Cassette assembly for silicon carbide wafer

Abstract

The utility model discloses a clamping plug assembly used for a silicon carbide wafer, comprising a clamping plug, the clamping plug is provided with a plurality of clamping grooves suitable for placing the silicon carbide wafer, the top of each clamping groove is open, and the width of the clamping groove is greater than the thickness of the silicon carbide wafer; the top of the slope part is provided with a slope surface suitable for placing a clamping plug, the included angle alpha between the slope surface and the horizontal plane is larger than or equal to 5 degrees and smaller than or equal to 10 degrees. According to the clamping plug assembly for the silicon carbide wafer, the clamping plug is arranged on the slope piece, the clamping groove of the clamping plug can be inclined, and the carbon surface of the silicon carbide wafer is attached to the clamping groove wall of the clamping plug under the action of gravity, so that when the silicon carbide wafer is taken and placed by using a wafer clamp or a suction pen, the silicon carbide wafer can be clamped by the clamping plug. The carbon surface of the silicon carbide wafer rubs with the clamping plug, so that the silicon surface is protected, and the quality of the silicon surface of the silicon carbide wafer is improved.

Description

Technical Field

[0001] This utility model relates to the field of silicon carbide, and in particular to a cassette assembly for silicon carbide wafers. Background Technology

[0002] During the production, testing, or transportation of silicon carbide wafers, chucks are used to secure and store the wafers to prevent damage or contamination. However, when using wafer chucks or pick-and-place pens to handle silicon carbide wafers, friction can easily occur between the wafer and the chuck, potentially scratching the silicon surface of the wafer and affecting its final quality. Therefore, reducing silicon surface damage to silicon carbide wafers is a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a retainer assembly for silicon carbide wafers. By placing the retainer on a ramp, the retainer's slot can be tilted. Under the action of gravity, the carbon surface of the silicon carbide wafer abuts against the slot wall of the retainer. Therefore, when the silicon carbide wafer is removed using wafer tongs or a pick-and-place tool, the friction is primarily between the carbon surface of the silicon carbide wafer and the retainer, thus protecting the silicon surface and improving the silicon surface quality of the silicon carbide wafer.

[0004] A chuck assembly for silicon carbide wafers according to an embodiment of the present invention includes: a chuck having a plurality of slots suitable for placing the silicon carbide wafer, each slot having an open top and the width of the slot being greater than the thickness of the silicon carbide wafer; and a ramp member having a ramp surface at the top suitable for placing the chuck, the ramp surface having an angle α with a horizontal plane, α satisfying: 5°≤α≤10°.

[0005] According to the embodiments of the present invention, the cassette assembly for silicon carbide wafers allows the cassette slot to be tilted by placing the cassette on a ramp. Under the action of gravity, the carbon surface of the silicon carbide wafer is pressed against the slot wall of the cassette. Thus, when the silicon carbide wafer is removed with wafer tweezers or a pick-up pen, the friction between the carbon surface of the silicon carbide wafer and the cassette is mainly caused by friction, thereby protecting the silicon surface and improving the silicon surface quality of the silicon carbide wafer.

[0006] In some embodiments of this utility model, the cassette has a plurality of clearance grooves on one axial side, and after the silicon carbide wafer is placed into the cassette, the silicon surface of the silicon carbide wafer is away from the clearance grooves.

[0007] In some embodiments of this utility model, the ramp component includes: a ramp body, the top surface of which defines the ramp surface; a first baffle and a second baffle, the first baffle and the second baffle being perpendicularly disposed on the ramp surface, and the connection between the first baffle and the second baffle being located at the lowest point of the ramp body.

[0008] In some embodiments of this utility model, the ramp component is made of spliced ​​acrylic sheets, and the thickness of the acrylic sheets is 5mm-10mm.

[0009] In some embodiments of this utility model, the height of the first baffle is 40mm-60mm.

[0010] In some embodiments of this utility model, the ramp component further includes: a first support plate, one end of which is connected to the top of the first baffle, and the other end of which extends horizontally in a direction away from the ramp body; and a second support plate, the upper end of which is connected to the other end of the first support plate, and the lower end of which extends to be flush with the bottom surface of the ramp body.

[0011] In some embodiments of this utility model, the height of the second baffle is 40mm-60mm.

