Corrosion-resistant and electromagnetic interference-resistant circuit board

Abstract

The utility model provides an anti-corrosion anti-electromagnetic interference circuit board, which comprises a circuit board body, a filling layer is arranged in the circuit board body, the upper surface of the filling layer is sequentially provided with a stress reducing layer, a bionic cellular board layer, a first anti-corrosion layer and a solder mask covering layer from bottom to top, and the lower surface of the filling layer is provided with a second anti-corrosion layer. The filling layer sequentially comprises an AFB layer, an epoxy resin adhesive film and a PTFE laminated plate from top to bottom according to the lamination sequence, a first carbon fiber cloth layer is arranged on the upper surface of the bionic honeycomb plate layer, and honeycomb core holes of the bionic honeycomb plate layer are filled with a wave-absorbing material layer; the stress reducing layer sequentially comprises a second carbon fiber cloth layer, a transition layer and a polyimide substrate layer from top to bottom. On the basis of not depending on an external shielding structure, the structure has anti-corrosion and anti-electromagnetic interference functions.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a circuit board that is corrosion resistant and electromagnetic interference resistant. Background Technology

[0002] In the existing technology, PCB circuit boards are simply shielded by an external surface layer. The shielding effect of the board body is not strong, especially for PCB circuit boards inside the chassis. The chassis may also reflect the electromagnetic waves emitted by the PCB circuit board itself, causing interference. Furthermore, due to the small space and many electrical devices, the various electromagnetic waves concentrated together can easily interfere with the operation of the PCB circuit board. For example, Chinese patent announcement number CN218679466U, with an announcement date of March 21, 2023, discloses a circuit board structure with good thermal conductivity. The beneficial effects of this utility model are that by installing a transparent dustproof and heat-conducting plastic cover and a movable plastic cover, it not only has excellent insulation, thermal conductivity, and corrosion resistance, but also dustproof properties. Furthermore, it is low-cost and has a long service life. The transparent structure also allows workers to observe the internal condition without disassembling the dustproof and heat-conducting plastic cover and the movable plastic cover. The dustproof and heat-conducting plastic cover and the movable plastic cover have first heat dissipation holes for easy heat dissipation. Metal mesh plates are installed inside several of these first heat dissipation holes, which improve the device's anti-interference performance while providing heat dissipation and dustproof protection. By installing dampers and buffer springs, the dustproof and heat-conducting plastic cover is buffered from damage by external forces, preventing damage to the circuit board itself. The drawback of this prior art is that the shielding and anti-interference effect of the board body is not strong, requiring an external shielding structure for support, increasing the complexity of the overall structure. Given this situation, improvement is urgently needed. Utility Model Content

[0003] Based on this, the purpose of this utility model is to provide a circuit board that is corrosion-resistant and electromagnetic interference-resistant, which can achieve corrosion resistance and electromagnetic interference protection without relying on an external shielding structure.

[0004] This utility model provides a circuit board that is corrosion-resistant and electromagnetic interference-resistant, including a circuit board body. The circuit board body includes a filling layer inside. The upper surface of the filling layer is provided with a stress-reducing layer, a biomimetic honeycomb layer, a first anti-corrosion layer, and a solder resist cover layer from bottom to top. The lower surface of the filling layer is provided with a second anti-corrosion layer. The filling layer includes an AFB layer, an epoxy resin adhesive film, and a PTFE laminate from top to bottom according to the lamination sequence. The upper surface of the biomimetic honeycomb layer is provided with a first carbon fiber cloth layer. The honeycomb core of the biomimetic honeycomb layer is filled with a wave-absorbing material layer. The stress-reducing layer includes a second carbon fiber cloth layer, a transition layer, and a polyimide substrate layer from top to bottom.

[0005] Preferably, the transition layer is a polydopamine or PDA material layer.

[0006] Preferably, the biomimetic honeycomb panel is configured as a four-axis optically oriented honeycomb structure panel.

[0007] Preferably, the first anti-corrosion layer is an environmentally friendly conformal coating.

[0008] Preferably, the second anti-corrosion layer is a diamond carbon film layer.

[0009] Preferably, the microwave absorbing material layer is configured as a microwave absorbing resin material layer.

[0010] The beneficial effects of this utility model are as follows: the first and second anti-corrosion layers give the structure excellent corrosion resistance; the solder resist covering layer gives the structure anti-oxidation properties and also improves the insulation and anti-fouling ability of the circuit board; the honeycomb core holes of the biomimetic honeycomb board are filled with a wave-absorbing material layer, which directly enhances the structure's ability to resist electromagnetic interference. Attached Figure Description

[0011] Figure 1 This is a cross-sectional view of the present invention.

[0012] Figure 2 This is a cross-sectional view of the stress-reducing layer.

