PZT film wafer surface defect detection device

Abstract

The utility model discloses a PZT film wafer surface defect detection device, and relates to the technical field of wafer defect detection. According to the PZT thin film wafer surface defect detection device, by arranging a first rotating shaft, a first gear, a sector gear, a second rotating shaft, an adjusting rod, a second connecting groove, a rotating plate, a connecting column, a third rotating shaft, a sliding block, a second supporting plate, a first connecting groove and a first connecting frame, the function of overturning a PZT thin film wafer is achieved; a third rotating shaft rotates to drive a rotating plate and a connecting column to rotate, when the connecting column rotates, the connecting column continuously moves in a second connecting groove and drives an adjusting rod to swing back and forth, the adjusting rod rotates to drive a sector gear to swing back and forth through a second rotating shaft, and the sector gear rotates to drive a first rotating shaft to rotate through a first gear; and the other side of the PZT thin film wafer can be conveniently detected by the laser light emitter body.

Description

Technical Field

[0001] This utility model relates to the field of wafer defect detection technology, specifically a PZT thin film wafer surface defect detection device. Background Technology

[0002] Lead zirconate titanate (PZT) film is a thin film prepared from lead zirconate titanate and has a typical perovskite structure. Its general formula is PbZrxTi1-xO3. It is an important ferroelectric memory film material, exhibiting excellent ferroelectricity and a high Curie temperature. Because the ionic radii of Ti4+ (0.061 nm) and Zr4+ (0.072 nm) are similar, and their chemical properties are similar, lead titanate and lead zirconate can form a continuous solid solution in any ratio. The dielectric, ferroelectric, piezoelectric, and pyroelectric properties can be altered by changing the zirconium / titanium ratio. Before leaving the factory, PZT films require surface defect inspection on the wafers. Existing factories use inspection devices for PZT film wafer surface defect inspection. Common inspection devices typically involve placing the PZT film wafer to be inspected directly on the device, and then... The process involves using a laser emitter to illuminate the surface of a PZT thin-film wafer to detect and identify defects. However, when the PZT thin-film wafer is placed on the inspection device, the laser emitter only illuminates one side of the wafer. Since the other side also needs to be inspected for defects, the operator needs to adjust the position of the wafer before proceeding with the inspection. This results in the wafer needing to be fixed twice during the inspection process, increasing the time required for surface defect detection, the probability of inaccurate results, and reducing the efficiency of the inspection device. Utility Model Content

[0003] To address the shortcomings of existing technologies, this invention provides a PZT thin film wafer surface defect detection device to solve the problems mentioned in the background section.

[0004] When a PZT thin film wafer is placed on the inspection device, the laser emitter only corresponds to one side of the PZT thin film wafer. However, the other side of the PZT thin film wafer also needs to be inspected for defects. Therefore, the operator needs to adjust the position of the PZT thin film wafer before inspection. This results in the PZT thin film wafer needing to be fixed twice during the inspection process. This increases the time for inspecting surface defects of the PZT thin film wafer, increases the probability of deviation in the inspection results, and reduces the inspection efficiency of the inspection device.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A PZT thin film wafer surface defect detection device includes a base, a support frame slidably connected to the top of the base, a first support plate fixedly connected to one end of the top of the support frame, a second support plate fixedly connected to the end of the support frame away from the first support plate, a connecting plate fixedly connected to the top of the first support plate, a first connecting frame fixedly connected to the top of the second support plate, a first connecting groove penetrating the surface of the top of the second support plate, a first rotating shaft rotatably connected to the top of the second support plate, a connecting frame fixedly connected to one end of the first rotating shaft, and a connecting frame rotatably connected to the connecting plate at the end of the connecting frame away from the first rotating shaft. A first gear is fixedly connected to the outer side of the shaft. A second shaft is rotatably connected to the top of the first connecting frame. A sector gear is fixedly connected to one end of the second shaft. One side of the sector gear meshes with the first gear. An adjusting rod is fixedly connected to the outer side of the second shaft. A third shaft is rotatably connected to the top of the second support plate and to the side away from the first shaft. A rotating plate is fixedly connected to one end of the third shaft. A connecting column is fixedly connected to one side of the rotating plate. A second connecting groove penetrating the surface of the adjusting rod is opened on one side. The outer side of the connecting column is slidably connected to the second connecting groove. A third connecting frame is fixedly connected to one side of the base. A laser emitter body is installed at the bottom of the third connecting frame.

