Device for keeping liquid level balance and line body processing system

By using a liquid level adjustment mechanism and Archimedes' principle, the liquid level in the tin coating machine is kept stable, which solves the problem of uneven coating thickness caused by liquid level fluctuations, and achieves simplified control and cost reduction.

CN223866736UActive Publication Date: 2026-02-03ANHUI YUBANG NEW MATERIALS CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202520340849.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-28
Publication Date
2026-02-03
Estimated Expiration
2035-02-28

AI Technical Summary

Technical Problem

In existing technologies, when the tin coating machine operates with two heads, fluctuations in the solder level can lead to uneven coating thickness on the products produced on the production line, affecting production quality.

Method used

A liquid level regulating mechanism, including an regulating body and a sliding component, is adopted. Utilizing Archimedes' principle, the regulating body synchronously immerses or removes the processing liquid when the tooling equipment is immersed or removed, maintaining a stable liquid level and avoiding liquid level fluctuations.

Benefits of technology

It achieves stable liquid level in the processing, avoids uneven coating thickness on the production line, simplifies control logic, reduces costs, and improves reliability.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223866736U_ABST
    Figure CN223866736U_ABST
Patent Text Reader

Abstract

The utility model relates to the technical field of welding strip machining, and provides a device for keeping liquid level balance and a line body machining system.The device is applied to machining equipment, the machining equipment comprises at least two machining heads, the device comprises tool equipment connected to the machining heads, and when the tool equipment is immersed in machining liquid, the machining liquid has a preset standard liquid level; the liquid level adjusting mechanism comprises an adjusting body and is connected to the tool equipment; wherein when the tool equipment is moved out of the processing liquid, the adjusting body is synchronously immersed in the processing liquid, and the volume of the adjusting body is equal to the volume of the liquid discharged when the tool equipment is immersed in the processing liquid, so that the liquid level of the processing liquid is maintained to be a preset standard liquid level. In the scheme, the volume of the adjusting body is equal to the volume of the liquid discharged by the tool equipment, liquid level compensation can be realized by directly utilizing the Archimedes principle when the tool equipment is immersed into or moved out of the processing liquid, and the technical problem that the thickness of a line body coating is not uniform due to liquid level fluctuation in the prior art is solved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This application relates to the field of welding strip processing technology, and more particularly to a device and line processing system for maintaining liquid level balance. Background Technology

[0002] A dual-head soldering machine is a device used for soldering electronic components. It consists of a solder pot, soldering heads, tooling equipment, and an air knife. The soldering heads apply molten solder to the wire body. The two soldering heads share a single solder pot, and each head can operate independently, allowing for simultaneous soldering of two circuits during the soldering process, significantly reducing the production cycle. The tooling equipment is used to fix and guide the wire body; it is correspondingly set with the soldering heads and can be raised or lowered individually as needed. The air knife is used to cool the wire body with airflow.

[0003] In actual production, the tinning machine operates with both heads working simultaneously. When both fixtures are immersed in solder, the solder level and tinning frequency are relatively stable. If one tinning head malfunctions, for example, requiring a shutdown for maintenance, the fixture corresponding to that tinning head will momentarily lift off the solder, causing the solder level to drop instantly below the standard level. This instantaneous drop will affect the coating thickness of the product in the other fixture. Subsequently, the automatic tinning system will activate, replenishing solder to restore the level to the standard level. When the malfunction is resolved and the fixture is lowered back into the solder, the solder level will momentarily rise above the standard level. This instantaneous rise will also affect the coating thickness of the product in the other fixture.

[0004] Therefore, how to maintain a stable solder level during the production process is a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0005] The purpose of this application is to provide a device and a processing line system for maintaining liquid level balance, which can use basic physical principles to keep the liquid level of the processing liquid stable. Regardless of whether the tooling equipment is immersed in or removed from the processing liquid, the liquid level of the processing liquid always meets the standard value, thus avoiding the adverse effects of liquid level fluctuations on the coating thickness of the production line products.

[0006] The solution proposed in this application to solve the problem is:

[0007] In a first aspect, a device for maintaining liquid level balance is provided, applied in a processing equipment, the processing equipment including at least two processing heads, the device comprising:

[0008] When the tooling equipment connected to the processing head is immersed in the processing liquid, the processing liquid has a preset standard liquid level;

[0009] A liquid level regulating mechanism, including an regulating body, is connected to the tooling equipment;

[0010] When the tooling equipment is removed from the processing liquid, the regulating body is simultaneously immersed in the processing liquid, and the volume of the regulating body is equal to the volume of liquid displaced when the tooling equipment is immersed in the processing liquid, so as to maintain the liquid level of the processing liquid at the preset standard liquid level.

