180-degree motor rejecting mechanism for silicon wafers

Abstract

The utility model belongs to the technical field of silicon wafer sorting, and particularly relates to a 180-degree motor rejecting mechanism for silicon wafers, which comprises a driving assembly and a rejecting assembly, the driving assembly comprises a first driving motor and an eccentric shaft, and the eccentric shaft is connected with the output end of the first driving motor; one end of the removing assembly is eccentrically connected with the eccentric shaft, the other end of the removing assembly is connected with the silicon wafer conveying belt assembly, and the first driving motor drives the eccentric shaft to rotate so as to drive the removing assembly to swing and further drive the silicon wafer conveying belt assembly to rotate around the first rotating axis by a target angle. The utility model has the advantages that the transmission stability is high, the motor is easier to control, the vibration phenomenon of the motor is reduced, and the success rate of silicon wafers entering the basket is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon wafer sorting, especially to a silicon wafer 180° motor rejecting mechanism. BACKGROUND

[0002] In the conveying equipment of the photovoltaic industry, after the silicon wafer completes the front-end processing procedure, it is placed in a row in the form of a group. Then, the next processing procedure requires the silicon wafer to be output one by one for cleaning, sorting, and other actions. During the process of outputting the silicon wafer one by one, due to uncontrollable factors, the silicon wafer may have hidden cracks, fragments, and other situations. Therefore, a rejecting mechanism is needed to quickly reject the unqualified silicon wafer with hidden cracks, fragments, and the like.

[0003] Currently, the conventional technical solution is to use a cylinder contraction to realize the lifting of the swing arm. When the cylinder contracts, the rejection of the fragments begins. When the cylinder is in the original state, the normal wafer passing step is performed. However, this solution has some problems: the working efficiency of the cylinder is relatively low, and vibration and damage are prone to occur; sometimes, the stability is also affected due to insufficient air pressure. Another solution is to use a motor to rotate by a certain angle to realize the rejecting function. Although this improves the production efficiency, the torque maintaining ability of the motor is required to be relatively high. In order to meet this requirement, a speed reducer needs to be added or the torque of the stepping motor needs to be increased, which undoubtedly increases the cost. In addition, the motor in the mechanism needs to frequently reciprocate by an angle of about 10°, which makes the control difficult, and the vibration phenomenon of the motor affects the success rate of the wafer entering the basket. SUMMARY

[0004] The technical problem to be solved by the utility model is: in order to solve the technical problems existing in the prior art, the utility model provides a silicon wafer 180° motor rejecting mechanism. Under the premise of ensuring the production efficiency and the cost, the stability during the transmission of the silicon wafer is improved, the motor is easier to control, the vibration phenomenon of the motor is reduced, and the success rate of the silicon wafer entering the basket is improved.

[0005] The technical solution adopted by the utility model to solve the technical problem is: a silicon wafer 180° motor rejecting mechanism is used to reject the unqualified silicon wafer conveyed on a silicon wafer conveying belt assembly. The silicon wafer 180° motor rejecting mechanism comprises:

[0006] A driving assembly comprises a first driving motor and an eccentric shaft, and the eccentric shaft is connected to the output end of the first driving motor.

[0007] A rejecting assembly is eccentrically connected to one end of the eccentric shaft, and the other end of the rejecting assembly is connected to the silicon wafer conveying belt assembly. The first driving motor drives the eccentric shaft to rotate, so as to drive the rejecting assembly to swing and further drive the silicon wafer conveying belt assembly to rotate by a target angle around a first rotation axis.

[0008] The specific technical effect is: by setting the silicon wafer conveying belt assembly to convey the silicon wafer, the stability is higher, and by cooperating the driving assembly with the rejection assembly, when the silicon wafer with hidden cracks or cracks is detected, the first driving motor drives the eccentric shaft to rotate to drive the rejection assembly to swing, and then drives the silicon wafer conveying belt assembly to rotate around the first rotation axis by a target angle, the silicon wafer conveying belt assembly rotates from the horizontal state to the inclined state, the silicon wafer conveying belt assembly rotates from the inclined state to the horizontal state, and the reset of the silicon wafer conveying belt assembly is completed. The first driving motor is set to reciprocate and reject, so that the motor is easier to control, reduces the vibration phenomenon of the motor, improves the success rate of the silicon wafer into the basket, and adopts the eccentric shaft, so that the transmission efficiency is higher.

