Wafer box structure capable of automatically searching edges

Abstract

The utility model provides a wafer box structure capable of automatically searching edges, which is characterized by comprising a box body, side push plate assemblies which are arranged on two sides of an inner cavity of the box body in a sliding manner and are used for abutting against wafers, and a rotating shaft assembly which is arranged at the center of the bottom of the inner cavity of the box body in the length direction and is used for searching the edges, a plurality of partition plates which are sequentially arranged at intervals in the width direction of the box body are arranged on the two sides of an inner cavity of the box body, and wafer containing grooves used for containing wafers are formed between every two adjacent partition plates; the side push plate assembly comprises a transverse push plate slidably arranged at the top of the box body and a side push plate connected to one end, facing the center of the box body, of the transverse push plate, arranged corresponding to the wafer placement groove and used for abutting against the wafer.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor, especially relates to a wafer box structure of automatic edge searching. BACKGROUND

[0002] The wafer usually needs to be positioned by searching edge before etching and coating, to ensure that the wafer has a preset state, so as to facilitate downstream continuous standardized operation.

[0003] The semiconductor industry often determines the position of the wafer by a gap, which is a specially formed corner of the wafer.

[0004] In the prior art, the wafer box for accommodating wafers in the current process often needs a matching edge finder to complete the edge searching. Different sizes of wafers need a matching wafer box and a matching edge finder, which is high in cost. The existing edge finder needs manual operation to complete the edge searching of the wafer, and after the edge searching is completed, it is necessary to verify whether the gap of each wafer in the wafer box is directed downward by the naked eye. However, the naked eye observation cannot accurately determine whether the gap of the wafer is directed downward, which is low in efficiency. SUMMARY

[0005] Therefore, the utility model aims at providing a wafer box structure of automatic edge searching, which can effectively solve the above-mentioned problems in the prior art.

[0006] A wafer box structure of automatic edge searching, comprising a box body, a side push plate assembly slidingly arranged at both sides of the inner cavity of the box body for abutting against a wafer, and a rotating shaft assembly arranged at the center of the length direction of the bottom of the inner cavity of the box body for edge searching, a plurality of partition plates are arranged at both sides of the inner cavity of the box body and are sequentially and spaced apart along the width direction of the box body, a wafer placing groove for placing a wafer is arranged between two adjacent partition plates, the side push plate assembly comprises a horizontal push plate slidingly arranged at the top of the box body and a side push plate connected to one end of the horizontal push plate facing the center of the box body and corresponding to the wafer placing groove for abutting against a wafer.

[0007] Further, the inner cavity of the box body is a concave structure.

[0008] Further, the wafer placing groove is a concave structure.

[0009] Further, the partition plate is a conical structure.

[0010] Further, the rotating shaft assembly comprises a rotating shaft structure arranged at the center of the length direction of the bottom of the inner cavity of the box body, a scraper partially surrounding the rotating shaft structure, and a driving structure for driving the rotating shaft structure.

[0011] Further, the height of the top of the rotating shaft structure is A, the height of the bottom of the wafer placing groove is B, and the thickness of the scraper is C, B>A, and B=A+C.

[0012] Further, a grating ruler structure for wafer positioning is arranged on one side of the box body, the grating ruler structure is used for controlling the driving structure, and the height of the grating ruler structure is D, B>D>A.

[0013] Further, an avoiding position for avoiding the scraper is arranged on the grating ruler structure, and the avoiding position is arranged at the top of the rotating shaft structure.

[0014] Further, a tenon piece is arranged on both sides of the horizontal push plate, and the horizontal push plate is slidably arranged in the inner cavity of the box body through the tenon piece.

[0015] Further, the inclination of the side push plate is greater than that of the wafer placing groove.

[0016] Compared with the prior art, the wafer box structure has the following beneficial effects: a plurality of partition plates are arranged on both sides of the inner cavity of the box body and are sequentially and spaced apart along the width direction of the box body, a wafer placing groove is arranged between adjacent two partition plates, so that a wafer can be placed in the wafer placing groove; a horizontal push plate is slidably arranged at the top of the box body, a side push plate for abutting against a wafer is arranged at the end of the horizontal push plate facing the center of the box body and corresponding to the wafer placing groove, when wafers of different sizes are placed, the horizontal push plate is slid toward the center of the box body to drive the side push plate to move toward the center of the box body to reduce the volume of the inner cavity of the box body to adapt to small wafers, the horizontal push plate is slid away from the center of the box body to drive the side push plate to move away from the center of the box body to expand the volume of the inner cavity of the box body to adapt to large wafers, and then the rotating shaft assembly is used for wafer edge finding, so that different wafer boxes and different edge finders do not need to be provided for wafers of different sizes, and cost is saved. BRIEF DESCRIPTION OF DRAWINGS

