Wafer loading device and equipment

Abstract

The utility model provides a wafer loading device and equipment, and relates to the field of semiconductor manufacturing. The wafer loading device comprises a wafer loading box and an anti-slip mechanism. The side surface of the wafer loading box is provided with an anti-slip mechanism installation opening. And the anti-sliding mechanism is fixedly mounted at the anti-sliding mechanism mounting opening. The utility model provides a wafer loading device comprising a wafer loading box and an anti-slip mechanism. The side surface of the wafer loading box is provided with an anti-slip mechanism installation opening for installing the anti-slip mechanism. When the wafer needs to be transported, the wafer is limited in the wafer loading box through the anti-slip mechanism, so that the wafer is effectively prevented from falling out of the wafer loading box, a loading box cover does not need to be additionally arranged, the workload of workers is reduced, and the working efficiency of wafer transportation is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, and more specifically, to a wafer loading device and equipment. Background Technology

[0002] In semiconductor manufacturing, wafers are transported using loading cassettes. Standard loading cassettes typically come with a lid. In actual operations, processes such as film application and polishing often require manual handling. To prevent wafers from slipping out of the loading cassette during these operations, the lid must be locked.

[0003] However, using the loading box cover can easily cause wafer cracking. In addition, the operation of installing and removing the loading box cover is cumbersome, making it inconvenient and inefficient for workers. Utility Model Content

[0004] The purpose of this invention is to provide a wafer loading device and equipment that can at least partially solve the above-mentioned technical problems.

[0005] In a first aspect, the present invention provides a wafer loading device, the wafer loading device including a wafer loading box and an anti-slip mechanism, the wafer loading box loading a wafer, and the anti-slip mechanism for confining the wafer within the wafer loading box;

[0006] The wafer loading box has an opening on its side for installing an anti-slip mechanism;

[0007] The anti-slip mechanism is installed and fixed at the installation opening of the anti-slip mechanism.

[0008] Optionally, a plurality of first sheet-like protrusions are provided on the inner surface of the first side of the wafer loading box; wherein, the first side is the side with the mounting opening of the anti-slip mechanism;

[0009] Multiple first plate-shaped protrusions are arranged sequentially along a first direction, and each first plate-shaped protrusion is perpendicular to the length direction of the installation opening of the anti-slip mechanism.

[0010] Optionally, a plurality of second sheet-like protrusions are provided on the inner surface of the second side of the wafer loading cassette; wherein, the second side is the side of the wafer loading cassette opposite to the first side.

[0011] Multiple second plate-shaped protrusions are arranged sequentially along the first direction;

[0012] The second plate-like protrusion corresponds one-to-one with the first plate-like protrusion.

[0013] Optionally, the anti-slip mechanism includes a slide bar, which includes a slide bar body and a plurality of locking teeth;

[0014] Multiple locking teeth are fixed to the slide bar body;

[0015] The slide bar body is located at the mounting opening of the anti-slip mechanism, and the locking teeth face the inside of the wafer loading box through the mounting opening of the anti-slip mechanism;

[0016] Each of the locking teeth corresponds to one of the first plate-like protrusions.

[0017] Optionally, the anti-slip mechanism further includes a first buckle; two protrusions are respectively provided on two sides of one end of the slide bar body;

[0018] The first buckle is fixed to the outer surface of the first side and is located at one end of the mounting opening of the anti-slip mechanism;

[0019] The first buckle has a first groove for limiting the sliding bar body and a second groove for limiting the protrusion.

[0020] The first groove is adapted to the shape and size of the slider body, and the second groove is adapted to the shape and size of the protrusion.

[0021] Optionally, the anti-slip mechanism further includes a second latch;

[0022] The second buckle is fixed to the outer surface of the first side and is located at the other end of the anti-slip mechanism mounting opening opposite to the first buckle.

[0023] Optionally, the length of the slider body is greater than the length of the installation opening of the anti-slip mechanism;

[0024] When the protrusion is located at the bottom of the second groove, one end of the slide bar body opposite to the protrusion extends from the first side, and each of the locking teeth is located between two adjacent first plate-shaped protrusions;

[0025] When the wafer loading device is placed on a plane, one end of the slide body away from the protrusion is flush with the bottom of the wafer loading box, and each of the locking teeth corresponds to one of the first plate-shaped protrusions.

[0026] Optionally, the wafer loading cassette is further provided with an annular protrusion facing the interior of the wafer loading cassette;

[0027] There are multiple annular protrusions, and the annular protrusions, the first plate-shaped protrusions, and the second plate-shaped protrusions are arranged in a corresponding manner.

