Electroplating device for wafer cutting blade

Abstract

The utility model discloses an electroplating device for a wafer cutting blade, which relates to the technical field of wafer cutting blades and is technically characterized by comprising an electroplating box and a fixing frame fixedly arranged on the left side surface of the electroplating box, a fixing mechanism is arranged on the inner side of the fixing frame, and a lifting mechanism is arranged on the outer side of the fixing frame; the fixing mechanism is located on the outer side of the fixing mechanism, and the technical effects are that the fixing mechanism cooperates with the electric telescopic rod, the control panel, the expansion ring, the lifting ring, the sliding sleeve, the adjusting plate, the telescopic connecting rod and the like, and the electric telescopic rod drives the control panel to move and drives the lifting ring, the sliding sleeve and the adjusting plate to move; the expansion rings expand towards the front end and the rear end to be in close contact with the inner side of the wafer cutting blade, meanwhile, the stability of the expansion rings is enhanced through the telescopic connecting rods, multiple blades can be fixed at the same time through the multiple sets of fixing parts, the surfaces of the two expansion rings make contact with the inner side face of the wafer cutting blade during electroplating, and the surfaces of the wafer cutting blade can be evenly electroplated during electroplating.

Description

Technical Field

[0001] This utility model relates to the field of wafer dicing blade technology, specifically to an electroplating device for wafer dicing blades. Background Technology

[0002] With the booming development of the semiconductor industry, the demand for wafer dicing blades continues to rise. In the production process of wafer dicing blades, electroplating is a key process that plays a vital role in improving the hardness, wear resistance, and corrosion resistance of the blades, thereby extending their service life.

[0003] Existing wafer dicing blades require fixation during electroplating. Most existing fixation methods involve clamping the surface of the wafer dicing blade. During clamping, the clamped part comes into contact with the surface of the wafer dicing blade, resulting in poor electroplating effect on the clamped part and greatly affecting the electroplating quality. Therefore, an electroplating device for wafer dicing blades is proposed. Utility Model Content

[0004] To achieve the above objectives, the present invention provides the following technical solution: an electroplating device for wafer dicing blades, comprising an electroplating tank and a fixing frame fixedly disposed on the left side of the electroplating tank, a fixing mechanism disposed on the inner side of the fixing frame, and a lifting mechanism disposed on the outer side of the fixing frame;

[0005] The lifting mechanism is located outside the fixed mechanism;

[0006] The fixing mechanism includes a driving part and a fixing part;

[0007] The drive unit includes an electric telescopic rod and a control panel, and the fixing unit includes a fixing block and two expansion rings;

[0008] A lifting plate is slidably arranged on the inner left end face of the fixed frame. The bottom surface of the lifting plate is fixedly connected to the top surface of the fixed block. The two expansion rings are located on the front and rear sides of the fixed block, respectively. Two slide rails are fixedly arranged on the front and rear sides of the fixed block, and two sliding sleeves are slidably arranged on the surfaces of the two slide rails. Two adjusting plates are hinged to the opposite sides of the two sliding sleeves, and the opposite sides of the two adjusting plates are hinged to the inner sides of the two expansion rings.

[0009] Preferably, the lifting mechanism includes a motor, a sliding groove is provided through the left side of the fixed frame, a lifting block is slidably arranged on the inner wall of the sliding groove, the right side of the lifting block is fixedly connected to the left side of the lifting plate, a support plate is fixedly arranged on the left side of the electroplating box, the top surface of the support plate is fixedly connected to the bottom surface of the motor, and a threaded rod is fixedly arranged on the top surface of the motor output end, the top surface of the threaded rod threaded through the bottom surface of the lifting block and extending to the top of the lifting block.

[0010] Preferably, a lifting ring is slidably sleeved on the surface of the fixed block, and two connecting plates are fixedly disposed on the bottom surface of the lifting ring, with the bottom surfaces of the two connecting plates respectively fixedly connected to the top surfaces of the two sliding sleeves.

[0011] Preferably, two sets of telescopic connecting rods are fixedly provided on the front and rear end faces of the fixed block, and the two sets of telescopic connecting rods are respectively fixedly connected to the sides of the two expansion rings.

[0012] Preferably, the top surface of the lifting plate is fixedly connected to the bottom surface of the electric telescopic rod, the bottom surface of the output end of the electric telescopic rod extends through the top surface of the lifting plate to the bottom of the lifting plate, the bottom surface of the output end of the electric telescopic rod is fixedly connected to the top surface of the control plate, and multiple sets of fixing parts are provided. Multiple connecting frames are fixedly provided on the top surfaces of multiple lifting rings respectively, and the bottom surfaces of the rear sides of multiple connecting frames are fixedly connected to the top surface of the control plate.