[0013] The attached figures are labeled as follows: filler layer 10, epoxy resin adhesive film 11, PTFE laminate 12, stress-reducing layer 13, biomimetic honeycomb panel layer 14, first anti-corrosion layer 15, second anti-corrosion layer 16, AFB layer 17, solder resist cover layer 18, first carbon fiber cloth layer 19, second carbon fiber cloth layer 20, transition layer 21, and polyimide substrate layer 22. Detailed Implementation

[0014] To further understand the features, technical means, and specific objectives and functions achieved by this utility model, the following detailed description of this utility model is provided in conjunction with specific embodiments and accompanying drawings.

[0015] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0016] Please refer to Figure 1-2As shown, this utility model provides a corrosion-resistant and electromagnetic interference-resistant circuit board, including a circuit board body. The circuit board body includes a filler layer 10. The upper surface of the filler layer 10, from bottom to top, is sequentially provided with a stress-reducing layer 13, a biomimetic honeycomb layer 14, a first anti-corrosion layer 15, and a solder resist cover layer 18. The lower surface of the filler layer 10 is provided with a second anti-corrosion layer 16. The stress-reducing layer 13, the biomimetic honeycomb layer 14, the first anti-corrosion layer 15, and the second anti-corrosion layer 16 are laminated together. The solder resist cover layer 18 is applied by coating. The filler layer 10, according to the lamination sequence from top to bottom, includes an AFB layer 17. An epoxy resin adhesive film 11 and a PTFE laminate 12 are bonded together. A first carbon fiber cloth layer 19 is laminated onto the upper surface of the biomimetic honeycomb panel layer 14. The honeycomb core of the biomimetic honeycomb panel layer 14 is filled with a microwave-absorbing material layer, which is a microwave-absorbing resin material layer. In practice, the microwave-absorbing resin material can be coated onto the surface of the biomimetic honeycomb panel layer 14, followed by multiple impregnation and curing processes. The stress-reducing layer 13, from top to bottom, includes a second carbon fiber cloth layer 20, a transition layer 21, and a polyimide substrate layer 22. The transition layer is a polydopamine or PDA material layer, and they are bonded together using a mixed lamination process. Based on the circuit board body, drilling, solder masking, and surface treatment processes are then performed to create a circuit board structure that meets the requirements.

[0017] In this embodiment, the biomimetic honeycomb panel 14 is configured as a four-axis optically oriented honeycomb structure panel. The first anti-corrosion layer 15 is configured as an environmentally friendly conformal coating layer, applied by coating, such as KDD MR1715 conformal coating layer. The second anti-corrosion layer 16 is configured as a diamond carbon film layer, which can be prepared by electrodeposition or chemical vapor deposition processes in actual production.

[0018] In this embodiment, a first anti-corrosion layer and a second anti-corrosion layer are provided to give the structure excellent corrosion resistance. A solder resist cover layer is provided to give the structure anti-oxidation properties and also improve the insulation and anti-fouling ability of the circuit board. The honeycomb core holes of the biomimetic honeycomb board layer are filled with a wave-absorbing material layer, which directly enhances the structure's ability to resist electromagnetic interference.

[0019] The above-described embodiments are merely one implementation of this utility model, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A corrosion-resistant and electromagnetic interference-resistant circuit board, comprising a circuit board body, characterized in that: The circuit board body includes a filling layer (10). The upper surface of the filling layer (10) is provided with a stress-reducing layer (13), a bionic honeycomb plate layer (14), a first anti-corrosion layer (15), and a solder resist cover layer (18) from bottom to top. The lower surface of the filling layer (10) is provided with a second anti-corrosion layer (16). The filling layer (10) includes an AFB layer (17), an epoxy resin adhesive film (11), and a PTFE laminate (12) from top to bottom according to the lamination sequence. The upper surface of the bionic honeycomb plate layer (14) is provided with a first carbon fiber cloth layer (19). The honeycomb core of the bionic honeycomb plate layer (14) is filled with a wave-absorbing material layer. The stress-reducing layer (13) includes a second carbon fiber cloth layer (20), a transition layer (21), and a polyimide substrate layer (22) from top to bottom.

2. The circuit board with anti-corrosion and anti-electromagnetic interference properties according to claim 1, characterized in that: The transition layer is configured as a polydopamine or PDA material layer.

3. The anti-corrosion and anti-electromagnetic interference circuit board according to claim 1, characterized in that: The biomimetic honeycomb panel (14) is configured as a four-axis optically rotatable honeycomb structure panel.

4. The anti-corrosion and anti-electromagnetic interference circuit board according to claim 1, characterized in that: The first anti-corrosion layer (15) is set as an environmentally friendly three-proof paint layer.

5. The anti-corrosion and anti-electromagnetic interference circuit board according to claim 1, characterized in that: The second anti-corrosion layer (16) is a diamond carbon film layer.

6. The anti-corrosion and anti-electromagnetic interference circuit board according to claim 1, characterized in that: The microwave absorbing material layer is configured as a microwave absorbing resin material layer.

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