[0007] Preferably, a fixed plate is fixedly connected inside the connecting frame, and a movable plate is fixedly connected inside the connecting frame and above the fixed plate. A threaded column is rotatably connected to the top of the movable plate, and a second connecting frame is threadedly connected to the outer side of the threaded column. A pressure plate is fixedly connected to the bottom of the second connecting frame through the bottom of the movable plate.

[0008] Preferably, a third support plate is fixedly connected to one side of the base, a sleeve rod is rotatably connected inside the third support plate, a sliding groove is formed on the inner wall surface of the sleeve rod, and a slider is fixedly connected to the outer side of the end of the third rotating shaft away from the rotating plate, and the outer side of the slider is slidably connected to the sliding groove.

[0009] Preferably, a reciprocating lead screw is rotatably connected to the top of the base, and the bottom of the first support plate is threadedly connected to the reciprocating lead screw.

[0010] Preferably, a motor is fixedly connected to one side of the base, and one end of the reciprocating lead screw passes through one side of the base and is fixedly connected to the output end of the motor.

[0011] Preferably, the end of the reciprocating screw away from the motor is fixedly connected to a first pulley through one side of the base.

[0012] Preferably, the end of the sleeve rod away from the third rotating shaft passes through the side of the third support plate and is fixedly connected to a second pulley, which is connected to the first pulley via a transmission belt.

[0013] This invention provides a device for detecting surface defects on PZT thin film wafers. Compared with the prior art, it has the following advantages:

[0014] 1. This PZT thin film wafer surface defect detection device, by setting up a first rotating shaft, a first gear, a sector gear, a second rotating shaft, an adjusting rod, a second connecting groove, a rotating plate, a connecting column, a third rotating shaft, a slider, a second support plate, a first connecting groove, and a first connecting frame, realizes the function of flipping the PZT thin film wafer. The rotation of the third rotating shaft drives the rotating plate and the connecting column to rotate. When the connecting column rotates, it moves continuously in the second connecting groove, causing the adjusting rod to swing back and forth. The rotation of the adjusting rod drives the sector gear to swing back and forth through the second rotating shaft. The rotation of the sector gear drives the first rotating shaft to rotate through the first gear, which facilitates the laser light emitter body to detect the other side of the PZT thin film wafer.

[0015] 2. This PZT thin film wafer surface defect detection device, by setting up a base, support frame, reciprocating screw and motor, realizes the function of moving the PZT thin film wafer back and forth. The rotation of the reciprocating screw moves the support frame back and forth on the surface of the base, so that the surface of the PZT thin film wafer can always be located directly below the laser light emitter body, reducing the error of the detection result and more comprehensively detecting the surface of the PZT thin film wafer. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the internal structure of the present invention;

[0017] Figure 2 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 1 ;

[0018] Figure 3 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 2 ;

[0019] Figure 4 This is an exploded view of the present invention;

[0020] Figure 5 This is a partial structural schematic diagram of the present invention;

[0021] Figure 6 This is an enlarged structural diagram of part A in this utility model.

