Primary-secondary ring and frame wafer transfer machine

Abstract

The utility model provides a mother-son ring and frame wafer conveying machine, which is used for wafer conveying equipment and comprises a robot side frame and a platform side frame, a wafer robot is mounted on the robot side frame, a material box positioning device is mounted on the side of the wafer robot, a wafer centering mechanism is mounted on the side of the material box positioning device, and the wafer centering mechanism is mounted on the platform side frame. According to the invention, the three groups of material box positioning devices are used for loading the mother-son ring wafer and the frame wafer, the wafer robot is used for realizing processing detection and internal transmission of the wafer at each position, and the wafer centering mechanism has the functions of realizing edge searching positioning and code scanning identification of the mother-son ring wafer, and can realize the code scanning identification function of the frame wafer.

Description

Technical Field

[0001] This utility model relates to the field of wafer transfer equipment, specifically a mother-daughter ring and frame wafer transfer machine. Background Technology

[0002] A wafer transfer machine is a device that uses wafer robots to transfer various wafers according to specific technical requirements. Nearly 70% of semiconductor manufacturing processes use this equipment.

[0003] In the wafer manufacturing process, different semiconductor manufacturers use different types of wafers, thus requiring various equipment to meet usage requirements during transport. This patent application needs to simultaneously support both parent-child ring wafers and frame wafers, therefore requiring a wafer transfer machine compatible with both parent-child ring wafers and frame wafers. Utility Model Content

[0004] To address the aforementioned issues, this application provides a mother-daughter ring and a frame wafer transfer machine.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution: a mother-daughter ring and frame wafer transfer machine for wafer transfer equipment, including a robot side frame and a platform side frame. A wafer robot is mounted on the robot side frame, a hopper positioning device is mounted on the side of the wafer robot, a wafer alignment mechanism is mounted on the side of the hopper positioning device, an industrial control computer is mounted inside the robot side frame, a UPS power supply component is mounted on the side of the platform side frame, a motion platform module is mounted on the top of the platform side frame, and an external docking interface component is mounted on the side of the UPS power supply component.

[0006] Through the above technical solution, the wafer robot is the core component of this application, mainly responsible for the task of wafer transfer, ensuring accurate transfer of wafers between various points. The function of the cassette positioning device is to place and distinguish the mother ring wafer cassette and the frame wafer cassette, and also has the functions of detecting wafer bumps and cassette positioning. The wafer alignment mechanism provides alignment, edge finding and barcode scanning for the mother ring wafers, and also has the function of barcode scanning for the frame wafers. The motion platform module is responsible for the photo acquisition of the mother ring wafers and the frame wafers. The industrial control computer, as the CPU of the equipment, has the ability to receive various signals from various components, process various signals, and issue various execution instructions to various components.

[0007] Furthermore, the platform side frame is equipped with an electrical control cabinet, an EMO button, a signal tower, a human-machine operation module, and a display assembly, while the wafer robot is equipped with a wafer scanning sensor, a clamping fork, and a clamping pressure plate.

[0008] Through the above technical solution, the electrical control cabinet mainly integrates and installs all electrical components. As an essential component, it serves as a relay station for signals and power. The EMO button is the emergency button for the equipment. In case of a sudden accident, this button can be pressed to stop the equipment immediately. The signal tower is used to indicate the output signals of the equipment. The human-machine operation module and display components are used for human-machine interaction.

[0009] Furthermore, the material box positioning device is equipped with an OK indicator light, and an NG indicator light and a detection button are installed on the side of the OK indicator light. The material box positioning device is also equipped with a material box differentiation sensor.

[0010] Through the above technical solution, the role of the material box positioning device in this application is to carry the material box, and its main functions include material box differentiation, positioning detection and tab detection.

[0011] Furthermore, the wafer alignment mechanism is equipped with a barcode scanner and a first chuck, and the motion platform module is equipped with a second chuck.

[0012] Through the above technical solution, the wafer alignment mechanism is used to align and position the wafer and scan and identify it, while the motion platform module is used to receive the wafer transmitted by the wafer robot and to capture images of the wafer.

[0013] Furthermore, the human-machine operation module includes a power-on button, a power-off button, a reset button, a lighting button, a positive pressure display meter, and a negative pressure display meter.

[0014] The above technical solution enables human-computer interaction through a human-computer operation module.

[0015] In summary, this application includes at least one of the following beneficial technical effects:

[0016] 1. This application uses three sets of material box positioning devices to load the mother-daughter ring wafers and frame wafers, and a wafer robot to realize the processing, inspection and internal transfer of wafers at various positions. The wafer alignment mechanism has the functions of edge positioning and barcode recognition of the mother-daughter ring wafers, and can also realize the barcode recognition function of the frame wafers. This application can meet the processing, inspection and transfer applications of mother-daughter ring wafers and frame wafers smaller than 6 inches in the market. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the isometric side of this application;

[0018] Figure 2 This application aims to conceal the door panel.