[0028] Optionally, the surfaces of the annular protrusion, the first sheet-like protrusion, and the second sheet-like protrusion are provided with cushioning elements.

[0029] Secondly, the present invention provides a wafer loading device, which includes the wafer loading apparatus described in any of the above claims.

[0030] The beneficial effects of the wafer loading device and equipment provided by this utility model are:

[0031] This invention provides a wafer loading device including a wafer loading cassette and an anti-slip mechanism. An anti-slip mechanism mounting opening is provided on the side of the wafer loading cassette for installing the anti-slip mechanism. When wafers need to be transported, the anti-slip mechanism confines the wafers within the wafer loading cassette, effectively preventing the wafers from falling out. No additional loading cassette cover is required, reducing the workload of workers and improving the efficiency of wafer transportation. Attached Figure Description

[0032] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 A schematic diagram of a wafer loading device provided in an embodiment of this utility model;

[0034] Figure 2 A schematic diagram of the first sheet-like protrusion provided for an embodiment of this utility model;

[0035] Figure 3 A schematic diagram of the second sheet-like protrusion provided in an embodiment of this utility model;

[0036] Figure 4 A schematic diagram of the annular protrusion provided in an embodiment of this utility model;

[0037] Figure 5 A top view of a wafer being loaded into a wafer loading cassette, provided in an embodiment of this utility model;

[0038] Figure 6 A schematic diagram of the slider provided in an embodiment of this utility model;

[0039] Figure 7 A schematic diagram illustrating the positioning of the wafer by the locking teeth provided in an embodiment of this utility model;

[0040] Figure 8 This is one of the structural schematic diagrams of the first buckle provided in the embodiment of this utility model;

[0041] Figure 9 This is the second schematic diagram of the structure of the first buckle provided in the embodiment of the present utility model;

[0042] Figure 10 A schematic diagram of the slider body provided in an embodiment of this utility model;

[0043] Figure 11 A schematic diagram of the second buckle provided in an embodiment of this utility model;

[0044] Figure 12 This is a schematic diagram illustrating how the locking teeth do not limit the wafer positioning, as provided in an embodiment of this utility model.

[0045] Icons: 01-Wafer loading device; 11-Wafer loading box; 111-Anti-slip mechanism mounting opening; 112-First side; 1121-First sheet-like protrusion; 113-Second side; 1131-Second sheet-like protrusion; 114-Annular protrusion; 12-Anti-slip mechanism; 121-Slide bar; 1211-Slide bar body; 1212-Locking tooth; 1213-Protrusion; 122-First buckle; 1221-First groove; 1222-Second groove; 123-Second buckle. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0047] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0048] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0049] In the description of this utility model, it should be understood that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0050] Furthermore, the terms "first," "second," and "third" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0051] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0052] In semiconductor manufacturing, wafers are loaded using standard loading cassettes with lids. During actual operations, processes such as film application and polishing often require manual handling. To prevent wafers from slipping out of the loading cassettes, the lids are used to lock them in place. However, using lids can easily cause wafer cracking, and installing and removing the lids is cumbersome, making the work inconvenient for workers.

[0053] Based on the above, embodiments of this specification provide a wafer loading apparatus and device that can at least partially solve the above-mentioned technical problems.

[0054] Please see Figure 1 The present invention provides a wafer loading device 01, which includes a wafer loading box 11 and an anti-slip mechanism 12. The wafer loading box 11 is loaded with wafers, and the anti-slip mechanism 12 is used to restrict the wafers within the wafer loading box 11.

[0055] The wafer loading box 11 has an anti-slip mechanism mounting opening 111 on its side. The anti-slip mechanism 12 is installed and fixed at the anti-slip mechanism mounting opening 111.

[0056] like Figure 1As shown, one of the four sides of the wafer loading box 11 is open, and a rectangular anti-slip mechanism mounting opening 111 is provided on the side adjacent to the open side. The anti-slip mechanism 12 is fixed at the anti-slip mechanism mounting opening 111.

[0057] When placing the wafer, the wafer can be placed into the wafer loading device 01 from the side of the opening, and the wafer is limited by the anti-slip mechanism 12 so that the wafer can be transported without a cover.

[0058] Optionally, a plurality of first sheet-like protrusions 1121 are provided on the inner surface of the first side surface 112 of the wafer loading box 11. The first side surface 112 is the side surface provided with the anti-slip mechanism mounting opening 111.