[0009] Further, the rejection assembly comprises a rejection adjusting block and a rejection rocker arm, the rejection adjusting block is connected with the silicon wafer conveying belt assembly, one end of the rejection rocker arm is connected with the rejection adjusting block through a first rotating shaft, and the other end of the rejection rocker arm is eccentrically connected with the eccentric shaft through a second rotating shaft.

[0010] Further, the driving assembly further comprises a mounting seat and a shaft coupling, the first driving motor is mounted on the mounting seat, and the eccentric shaft is connected with the output shaft of the first driving motor through the shaft coupling.

[0011] Further, it further comprises an inductive detection assembly, and the inductive detection assembly is used for detecting the rotation number of the eccentric shaft.

[0012] Further, the inductive detection assembly comprises an inductive detection disc and a slot-shaped photoelectricity, the inductive detection disc is sleeved on the eccentric shaft, and the slot-shaped photoelectricity is arranged on the mounting seat and is used for detecting the rotation number of the inductive detection disc.

[0013] The specific technical effect is: the inductive detection disc rotates with the rotation of the eccentric shaft, the notch on the inductive detection disc reaches the position of the slot-shaped photoelectricity to record the rotation number, the number of defective silicon wafers can be recorded and detected, and the detection accuracy is further improved.

[0014] Further, the silicon wafer conveying belt assembly comprises a driving shaft, a driven shaft, a round belt and a rejection rocker arm, the driving shaft and the driven shaft are drivingly connected through the round belt, one end of the rejection rocker arm is rotationally connected with the driving shaft, the other end of the rejection rocker arm is connected with the driven shaft, and the other end of the rejection assembly is connected with the rejection rocker arm and drives the rejection rocker arm to rotate around the driving shaft.

[0015] Further, the silicon wafer conveying belt assembly further comprises a second driving motor and a bearing seat, the output end of the second driving motor is connected with the driving shaft, and the driving shaft is rotationally arranged on the bearing seat.

[0016] Further, the silicon wafer conveying belt assembly further comprises a first sensing seat and a second sensing seat, the first sensing seat is arranged on one side of the driving shaft and is used for detecting whether the silicon wafer on the silicon wafer conveying belt assembly is qualified, and the second sensing seat is arranged on one side of the driven shaft.

[0017] Compared with the prior art, the utility model has the advantages that:

[0018] (1), the utility model discloses a silicon wafer conveying belt assembly is set to the transmission silicon wafer, and the stability is higher;

[0019] (2), the utility model discloses a drive assembly and the cooperation of the elimination assembly, so that when detecting the silicon wafer of hidden crack or fragmentation, the first drive motor drives eccentric shaft rotation to drive the elimination assembly swing, and then drive the silicon wafer conveying belt assembly rotates around the first rotation axis target angle, and the silicon wafer conveying belt assembly rotates from the horizontal state to the inclined state, and the silicon wafer of defective product is transported and eliminated, or rotates from the inclined state to the horizontal state, and the reset of the silicon wafer conveying belt assembly is completed;

[0020] (3), the utility model discloses a first drive motor is used for reciprocating elimination, and the motor is more easily controlled, reduces the vibration phenomenon of motor, improves the success rate of silicon wafer into the basket, and adopts eccentric shaft, and the transmission efficiency is higher;

[0021] (4), the utility model discloses a sensing monitoring disc and the detection mode of the cooperation of slot photoelectricity, and the detection accuracy is higher. BRIEF DESCRIPTION OF DRAWINGS

[0022] The utility model is further explained in connection with the drawings and examples.

[0023] Figure 1 It is the structure schematic diagram of the silicon wafer 180 ° motor elimination mechanism of the utility model;

[0024] Figure 2 It is the front view of Figure 1 ;

[0025] Figure 3 It is the assembly structure schematic diagram of the drive assembly and the elimination assembly of the utility model.