[0017] Fig. 1 It is a front view of the wafer box structure for automatic edge finding in the embodiment of the utility model;

[0018] Fig. 2 It is a top view of the wafer box structure for automatic edge finding in the embodiment of the utility model;

[0019] Explanation of main element symbols:

[0020]

[0021]

[0022] The following specific embodiments will further illustrate the utility model in combination with the above drawings. SPECIFIC EMBODIMENTS

[0023] For the purpose of facilitating the understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The drawings show several embodiments of the present application. However, the present application can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0024] It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intervening element. The terms "vertical", "horizontal", "left", "right", and similar expressions used herein are for illustrative purposes only.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the description of the present application herein only for the purpose of describing specific embodiments of the present application and is not intended to limit the present application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0026] Please refer to Figs. 1-2 , the automatic edge finding wafer box structure in the embodiment of the present application is shown, including a box body 10, a side push plate assembly 20 slidingly arranged in the inner cavity of the box body 10 for abutting against a wafer, and a rotating shaft assembly 30 arranged in the length direction of the center of the inner cavity of the box body 10 for edge finding, a plurality of partition plates 11 are arranged on both sides of the inner cavity of the box body 10 in sequence along the width direction of the box body 10, a wafer placing groove 12 for placing a wafer is arranged between the adjacent two partition plates 11, the side push plate assembly 20 includes a horizontal push plate 21 slidingly arranged on the top of the box body 10, and a side push plate 22 for abutting against a wafer is arranged corresponding to the wafer placing groove 12 at the end of the horizontal push plate 21 towards the center of the box body 10.

[0027] It can be understood that by arranging a plurality of said partition plates 11 on both sides of the inner cavity of the box body 10 in sequence along the width direction of the box body 10, and arranging the wafer placing grooves 12 between adjacent two said partition plates 11, the wafer can be placed in the wafer placing groove 12; by slidingly arranging the horizontal push plate 21 on the top of the box body 10, and arranging the side push plate 22 for abutting the wafer on the end of the horizontal push plate 21 towards the center of the box body 10 corresponding to the wafer placing groove 12, when placing wafers of different sizes, the horizontal push plate 21 is slid towards the center of the box body 10 to drive the side push plate 22 to move towards the center of the box body 10 to reduce the volume of the inner cavity of the box body 10 to adapt to small wafers, and the horizontal push plate 21 is slid away from the center of the box body 10 to drive the side push plate 22 to move away from the center of the box body 10 to expand the volume of the inner cavity of the box body 10 to adapt to large wafers, and then the wafer edge finding is performed by the rotating shaft assembly 30, so that different wafer boxes and different edge finders are not required for wafers of different sizes, and cost is saved.

[0028] Further, the inner cavity of the box body 10 is a concave structure.

[0029] It can be understood that by arranging the inner cavity of the box body 10 as a concave structure, the structural stability of the utility model can be increased.

[0030] Further, the wafer placing groove 12 is a concave structure.

[0031] It can be understood that by arranging the wafer placing groove 12 as a concave structure, and when the wafer is placed in the utility model, the wafer placing groove 12 can play a positioning and protection role for the wafer.

[0032] Further, the partition plate 11 is a conical structure.

[0033] It can be understood that by arranging the partition plate 11 as a conical structure, the distance between adjacent two partition plates gradually decreases from top to bottom, and then when the wafer is placed in the utility model, the partition plate 11 can play a guiding and buffering role.

[0034] Further, the rotating shaft assembly 30 includes a rotating shaft structure 31 arranged at the center of the length direction of the inner cavity of the box body 10, a scraper 32 partially surrounding the rotating shaft structure 31, and a driving structure 33 for driving the rotating shaft structure 31.

[0035] Further, the height of the top of the rotating shaft structure 31 is A, the height of the bottom of the wafer placing groove 12 is B, and the thickness of the scraper 32 is C, B>A, and B=A+C.

[0036] It can be understood that the driving structure 33 drives the rotating shaft structure 31, and the scraper 32 around the rotating shaft structure 31 is driven to rotate. When the notch of the wafer is downward, the scraper 32 has no contact with the wafer. When the edge of the wafer is downward, the scraper 32 drives the wafer to rotate in the box until the notch of the wafer is downward.

[0037] Further, the box 10 is provided with a grating ruler structure 40 for positioning the wafer on one side. The height of the grating ruler structure 40 is D, and B>D>A.