[0011] Preferably, the liquid level adjustment mechanism further includes a sliding component connected between the tooling device and the adjusting body, for driving the adjusting body to be synchronously immersed in the processing liquid when the tooling device is removed from the processing liquid, and for driving the adjusting body to be removed from the processing liquid when the tooling device is immersed in the processing liquid.

[0012] Preferably, the sliding assembly includes a slider and a connector, one end of the connector being connected to the tooling equipment, and the other end passing through the slider and connected to the adjusting body.

[0013] Preferably, the sliding assembly further includes a snap-fit ​​connection assembly, through which the connector is connected to the tooling equipment and the adjusting body respectively.

[0014] Preferably, the sliding element includes a pulley or a pulley assembly consisting of multiple pulleys.

[0015] Preferably, the connector includes a steel cable.

[0016] Preferably, the liquid level adjustment mechanism further includes a linkage assembly connected between the tooling device and the adjusting body, for driving the adjusting body to be synchronously immersed in the processing liquid when the tooling device is removed from the processing liquid, and for driving the adjusting body to be removed from the processing liquid when the tooling device is immersed in the processing liquid.

[0017] Preferably, the device further includes a liquid level sensor disposed above the processing liquid for detecting the liquid level height of the processing liquid.

[0018] Preferably, the device further includes a lifting mechanism connected to the tooling equipment for immersing or removing the tooling equipment from the processing liquid.

[0019] In a second aspect, a line processing system is provided, including the means for maintaining liquid level balance as described in the first aspect.

[0020] According to the specific embodiments provided in this application, the following technical effects are disclosed:

[0021] This application provides a device and a machining line system for maintaining liquid level balance. The device is applied in a machining equipment, which includes at least two machining heads. The device includes: a tooling device connected to the machining heads, which, when immersed in a machining liquid, has a preset standard liquid level; and a liquid level adjustment mechanism, including an adjusting body connected to the tooling device. When the tooling device is removed from the machining liquid, the adjusting body is simultaneously immersed in the machining liquid, and the volume of the adjusting body is equal to the volume of liquid displaced when the tooling device is immersed in the machining liquid, so as to maintain the liquid level of the machining liquid at the preset standard level. In this solution, the volume of the adjusting body is equal to the volume of liquid displaced by the tooling device, which can directly utilize Archimedes' principle to achieve liquid level compensation when the tooling device is immersed in or removed from the machining liquid, solving the technical problem of uneven coating thickness caused by liquid level fluctuations in the prior art. Furthermore, this device does not require a complex electronic control logic system for liquid level adjustment; it can ensure liquid level balance using a linked mechanical structure, which is simple, low-cost, and highly reliable. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram showing that both the first tooling and the second tooling provided in the embodiments of this application are immersed in the processing liquid;

[0024] Figure 2 This is a schematic diagram of the first tooling device being removed from the processing liquid and the first regulating body being immersed in the processing liquid, as provided in the embodiments of this application;

[0025] Figure 3 This is a schematic diagram of the second tooling device being removed from the processing liquid and the second regulating body being immersed in the processing liquid, as provided in the embodiments of this application;

[0026] Figure 4 This is a schematic diagram showing that both the first and second regulating bodies provided in this application embodiment are immersed in the processing liquid.

[0027] Figure label:

[0028] 10. Processing liquid; 20. First tooling equipment; 21. Second tooling equipment; 30. First adjusting body; 31. Second adjusting body; 40. First sliding member; 41. Second sliding member; 50. First connecting member; 51. Second connecting member; 60. Liquid level sensor. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] As described in the background section, in actual production, the two heads of the soldering machine operate simultaneously. When both fixtures are immersed in solder, the solder level and the frequency of solder addition are relatively stable. If one of the soldering heads malfunctions, for example, requiring a shutdown for maintenance, the fixture corresponding to that head will momentarily lift off the solder, causing the solder level to drop instantly below the standard level. This instantaneous drop will affect the coating thickness of the product in the other fixture. Subsequently, the automatic soldering system will activate, replenishing solder to the solder bath to restore the level to the standard level. When the malfunction is resolved and the fixture is lowered back into the solder, the solder level will momentarily rise above the standard level. This instantaneous rise will also affect the coating thickness of the product in the other fixture.

