ECU heat dissipation structure
By using a combination of spring sheets and metal oxide layers in the ECU, the problems of low surface contact efficiency of the heat sink and uneven coating of thermal paste are solved, achieving more efficient heat dissipation and easier detection.
Patent Information
- Application Number
- CN202520054691.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-10
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2035-01-10
AI Technical Summary
In existing ECU cooling methods, the heat sink contacts the circuit board surface, resulting in low heat dissipation efficiency, and uneven application of thermal adhesive makes it difficult to detect.
The system employs a combination structure of spring sheet and metal oxide layer. The spring sheet is soldered onto the circuit board, and the metal oxide layer is formed on the metal cover plate. The spring sheet and the metal oxide layer are in contact. The metal oxide layer is aluminum oxide with a thickness of 35-50 micrometers.
It improves heat dissipation efficiency, ensures insulation and stability, and makes it easy to detect the location and uniformity of the metal oxide layer.
Smart Images
Figure CN223872460U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat dissipation structure technology, specifically to an ECU heat dissipation structure. Background Technology
[0002] The electronic control unit of a car, also known as the ECU, typically includes a base, a circuit board, and a metal cover. The circuit board is mounted on the base, and the metal cover is then mounted on the base to protect the circuit board.
[0003] When an ECU is operating, the electronic components on its internal circuit board generate heat, necessitating a certain level of heat dissipation for the ECU. Typically, heat sinks and thermal paste are placed between the circuit board and the metal cover to dissipate heat from the electronic components on the circuit board.
[0004] However, the above methods using heat sinks and thermal paste have at least the following problems:
[0005] 1. Typically, the heat sink and the circuit board are in surface contact, which has a large contact area and can easily affect the heat sink's heat dissipation efficiency on the circuit board.
[0006] 2. Thermal adhesive needs to be applied to the metal cover, and it is usually difficult to check whether the thermal adhesive has been applied properly and evenly. Utility Model Content
[0007] In view of the above-mentioned problems in the prior art, this utility model provides an ECU heat dissipation structure.
[0008] To solve the above-mentioned technical problems, the present invention provides a solution through the following technical method:
[0009] An ECU heat dissipation structure is disposed between a circuit board and a metal cover plate, comprising a spring sheet with one end soldered to the circuit board and a metal oxide layer formed on the metal cover plate;
[0010] With the metal cover plate covering the circuit board, the other end of the spring sheet abuts against the metal oxide layer.
[0011] Preferably, the spring sheet corresponds to the position of the electronic components on the circuit board.
[0012] Preferably, the spring sheet and the electronic components are located on opposite sides of the circuit board.
[0013] Preferably, the metal oxide layer is aluminum oxide.
[0014] Preferably, the thickness of the metal oxide layer is not less than 35 micrometers.
[0015] Preferably, the thickness of the metal oxide layer is no more than 50 micrometers.
[0016] This utility model has at least the following beneficial effects:
[0017] 1. When the spring sheet is soldered onto the circuit board in this application, the spring sheet and the circuit board are in point contact or line contact, which makes the contact area between the spring sheet and the circuit board smaller than the surface contact between the heat sink and the circuit board, resulting in better heat dissipation efficiency.
[0018] 2. After the metal oxide layer of this application comes into contact with the spring sheet on the circuit board, it can provide better insulation to ensure safety and stability. On the other hand, it can also help the spring sheet dissipate heat from the circuit board, so that the heat on the circuit board can be transferred to the metal cover plate in a better way.
[0019] 3. Since the metal oxide layer formed on the metal cover plate has a certain thickness and shape, it can be directly observed. Compared with the coating of thermal adhesive on the metal cover plate, the metal oxide layer is easier to observe, and the position and uniformity of the metal oxide layer can be better detected. Attached Figure Description
[0020] Figure 1 This illustration shows a schematic diagram of a spring sheet and a metal oxide layer disposed between a circuit board and a metal cover plate in some embodiments of this application.
[0021] The names of the parts referred to by the numbers in the attached diagram are as follows:
[0022] 100. Base; 200. Circuit board; 210. Electronic components; 220. Spring sheet; 300. Metal cover plate; 310. Metal oxide layer. Detailed Implementation
[0023] To further understand the content of this utility model, a detailed description of this utility model will be provided in conjunction with the accompanying drawings and embodiments. It should be understood that the embodiments are merely illustrative of this utility model and are not intended to limit it.
[0024] like Figure 1As shown, this embodiment provides an ECU heat dissipation structure, which is disposed between a circuit board 200 and a metal cover plate 300 for heat dissipation of the circuit board 200. The ECU heat dissipation structure includes a spring plate 220 and a metal oxide layer 310. One end of the spring plate 220 is soldered and fixed to the circuit board 200, while the metal oxide layer 310 is formed on the metal cover plate 300. During ECU assembly, the circuit board 200 is first mounted onto the base 100, and then the metal cover plate 300 is fixedly mounted onto the base 100, allowing the metal cover plate 300 to cover and protect the circuit board 200. During this process, the other end of the spring plate 220 abuts against the metal oxide layer 310.