[0022] In the diagram: 1. Base; 2. Support frame; 3. First support plate; 4. Second support plate; 5. First connecting groove; 6. First connecting frame; 7. First rotating shaft; 8. First gear; 9. Sector gear; 10. Second rotating shaft; 11. Adjusting rod; 12. Second connecting groove; 13. Rotating plate; 14. Connecting column; 15. Third rotating shaft; 16. Sliding block; 17. Fixed plate; 18. Moving plate; 19. Second connecting frame; 20. Threaded column; 21. Pressure plate; 22. Third support plate; 23. Sleeve rod; 24. Third connecting frame; 25. Laser emitter body; 26. Reciprocating lead screw; 27. Motor; 28. First pulley; 29. ​​Second pulley; 30. Transmission belt; 31. Connecting plate; 32. Connecting frame; 33. Slide groove. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-6This utility model provides a technical solution: a PZT thin film wafer surface defect detection device, including a base 1, a support frame 2 slidably connected to the top of the base 1, a slide rod fixedly connected to the top of the base 1, the outer side of the slide rod being slidably connected to the support frame 2, the support frame 2 being U-shaped, a first support plate 3 fixedly connected to one end of the top of the support frame 2, the support frame 2 moving along with the first support plate 3, a second support plate 4 fixedly connected to the end of the support frame 2 away from the first support plate 3, the support frame 2 moving along with the first support plate 3, a connecting plate 31 fixedly connected to the top of the first support plate 3, the first support plate 3 moving along with the connecting plate 4. The connecting plate 31 moves, and the top of the second support plate 4 is fixedly connected to the first connecting frame 6. The movement of the second support plate 4 moves the first connecting frame 6 along with it. The top of the second support plate 4 has a first connecting groove 5 that penetrates its surface. The top of the second support plate 4 is rotatably connected to the first rotating shaft 7. One end of the first rotating shaft 7 is fixedly connected to the connecting frame 32. The end of the connecting frame 32 away from the first rotating shaft 7 is rotatably connected to the connecting plate 31. The rotation of the first rotating shaft 7 moves the connecting frame 32 along with it. The outer side of the first rotating shaft 7 is fixedly connected to the first gear 8. The rotation of the first rotating shaft 7 moves the first gear 8 along with it. The top of the first connecting frame 6 rotates... A second rotating shaft 10 is connected to a first gear 8. A sector gear 9 is fixedly connected to one end of the second rotating shaft 10. Rotation of the second rotating shaft 10 causes the sector gear 9 to rotate. One side of the sector gear 9 meshes with a first gear 8. An adjusting rod 11 is fixedly connected to the outer side of the second rotating shaft 10. Rotation of the adjusting rod 11 causes the second rotating shaft 10 to rotate. A third rotating shaft 15 is rotatably connected to the top of the second support plate 4, away from the first rotating shaft 7. A rotating plate 13 is fixedly connected to one end of the third rotating shaft 15. Rotation of the third rotating shaft 15 causes the rotating plate 13 to rotate. One side of the rotating plate 13 is fixedly connected to… A connecting post 14 is connected, and the rotating plate 13 rotates, causing the connecting post 14 to rotate as well. A second connecting groove 12 penetrating the surface of the adjusting rod 11 is provided on one side. The outer side of the connecting post 14 is slidably connected to the second connecting groove 12. The connecting post 14 rotates, causing the adjusting rod 11 to rotate, and the outer side of the adjusting rod 11 is slidably connected to the first connecting groove 5. When the adjusting rod 11 rotates, it moves within the first connecting groove 5. A third connecting frame 24 is fixedly connected to one side of the base 1. A laser light emitter body 25 is installed at the bottom of the third connecting frame 24. The laser light emitter body 25 is turned on to inspect the surface of the PZT thin film wafer.

[0025] Furthermore, a fixed plate 17 is fixedly connected inside the connecting frame 32, and a movable plate 18 is fixedly connected inside the connecting frame 32 and above the fixed plate 17. A threaded post 20 is rotatably connected to the top of the movable plate 18, and a second connecting bracket 19 is threadedly connected to the outside of the threaded post 20. A pressure plate 21 is fixedly connected to the bottom of the second connecting bracket 19, which passes through the bottom of the movable plate 18. When the PZT thin film wafer is placed on the surface of the fixed plate 17, the threaded post 20 is rotated, and the threaded post 20 moves the second connecting bracket 19. The second connecting bracket 19 moves the pressure plate 21 toward the PZT thin film wafer until the pressure plate 21 contacts the surface of the PZT thin film wafer, thus fixing the PZT thin film wafer inside the connecting frame 32.

