AGV (Automatic Guided Vehicle) transferring equipment for semiconductor module

Abstract

The utility model discloses AGV (Automatic Guided Vehicle) transferring equipment for a semiconductor module, and belongs to the technical field of AGV transferring equipment. Comprising an AGV trolley and a supporting frame, the supporting frame is installed at the top end of the AGV trolley, a fork arm is arranged outside the supporting frame, a supporting plate is arranged in the AGV trolley, a rotating disc is arranged outside the supporting plate, a supporting frame is installed at the top end of the rotating disc, and a control panel is installed on the side wall of the top end of the AGV trolley. A servo motor is mounted at the top end of the AGV trolley on one side of the supporting frame, and a threaded rod is mounted at the output end of the servo motor. According to the utility model, the AGV transfer equipment can conveniently convey the moving positions of the semiconductor modules, the convenience of the AGV transfer equipment for moving the semiconductor modules is improved, the AGV transfer equipment can convey the semiconductor modules in multiple modes, and the convenience of the AGV transfer equipment for conveying the semiconductor modules in multiple modes is improved.

Description

Technical Field

[0001] This utility model relates to the field of AGV transfer equipment technology, specifically to an AGV transfer equipment for semiconductor modules. Background Technology

[0002] AGVs (Automated Guided Vehicles) autonomously travel along preset paths, enabling high-precision material handling based on sensors and navigation systems. These automated devices can work 24 hours a day without slowing down due to fatigue, thus significantly improving production efficiency. Through precise navigation systems and sensors, AGVs can avoid obstacles, ensuring the safety of the operation process and avoiding errors in traditional manual operations. This helps reduce production problems caused by human error.

[0003] As disclosed in the patent announcement number CN221317819U, a transfer device includes a fixing device, a driving device, a lifting cam, a lifting member, and multiple conveying devices. The multiple conveying devices are pivotally connected to the fixing device. The lifting member is located between the multiple conveying devices. The lifting cam is located below the lifting member and abuts against the bottom of the lifting member. The lifting cam has a protruding structure that can periodically contact the bottom of the lifting member as the lifting cam rotates to lift the lifting member. The driving device is drivenly connected to the lifting cam and the multiple conveying devices to drive the lifting cam and the multiple conveying devices to rotate synchronously.

[0004] Although it achieves the function of supporting and fixing the roller conveyor assembly by using rotating components, thereby driving the roller conveyor assembly to rotate and change its conveying direction, the rolling friction between the lifting cam and the roller can further reduce the lifting resistance of the lifting cam on the lifting component, making the lifting process easier and more stable. This allows any side of the transfer equipment to be seamlessly connected to the conveyor line, improving the flexibility and convenience of the transfer equipment installation.

[0005] However, this does not solve the problem that existing AGV transfer equipment of this type is generally not conducive to the convenient movement and transportation of semiconductor modules, which affects the ease of moving semiconductor modules and the convenience of multi-mode transportation of semiconductor modules by AGV transfer equipment. Utility Model Content

[0006] The purpose of this utility model is to provide an AGV transfer device for semiconductor modules, so as to solve the problems mentioned in the background art, which are that the AGV transfer device is not convenient for the AGV transfer device to easily move and transport semiconductor modules, thus affecting the convenience of the AGV transfer device to move semiconductor modules and the AGV transfer device is not convenient for transporting semiconductor modules in multiple ways, thus affecting the convenience of the AGV transfer device to transport semiconductor modules in multiple ways.

[0007] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0008] An AGV transfer device for semiconductor modules includes an AGV trolley and a support frame. The support frame is mounted on the top of the AGV trolley, and a fork arm is provided on the outside of the support frame. A support plate is provided inside the AGV trolley, and a rotating disk is provided on the outside of the support plate. A support frame is mounted on the top of the rotating disk. A control panel is mounted on the top side wall of the AGV trolley. A servo motor is mounted on the top of the AGV trolley on one side of the support frame, and a threaded rod is mounted on the output end of the servo motor.

[0009] Optionally, the threaded rod passes through the support frame and is movably connected thereto. A threaded block is fitted on the surface of the threaded rod, and the threaded rod is threadedly connected to the threaded block. A lifting plate is installed on the side wall of the threaded block, and the lifting plate is movably connected to the fork arm.