[0031] Based on this, this application provides a device and a line processing system for maintaining liquid level balance, aiming to solve the technical problem of uneven coating thickness caused by liquid level fluctuations in the prior art.

[0032] Example 1

[0033] refer to Figures 1 to 4 A device for maintaining liquid level balance is applied in a processing equipment, the processing equipment including at least two processing heads. The device includes: a tooling device connected to the processing heads, which, when immersed in a processing liquid, has a preset standard liquid level; and a liquid level adjustment mechanism, including an adjustment body connected to the tooling device; wherein, when the tooling device is removed from the processing liquid, the adjustment body is simultaneously immersed in the processing liquid, and the volume of the adjustment body is equal to the volume of liquid displaced when the tooling device is immersed in the processing liquid, so as to maintain the liquid level of the processing liquid at the preset standard liquid level.

[0034] This device is suitable for various applications, such as 3D printing, electroplating, chemical cleaning, and tin plating. The following embodiments use tin plating as an example for specific analysis, where the processing head is a tin-coating head, the processing liquid is molten tin, and the production line is solder ribbon.

[0035] In one specific embodiment, the device contains a fixed amount of processing liquid 10. Tooling equipment, including a first tooling device 20 and a second tooling device 21, is used to thread and fix the line, both of which are immersed in the processing liquid 10. At this time, as... Figure 1 The dotted line indicates that the liquid level of the processing liquid 10 conforms to the preset standard liquid level. The regulating body includes a first regulating body 30 and a second regulating body 31. The first regulating body 30 is connected to the first tooling device 20, and the second regulating body 31 is connected to the second tooling device 21. The air knife is positioned above the processing liquid 10 and maintains a preset distance from the liquid surface with the preset standard liquid level.

[0036] In one situation, such as Figure 2 As shown, when the first tooling device 20 is lifted and removed from the processing liquid 10, the liquid level decreases, increasing the distance between the air knife and the liquid surface. This leads to thickening of the coating and particle defects in the product line of the second tooling device 21. If new liquid is subsequently added using an automatic liquid addition system to bring the liquid level to the preset standard level, and the first tooling device 20 is then immersed back into the processing liquid 10, the liquid level rises, decreasing the distance between the air knife and the liquid surface. This again leads to thinning of the coating and particle defects in the product line of the second tooling device 21. To solve this problem and avoid secondary liquid addition, when the first tooling device 20 is removed from the processing liquid 10, the first regulating body 30 is simultaneously immersed in the processing liquid 10 to raise the liquid level and bring it to the preset standard level.

[0037] In one situation, such as Figure 3 As shown, when the second tooling device 21 is lifted and removed from the processing liquid 10, the liquid level decreases, increasing the distance between the air knife and the liquid surface. This can lead to thickening of the coating and particle defects in the linear product of the first tooling device 20. If new liquid is subsequently added using an automatic liquid addition system to bring the liquid level to the preset standard level, and the second tooling device 21 is then immersed back into the processing liquid 10, the liquid level rises, decreasing the distance between the air knife and the liquid surface. This can again cause thinning of the coating and particle defects in the linear product of the first tooling device 20. To solve this problem and avoid secondary liquid addition, when the second tooling device 21 is removed from the processing liquid 10, the second regulating body 31 is simultaneously immersed in the processing liquid 10 to raise the liquid level and bring it to the preset standard level.

[0038] In one situation, such as Figure 4As shown, when the first tooling device 20 and the second tooling device 21 are simultaneously lifted, the liquid level decreases. If new liquid is subsequently added using an automatic liquid addition system to bring the liquid level to the preset standard level, and the first tooling device 20 and the second tooling device 21 are then immersed in the processing liquid 10 again, the liquid level rises. This reduces the distance between the air knife and the liquid surface, leading to thinning of the coating and particle defects in the product line of both the first tooling device 20 and the second tooling device 21. To solve this problem and avoid secondary liquid addition, when both the first tooling device 20 and the second tooling device 21 are removed from the processing liquid, the first regulating body 30 and the second regulating body 31 are simultaneously immersed in the processing liquid 10 to raise the liquid level to the preset standard level.

