the connecting portion (120).
10. A heat dissipation system, characterized in that, Includes at least one radiator (10) according to any one of claims 1-9, wherein at least one of the radiators (10) covers the component to be cooled.