[0059] Multiple first plate-shaped protrusions 1121 are arranged sequentially along the first direction, and each first plate-shaped protrusion 1121 is perpendicular to the length direction of the anti-slip mechanism mounting opening 111.

[0060] The first direction can be the direction in which the anti-slip mechanism 12 moves on the wafer loading cassette 11. For example... Figure 2 As shown, a plurality of first sheet-like protrusions 1121 are fixedly installed on the side of the first side 112 facing the interior of the wafer loading cassette 11, with a distance of one wafer thickness between every two first sheet-like protrusions 1121. When placing a wafer, a wafer can be placed between every two first sheet-like protrusions 1121, and the first sheet-like protrusions 1121 serve to support and limit the wafer.

[0061] Optionally, a plurality of second sheet-like protrusions 1131 are provided on the inner surface of the second side 113 of the wafer loading container 11. The second side 113 is the side of the wafer loading container 11 opposite to the first side 112.

[0062] Multiple second plate-shaped protrusions 1131 are arranged sequentially along the first direction. The second plate-shaped protrusions 1131 correspond one-to-one with the first plate-shaped protrusions 1121.

[0063] like Figure 3 As shown, multiple second sheet-like protrusions 1131, smaller than the first sheet-like protrusion 1121, can be provided on the second side 113 opposite to the first side 112. Each second sheet-like protrusion 1131 corresponds to a unique first sheet-like protrusion 1121. During wafer placement, a wafer is placed between every two corresponding first sheet-like protrusions 1121 and second sheet-like protrusions 1131, ensuring that each wafer placed in the wafer loading cassette 11 is supported on both sides, thus improving the stability of the wafer within the wafer loading cassette 11.

[0064] Optionally, the wafer cassette 11 is also provided with an annular protrusion 114 facing the interior of the wafer cassette 11.

[0065] There are multiple annular protrusions 114, and the annular protrusions 114, the first plate-shaped protrusion 1121 and the second plate-shaped protrusion 1131 are arranged in sequence.

[0066] Similarly, such as Figure 4 As shown, two circular grooves can be provided on the side of the wafer loading cassette 11 opposite to its opening, and a plurality of annular protrusions 114 can be provided along the circular grooves. Each annular protrusion 114 corresponds to a first sheet-like protrusion 1121 and a second sheet-like protrusion 1131. In this way, the wafer placed in the wafer loading cassette 11 can be supported on three sides of the wafer loading cassette 11, further improving the stability of the wafer during transportation.

[0067] like Figure 5 The image shown is a top view of a wafer being loaded into a wafer loading cassette 11. It can be seen that after the wafer is loaded, the annular protrusion 114, the first sheet-like protrusion 1121, and the second sheet-like protrusion 1131 together support one wafer. It should be noted that the annular protrusion 114 can be arranged in one row or multiple rows; this invention does not specifically limit this arrangement.

[0068] Optionally, the surfaces of the annular protrusion 114, the first sheet protrusion 1121, and the second sheet protrusion 1131 are provided with cushioning elements.

[0069] To prevent the wafer from sliding within the wafer loading cassette 11, buffer elements such as rubber pads (not shown in the figure) can be provided on the surfaces of the annular protrusion 114, the first sheet protrusion 1121, and the second sheet protrusion 1131. These buffer elements not only prevent the wafer from sliding within the wafer loading cassette 11 but also provide longitudinal cushioning.

[0070] Optionally, the anti-slip mechanism 12 includes a slide bar 121, which includes a slide bar body 1211 and a plurality of locking teeth 1212;

[0071] Multiple locking teeth 1212 are fixed to the slide body 1211. The slide body 1211 is located at the anti-slip mechanism mounting opening 111, and the locking teeth 1212 face the interior of the wafer loading cassette 11 through the anti-slip mechanism mounting opening 111. Each locking tooth 1212 corresponds to a first plate-shaped protrusion 1121.

[0072] like Figure 6 As shown, locking teeth 1212 are disposed on the surface of slide bar 121. When mounted on wafer cassette 11, the side of slide bar 121 with locking teeth 1212 faces the interior of wafer cassette 11, and locking teeth 1212 extend into wafer cassette 11 (e.g., Figure 2 Each locking tooth 1212 corresponds to a first plate-like protrusion 1121, as shown below. Figure 7As shown, after the wafer is placed, by adjusting the slider body 1211 up and down, the locking teeth 1212 can be positioned between the two first plate-shaped protrusions 1121, thereby achieving the effect of restricting the wafer from sliding out of the wafer loading box 11.