[0010] Optionally, guide rails are symmetrically installed on the side walls of the support frame, and sliders are installed on the side walls of the lifting plates on both sides of the threaded block, and the sliders are slidably connected to the guide rails.

[0011] Optionally, a support shaft is installed at the center of the bottom end of the rotating disk, the support shaft extends to the top of the support plate, a worm gear is fitted on the surface of the support shaft, a stepper motor is installed at the top of the external support plate of the support shaft, a worm is installed at the output end of the stepper motor, the worm meshes with the support shaft, and a second electric push rod is installed at the top of the support frame.

[0012] Optionally, a support block is movably installed inside the support frame, the output end of the second electric push rod extends into the interior of the support frame, the output end of the second electric push rod is connected to the support block, a first electric push rod is installed on the side wall of the support block, and a connecting block is installed on the output end of the first electric push rod.

[0013] Optionally, a connecting plate is installed on the side wall of the connecting block, and a third electric push rod is movably installed on the side wall of the connecting plate.

[0014] Optionally, the output end of the third electric actuator is equipped with an auxiliary shaft, which is movably connected to the connecting plate and extends through the connecting plate to its exterior.

[0015] Optionally, a connecting plate is installed at the top of the auxiliary shaft, and a right clamping arm is installed on the side wall of the connecting plate.

[0016] Optionally, a fourth electric push rod is installed inside the right clamping arm, and the output end of the fourth electric push rod is installed with the left clamping arm.

[0017] Optionally, a limiting rod is movably mounted on the top end of the fourth electric push rod, and the limiting rod is connected to the left clamping arm.

[0018] Compared with the prior art, the beneficial effects of this utility model are: the AGV transfer device not only realizes the convenient transportation of semiconductor modules, improving the convenience of moving semiconductor modules, but also realizes the multi-mode transportation of semiconductor modules, improving the convenience of multi-mode transportation of semiconductor modules.

[0019] The AGV is moved to the working area, causing the fork arm to move below the semiconductor module. The servo motor drives the threaded rod to rotate, which in turn moves the threaded block. The threaded block then moves the lifting plate inside the support frame, which in turn moves the fork arm. This allows the fork arm to lift and transport the semiconductor module upwards, facilitating convenient and efficient transport of the semiconductor module. This improves the ease of moving semiconductor modules using the AGV transfer equipment.

[0020] A stepper motor drives a worm gear to rotate, which in turn drives a worm wheel to rotate. The worm wheel then drives a support shaft, a rotating disk, a support frame, a support block, a connecting block, a connecting plate, a right clamping arm, and a left clamping arm to rotate. A first electric push rod drives the connecting block, connecting plate, right clamping arm, and left clamping arm to move above the semiconductor module. A second electric push rod drives the support block, connecting block, connecting plate, right clamping arm, and left clamping arm to move to the surface of the semiconductor module. A third electric push rod drives an auxiliary shaft to rotate inside the connecting plate, which in turn drives the connecting plate, right clamping arm, and left clamping arm to rotate. A fourth electric push rod drives the left clamping arm to move, clamping and conveying the semiconductor module. This facilitates multi-angle rotation for clamping and conveying the semiconductor module, enabling the AGV transfer equipment to convey the semiconductor module in multiple ways and improving the convenience of multi-mode semiconductor module conveying by the AGV transfer equipment. Attached Figure Description

[0021] The accompanying drawings, which are incorporated herein and form part of the specification, illustrate embodiments of the present invention and, together with the specification, further serve to explain the principles of the present invention and enable those skilled in the art to implement and use the present invention.

[0022] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0023] Figure 2 This is a front view structural diagram of the present utility model;

[0024] Figure 3 This is a three-dimensional structural diagram of the lifting plate of this utility model;

[0025] Figure 4 This is a three-dimensional structural diagram of the AGV trolley of this utility model;

[0026] Figure 5 This is a three-dimensional structural diagram of the rotating disk of this utility model;

[0027] Figure 6 This is a three-dimensional structural diagram of the connecting plate of this utility model;

[0028] Figure 7 This is a three-dimensional structural diagram of the connecting plate of this utility model.