[0026] Fig., 1, drive assembly;101, first drive motor;102, eccentric shaft;103, mounting seat;104, shaft coupling;

[0027] 2, elimination assembly;201, elimination adjusting block;202, elimination rocker arm;203, first rotation shaft;204, second rotation shaft;

[0028] 3. Silicon wafer conveying belt assembly; 301. driving shaft; 302. driven shaft; 303. round belt; 304. ejecting swing arm; 305. second driving motor; 306. bearing seat;

[0029] 4. Induction detection assembly; 401. induction detection disc; 402. slot photoelectric. DETAILED DESCRIPTION

[0030] The utility model will be explained in further detail in combination with the drawings. These drawings are all simplified schematic diagrams, and only schematically show the basic structure of the utility model, so they only show the structure related to the utility model.

[0031] In the description of the utility model, it is to be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, so it cannot be understood as a limitation on the utility model. In addition, the features limited as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0032] In the description of the utility model, it is to be noted that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the communication between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0033] As Figures 1 to 3The utility model discloses a silicon wafer 180 degree motor rejects mechanism, for the unqualified silicon wafer of sending on silicon wafer conveyer belt assembly 3 is rejected, guarantees the integrity of output silicon wafer, wherein, including: drive assembly 1 and rejects component 2, drive assembly 1 includes first drive motor 101 and eccentric shaft 102, and eccentric shaft 102 is connected with the output end of first drive motor 101, and one end of rejects component 2 is eccentrically connected with eccentric shaft 102, and the other end of rejects component 2 is connected with silicon wafer conveyer belt assembly 3, and first drive motor 101 drives eccentric shaft 102 to rotate to drive rejects component 2 to swing, and then drive silicon wafer conveyer belt assembly 3 to rotate target angle around first rotation axis.

[0034] Therefore: by setting silicon wafer conveyer belt assembly 3 transmission silicon wafer, higher stability, and then through the cooperation of drive assembly 1 and rejects component 2, when detecting the silicon wafer of hidden crack or fragmentation, first drive motor 101 drives eccentric shaft 102 to rotate to drive rejects component 2 to swing, and then drive silicon wafer conveyer belt assembly 3 to rotate target angle around first rotation axis, silicon wafer conveyer belt assembly 3 rotates from horizontal state to inclined state, transports rejects silicon wafer, or rotates from inclined state to horizontal state, completes the reset of silicon wafer conveyer belt assembly 3, sets up first drive motor 101 to reciprocating rejects, makes the motor more easily control, reduces the vibration phenomenon of motor, improves the success rate of silicon wafer into basket, and adopts eccentric shaft 102, and the transmission efficiency is higher.

[0035] In the embodiment, rejects component 2 includes rejects adjusting block 201 and rejects rocker arm 202, rejects adjusting block 201 is connected with silicon wafer conveyer belt assembly 3, one end of rejects rocker arm 202 is connected with rejects adjusting block 201 through first rotation shaft 203, and the other end of rejects rocker arm 202 is eccentrically connected with eccentric shaft 102 through second rotation shaft 204.

[0036] In the embodiment, drive assembly 1 further includes: mounting seat 103 and shaft coupling 104, first drive motor 101 is installed on mounting seat 103, and eccentric shaft 102 is connected with the output shaft of first drive motor 101 through shaft coupling 104.

[0037] In the embodiment, further include inductive detection component 4, and inductive detection component 4 is used to detect the rotation number of eccentric shaft 102.

[0038] In the embodiment, inductive detection component 4 includes inductive detection disc 401 and slot photoelectric 402, inductive detection disc is sleeved on eccentric shaft 102, and slot photoelectric 402 is set up on mounting seat 103 and is used to detect the rotation number of inductive detection disc.

[0039] Thus: induction monitoring disc rotates with eccentric shaft 102, the gap on the induction monitoring disc reaches the groove photoelectricity 402 position and records the number of rotations, which can record the number of defective silicon wafers and further improve the detection accuracy.