[0013] Preferably, a wedge-shaped groove is provided on the inner left end face of the fixed frame, and a wedge-shaped block is slidably disposed on the inner wall of the wedge-shaped groove. The right side of the wedge-shaped block is fixedly connected to the left side of the lifting plate.

[0014] Preferably, the bottom surface of the electroplating tank is fixedly provided with four support legs, and a drain pipe is fixedly provided through the right side of the electroplating tank, extending into the interior of the electroplating tank. A valve is fixedly provided through the right side of the drain pipe. Beneficial effects

[0015] Compared with the prior art, the present invention provides an electroplating device for wafer dicing blades, which has the following advantages:

[0016] 1. The fixing mechanism works in concert with components such as an electric telescopic rod, control board, expansion ring, lifting ring, sliding sleeve, adjusting plate, and telescopic connecting rod. The electric telescopic rod drives the control board to move, which in turn moves the lifting ring, sliding sleeve, and adjusting plate, causing the expansion ring to expand forward and backward to make close contact with the inner side of the wafer dicing blade. At the same time, the telescopic connecting rod enhances the stability of the expansion ring, and multiple fixing parts can fix multiple blades simultaneously. During electroplating, the surfaces of the two expansion rings contact the inner side of the wafer dicing blade, which allows for uniform electroplating of the surface of the wafer dicing blade and effectively prevents the blade from loosening during the electroplating process, improving production efficiency and enhancing the practicality of the device.

[0017] 2. The lifting mechanism consists of a motor, a threaded rod, a lifting block, a wedge block, and other components. The rotation of the motor output drives the threaded rod to rotate, which in turn causes the lifting block to move the lifting plate up and down, achieving precise lifting of the wafer dicing blade. At the same time, the wedge block cooperates with the wedge groove on the inner left end face of the fixed frame to further ensure the stability of the lifting plate during the lifting process, prevent shaking, and make operation convenient, thereby improving the efficiency and quality of electroplating. Attached Figure Description

[0018] Figure 1 This is a front-view perspective view of the present invention;

[0019] Figure 2 This is a three-dimensional view of the left side of the present invention;

[0020] Figure 3 This is a partial three-dimensional schematic diagram of the right side of this utility model;

[0021] Figure 4 This is a three-dimensional schematic diagram of the fixing part of this utility model;

[0022] Figure 5 This utility model Figure 3 Enlarged 3D schematic diagram of area A in the middle.

[0023] In the diagram: 1. Electroplating tank; 2. Fixing mechanism; 21. Lifting plate; 22. Expansion ring; 23. Electric telescopic rod; 24. Control panel; 25. Fixing block; 26. Lifting ring; 27. Connecting plate; 28. Sliding sleeve; 29. ​​Adjusting plate; 210. Telescopic connecting rod; 211. Slide rail; 212. Connecting frame; 3. Fixing frame; 4. Lifting mechanism; 41. Lifting block; 42. Threaded rod; 43. Motor; 44. Support plate; 45. Wedge block; 5. Support leg; 6. Drain pipe. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example 1

[0025] like Figures 1-5 As shown, this embodiment proposes an electroplating box 1 and a fixing frame 3 fixedly installed on the left side of the electroplating box 1, a fixing mechanism 2 installed on the inner side of the fixing frame 3, and a lifting mechanism 4 installed on the outer side of the fixing frame 3.

[0026] The lifting mechanism 4 is located outside the fixed mechanism 2;

[0027] The fixing mechanism 2 includes a driving part and a fixing part;

[0028] The drive unit includes an electric telescopic rod 23 and a control panel 24, and the fixing unit includes a fixing block 25 and two expansion rings 22;