[0012] In some embodiments of this utility model, the height of the ramp body does not exceed 40mm.

[0013] In some embodiments of this utility model, the bottom of the ramp is provided with a rubber anti-slip layer.

[0014] In some embodiments of this utility model, the area occupied by the ramp component is S1, and the area occupied by the stopper is S2, where S1 and S2 satisfy: S1≥3S2.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a cassette assembly for a silicon carbide wafer according to an embodiment of the present invention, wherein a silicon carbide wafer is placed inside the cassette.

[0017] Figure 2 This is a schematic diagram of a clasp assembly for a silicon carbide wafer according to an embodiment of the present invention, wherein the silicon carbide wafer is removed;

[0018] Figure 3 This is a perspective view of a ramp component according to an embodiment of the present utility model;

[0019] Figure 4 This is a plan view of a ramp component according to another embodiment of the present invention;

[0020] Figure 5 yes Figure 4 Schematic diagram of the cross section at point AA;

[0021] Figure 6 yes Figure 4 Schematic diagram of cross-section at point BB.

[0022] Figure label:

[0023] Cassette assembly 100;

[0024] 10; 11; 12;

[0025] Inclined component 20; inclined surface 21; inclined body 22; first baffle 23; first support plate 231; second support plate 232; second baffle 24; third support plate 241;

[0026] Silicon carbide wafer 200; carbon surface 201; silicon surface 202. Detailed Implementation

[0027] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0028] The following disclosure provides numerous different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention; however, those skilled in the art will recognize the applicability of other processes and / or the use of other materials.

[0029] Reference Figures 1-6As shown, the chuck assembly 100 for a silicon carbide wafer 200 according to an embodiment of the present invention may include a chuck 10 and a ramp member 20. The chuck 10 has a plurality of slots 11 suitable for placing the silicon carbide wafer 200, wherein "a plurality of" refers to two or more. The top of each slot 11 is open, and the width of the slot 11 is greater than the thickness of the silicon carbide wafer 200. For example, if the thickness of the silicon carbide wafer 200 is 350±25um, the width of the slot 11 is generally 1000um. The top of the ramp member 20 has a ramp surface 21 suitable for placing the chuck 10. (Refer to...) Figure 5 As shown, the angle between the slope surface 21 and the horizontal plane is α, which satisfies: 5°≤α≤10°. In other words, α can take any value between 5° and 10°, for example, α can take the value of 5°, 6°, 7°, 8°, 9° or 10°.

[0030] It should be noted that the silicon carbide wafer 200 has a silicon surface 202 and a carbon surface 201. The silicon surface 202, due to its specific electrical and mechanical properties, is often used as a reference surface for epitaxial growth, and its roughness requirement is less than 0.2 nm. If the cassette 10 is placed directly on the working plane, after the silicon carbide wafer 200 is placed on the cassette 10 using a wafer clamp or a pick-up pen, under the action of gravity, it is possible that the carbon surface 201 of the silicon carbide wafer 200 is against the cassette 10, or it is possible that the silicon surface 202 of the silicon carbide wafer 200 is against the cassette 10. When the silicon carbide wafer 200 is used for testing next time, both the silicon surface 202 and the carbon surface 201 of the silicon carbide wafer 200 may rub against the cassette 10, affecting the quality of the silicon surface 202 of the silicon carbide wafer 200.

[0031] In view of this, the chuck assembly 100 for silicon carbide wafer 200 according to the present invention, by placing the chuck 10 on the ramp 20, allows the chuck groove 11 of the chuck 10 to tilt. Under the action of gravity, the carbon surface 201 of the silicon carbide wafer 200 abuts against the wall of the chuck groove 11 of the chuck 10. Thus, when the silicon carbide wafer 200 is removed with wafer tweezers or a pick-up pen, the friction is mainly between the carbon surface 201 of the silicon carbide wafer 200 and the chuck 10, thereby protecting the silicon surface 202 and facilitating the removal of the silicon carbide wafer 200. To improve the quality of the silicon carbide wafer 200, and by making the angle α between the ramp surface 21 and the horizontal plane between 5° and 10°, on the one hand, the slope of the ramp surface 21 is not too small, which helps to ensure that the silicon carbide wafer 200 is placed tilted in the cassette 10 and the carbon surface 201 of the silicon carbide wafer 200 is in contact with the wall of the cassette groove 11 of the cassette 10. On the other hand, the tilt angle of the ramp surface 21 is not too large, which helps to prevent the cassette 10 from slipping off the ramp surface 21.

