Automatic feeding and discharging device for wafer vertical electroplating hanger

Abstract

The utility model discloses an automatic feeding and discharging device for a wafer vertical electroplating hanger, which relates to the technical field of wafers and comprises a bottom plate, a positioning mechanism, a suction cup, a first adjusting mechanism, a second adjusting mechanism and a third adjusting mechanism, a rotating mechanism is arranged at the bottom end of the bottom plate, and the positioning mechanism is arranged at the top end of the bottom plate. The positioning mechanism is used for positioning the hanging tool, the suction cup is arranged above the bottom plate, the first adjusting mechanism is used for transversely moving the suction cup, the second adjusting mechanism is used for overturning the suction cup, and the third adjusting mechanism is used for rotating the suction cup. According to the utility model, under the cooperation of the first adjusting mechanism, the second adjusting mechanism and the third adjusting mechanism, the functions of automatic loading and unloading, horizontal movement and overturning of wafers are realized, and the wafers can be fixed on the front and back surfaces of the hanger due to the double-station arrangement, so that the production efficiency is improved, and the manual operation difficulty is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer technical field especially relates to a kind of automatic feeding and discharging devices for wafer vertical electroplating hanger. BACKGROUND

[0002] Wafer wet electroplating is a key technology in semiconductor manufacturing process, mainly used for depositing metal layer on wafer surface. This process is crucial for improving the performance and reliability of semiconductor devices.

[0003] In wet electroplating, wafers are usually placed in electroplating tank and treated with chemical solution to achieve the desired electroplating effect. One existing method is vertical immersion electroplating, which involves fixing wafers on a hanger and then vertically placing them in the electroplating tank to deposit metal layer on the wafer surface. The installation or removal of wafers from the hanger is mostly done by automatic loading and unloading devices. This automatic loading and unloading device needs to complete two key actions: one is to turn the horizontally placed wafer vertically, and the other is to make the vertically placed wafer close to the electroplating hanger and fix it to the electroplating hanger. Both actions require high accuracy in wafer movement and turning for the automatic loading and unloading device. Meanwhile, to improve the efficiency of wafer loading and unloading, the electroplating hanger is usually double-sided, which further increases the complexity of the automatic feeding and discharging device. The current equipment cannot meet the requirements, therefore, we propose an automatic feeding and discharging device for wafer vertical electroplating hanger. SUMMARY

[0004] The purpose of the present utility model is to provide an automatic feeding and discharging device for wafer vertical electroplating hanger to solve the problems raised in the background.

[0005] To achieve the above purpose, the present utility model provides the following technical solution: an automatic feeding and discharging device for wafer vertical electroplating hanger, comprising:

[0006] A bottom plate is provided with a rotating mechanism at the bottom end;

[0007] A positioning mechanism is provided at the top end of the bottom plate, which is used to position the hanger;

[0008] A suction cup is provided above the bottom plate;

[0009] A first adjusting mechanism is used to move the suction cup horizontally;

[0010] A second adjusting mechanism is used to turn the suction cup over;

[0011] A third adjusting mechanism is used to rotate the suction cup.

[0012] Preferably, the rotating mechanism comprises a rotating table, and the bottom end of the bottom plate is fixedly connected with the top end of the rotating table.

[0013] Preferably, the positioning mechanism comprises a positioning frame, and the positioning frame is used for positioning the hanger, and the outer wall of the positioning frame is provided with a plurality of extrusion mechanisms.

[0014] Preferably, the extrusion mechanism comprises:

[0015] a cylinder, which is installed on the outer wall of the positioning frame;

[0016] a pressing block, which is fixedly connected with the output end of the cylinder.

[0017] Preferably, the bottom of the positioning frame is fixedly connected with an accumulated liquid disc, and the accumulated liquid disc is arranged below the hanger.

[0018] Preferably, the first adjusting mechanism comprises a moving assembly, the moving assembly is fixedly connected with the top end of the bottom plate, and the second adjusting mechanism is arranged at the top end of the moving assembly.

[0019] Preferably, the second adjusting mechanism comprises a turnover assembly, the turnover assembly is fixedly connected with the top end of the moving assembly, and the third adjusting mechanism is arranged between the turnover assembly and the suction disc.

[0020] Preferably, the third adjusting mechanism comprises a rotating assembly, and the rotating assembly is arranged between the suction disc and the turnover assembly.