[0029] A lifting plate 21 is slidably mounted on the inner left end face of the fixed frame 3. The bottom surface of the lifting plate 21 is fixedly connected to the top surface of the fixed block 25. Two expansion rings 22 are located on the front and rear sides of the fixed block 25, respectively. Two slide rails 211 are fixedly mounted on the front and rear sides of the fixed block 25, respectively. Two sliding sleeves 28 are slidably mounted on the surfaces of the two slide rails 211, respectively. Two adjusting plates 29 are hinged to the opposite sides of the two sliding sleeves 28, respectively. The opposite sides of the two adjusting plates 29 are hinged to the inner surfaces of the two expansion rings 22, respectively. A lifting ring 26 is slidably mounted on the surface of the fixed block 25. Two connecting plates 27 are fixedly mounted on the bottom surface of the lifting ring 26, respectively. The bottom surfaces of the two connecting plates 27 are fixedly connected to the top surfaces of the two sliding sleeves 28, respectively. Two sliding sleeves 28 are fixedly mounted on the front and rear ends of the fixed block 25, respectively. Two sets of telescopic connecting rods 210 are fixedly connected on opposite sides to the adjacent sides of two expansion rings 22. The top surface of the lifting plate 21 is fixedly connected to the bottom surface of the electric telescopic rod 23. The bottom surface of the output end of the electric telescopic rod 23 extends through the top surface of the lifting plate 21 to the bottom of the lifting plate 21. The bottom surface of the output end of the electric telescopic rod 23 is fixedly connected to the top surface of the control plate 24. Multiple sets of fixed parts are provided. Multiple connecting frames 212 are fixedly installed on the top surface of multiple lifting rings 26. The bottom surface of the rear side of multiple connecting frames 212 is fixedly connected to the top surface of the control plate 24. Four support legs 5 are fixedly installed on the bottom surface of the electroplating tank 1. A drain pipe 6 is fixedly installed through the right side of the electroplating tank 1 and extends into the interior of the electroplating tank 1. A valve is fixedly installed through the right side of the drain pipe 6.

[0030] In this embodiment, the fixing mechanism 2 works in concert with components such as the electric telescopic rod 23, control plate 24, expansion ring 22, lifting ring 26, sliding sleeve 28, adjusting plate 29, and telescopic connecting rod 210. The electric telescopic rod 23 drives the control plate 24 to move, which in turn moves the lifting ring 26, sliding sleeve 28, and adjusting plate 29, causing the expansion ring 22 to expand forward and backward and make close contact with the inner side of the wafer dicing blade. At the same time, the telescopic connecting rod 210 enhances the stability of the expansion ring 22, and multiple fixing parts can fix multiple blades at the same time. During electroplating, the surfaces of the two expansion rings 22 contact the inner side of the wafer dicing blade, which can uniformly electroplat the surface of the wafer dicing blade and effectively prevent the blade from loosening during the electroplating process, thereby improving production efficiency and enhancing the practicality of the device. Example 2

[0031] like Figures 1-5As shown, based on the same concept as Embodiment 1 above, this embodiment also proposes that the lifting mechanism 4 includes a motor 43, a sliding groove is provided through the left side of the fixed frame 3, a lifting block 41 is slidably arranged on the inner wall of the sliding groove, the right side of the lifting block 41 is fixedly connected to the left side of the lifting plate 21, a support plate 44 is fixedly arranged on the left side of the electroplating box 1, the top surface of the support plate 44 is fixedly connected to the bottom surface of the motor 43, a threaded rod 42 is fixedly arranged on the top surface of the output end of the motor 43, the top surface of the threaded rod 42 is threaded through the bottom surface of the lifting block 41 and extends above the lifting block 41, a wedge-shaped groove is provided on the left end of the inner side of the fixed frame 3, a wedge-shaped block 45 is slidably arranged on the inner wall of the wedge-shaped groove, and the right side of the wedge-shaped block 45 is fixedly connected to the left side of the lifting plate 21.

[0032] In this embodiment, the lifting mechanism 4 is composed of components such as a motor 43, a threaded rod 42, a lifting block 41, and a wedge block 45. The output end of the motor 43 rotates, driving the threaded rod 42 to rotate, which causes the lifting block 41 to move the lifting plate 21 up and down, thereby achieving precise lifting of the wafer cutting blade. At the same time, the wedge block 45 cooperates with the wedge groove on the inner left end face of the fixed frame 3 to further ensure the stability of the lifting plate 21 during the lifting process, prevent shaking, facilitate operation, and improve the efficiency and quality of electroplating.

[0033] In use, the wafer dicing blade to be electroplated is fitted onto the outside of the two expansion rings 22. When the electric telescopic rod 23 is activated and its output end extends, the control plate 24 moves downward. When the control plate 24 moves downward, the lifting ring 26 moves downward through the connecting frame 212. When the lifting ring 26 moves downward, the two sliding sleeves 28 move downward synchronously through the two connecting plates 27. When the two sliding sleeves 28 move downward, the two expansion rings 22 expand forward and backward through the two adjusting plates 29. When the two expansion rings 22 expand forward and backward, they can contact the inner side of the wafer dicing blade and fix it. Multiple sets of fixing parts can fix multiple wafer dicing blades at the same time.

[0034] After the fixing is completed, the motor 43 is turned on. When the output end of the motor 43 rotates, the threaded rod 42 can be rotated. During the rotation of the threaded rod 42, the lifting plate 21 can be moved up and down through the lifting block 41. When the lifting plate 21 moves down, the wafer cutting blade can enter the electroplating box 1 for electroplating.