[0039] It should be noted that the volume of the first adjusting body 30 is equal to the volume of liquid displaced when the first tooling device 20 is immersed in the processing liquid 10, and the volume of the second adjusting body 31 is equal to the volume of liquid displaced when the second tooling device 21 is immersed in the processing liquid 10. The shape of the adjusting body can be arbitrary, and the material can be stainless steel or titanium alloy or other alloys.

[0040] In summary, by ensuring that the volume of the regulating body is equal to the volume of liquid displaced by the tooling equipment, Archimedes' principle can be directly applied to achieve liquid level compensation when the tooling equipment is immersed in or removed from the processing liquid. This solves the technical problem of uneven coating thickness caused by liquid level fluctuations in existing technologies. Furthermore, this device eliminates the need for complex electronic control logic systems for liquid level regulation; a linked mechanical structure is sufficient to maintain liquid level balance. It is simple, low-cost, and highly reliable.

[0041] Preferably, refer to Figures 1 to 4 The liquid level adjustment mechanism also includes a sliding component, which is connected between the tooling equipment and the adjusting body. The sliding component is used to convert the lifting motion of the tooling equipment into the lifting motion of the adjusting body. When the tooling equipment is removed from the processing liquid, it drives the adjusting body to be simultaneously immersed in the processing liquid, and when the tooling equipment is immersed in the processing liquid, it drives the adjusting body to be removed from the processing liquid.

[0042] In one specific embodiment, reference Figures 1 to 4 The sliding assembly includes a slider and a connector. One end of the connector is connected to a tooling device, and the other end passes through the slider and is connected to an adjusting body. The slider includes a first slider 40 and a second slider 41. The connector includes a first connector 50 and a second connector 51. One end of the first connector 50 is connected to a first tooling device 20, and the other end passes through the first slider 40 and is connected to a first adjusting body 30. One end of the second connector 51 is connected to a second tooling device 21, and the other end passes through the second slider 41 and is connected to a second adjusting body 31.

[0043] In one specific embodiment, both the first sliding member 40 and the second sliding member 41 include pulleys or pulley groups composed of multiple pulleys, and both the first connecting member 50 and the second connecting member 51 include steel cables. Figures 1 to 4 As shown, both the first sliding member 40 and the second sliding member 41 are fixed pulleys. When the first tooling device 20 rises or falls, the first adjusting body 30 rises or falls synchronously, and the first sliding member 40 rotates. When the second tooling device 21 rises or falls, the second adjusting body 31 rises or falls synchronously, and the second sliding member 41 rotates.

[0044] In an optional embodiment, both the first slider 40 and the second slider 41 can be electric pulleys or electric pulley groups consisting of multiple electric pulleys.

[0045] Preferably, refer to Figures 1 to 4 The sliding assembly also includes a snap-fit ​​connection assembly (not shown in the figure), through which the connector is connected to the tooling equipment and the adjusting body respectively.

[0046] In one specific embodiment, the snap-fit ​​connection assembly includes a first snap body, a first buckle body, and a first chain, as well as a second snap body, a second buckle body, and a second chain. The first connector 50 has a first snap body at both ends, and the first buckle body is located at the top of the first tooling device 20. One first snap body is connected to the first buckle body, and the other first snap body is connected to the first adjusting body 30 via the first chain. The second connector 51 has a second snap body at both ends, and the second buckle body is located at the top of the second tooling device 21. One second snap body is connected to the second buckle body, and the other second snap body is connected to the second adjusting body 31 via the second chain. All of the aforementioned connection methods are detachable, thus enabling quick assembly and disassembly when any component among the connector, tooling device, and adjusting body needs maintenance or replacement.

[0047] In an optional embodiment, the liquid level regulating mechanism further includes a linkage assembly (not shown in the figure), which is connected between the tooling device and the regulating body, for converting the lifting motion of the tooling device into the lifting motion of the regulating body, driving the regulating body to be synchronously immersed in the processing liquid when the tooling device is removed from the processing liquid, and driving the regulating body to be removed from the processing liquid when the tooling device is immersed in the processing liquid.

[0048] Among them, the linkage assembly has no flexible parts, such as the aforementioned steel cable, compared to the sliding assembly. It has higher transmission accuracy and is suitable for tin plating scenarios with a large amount of processing liquid, so as to meet the high torque requirements of tooling equipment and adjustment body.

[0049] Preferably, refer to Figures 1 to 4 The device also includes a liquid level sensor 60, which is located above the processing liquid 10 to detect the height of the processing liquid.