[0021] The technical effects and advantages of the utility model are as follows:

[0022] The utility model discloses a first adjusting mechanism, second adjusting mechanism and third adjusting mechanism cooperate, realize the automatic feeding and discharging of wafer, horizontal movement and turnover function, and are double position setting, can fix on wafer on the two faces of hanger, thereby improve production efficiency, reduce manual operation difficulty. DRAWINGS

[0023] Fig. 1 It is one of the three-dimensional structure schematic diagram of the utility model.

[0024] Fig. 2 It is the second three-dimensional structure schematic diagram of the utility model.

[0025] In the drawing: 1, bottom plate;2, rotating table;3, positioning frame;4, moving assembly;5, suction disc;6, rotating assembly;7, turnover assembly;8, cylinder;9, accumulated liquid disc. CONCRETE IMPLEMENTATION

[0026] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0027] The utility model provides a kind of automatic feeding and discharging device for wafer vertical electroplating hanger as Figs. 1-2 As shown in a kind of automatic feeding and discharging device for wafer vertical electroplating hanger, including bottom plate 1, positioning mechanism, suction cup 5, first adjusting mechanism, second adjusting mechanism and third adjusting mechanism, the bottom end of bottom plate 1 is provided with rotating mechanism, positioning mechanism is set to the top end of bottom plate 1, positioning mechanism is used to position hanger, suction cup 5 is set to the top of bottom plate 1, first adjusting mechanism is used to move horizontally to suction cup 5, second adjusting mechanism is used to overturn suction cup 5, third adjusting mechanism is used to rotate suction cup 5, under the cooperation of first adjusting mechanism, second adjusting mechanism and third adjusting mechanism, realize the automatic feeding and discharging of wafer, horizontal movement and overturning function, and double-station is set, can be fixed on wafer on the front and back two faces of hanger, to improve production efficiency, reduce artificial operation difficulty.

[0028] Among them, rotating mechanism includes rotating table 2, the bottom end of bottom plate 1 is fixedly connected with the top end of rotating table 2, rotating table 2 is composed of turntable, driving synchronous wheel, passive synchronous wheel, synchronous belt and click, turntable is connected with bottom plate 1, turntable is also connected with passive synchronous wheel, passive synchronous wheel and driving synchronous wheel are all engaged with synchronous belt, motor is installed at the bottom end of bottom plate 1, the output shaft of motor is connected with driving synchronous wheel.

[0029] Among them, positioning mechanism includes positioning frame 3, positioning frame 3 is used to position hanger, the outer wall of positioning frame 3 is provided with multiple extrusion mechanisms, hanger is directly placed in positioning frame 3.

[0030] Among them, extrusion mechanism includes cylinder 8 and pressing block, cylinder 8 is installed on the outer wall of positioning frame 3, pressing block is fixedly connected to the output end of cylinder 8, the piston rod of cylinder 8 drives pressing block to top up the hole on hanger by top suction cup 5, pressing block is connected with vacuum generator through pipeline, and negative pressure sensor is installed on the pipeline.

[0031] Among them, the bottom of positioning frame 3 is fixedly connected with liquid trap 9, liquid trap 9 is set below hanger, for collecting liquid dropped on hanger, to prevent liquid from polluting bottom device.

[0032] The first adjusting mechanism comprises a moving assembly 4 fixedly connected to the top end of the bottom plate 1, and a second adjusting mechanism arranged at the top end of the moving assembly 4. The moving assembly comprises a servo motor, double guide rails and a sliding block. The sliding block is connected to the overturning assembly 7, and the double guide rails are fixed on the bottom plate 1. The servo motor can control the sliding block to move linearly on the double guide rails, thereby realizing the horizontal movement of the wafer.

[0033] The second adjusting mechanism comprises an overturning assembly 7 fixedly connected to the top end of the moving assembly 4, and a third adjusting mechanism arranged between the overturning assembly 7 and the chuck 5. The overturning assembly comprises a servo motor and a connecting rod assembly. The servo motor is connected to the rotating assembly 6 through the connecting rod. The servo motor controls the rotating assembly 6 to switch between the horizontal placement and the vertical placement, thereby realizing the overturning function of the wafer between the horizontal placement and the vertical placement.

[0034] The third adjusting mechanism comprises a rotating assembly 6 arranged between the chuck 5 and the overturning assembly 7. The rotating assembly 6 comprises a servo motor and a bracket. The servo motor drives the chuck 5 to rotate within a moving angle, thereby realizing the rotating function of the chuck 5.