[0029] Figure label:

[0030] 1. AGV trolley; 2. Support frame; 3. Fork arm; 4. Support plate; 5. Rotary disk; 6. Support frame; 7. Control panel; 8. Servo motor; 9. Threaded rod; 10. Threaded block; 11. Lifting plate; 12. Guide rail; 13. Slider; 14. Stepper motor; 15. Worm gear; 16. Support shaft; 17. Worm wheel; 18. Support block; 19. First electric push rod; 20. Second electric push rod; 21. Connecting block; 22. Connecting plate; 23. Third electric push rod; 24. Auxiliary shaft; 25. Connecting plate; 26. Right clamping arm; 27. Limiting rod; 28. Left clamping arm; 29. ​​Fourth electric push rod.

[0031] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiment of this utility model. However, this is only for illustrative purposes and is not intended to limit this utility model to this specific structure, device and environment. Those skilled in the art can adjust or modify these devices and environments according to specific needs. Detailed Implementation

[0032] The AGV transfer device for semiconductor modules provided by this utility model will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and those skilled in the art can use other alternative methods to implement some known technologies; moreover, the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit this utility model.

[0033] It should be noted that the use of terms such as "an embodiment," "an embodiment," "an exemplary embodiment," and "some embodiments" in the specification indicates that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the art.

[0034] Generally, terms can be understood at least partly from their use in context. For example, depending at least partly on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in a singular sense, or a combination of features, structures, or characteristics in a plural sense. Additionally, the term "based on" can be understood not necessarily to convey an exclusive set of factors, but rather, alternatively, depending at least partly on the context, to allow for the presence of other factors that are not necessarily explicitly described.

[0035] It is understood that the meanings of “on”, “above”, and “above” in this utility model should be interpreted in the broadest manner, such that “on” not only means “directly on” something, but also includes the meaning of being “on” something with an intervening feature or layer, and that “above” or “above” not only means “on” something, but also includes the meaning of being “on” something without an intervening feature or layer.

[0036] Furthermore, spatially related terms such as “below,” “under,” “lower,” “above,” and “upper” are used herein for convenience to describe the relationship of one element or feature to one or more other elements or features, as illustrated in the accompanying drawings. Spatially related terms are intended to cover different orientations in the use or operation of the device other than those depicted in the accompanying drawings. The device may be oriented in other ways, and the spatially related descriptive terms used herein can be interpreted similarly.

[0037] like Figures 1 to 7As shown, an embodiment of this utility model provides an AGV transfer device for semiconductor modules, including an AGV trolley 1 and a support frame 2. The support frame 2 is installed at the top of the AGV trolley 1, and a fork arm 3 is provided on the outside of the support frame 2. A support plate 4 is provided inside the AGV trolley 1, and a rotating disk 5 is provided on the outside of the support plate 4. A support frame 6 is installed at the top of the rotating disk 5. A control panel 7 is installed on the top side wall of the AGV trolley 1. A servo motor 8 is installed at the top of the AGV trolley 1 on one side of the support frame 2. A threaded rod 9 is installed at the output end of the servo motor 8. The threaded rod 9 passes through the support frame 2 and is movably connected to it. A threaded block 10 is fitted on the surface of the threaded rod 9, and the threaded rod 9 is threadedly connected to the threaded block 10. A lifting plate 11 is installed on the side wall of the threaded block 10 and is movably connected to the fork arm 3. Guide rails 12 are symmetrically installed on the side wall of the support frame 2. Slider blocks 13 are installed on the side walls of the lifting plates 11 on both sides of the threaded block 10, and the sliders 13 are slidably connected to the guide rails 12.

[0038] When using an AGV transfer device for semiconductor modules, the AGV trolley 1 is moved to the working area, causing the fork arm 3 to move below the semiconductor module. The control panel 7 is then activated to turn on the servo motor 8. Supported by the AGV trolley 1, the servo motor 8 drives the threaded rod 9 to rotate. With the threaded connection between the threaded rod 9 and the threaded block 10, the threaded rod 9 moves the threaded block 10. The threaded block 10 then moves the lifting plate 11 inside the support frame 2. The lifting plate 11 moves the fork arm 3, causing the fork arm 3 to lift and transport the semiconductor module upwards. This facilitates convenient transport of the semiconductor module, improving the ease of moving the semiconductor module using the AGV transfer device.