[0032] In some embodiments of this utility model, reference is made to Figure 1As shown, the retainer 10 has multiple clearance grooves 12 on one axial side. After the silicon carbide wafer 200 is placed into the retainer 11, the silicon surface 202 of the silicon carbide wafer 200 moves away from the clearance grooves 12. For example, as... Figure 2 As shown, the side of the retainer 10 with the clearance groove 12 can be abutted against the first baffle 23 described below. It can be understood that by providing the clearance groove 12 on one axial side of the retainer 10, the silicon surface 202 of the silicon carbide wafer 200 is away from the clearance groove 12, thereby preventing the silicon carbide wafer 200 from being placed upside down, and at the same time facilitating the observation of the state of the placed silicon carbide wafer 200, which helps to ensure the reliable storage of the silicon carbide wafer 200.

[0033] In some embodiments of this utility model, reference is made to Figure 3 As shown, the ramp component 20 includes: a ramp body 22, a first baffle 23, and a second baffle 24. The top surface of the ramp body 22 defines a ramp surface 21. For example, the ramp body 22 can be formed into a cube with an inclined top. The first baffle 23 and the second baffle 24 are vertically disposed on the ramp surface 21. The connection between the first baffle 23 and the second baffle 24 is located at the lowest point of the ramp body 22. The first baffle 23 and the second baffle 24 can both be formed as flat plates. It is understood that by setting the first baffle 23 and the second baffle 24 to cooperate with the plug 10, the plug 10 can be prevented from slipping off the ramp component 20, which helps to ensure the reliable placement of the plug 10.

[0034] In some embodiments of this utility model, reference is made to Figures 4-6 As shown, the ramp component 20 is made of spliced ​​acrylic sheets. It is understood that acrylic sheets have advantages such as high transparency, good processing performance, strong weather resistance, and strong impact resistance. By making the ramp component 20 of spliced ​​acrylic sheets, the overall performance of the ramp body 22 is improved. Optionally, the first baffle 23 and the second baffle 24 can also be made of acrylic sheets.

[0035] Reference Figure 2 As shown, the thickness of the acrylic sheet is 5mm-10mm. In other words, the thickness of the acrylic sheet can be any value between 5mm and 10mm. It can be understood that by making the thickness of the acrylic sheet between 5mm and 10mm, on the one hand, the thickness of the acrylic sheet is not too small, which helps to ensure the structural strength of the ramp component 20; on the other hand, the thickness of the acrylic sheet is not too large, which helps to reduce production costs.

[0036] In some embodiments of this utility model, reference is made to Figure 5As shown, the height of the first baffle 23 is 40mm-60mm. In other words, the height of the first baffle 23 can be any value between 40mm and 60mm. For example, the height of the first baffle 23 can be 40mm, 45mm, 50mm, 55mm, or 60mm. It is understandable that by making the height of the first baffle 23 40mm-60mm, it is beneficial to ensure the stopping effect on the jammer 10, and at the same time, it can prevent the height of the ramp 20 from being too high, making it easier for the inspection personnel to operate.

[0037] In some embodiments of this utility model, reference is made to Figure 5 As shown, the ramp component 20 further includes: a first support plate 231 and a second support plate 232. One end of the first support plate 231 is connected to the top of the first baffle 23, and the other end of the first support plate 231 extends horizontally in a direction away from the ramp body 22. The upper end of the second support plate 232 is connected to the other end of the first support plate 231, and the lower end of the second support plate 232 extends to be flush with the bottom surface of the ramp body 22. For example, see reference... Figure 5 As shown, the first baffle 23, the first support plate 231, and the second support plate 232 are formed in an inverted U-shape. It can be understood that by setting the first support plate 231 and the second support plate 232, the contact area between the ramp 20 and the worktable surface can be increased, thereby preventing the entire component from tipping over after the plug 10 is placed on the ramp 20.