[0035] After electroplating is completed, the control motor 43 is reversed to move the wafer dicing blade upward until it rises above the electroplating tank 1. Then the motor 43 is turned off. By controlling the output end of the electric telescopic rod 23 to retract, the two expansion rings 22 can be brought closer to each other, so that the outer side of the two expansion rings 22 is separated from the inner side of the wafer dicing blade, and the wafer dicing blade can be removed.

[0036] The above are merely specific embodiments of this utility model, but the technical features of this utility model are not limited thereto. Any simple changes, equivalent substitutions, or modifications made based on this utility model to solve essentially the same technical problems and achieve essentially the same technical effects are all covered within the protection scope of this utility model.

Claims

1. An electroplating apparatus for wafer dicing blades, comprising an electroplating tank (1) and a fixing frame (3) fixedly disposed on the left side of the electroplating tank (1), characterized in that: A fixing mechanism (2) is provided on the inner side of the fixing frame (3), and a lifting mechanism (4) is provided on the outer side of the fixing frame (3). The lifting mechanism (4) is located outside the fixed mechanism (2); The fixing mechanism (2) includes a driving part and a fixing part; The drive unit includes an electric telescopic rod (23) and a control panel (24), and the fixing unit includes a fixing block (25) and two expansion rings (22). A lifting plate (21) is slidably provided on the left side of the inner side of the fixed frame (3). The bottom surface of the lifting plate (21) is fixedly connected to the top surface of the fixed block (25). The two expansion rings (22) are located on the front and rear sides of the fixed block (25). Two slide rails (211) are fixedly provided on the front and rear sides of the fixed block (25). Two sliding sleeves (28) are slidably provided on the surfaces of the two slide rails (211). Two adjusting plates (29) are hinged to the opposite sides of the two sliding sleeves (28). The opposite sides of the two adjusting plates (29) are hinged to the inner sides of the two expansion rings (22).

2. The electroplating apparatus for wafer dicing blades according to claim 1, characterized in that: The lifting mechanism (4) includes a motor (43). A sliding groove is provided through the left side of the fixed frame (3). A lifting block (41) is slidably arranged on the inner wall of the sliding groove. The right side of the lifting block (41) is fixedly connected to the left side of the lifting plate (21). A support plate (44) is fixedly arranged on the left side of the electroplating box (1). The top surface of the support plate (44) is fixedly connected to the bottom surface of the motor (43). A threaded rod (42) is fixedly arranged on the top surface of the output end of the motor (43). The threaded rod (42) extends through the bottom surface of the lifting block (41) and above the lifting block (41).

3. The electroplating apparatus for wafer dicing blades according to claim 1, characterized in that: The surface of the fixed block (25) is slidably fitted with a lifting ring (26), and the bottom surface of the lifting ring (26) is fixedly provided with two connecting plates (27), and the bottom surfaces of the two connecting plates (27) are respectively fixedly connected to the top surfaces of the two sliding sleeves (28).

4. The electroplating apparatus for wafer dicing blades according to claim 3, characterized in that: The front and rear ends of the fixed block (25) are respectively fixedly provided with two sets of telescopic connecting rods (210), and the two sets of telescopic connecting rods (210) are respectively fixedly connected to the side of the two expansion rings (22) on the opposite side.

5. The electroplating apparatus for wafer dicing blades according to claim 4, characterized in that: The top surface of the lifting plate (21) is fixedly connected to the bottom surface of the electric telescopic rod (23). The bottom surface of the output end of the electric telescopic rod (23) extends through the top surface of the lifting plate (21) to the bottom of the lifting plate (21). The bottom surface of the output end of the electric telescopic rod (23) is fixedly connected to the top surface of the control plate (24). Multiple sets of fixing parts are provided. Multiple connecting frames (212) are fixedly provided on the top surface of multiple lifting rings (26). The bottom surface of the rear side of multiple connecting frames (212) is fixedly connected to the top surface of the control plate (24).

6. The electroplating apparatus for wafer dicing blades according to claim 2, characterized in that: The inner left end face of the fixed frame (3) is provided with a wedge-shaped groove, and a wedge-shaped block (45) is slidably provided on the inner wall of the wedge-shaped groove. The right side of the wedge-shaped block (45) is fixedly connected to the left side of the lifting plate (21).

7. The electroplating apparatus for wafer dicing blades according to claim 1, characterized in that: The bottom surface of the electroplating tank (1) is fixedly provided with four support legs (5), and the right side of the electroplating tank (1) is fixedly provided with a drain pipe (6) extending into the interior of the electroplating tank (1). The right side of the drain pipe (6) is fixedly provided with a valve.

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