[0019] Figure 3 This is a front view of the present application;

[0020] Figure 4 This is a top view of the structure of this application;

[0021] Figure 5 This is a schematic diagram of the robot structure in this application;

[0022] Figure 6 This is a schematic diagram of the material box positioning device of this application;

[0023] Figure 7 This is a schematic diagram of the wafer alignment mechanism in this application;

[0024] Figure 8 This is a schematic diagram of the motion platform module of this application;

[0025] Figure 9 This is a schematic diagram of the human-machine operation module of this application;

[0026] In the diagram: 1. Robot side frame; 2. Platform side frame; 3. Wafer robot; 301. Wafer scanning sensor; 302. Clamping fork; 303. Clamping pressure plate; 4. Material box positioning device; 401. OK indicator light; 402. NG indicator light; 403. Detection button; 404. Material box differentiation sensor; 5. Wafer alignment mechanism; 501. Barcode scanner; 502. First chuck; 6. Motion platform module; 601. Second chuck; 7. Industrial computer; 8. External interface assembly; 9. UPS power supply assembly; 10. Electrical control cabinet; 11. EMO button; 12. Signal tower; 13. Human-machine operation module; 1301. Power-on button; 1302. Power-off button; 1303. Reset button; 1304. Lighting button; 1305. Positive pressure display meter; 1306. Negative pressure display meter; 14. Display assembly. Detailed Implementation

[0027] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0028] Please see Figures 1 to 9This utility model provides a technical solution: a mother-daughter ring and frame wafer transfer machine for wafer transfer equipment, including a robot-side frame 1 and a platform-side frame 2. A wafer robot 3 is mounted on the robot-side frame 1. A hopper positioning device 4 is mounted on the side of the wafer robot 3. A wafer alignment mechanism 5 is mounted on the side of the hopper positioning device 4. An industrial control computer 7 is installed inside the robot-side frame 1. A UPS power supply component 9 is mounted on the side of the platform-side frame 2. A motion platform module 6 is mounted on the top of the platform-side frame 2. An external docking interface component 8 is mounted on the side of the UPS power supply component 9. The wafer robot 3 is the core component of this application, mainly... The wafer transport module 4 is responsible for transporting wafers, ensuring accurate transfer between various points. The wafer positioning device 4 is used to place and differentiate the mother ring wafer cassette and frame wafer cassette, and also has the functions of detecting wafer bumps and positioning the cassette. The wafer alignment mechanism 5 provides alignment, edge finding and barcode scanning for the mother and daughter ring wafers, and also has the function of barcode scanning for frame wafers. The motion platform module 6 is responsible for capturing images of the mother and daughter ring wafers and frame wafers. The industrial control computer 7, as the CPU of the equipment, receives various signals from various components, processes these signals, and issues various execution instructions to various components.

[0029] See Figure 1 and Figure 5 The platform side frame 2 is equipped with an electrical control cabinet 10, an EMO button 11, a signal tower 12, a human-machine operation module 13, and a display assembly 14. The wafer robot 3 is equipped with a wafer scanning sensor 301, a clamping fork 302, and a clamping pressure plate 303. The electrical control cabinet 10 mainly integrates and installs all electrical components. As a signal and power relay station, it is an essential component. The EMO button 11 is the emergency button of the equipment. If a sudden accident occurs, this button can be pressed to stop the equipment immediately. The signal tower 12 is used for equipment output signal indication. The human-machine operation module 13 and the display assembly 14 are used for human-machine interaction.

[0030] See Figure 6 The material box positioning device 4 is equipped with an OK indicator light 401, and an NG indicator light 402 and a detection button 403 are installed on the side of the OK indicator light 401. The material box positioning device 4 is equipped with a material box differentiation sensor 404. The function of the material box positioning device 4 in this application is to carry the material box, and its main functions include material box differentiation, positioning detection and tab detection.

[0031] See Figure 7 and Figure 8The wafer alignment mechanism 5 is equipped with a barcode scanner 501 and a first chuck 502, and the motion platform module 6 is equipped with a second chuck 601. The wafer alignment mechanism 5 is used to align and position the wafer and scan and identify it. The motion platform module 6 is used to receive the wafer transmitted by the wafer robot and to take pictures of the wafer.

[0032] See Figure 9 The human-machine operation module 13 includes a power-on button 1301, a power-off button 1302, a reset button 1303, a lighting button 1304, a positive pressure display 1305, and a negative pressure display 1306. Human-machine interaction is realized through the human-machine operation module 13.