[0038] It can be understood that the grating ruler structure 40 is provided to control the driving structure 33 and position the wafer in the box 10. After the wafer in the box 10 is completely edge finding, the grating ruler structure 40 stops the driving structure. Thus, it can be accurately judged whether the wafer in the box 10 is completely edge finding. Therefore, manual edge finding is not required, and after edge finding is completed, it is not necessary to verify whether each wafer in the wafer box is completely edge finding by naked eye, which increases efficiency.

[0039] Further, the grating ruler structure 40 is provided with an avoiding position 41 for avoiding the scraper 32. The avoiding position 41 is arranged at the top of the rotating shaft structure 31.

[0040] It can be understood that the avoiding position 41 is provided to prevent the grating ruler structure 40 from misjudging the scraper 32 as a wafer.

[0041] Further, the horizontal push plate 21 is provided with a tenon joint 23 on both sides. The horizontal push plate 21 is slidably arranged in the cavity of the box 10 through the tenon joint 23.

[0042] Further, the inclination of the side push plate 22 is greater than that of the wafer placing groove 12.

[0043] In summary, the wafer box structure with automatic edge searching in the above-mentioned embodiments of the present application is characterized in that: a plurality of partition plates are arranged on both sides of the inner cavity of the box body in sequence along the width direction of the box body, a wafer placing groove is arranged between the adjacent two partition plates, so that the wafer can be placed in the wafer placing groove; a horizontal push plate is arranged on the top of the box body in a sliding manner, a side push plate for abutting against the wafer is arranged on the end of the horizontal push plate facing the center of the box body corresponding to the wafer placing groove, when placing wafers of different sizes, the horizontal push plate is slid toward the center of the box body to drive the side push plate to move toward the center of the box body to reduce the volume of the inner cavity of the box body to adapt to small wafers, the horizontal push plate is slid away from the center of the box body to drive the side push plate to move away from the center of the box body to expand the volume of the inner cavity of the box body to adapt to large wafers, and then the wafer edge searching is performed through the rotating shaft assembly, so that different wafer boxes and different edge searchers do not need to be provided for wafers of different sizes, and cost is saved.

[0044] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the description of the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0045] The above-mentioned embodiments only express several embodiments of the present application, the description is more specific and detailed, but it cannot be understood as a limitation on the scope of the present application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A wafer cassette structure with automatic edge finding, characterized in that, The device includes a housing, side pusher plate assemblies slidably disposed on both sides of the inner cavity of the housing for abutting against wafers, and a pivot assembly disposed at the center of the bottom of the inner cavity of the housing for edge finding. Several partitions are provided on both sides of the inner cavity of the housing, spaced apart sequentially along the width direction of the housing. A wafer placement slot is provided between two adjacent partitions for placing wafers. The side pusher plate assembly includes a horizontal pusher plate slidably disposed on the top of the housing and a side pusher plate connected to the horizontal pusher plate at one end facing the center of the housing and disposed corresponding to the wafer placement slot for abutting against wafers.

2. The wafer cassette structure with automatic edge finding according to claim 1, characterized in that, The inner cavity of the box has a concave structure.

3. The wafer cassette structure with automatic edge finding according to claim 1, characterized in that, The wafer placement groove has a concave structure.

4. The wafer cassette structure with automatic edge finding according to claim 1, characterized in that, The partition has a conical structure.

5. The wafer cassette structure with automatic edge finding according to claim 1, characterized in that, The rotating shaft assembly includes a rotating shaft structure disposed at the center of the bottom of the inner cavity of the box along its length, a scraper partially surrounding the rotating shaft structure, and a drive structure for driving the rotating shaft structure.

6. The wafer cassette structure with automatic edge finding according to claim 5, characterized in that, The height of the top of the rotating shaft structure is A, the height of the bottom of the wafer placement groove is B, and the thickness of the scraper is C, where B > A and B = A + C.

7. The wafer cassette structure with automatic edge finding according to claim 6, characterized in that, A grating ruler structure for wafer positioning is also provided on one side of the box body. The grating ruler structure is used to control the driving structure. The height of the grating ruler structure is D, where B > D > A.

8. The wafer cassette structure with automatic edge finding according to claim 7, characterized in that, The grating ruler structure is also provided with a clearance position for avoiding the scraper, and the clearance position is located at the top of the rotating shaft structure.

9. The wafer cassette structure with automatic edge finding according to claim 1, characterized in that, Tenon joints are provided on both sides of the horizontal push plate, and the horizontal push plate is slidably disposed on both sides of the inner cavity of the box through the tenon joints.

10. The wafer cassette structure with automatic edge finding according to claim 1, characterized in that, The inclination of the side push plate is greater than that of the wafer placement slot.

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