[0025] It should be noted that the spring sheet 220 in this embodiment is a sheet-like structure with elastic properties formed by bending. When it is soldered onto the circuit board 200, the spring sheet 220 and the circuit board 200 are in point contact or line contact, which makes the contact area between the spring sheet 220 and the circuit board 200 smaller than the surface contact between the heat sink and the circuit board 200, resulting in better heat dissipation efficiency. Because the spring sheet 220 itself has excellent elastic properties, after assembling the base 100, the circuit board 200, and the metal cover plate 300, the metal cover plate 300 can press the circuit board 200 firmly onto the base 100 through the spring sheet 220, resulting in better positional stability of the circuit board 200. At the same time, the metal cover plate 300, through its own elastic properties, can effectively buffer external shaking or collisions, making the position of the spring sheet 220 relative to the circuit board 200 and the metal cover plate 300 more stable, better preventing positional displacement of the spring sheet 220, and resulting in more stable heat dissipation for the circuit board 200.
[0026] Furthermore, in this embodiment, the metal oxide layer 310 is formed on the metal cover plate 300. After it comes into contact with the spring sheet 220 on the circuit board 200, it provides better insulation, ensuring safety and stability. It also assists the spring sheet 220 in dissipating heat from the circuit board 200, effectively transferring heat from the circuit board 200 to the metal cover plate 300. Because the metal oxide layer 310 has a certain thickness and shape after forming on the metal cover plate 300, it can be directly observed. Compared to the coating of thermal adhesive on the metal cover plate 300, the metal oxide layer 310 is easier to observe, allowing for better detection of its position and uniformity.
[0027] In some embodiments, electronic components 210 are soldered onto the circuit board 200, and the positions of spring pieces 220 soldered onto the circuit board 200 correspond to the positions of the electronic components 210. More specifically, multiple electronic components 210 are soldered onto the circuit board 200, and the number of spring pieces 220 is at least one, and the position of each spring piece 220 corresponds to the position of one of the multiple electronic components 210. That is, the positional relationship between the spring pieces 220 and the electronic components 210 is one-to-one. Preferably, the spring piece 220 corresponds to the position of the electronic component 210 that generates more heat.
[0028] It is understandable that the heat on the circuit board 200 is generally generated by the electronic components 210 soldered on it during operation. In order to improve the heat dissipation efficiency of the circuit board 200, the position of the spring sheet 220 is set to correspond to the position of the electronic components 210, so that the position of the spring sheet 220 directly corresponds to the position of the heat source on the circuit board 200. When the electronic components 210 generate heat during operation, it can be transferred to the spring sheet 220, the metal oxide layer 310 and the metal cover plate 300 in a timely manner, thereby achieving heat dissipation of the circuit board 200.
[0029] In some embodiments, after the spring sheet 220 and the electronic component 210 are soldered onto the circuit board 200, the spring sheet 220 and the electronic component 210 are respectively located on both sides of the circuit board 200, so that the arrangement of the spring sheet 220 on the circuit board 200 will not affect the arrangement of the electronic component 210, thus better avoiding the influence of the spring sheet 220 on the electronic component 210.
[0030] When assembling the ECU, the side of the circuit board 200 with electronic components 210 faces the base 100, so that the circuit board 200 is fixed to the base 100 by means of bolt connection or other means. Then, the metal cover plate 300 is fixedly installed on the base 100, so that the side of the circuit board 200 with spring sheet 220 faces the metal cover plate 300, so that the other end of the spring sheet 220 can abut against the metal oxide layer 310 of the metal cover plate 300.
[0031] When the electronic component 210 generates heat during operation, the heat is transferred to the spring sheet 220 behind the electronic component 210, thereby reducing the temperature of the circuit board 200.
[0032] In some embodiments, the metal oxide layer 310 formed on the metal cover plate 300 is aluminum oxide.
[0033] Furthermore, in this embodiment, the metal cover plate 300 is made of aluminum. Through the metal surface anodizing process, a metal oxide layer 310 is formed on the metal cover plate 300, which serves to achieve insulation on the one hand, and on the other hand, can better assist the spring sheet 220 in dissipating heat from the circuit board 200.
[0034] In some embodiments, the thickness of the metal oxide layer 310 formed on the metal cover plate 300 is not less than 35 micrometers, making the metal oxide layer 310 easy to observe. Compared with the coating of thermal adhesive on the metal cover plate 300, the metal oxide layer 310 is easier to observe, and the position and uniformity of the metal oxide layer 310 can be better detected.
[0035] In some embodiments, the thickness of the metal oxide layer 310 formed on the metal cover plate 300 is no more than 50 micrometers.
[0036] It is understandable that the thicker the metal oxide layer 310, the less conducive it is to heat transfer. In this embodiment, the thickness of the metal oxide layer 310 is limited to no more than 50 micrometers, so that the metal oxide layer 310 can have better insulation and thermal conductivity.
[0037] In summary, the above description is only a preferred embodiment of the present utility model. All equivalent changes and modifications made within the scope of the patent application of the present utility model shall fall within the scope of the patent of the present utility model.
Claims
1. An ECU heat dissipation structure, disposed between a circuit board and a metal cover plate, characterized in that: Includes a spring sheet with one end soldered to the circuit board and a metal oxide layer formed on the metal cover plate; With the metal cover plate covering the circuit board, the other end of the spring sheet abuts against the metal oxide layer.
2. The ECU heat dissipation structure according to claim 1, characterized in that: The spring sheet corresponds to the position of the electronic components on the circuit board.
3. The ECU heat dissipation structure according to claim 2, characterized in that: The spring sheet and the electronic components are located on opposite sides of the circuit board.
4. The ECU heat dissipation structure according to claim 1, characterized in that: The metal oxide layer is aluminum oxide.
5. The ECU heat dissipation structure according to claim 1, characterized in that: The thickness of the metal oxide layer is not less than 35 micrometers.
6. The ECU heat dissipation structure according to claim 5, characterized in that: The thickness of the metal oxide layer is no more than 50 micrometers.