[0039] A support shaft 16 is installed at the center of the bottom of the rotating disk 5. The support shaft 16 extends to the top of the support plate 4. A worm gear 17 is fitted on the surface of the support shaft 16. A stepper motor 14 is installed on the top of the support plate 4 outside the support shaft 16. A worm 15 is installed at the output end of the stepper motor 14. The worm 15 meshes with the support shaft 16. A second electric push rod 20 is installed on the top of the support frame 6.

[0040] A support block 18 is movably installed inside the support frame 6. The output end of the second electric push rod 20 extends into the interior of the support frame 6 and is connected to the support block 18. A first electric push rod 19 is installed on the side wall of the support block 18, and a connecting block 21 is installed at the output end of the first electric push rod 19.

[0041] A connecting plate 22 is installed on the side wall of the connecting block 21. A third electric push rod 23 is movably installed on the side wall of the connecting plate 22. An auxiliary shaft 24 is installed at the output end of the third electric push rod 23. The auxiliary shaft 24 is movably connected to the connecting plate 22 and extends through the connecting plate 22 to its outside.

[0042] A connecting plate 25 is installed at the top of the auxiliary shaft 24. A right clamping arm 26 is installed on the side wall of the connecting plate 25. A fourth electric push rod 29 is installed inside the right clamping arm 26. A left clamping arm 28 is installed at the output end of the fourth electric push rod 29. A limit rod 27 is movably installed at the top of the fourth electric push rod 29. The limit rod 27 is connected to the left clamping arm 28.

[0043] When smaller semiconductor modules need to be clamped and transported, stepper motor 14 is activated. Supported by support plate 4, stepper motor 14 drives worm gear 15 to rotate. With the meshing of worm gear 15 and worm wheel 17, worm gear 15 drives worm wheel 17 to rotate. Worm wheel 17 drives support shaft 16, rotary disk 5, support frame 6, support block 18, connecting block 21, connecting plate 22, right clamping arm 26, and left clamping arm 28 to rotate. First electric push rod 19 is activated. Supported by support block 18, first electric push rod 19 drives connecting block 21, connecting plate 22, right clamping arm 26, and left clamping arm 28 to move above the semiconductor module. Second electric push rod 20 is activated. Supported by support frame 6, second electric push rod 20 drives support block 18. Connecting block 21, connecting plate 22, right clamping arm 26, and left clamping arm 28 move to the surface of the semiconductor module. The third electric push rod 23 is opened. With the support of connecting plate 22, the third electric push rod 23 drives the auxiliary shaft 24 to rotate inside the connecting plate 22. The auxiliary shaft 24 drives the connecting plate 25, right clamping arm 26, and left clamping arm 28 to rotate. The fourth electric push rod 29 is opened. With the support of right clamping arm 26 and the limit rod 27, the fourth electric push rod 29 drives the left clamping arm 28 to move, clamping and conveying the semiconductor module. This facilitates clamping and conveying the semiconductor module by rotating at multiple angles, realizing multi-mode conveying of semiconductor modules by AGV transfer equipment and improving the convenience of multi-mode conveying of semiconductor modules by AGV transfer equipment.