[0035] The hanger is placed into the hanger positioning frame 3 and vertically positioned on the rotating table 2. The wafer placement slot faces the chuck 5. The conductive sealing ring is placed onto the outer circle of the horizontally placed chuck 5 and is sucked. The chuck 5 on the moving assembly 4 sucks the wafer and places the wafer onto the inner circle plate of the chuck 5 and sucks it. The wafer is embedded into the conductive sealing ring. The overturning assembly 7 drives the horizontal chuck 5 to overturn 90 degrees, so that the wafer, the conductive sealing ring and the wafer placement slot of the hanger are parallel. The moving assembly 4 drives the vertical chuck 5 to move horizontally and linearly towards the hanger, until the several buckles on the conductive sealing ring are respectively inserted into the several water-drop-shaped holes on the spring sheet. The rotating assembly 6 rotates the chuck 5 by a certain angle, so that the buckles on the conductive sealing ring are moved from the large-diameter part of the water-drop-shaped hole to the small-diameter part, and the conductive sealing ring is clamped on the spring sheet. The chuck 5 releases the wafer and the conductive sealing ring. After the air bag is deflated, the spring sheet restores the pressure block to the front to press against the hole on the hanger. The vacuum generator drives the pressure block to generate a negative pressure suction force. The negative pressure sensor senses the size of the negative pressure, and judges whether the sealing performance of the wafer installed on the hanger is qualified.

[0036] The rotating table 2 is rotated to rotate the positioning frame 3, the hanger and the moving assembly 4 by 180 degrees. The same operation is performed on the other side of the hanger, so that the wafer is fixed on both sides of the hanger. Through the same principle, only the reverse operation is needed. The rotating direction of the rotating assembly 6 is opposite, and the horizontal moving direction of the moving assembly 4 is opposite, so that the wafer can be detached from the hanger. Finally, the hanger is taken out from the positioning frame 3.

[0037] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and is not intended to limit the present application, although the foregoing embodiments of the present application has been described in detail, for the skilled in the art, it still can be modified, or for part of the technical features of the equivalent replacement, the spirit and principles of the present application, made any modification, equivalent replacement, improvement, etc., should be included within the scope of the present application.

Claims

1. An automatic loading and unloading device for a wafer vertical electroplating hanger, characterized in that, The utility model relates to a kind of hanging device, including: Bottom plate (1), the bottom end of the bottom plate (1) is provided with rotating mechanism; Positioning mechanism, the top end of the bottom plate (1) is provided with positioning mechanism, and the positioning mechanism is used to position hanger; Sucking disc (5), the top of the bottom plate (1) is provided with sucking disc (5); First adjusting mechanism, the first adjusting mechanism is used to move sucking disc (5) laterally; Second adjusting mechanism, the second adjusting mechanism is used to overturn sucking disc (5); Third adjusting mechanism, the third adjusting mechanism is used to rotate sucking disc (5).

2. The automatic loading and unloading device for wafer vertical electroplating hanger according to claim 1, characterized in that, The rotating mechanism includes rotating table (2), and the bottom end of the bottom plate (1) is fixedly connected with the top end of rotating table (2).

3. The automatic loading and unloading device for wafer vertical electroplating hanger according to claim 1, characterized in that, The positioning mechanism includes positioning frame (3), and the positioning frame (3) is used to position hanger, and the outer wall of the positioning frame (3) is provided with multiple extrusion mechanisms.

4. The automatic loading and unloading device for wafer vertical electroplating hanger according to claim 3, characterized in that, The extrusion mechanism includes: Air cylinder (8), air cylinder (8) is installed on the outer wall of positioning frame (3); Press block, the press block is fixedly connected to the output end of air cylinder (8).

5. The automatic loading and unloading device for wafer vertical electroplating hanger according to claim 3, characterized in that, The bottom of the positioning frame (3) is fixedly connected with liquid accumulation disc (9), and the liquid accumulation disc (9) is arranged below hanger.

6. The automatic loading and unloading device for wafer vertical electroplating hanger according to claim 1, characterized in that, The first adjusting mechanism includes moving assembly (4), and the moving assembly (4) is fixedly connected to the top end of the bottom plate (1), and the second adjusting mechanism is arranged on the top end of moving assembly (4).

7. The automatic loading and unloading device for wafer vertical electroplating hanger according to claim 6, characterized in that, The second adjusting mechanism includes overturning assembly (7), and the overturning assembly (7) is fixedly connected to the top end of moving assembly (4), and the third adjusting mechanism is arranged between overturning assembly (7) and sucking disc (5).

8. The automatic loading and unloading device for wafer vertical electroplating hanger according to claim 7, characterized in that, The third adjusting mechanism includes rotating assembly (6), and the rotating assembly (6) is arranged between sucking disc (5) and overturning assembly (7).

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