[0073] Optionally, the anti-slip mechanism 12 also includes a first latch 122. Two protrusions 1213 are respectively provided on two sides at one end of the slider body 1211.

[0074] The first buckle 122 is fixed to the outer surface of the first side 112 and is located at one end of the anti-slip mechanism mounting opening 111.

[0075] The first buckle 122 has a first groove 1221 for limiting the slide body 1211 and a second groove 1222 for limiting the protrusion.

[0076] The first groove 1221 is adapted to the shape and size of the slider body 1211, and the second groove 1222 is adapted to the shape and size of the protrusion 1213.

[0077] Please see Figure 8 , Figure 9 as well as Figure 10 The first buckle 122 has two grooves, namely a first groove 1221 and a second groove 1222. When installing the slide bar 121, the first groove 1221 of the first buckle 122 holds the slide bar body 1211, and the protrusion 1213 at one end of the slide bar body 1211 is slidably installed in the second groove 1222 of the first buckle 122. One end of the first buckle 122 limits the first groove 1221, preventing the first groove 1221 from penetrating the entire first buckle 122 (e.g., ...). Figure 9 (As shown). After the slider 121 is installed, when the slider body 1211 slides to the bottom of the first buckle 122, the protrusion 1213 will be locked, so that the slider 121 will not fall off the first buckle 122.

[0078] Optionally, the anti-slip mechanism 12 further includes a second latch 123. The second latch 123 is fixed to the outer surface of the first side 112 and is located at one end of the anti-slip mechanism mounting opening 111 relative to the first latch 122.

[0079] like Figure 11 As shown, the second latch 123 is only provided with a groove for locking the slide bar body 1211. The shape and size of this groove can be the same as the first groove 1221 on the first latch 122. When the anti-slip mechanism 12 is installed, the first latch 122 and the second latch 123 respectively lock the slide bar 121 at both ends, so that the slide bar 121 can only move up and down in the wafer loading box 11.

[0080] Optionally, the length of the slider body 1211 is greater than the length of the anti-slip mechanism mounting opening 111.

[0081] When the protrusion 1213 is located at the bottom of the second groove 1222, the end of the slider body 1211 opposite to the protrusion 1213 extends from the first side 112, and each locking tooth 1212 is located between two adjacent first plate-shaped protrusions 1121.

[0082] When the wafer loading device 01 is placed on a plane, one end of the slider body 1211 away from the protrusion 1213 is flush with the bottom of the wafer loading box 11, and each locking tooth 1212 corresponds to a first sheet-like protrusion 1121.

[0083] Still with Figure 7 For example, when the wafer loading box 11 is in a suspended state, the lower end of the slider 121 extends beyond the bottom of the wafer loading box 11. At this time, the locking teeth 1212 of the slider 121 are arranged in an alternating pattern with the first plate-shaped protrusion 1121, thereby restricting the wafer from sliding out of the wafer loading box 11.

[0084] When the wafer loading box 11 is placed on the ground, such as Figure 12 As shown, the slider 121 is pushed upward by the pressure of the ground, so that the locking teeth 1212 of the slider 121 are aligned with the first plate-shaped protrusion 1121, thereby allowing the wafer to be placed into the interior of the wafer loading box 11.

[0085] As an alternative implementation, a spring can also be provided at one end of the slider body 1211 near the first latch 122 to better trigger the movement of the slider 121.

[0086] Based on the same inventive concept, this utility model provides a wafer loading device, which includes the wafer loading apparatus 01 described above.

[0087] Regarding the aforementioned wafer loading equipment, the specific functions and structures of each part have been described in detail in the embodiments of the wafer loading device 01 provided in this specification, and will not be elaborated upon here.

[0088] The above-described solutions in this utility model embodiment can achieve at least the following technical effects:

[0089] 1. A wafer loading device including a wafer loading cassette and an anti-slip mechanism is provided. An anti-slip mechanism mounting opening is provided on the side of the wafer loading cassette for installing the anti-slip mechanism. When wafers need to be transported, the anti-slip mechanism confines the wafers within the wafer loading cassette, effectively preventing the wafers from falling out. No additional loading cassette cover is required, reducing the workload of workers and improving the efficiency of wafer transportation.

[0090] 2. By setting buffers on the surfaces of the annular protrusion, the first plate-shaped protrusion, and the second plate-shaped protrusion, the safety of wafer transportation is improved, and a certain degree of anti-slip effect can be achieved.