[0040] In the embodiment, the silicon wafer conveying belt assembly 3 comprises a driving shaft 301, a driven shaft 302, a round belt 303 and a rejection swing arm 304, the driving shaft 301 is in driving connection with the driven shaft 302 through the round belt 303, one end of the rejection swing arm 304 is in rotational connection with the driving shaft 301, the other end of the rejection swing arm 304 is connected with the driven shaft 302, and the other end of the rejection assembly 2 is connected with the rejection swing arm 304 and drives the rejection swing arm 304 to rotate around the driving shaft 301.

[0041] In the embodiment, the silicon wafer conveying belt assembly 3 further comprises a second driving motor 305 and a bearing seat 306, and the output end of the second driving motor 305 is connected with the driving shaft 301, and the driving shaft 301 is rotationally arranged on the bearing seat 306.

[0042] In the embodiment, the silicon wafer conveying belt assembly 3 further comprises a first sensing seat and a second sensing seat, the first sensing seat is arranged on one side of the driving shaft 301 and is used for detecting whether the silicon wafer on the silicon wafer conveying belt assembly 3 is qualified, and the second sensing seat is arranged on one side of the driven shaft 302.

[0043] The working principle of the utility model is as follows: one end of the rejection swing arm 202 is connected with the rejection adjusting block 201 through the first rotating shaft 203, the other end of the rejection swing arm 202 is eccentrically connected with the eccentric shaft 102 through the second rotating shaft 204, the rejection adjusting block 201 is connected with the rejection swing arm 304, when the silicon wafer is transported through the driving shaft 301, at this time, the rejection swing arm 304 is in a horizontal state, the optical fiber on the first sensing seat arranged on the side close to the driving shaft 301 detects the silicon wafer, if the silicon wafer is complete, the driving assembly 1 and the rejection assembly 2 do not work, and the silicon wafer still transports forward in the horizontal direction; if the first sensing seat detects that the silicon wafer has hidden cracks, fragments and the like, the detection signal is transmitted to the driving assembly 1, the first driving motor 101 starts to work, the eccentric shaft 102 is driven to rotate 180 DEG through the shaft coupling 104, the other end of the rejection swing arm 202 is eccentrically connected with the eccentric shaft 102 through the second rotating shaft 204, the eccentric shaft 102 drives the rejection swing arm 202 to rotate and drives the rejection adjusting block 201 to overturn downward, and further drives the rejection swing arm 304 connected with the rejection adjusting block 201 to rotate around the driving shaft 301 by a certain angle, at this time, the rejection swing arm 304 is in an inclined state, and the defective silicon wafer is rejected into the basket under the conveying of the round belt 303;

[0044] When the optical fiber on the second induction seat on the side close to the passive wheel detects that the defective silicon wafer is completely removed, the signal is fed back to the first drive motor 101, the first drive motor 101 continues to drive the eccentric shaft 102 to rotate 180°, drives the removal rocker arm 202 to rotate and drives the removal adjusting block 201 to overturn upwards, so that the removal swing arm 304 rotates from the inclined state to the horizontal state, at this time the notch on the induction monitoring disc reaches the groove photoelectric 402 position and the number of rotation is recorded.

[0045] The optical fiber on the first induction seat continues to detect the silicon wafer, and if a silicon wafer with hidden cracks, fragments or the like is detected, the detection signal is fed back to the first drive motor 101, and the first drive motor 101 reciprocates the above-mentioned action to realize a continuous reciprocating removal process.

[0046] Compared with the prior art, the beneficial effects of the utility model are:

[0047] (1), the utility model discloses a silicon wafer conveying belt assembly 3 is set up to the transmission silicon wafer, and the stability is higher;

[0048] (2), the utility model discloses the cooperation of drive assembly 1 and removal assembly 2 makes when detecting the silicon wafer with hidden cracks or fragmentation, the first drive motor 101 drives eccentric shaft 102 to rotate to drive removal assembly 2 to swing and then drive silicon wafer conveying belt assembly 3 rotates around the first rotation axis to rotate target angle, and silicon wafer conveying belt assembly 3 rotates from the horizontal state to the inclined state, transports the defective silicon wafer and removes it, or rotates from the inclined state to the horizontal state, and the reset of silicon wafer conveying belt assembly 3 is completed;

[0049] (3), the utility model discloses the first drive motor 101 is used to reciprocatingly remove, so that the motor is more easily controlled, reduces the motor vibration phenomenon, improves the success rate of silicon wafer into the basket, and eccentric shaft 102 is used, so that the transmission efficiency is higher;

[0050] (4), the utility model discloses the detection mode that induction monitoring disc and groove photoelectric 402 are cooperated, so that the detection accuracy is higher.