[0033] The implementation principle of a mother-daughter ring and frame wafer transfer machine in this application embodiment is as follows: First, the worker needs to connect the power supply and positive and negative pressure air sources to the external interface component 8 of the equipment. Then, press the power-on button 1301 in the human-machine operation module 13. At this time, all components in the equipment are powered on, and the UPS also starts working. Press the lighting button 1304 to turn on the equipment lights. Then press the reset button 1303. At this time, the industrial control computer 7 starts, and the motion platform module 6, wafer robot 3, and wafer alignment mechanism 5 begin to reset. The worker can judge whether the air pressure range is normal by observing the data of the positive pressure display 1305 and the negative pressure display 1306. After the machine is completed, the worker places the mother-daughter ring cassette or frame cassette into the cassette positioning device 4 and presses the detection button 403. If the NG indicator light 402 lights up, it is necessary to check whether there is a problem with the cassette placement. After the check is completed, the worker presses the detection button 403 again. When the OK indicator light 401 lights up, the worker closes the door. In this step, the type of wafer cassette has been distinguished by the cassette differentiation sensor 404 in the cassette positioning device 4. After the above steps are completed, the equipment starts to run automatically. First, the industrial control computer 7 issues the wafer robot 3 to start working command. The wafer robot 3 detects the wafer placed in the cassette through the wafer scanning sensor 301, and then the wafer robot... 3. The wafer is gripped by the clamping fork 302 and the clamping plate 303. After gripping, the wafer is transferred by the wafer robot 3 to the wafer alignment mechanism 5. After the wafer arrives at the wafer alignment mechanism 5, it is divided into two different running paths according to the two different wafer types. The wafer type has been distinguished by the hopper positioning device 4. If it is a mother-daughter ring wafer, the industrial control computer 7 issues an instruction to place the mother-daughter ring wafer on the first chuck 502 of the wafer alignment mechanism 5. Then, the wafer alignment mechanism 5 performs alignment and barcode scanning on the mother-daughter ring wafer. If it is a frame wafer, the industrial control computer 7 issues an instruction to place the frame wafer under the barcode scanner 501 for scanning. After the wafer alignment mechanism 5 completes its work, the wafer robot 3 transports the wafer to the motion platform module 6. Once the wafer is placed on the second chuck 601 of the motion platform module 6, the industrial control computer 7 issues a command to open the negative pressure and hold the wafer. Next, the motion platform module 6 will begin the image acquisition process. After the motion platform module 6 completes its operation, the wafer robot 3 will grab the wafer again and transfer it to the mother-daughter ring hopper or frame hopper. The wafer robot 3 continuously repeats the above actions to ensure the operation of the entire equipment. After the equipment completes its work for the day, the worker presses the power-off button 1302, and the entire equipment stops working.

[0034] The advantages of this embodiment are:

[0035] This application uses three sets of material box positioning devices to load the mother-daughter ring wafers and frame wafers, and a wafer robot to realize the processing, inspection and internal transfer of wafers at various positions. The wafer alignment mechanism has the functions of edge finding and positioning of the mother-daughter ring wafers and barcode recognition, and can also realize the barcode recognition function of frame wafers. This application can meet the processing, inspection and transfer applications of mother-daughter ring wafers and frame wafers smaller than 6 inches in the market.

[0036] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0037] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A mother-daughter ring and frame wafer transfer machine for wafer transfer equipment, comprising a robot-side frame (1) and a platform-side frame (2), characterized in that: A wafer robot (3) is mounted on the robot side frame (1). A material box positioning device (4) is mounted on the side of the wafer robot (3). A wafer alignment mechanism (5) is mounted on the side of the material box positioning device (4). An industrial control computer (7) is installed inside the robot side frame (1). A UPS power supply component (9) is mounted on the side of the platform side frame (2). A motion platform module (6) is mounted on the top of the platform side frame (2). An external docking interface component (8) is mounted on the side of the UPS power supply component (9).

2. The wafer transfer machine with mother and daughter rings and frame according to claim 1, characterized in that: The platform side frame (2) is equipped with an electrical control cabinet (10), an EMO button (11), a signal tower (12), a human-machine operation module (13), and a display assembly (14). The wafer robot (3) is equipped with a wafer scanning sensor (301), a clamping tooth fork (302), and a clamping pressure plate (303).

3. The wafer transfer machine with mother and daughter rings and frame according to claim 1, characterized in that: The material box positioning device (4) is equipped with an OK indicator light (401), and an NG indicator light (402) and a detection button (403) are installed on the side of the OK indicator light (401). The material box positioning device (4) is also equipped with a material box differentiation sensor (404).

4. The wafer transfer machine with mother and daughter rings and frame according to claim 1, characterized in that: The wafer alignment mechanism (5) is equipped with a barcode scanner (501) and a first chuck (502), and the motion platform module (6) is equipped with a second chuck (601).

5. The wafer transfer machine with a mother-daughter ring and frame according to claim 2, characterized in that: The human-machine operation module (13) includes a power-on button (1301), a power-off button (1302), a reset button (1303), a lighting button (1304), a positive pressure display (1305), and a negative pressure display (1306).

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