[0038] In some embodiments of this utility model, reference is made to Figure 6 As shown, the height of the second baffle 24 is 40mm-60mm. For example, the height of the second baffle 24 can be 40mm, 45mm, 50mm, 55mm, or 60mm. It is understandable that by making the height of the second baffle 24 40mm-60mm, it is beneficial to ensure the stopping effect on the jammer 10, and at the same time, it can prevent the overall height of the ramp 20 from being too high, making it easier for the inspection personnel to operate.

[0039] Optionally, refer to Figure 6 As shown, the ramp component 20 also includes a third support plate 241, one end of which is connected to the top of the second baffle 24, and the other end of which extends horizontally outward, for example, as... Figure 6 As shown, the cross-sections of the third support plate 241 and the second baffle plate 24 are L-shaped. This further improves the stability of the ramp member 20.

[0040] In some embodiments of this utility model, reference is made to Figure 6 As shown, the height of the ramp 22 does not exceed 40mm. For example, the maximum height of the ramp 22 can be 35mm, which can avoid the overall height of the jammer 10 and the ramp 20 being too large, thus facilitating operation by inspection personnel.

[0041] In some embodiments of this utility model, reference is made to Figure 6 As shown, the bottom of the ramp 20 is provided with a rubber anti-slip layer (not shown). For example, the thickness of the rubber anti-slip layer can be 1mm-2mm. It is understood that by providing a rubber anti-slip layer at the bottom of the ramp 20, it is beneficial to prevent the ramp 20 from sliding relative to the worktable, thereby ensuring the reliable placement of the plug 10 and the ramp 20.

[0042] In some embodiments of this utility model, reference is made to Figure 6 As shown, the area occupied by the ramp component 20 is S1, and the area occupied by the stopper 10 is S2. S1 and S2 satisfy: S1 ≥ 3S2. Optionally, S1 is equal to 3.5 times S2. It can be understood that by ensuring that S1 and S2 satisfy: S1 ≥ 3S2, it is beneficial to prevent the stopper assembly 100 filled with silicon carbide wafers from tipping over, and can further ensure the reliable placement of the stopper assembly 100.

[0043] Other configurations and operations of the cassette assembly 100 for silicon carbide wafers according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0044] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0045] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0046] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0047] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0048] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0049] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A cassette assembly for silicon carbide wafers, characterized in that, include: The cassette has a plurality of slots adapted to place the silicon carbide wafer, each slot having an open top and a width greater than the thickness of the silicon carbide wafer; The ramp component has a ramp surface at its top suitable for placing the plug, and the angle between the ramp surface and the horizontal plane is α, where α satisfies: 5°≤α≤10°.

2. The cassette assembly for silicon carbide wafers according to claim 1, characterized in that, The cassette has multiple clearance grooves on one axial side. After the silicon carbide wafer is placed into the cassette, the silicon surface of the silicon carbide wafer is away from the clearance grooves.

3. The cassette assembly for silicon carbide wafers according to claim 1, characterized in that, The ramp component includes: A ramp body, the top surface of which defines the ramp surface; A first baffle and a second baffle are perpendicularly disposed on the slope surface, and the connection between the first baffle and the second baffle is located at the lowest point of the slope.

4. The cassette assembly for silicon carbide wafers according to claim 3, characterized in that, The ramp component is made of spliced ​​acrylic sheets, and the thickness of the acrylic sheets is 5mm-10mm.

5. The cassette assembly for silicon carbide wafers according to claim 3, characterized in that, The height of the first baffle is 40mm-60mm.

6. The cassette assembly for silicon carbide wafers according to claim 3, characterized in that, The ramp component also includes: The first support plate has one end connected to the top of the first baffle, and the other end of the first support plate extends horizontally in a direction away from the slope. The second support plate has its upper end connected to the other end of the first support plate, and its lower end extends to be flush with the bottom surface of the slope.

7. The cassette assembly for silicon carbide wafers according to claim 3, characterized in that, The height of the second baffle is 40mm-60mm.

8. The cassette assembly for silicon carbide wafers according to claim 3, characterized in that, The height of the slope body shall not exceed 40mm.

9. The cassette assembly for silicon carbide wafers according to claim 1, characterized in that, The bottom of the ramp component is provided with a rubber anti-slip layer.

10. The cassette assembly for silicon carbide wafers according to claim 1, characterized in that, The ramp component has a floor area of ​​S1, and the stopper has a floor area of ​​S2. S1 and S2 satisfy: S1≥3S2.

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