[0026] Furthermore, a third support plate 22 is fixedly connected to one side of the base 1. A sleeve rod 23 is rotatably connected inside the third support plate 22. A groove 33 is provided on the inner wall surface of the sleeve rod 23. A slider 16 is fixedly connected to the outer side of the end of the third rotating shaft 15 away from the rotating plate 13. The outer side of the slider 16 is slidably connected to the groove 33. The outer side of the third rotating shaft 15 is slidably connected to the sleeve rod 23. The outer side of the slider 16 is in contact with the inner wall of the groove 33. Therefore, when the sleeve rod 23 rotates, the third rotating shaft 15 will also rotate.

[0027] Furthermore, a reciprocating screw 26 is rotatably connected to the top of the base 1, and the bottom of the first support plate 3 is threadedly connected to the reciprocating screw 26. The reciprocating screw 26 rotates, causing the first support plate 3 to move.

[0028] Furthermore, a motor 27 is fixedly connected to one side of the base 1, and one end of the reciprocating lead screw 26 passes through one side of the base 1 and is fixedly connected to the output end of the motor 27. When the motor 27 is turned on, the motor 27 drives the reciprocating lead screw 26 to rotate.

[0029] Furthermore, the end of the reciprocating screw 26 away from the motor 27 passes through one side of the base 1 and is fixedly connected to the first pulley 28. The rotation of the reciprocating screw 26 causes the first pulley 28 to rotate.

[0030] Furthermore, the end of the sleeve rod 23 away from the third rotating shaft 15 passes through the side of the third support plate 22 and is fixedly connected to the second pulley 29. The rotation of the second pulley 29 causes the sleeve rod 23 to rotate. The second pulley 29 is connected to the first pulley 28 through the transmission belt 30. The first pulley 28 drives the second pulley 29 to rotate through the transmission belt 30.

[0031] In use, turn on the laser emitter body 25, place the PZT thin film wafer on the surface of the fixing plate 17, rotate the threaded column 20, the threaded column 20 moves the second connecting frame 19, the second connecting frame 19 moves the pressure plate 21 toward the PZT thin film wafer until the pressure plate 21 contacts the surface of the PZT thin film wafer, fixing the PZT thin film wafer inside the connecting frame 32. Turn on the motor 27, the motor 27 drives the reciprocating screw 26 to rotate, the reciprocating screw 26 rotates and moves the first support plate 3 back and forth, the first support plate 3 moves and moves the third rotating shaft 15 within the sleeve 23. At this time, the laser emitter body 25 detects various parts of the surface of the PZT thin film wafer. The rotation of the reciprocating screw 26 drives the first pulley 28 to rotate, the first pulley 28 drives the third rotating shaft 15 through the transmission belt 30. The second pulley 29 rotates, causing the sleeve rod 23 to rotate. The inner wall surface of the sleeve rod 23 has a groove 33. The outer side of the third rotating shaft 15 away from the rotating plate 13 is fixedly connected to a slider 16. Because the outer side of the slider 16 on the outer side of the third rotating shaft 15 is in contact with the inner wall of the groove 33, the third rotating shaft 15 will also rotate when the sleeve rod 23 rotates. The rotation of the third rotating shaft 15 causes the rotating plate 13 and the connecting column 14 to rotate. When the connecting column 14 rotates, it moves continuously in the second connecting groove 12, causing the adjusting rod 11 to swing back and forth. The rotation of the adjusting rod 11 causes the sector gear 9 to swing back and forth through the second rotating shaft 10. The rotation of the sector gear 9 causes the first rotating shaft 7 to rotate through the first gear 8, which facilitates the laser light emitter body 25 to detect the other side of the PZT thin film wafer.