[0051] The above-mentioned ideal embodiment according to the utility model is inspired, and through the description content, relevant staff can make various changes and modifications without deviating from the technical thought of the utility model.The technical scope of the utility model is not limited to the content in the specification, and must be determined by the scope of claims.

Claims

1. A 180° motor reject mechanism for silicon wafers, for rejecting defective silicon wafers transported on a silicon wafer conveyor assembly (3), characterized in that, The utility model relates to a silicon wafer conveying device, including: A driving assembly (1) comprising a first driving motor (101) and an eccentric shaft (102) connected to the output end of the first driving motor (101); A rejection assembly (2) one end of which is eccentrically connected to the eccentric shaft (102), and the other end of which is connected to the silicon wafer conveying belt assembly (3), and the first driving motor (101) drives the eccentric shaft (102) to rotate to drive the rejection assembly (2) to swing, thereby driving the silicon wafer conveying belt assembly (3) to rotate by a target angle around a first rotation axis.

2. The silicon wafer 180° motor shredding mechanism of claim 1, wherein, The rejection assembly (2) comprises a rejection adjusting block (201) connected to the silicon wafer conveying belt assembly (3), and a rejection rocker arm (202) one end of which is connected to the rejection adjusting block (201) through a first rotation shaft (203), and the other end of which is eccentrically connected to the eccentric shaft (102) through a second rotation shaft (204).

3. The silicon wafer 180° motor shredding mechanism of claim 1 wherein, The driving assembly (1) further comprises a mounting seat (103) and a shaft coupling (104), and the first driving motor (101) is mounted on the mounting seat (103), and the eccentric shaft (102) is connected to the output shaft of the first driving motor (101) through the shaft coupling (104).

4. The silicon wafer 180° motor shredding mechanism of claim 3, wherein, Further comprising an induction detection assembly (4) for detecting the number of rotations of the eccentric shaft (102).

5. The silicon wafer 180° motor shredding mechanism of claim 4, wherein, The induction detection assembly (4) comprises an induction detection disc (401) sleeved on the eccentric shaft (102), and a slot-shaped photoelectric sensor (402) arranged on the mounting seat (103) and used for detecting the number of rotations of the induction detection disc.

6. The silicon wafer 180° motor shredding mechanism of claim 1 wherein, The silicon wafer conveying belt assembly (3) comprises a driving shaft (301), a driven shaft (302), a round belt (303), and a rejection swing arm (304), the driving shaft (301) and the driven shaft (302) are drivingly connected through the round belt (303), one end of the rejection swing arm (304) is rotationally connected to the driving shaft (301), the other end of the rejection swing arm (304) is connected to the driven shaft (302), and the other end of the rejection assembly (2) is connected to the rejection swing arm (304) to drive the rejection swing arm (304) to rotate around the driving shaft (301).

7. The silicon wafer 180° motor shredding mechanism of claim 6, wherein, The silicon wafer conveying belt assembly (3) further comprises a second driving motor (305) and a bearing seat (306), and the output end of the second driving motor (305) is connected to the driving shaft (301), and the driving shaft (301) is rotationally arranged on the bearing seat (306).

8. The silicon wafer 180° motor shredding mechanism of claim 6, wherein, The silicon wafer conveying belt assembly (3) further comprises a first sensing seat and a second sensing seat, the first sensing seat is arranged on one side of the driving shaft (301) and is used for detecting whether the silicon wafer on the silicon wafer conveying belt assembly (3) is qualified, and the second sensing seat is arranged on one side of the driven shaft (302).

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