[0050] In one specific embodiment, the liquid level sensor 60 includes an ultrasonic liquid level sensing probe that emits ultrasonic waves to the liquid surface and calculates the liquid level height by measuring the time it takes for the ultrasonic waves to reflect from the liquid surface.

[0051] In one specific embodiment, the liquid level sensor 60 includes a resistive liquid level sensing probe, which detects the liquid level height by measuring the change in resistance when the probe comes into contact with the liquid.

[0052] Preferably, the device further includes a lifting mechanism (not shown in the figure), connected to the tooling equipment, for driving the tooling equipment to be immersed in or removed from the processing liquid.

[0053] In a specific embodiment, such as Figures 1 to 4 As shown, the lifting mechanism includes a first motor and a second motor. The first motor is connected to the first tooling device 20. The output shaft of the first motor rotates clockwise to raise the first tooling device 20 and simultaneously lower the first adjusting body 30. The output shaft also rotates counterclockwise to lower the first tooling device 20 and simultaneously raise the first adjusting body 30. The second motor is connected to the second tooling device 21. The output shaft of the second motor rotates clockwise to raise the second tooling device 21 and simultaneously lower the second adjusting body 31. The output shaft also rotates counterclockwise to lower the second tooling device 21 and simultaneously raise the second adjusting body 31.

[0054] Example 2

[0055] A line processing system includes the device for maintaining liquid level balance provided in Embodiment 1.

[0056] In one specific embodiment, the tooling device is equipped with a welding strip, which displaces a certain volume of liquid when the tooling device is immersed in the molten solder in the solder pot; the adjusting body is a hollow cylinder made of titanium alloy, and its volume is equal to the volume of liquid displaced by the tooling device; the tooling device and the adjusting body are connected by a fixed pulley and a steel cable, and the adjusting body moves up or down synchronously when the tooling device rises or falls.

[0057] In one specific embodiment, the system further includes a wire feeding device located upstream of the solder furnace for moving the solder strip along the production line direction to pass through the tooling equipment; and a winding device located downstream of the solder furnace for winding the solder strip after the tinning operation.

[0058] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0059] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0060] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A device for maintaining liquid level balance, applied in a processing equipment, said processing equipment comprising at least two processing heads, characterized in that, The device includes: A tooling device is connected to the processing head. When the tooling device is immersed in the processing liquid, the processing liquid has a preset standard liquid level. A liquid level regulating mechanism, including an regulating body, is connected to the tooling equipment; When the tooling equipment is removed from the processing liquid, the regulating body is simultaneously immersed in the processing liquid, and the volume of the regulating body is equal to the volume of liquid displaced when the tooling equipment is immersed in the processing liquid, so as to maintain the liquid level of the processing liquid at the preset standard liquid level.

2. The device for maintaining liquid level balance according to claim 1, characterized in that, The liquid level adjustment mechanism further includes a sliding component connected between the tooling equipment and the adjustment body, which is used to drive the adjustment body to be simultaneously immersed in the processing liquid when the tooling equipment is removed from the processing liquid.

3. The device for maintaining liquid level balance according to claim 2, characterized in that, The sliding assembly includes a slider and a connector. One end of the connector is connected to the tooling equipment, and the other end passes through the slider and is connected to the adjusting body.

4. The device for maintaining liquid level balance according to claim 3, characterized in that, The sliding assembly further includes a snap-fit ​​connection assembly, through which the connector is connected to the tooling equipment and the adjusting body respectively.

5. The device for maintaining liquid level balance according to claim 4, characterized in that, The sliding element includes a pulley or a pulley assembly consisting of multiple pulleys.

6. The device for maintaining liquid level balance according to claim 4, characterized in that, The connector includes a steel cable.

7. The device for maintaining liquid level balance according to claim 1, characterized in that, The liquid level adjustment mechanism further includes a linkage assembly, which is connected between the tooling equipment and the adjustment body, and is used to drive the adjustment body to be simultaneously immersed in the processing liquid when the tooling equipment is removed from the processing liquid.

8. The device for maintaining liquid level balance according to claim 1, characterized in that, The device also includes a liquid level sensor, located above the processing liquid, for detecting the liquid level height of the processing liquid.

9. The device for maintaining liquid level balance according to claim 1, characterized in that, The device also includes a lifting mechanism connected to the tooling equipment, used to drive the tooling equipment to be immersed in or removed from the processing liquid.

10. A line machining system, characterized in that, The system includes a device for maintaining liquid level balance as described in any one of claims 1 to 9.