[0032] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0033] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A PZT thin film wafer surface defect detection device, comprising a base (1), characterized in that: A support frame (2) is slidably connected to the top of the base (1). A first support plate (3) is fixedly connected to one end of the top of the support frame (2). A second support plate (4) is fixedly connected to the end of the support frame (2) away from the first support plate (3). A connecting plate (31) is fixedly connected to the top of the first support plate (3). A first connecting frame (6) is fixedly connected to the top of the second support plate (4). A first connecting groove (5) penetrating its surface is opened on the top of the second support plate (4). A first rotating shaft (7) is rotatably connected to the top of the second support plate (4). A connecting frame (32) is fixedly connected to one end of the first rotating shaft (7). The end of the connecting frame (32) away from the first rotating shaft (7) is rotatably connected to the connecting plate (31). A first gear (8) is fixedly connected to the outside of the first rotating shaft (7). The top of the first connecting frame (6) rotates... A second rotating shaft (10) is connected, and a sector gear (9) is fixedly connected to one end of the second rotating shaft (10). One side of the sector gear (9) is meshed with a first gear (8). An adjusting rod (11) is fixedly connected to the outside of the second rotating shaft (10). A third rotating shaft (15) is rotatably connected to the top of the second support plate (4) and to the side away from the first rotating shaft (7). A rotating plate (13) is fixedly connected to one end of the third rotating shaft (15). A connecting column (14) is fixedly connected to one side of the rotating plate (13). A second connecting groove (12) is opened on one side of the adjusting rod (11) and penetrates its surface. The outside of the connecting column (14) is slidably connected to the second connecting groove (12). A third connecting frame (24) is fixedly connected to one side of the base (1). A laser light emitter body (25) is installed at the bottom of the third connecting frame (24).

2. The PZT thin film wafer surface defect detection device according to claim 1, characterized in that: A fixed plate (17) is fixedly connected inside the connecting frame (32). A movable plate (18) is fixedly connected inside the connecting frame (32) and above the fixed plate (17). A threaded column (20) is rotatably connected to the top of the movable plate (18). A second connecting frame (19) is threadedly connected to the outside of the threaded column (20). A pressure plate (21) is fixedly connected to the bottom of the second connecting frame (19) through the bottom of the movable plate (18).

3. The PZT thin film wafer surface defect detection device according to claim 1, characterized in that: A third support plate (22) is fixedly connected to one side of the base (1). A sleeve rod (23) is rotatably connected inside the third support plate (22). A sliding groove (33) is provided on the inner wall surface of the sleeve rod (23). A slider (16) is fixedly connected to the outer side of the end of the third rotating shaft (15) away from the rotating plate (13). The outer side of the slider (16) is slidably connected to the sliding groove (33).

4. The PZT thin film wafer surface defect detection device according to claim 3, characterized in that: The top of the base (1) is rotatably connected to a reciprocating screw (26), and the bottom of the first support plate (3) is threadedly connected to the reciprocating screw (26).

5. The PZT thin film wafer surface defect detection device according to claim 4, characterized in that: A motor (27) is fixedly connected to one side of the base (1), and one end of the reciprocating screw (26) passes through one side of the base (1) and is fixedly connected to the output end of the motor (27).

6. The PZT thin film wafer surface defect detection device according to claim 5, characterized in that: The end of the reciprocating screw (26) away from the motor (27) passes through one side of the base (1) and is fixedly connected to the first pulley (28).

7. The PZT thin film wafer surface defect detection device according to claim 6, characterized in that: The end of the sleeve rod (23) away from the third rotating shaft (15) passes through the side of the third support plate (22) and is fixedly connected to the second pulley (29). The second pulley (29) is connected to the first pulley (28) through the transmission belt (30).

Images