[0091] 3. By setting a slide body with a length greater than the length of the anti-slip mechanism installation opening, and when the protrusion is located at the bottom of the second groove, the end of the slide body opposite to the protrusion extends from the first side, the anti-slip mechanism can be automatically opened when the wafer loading box is put down, and the anti-slip mechanism can be automatically closed when the wafer loading box is picked up.

[0092] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer loading device, characterized by comprising: The wafer loading device (01) includes a wafer loading box (11) and an anti-slip mechanism (12). The wafer loading box (11) is loaded with wafers, and the anti-slip mechanism (12) is used to restrict the wafers within the wafer loading box (11). The wafer loading box (11) has an anti-slip mechanism mounting opening (111) on its side; The anti-slip mechanism (12) is installed and fixed at the anti-slip mechanism installation opening (111).

2. The wafer loading device of claim 1, wherein The inner surface of the first side (112) of the wafer loading box (11) is provided with a plurality of first sheet-like protrusions (1121); wherein, the first side (112) is the side provided with the mounting opening (111) of the anti-slip mechanism; Multiple first plate-shaped protrusions (1121) are arranged sequentially along a first direction, and each first plate-shaped protrusion (1121) is perpendicular to the length direction of the anti-slip mechanism mounting opening (111).

3. The wafer loading device of claim 2, wherein A plurality of second sheet-like protrusions (1131) are provided on the inner surface of the second side (113) of the wafer loading box (11); wherein, the second side (113) is the side of the wafer loading box (11) opposite to the first side (112); Multiple second plate-shaped protrusions (1131) are arranged sequentially along the first direction; The second plate-shaped protrusion (1131) corresponds one-to-one with the first plate-shaped protrusion (1121).

4. The wafer loading device of claim 2, wherein The anti-slip mechanism (12) includes a slide bar (121), which includes a slide bar body (1211) and multiple locking teeth (1212); The plurality of locking teeth (1212) are fixed on the slide bar body (1211); The slide bar body (1211) is located at the anti-slip mechanism mounting opening (111), and the locking teeth (1212) face the inside of the wafer loading box (11) through the anti-slip mechanism mounting opening (111); Each of the locking teeth (1212) corresponds to one of the first plate-shaped protrusions (1121).

5. The wafer loading device of claim 4, wherein The anti-slip mechanism (12) also includes a first buckle (122); two protrusions (1213) are respectively provided on two sides of one end of the slide bar body (1211); The first buckle (122) is fixed to the outer surface of the first side (112) and is located at one end of the anti-slip mechanism mounting opening (111); The first buckle (122) has a first groove (1221) for limiting the slider body (1211) and a second groove (1222) for limiting the protrusion (1213); The first groove (1221) is adapted to the shape and size of the slider body (1211), and the second groove (1222) is adapted to the shape and size of the protrusion (1213).

6. The wafer loading apparatus as claimed in claim 5, characterized in that, The anti-slip mechanism (12) also includes a second buckle (123); The second buckle (123) is fixed to the outer surface of the first side (112) and is located at the other end of the anti-slip mechanism mounting opening (111) relative to the first buckle (122).

7. The wafer loading apparatus as claimed in claim 6, characterized in that, The length of the slide bar body (1211) is greater than the length of the anti-slip mechanism mounting opening (111); When the protrusion (1213) is located at the bottom of the second groove (1222), one end of the slider body (1211) opposite to the protrusion (1213) extends from the first side (112), and each of the locking teeth (1212) is located between two adjacent first plate-shaped protrusions (1121). When the wafer loading device (01) is placed on a plane, one end of the slider body (1211) away from the protrusion (1213) is flush with the bottom of the wafer loading box (11), and each of the locking teeth (1212) corresponds to one of the first sheet protrusions (1121).

8. The wafer loading apparatus as claimed in claim 3, characterized in that, The wafer loading cassette (11) is also provided with annular protrusions (114) facing the interior of the wafer loading cassette (11); There are multiple annular protrusions (114), and the annular protrusions (114), the first plate-shaped protrusion (1121), and the second plate-shaped protrusion (1131) are arranged in sequence.

9. The wafer loading apparatus as claimed in claim 8, characterized in that, The surfaces of the annular protrusion (114), the first sheet protrusion (1121), and the second sheet protrusion (1131) are provided with cushioning elements.

10. A wafer loading device, characterized in that, The wafer loading equipment includes the wafer loading device (01) according to any one of claims 1 to 9.

Images