[0044] The working principle of the technical solution provided by this utility model is as follows: Servo motor 8 drives threaded rod 9 to rotate, threaded rod 9 drives threaded block 10 to move, threaded block 10 drives lifting plate 11 to move inside support frame 2, lifting plate 11 drives fork arm 3 to move, so that fork arm 3 moves the semiconductor module upward for lifting and conveying, which facilitates convenient and easy conveying of the semiconductor module's moving position. Stepper motor 14 drives worm gear 15 to rotate, worm gear 15 drives worm wheel 17 to rotate, worm wheel 17 drives support shaft 16, rotating disk 5, support frame 6, support block 18, connecting block 21, connecting plate 22, right clamping arm 26, and left clamping arm 28 to rotate. First electric push rod 19 drives connecting block 21, connecting plate 22, and right clamping arm 26. The left clamping arm 28 moves to the top of the semiconductor module. The second electric push rod 20 drives the support block 18, connecting block 21, connecting plate 22, right clamping arm 26, and left clamping arm 28 to move to the surface of the semiconductor module. The third electric push rod 23 is opened. With the support of the connecting plate 22, the third electric push rod 23 drives the auxiliary shaft 24 to rotate inside the connecting plate 22. The auxiliary shaft 24 drives the connecting plate 25, right clamping arm 26, and left clamping arm 28 to rotate. The fourth electric push rod 29 is opened. With the support of the right clamping arm 26 and the limit rod 27, the fourth electric push rod 29 drives the left clamping arm 28 to move, clamping and conveying the semiconductor module. This facilitates clamping and conveying the semiconductor module by rotating it at multiple angles, thus completing the operation of the AGV transfer equipment.

[0045] This utility model encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this utility model. To provide the public with a thorough understanding of this utility model, specific details are described in detail in the following preferred embodiments; however, those skilled in the art will fully understand this utility model even without these detailed descriptions. Furthermore, to avoid unnecessary confusion regarding the essence of this utility model, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0046] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. An AGV transfer device for semiconductor modules, characterized in that: The system includes an AGV (Automated Guided Vehicle) trolley and a support frame. The support frame is mounted on the top of the AGV trolley, and a fork arm is provided on the outside of the support frame. A support plate is provided inside the AGV trolley, and a rotating disk is provided on the outside of the support plate. A support frame is mounted on the top of the rotating disk. A control panel is mounted on the top side wall of the AGV trolley. A servo motor is mounted on the top of the AGV trolley on one side of the support frame, and a threaded rod is mounted on the output end of the servo motor.

2. The AGV transfer device for semiconductor modules according to claim 1, characterized in that: The threaded rod passes through the support frame and is movably connected to it. A threaded block is fitted on the surface of the threaded rod, and the threaded rod is threadedly connected to the threaded block. A lifting plate is installed on the side wall of the threaded block, and the lifting plate is movably connected to the fork arm.

3. The AGV transfer device for semiconductor modules according to claim 2, characterized in that: Guide rails are symmetrically installed on the side walls of the support frame, and sliders are installed on the side walls of the lifting plates on both sides of the threaded block. The sliders are slidably connected to the guide rails.

4. The AGV transfer device for semiconductor modules according to claim 3, characterized in that: A support shaft is installed at the center of the bottom of the rotating disk, and the support shaft extends to the top of the support plate. A worm gear is fitted on the surface of the support shaft. A stepper motor is installed at the top of the external support plate of the support shaft. A worm is installed at the output end of the stepper motor and meshes with the support shaft. A second electric push rod is installed at the top of the support frame.

5. The AGV transfer device for semiconductor modules according to claim 4, characterized in that: A support block is movably installed inside the support frame. The output end of the second electric push rod extends into the interior of the support frame and is connected to the support block. A first electric push rod is installed on the side wall of the support block, and a connecting block is installed at the output end of the first electric push rod.

6. The AGV transfer device for semiconductor modules according to claim 5, characterized in that: A connecting plate is installed on the side wall of the connecting block, and a third electric push rod is movably installed on the side wall of the connecting plate.

7. The AGV transfer device for semiconductor modules according to claim 6, characterized in that: An auxiliary shaft is installed at the output end of the third electric push rod. The auxiliary shaft is movably connected to the connecting plate and extends through the connecting plate to its exterior.

8. The AGV transfer device for semiconductor modules according to claim 7, characterized in that: A connecting plate is installed at the top of the auxiliary shaft, and a right clamping arm is installed on the side wall of the connecting plate.

9. The AGV transfer device for semiconductor modules according to claim 8, characterized in that: The right clamping arm is equipped with a fourth electric push rod, and the output end of the fourth electric push rod is equipped with a left clamping arm.

10. The AGV transfer device for semiconductor modules according to claim 9, characterized in that: A limiting rod is movably mounted on the top of the fourth electric push rod, and the limiting rod is connected to the left clamping arm.

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