Wafer box carrying device

Abstract

According to the technical scheme, the wafer box carrying device comprises a frame and a plurality of mounting plates arranged on the frame, the mounting plates are used for bearing wafer boxes, and the mounting plates and the frame are connected through damping elements so that the mounting plates can float in the normal direction of a bearing face. According to the wafer box carrying device, the damping element is arranged between the frame and the mounting plate, so that the purpose of damping the mounting plate in the working process is achieved, and bad wafer damage caused by impact in the processes of feeding, discharging, transferring, conveying and the like of the wafer box can be well avoided.

Description

Technical Field

[0001] This utility model relates to the field of material handling technology, specifically to a wafer cassette handling device. Background Technology

[0002] In the semiconductor industry, the internal turnover of wafers uses front-opening wafer cassettes (FOUPs), which require wafer cassette handling equipment. Typically, the wafer cassette handling equipment moves wafers along a preset route to complete the loading and unloading of wafer cassettes.

[0003] During transport, the wafer cassette handling device moves uphill or downhill along corresponding tracks. Additionally, impacts may occur during the loading and unloading of wafer cassettes. Under these circumstances, the wafers inside the cassette may be damaged by the hard impact. Utility Model Content

[0004] In order to reduce the impact on the wafer during the wafer transport process and avoid wafer damage, this application provides a wafer box handling device.

[0005] The present invention provides a wafer cassette handling device, including a frame and a plurality of mounting plates disposed on the frame. The mounting plates are used to support the wafer cassette, and the mounting plates are connected to the frame by shock-absorbing elements so that the mounting plates can float along the normal direction of the supporting surface.

[0006] Preferably, each of the mounting plates is disposed within the envelope space formed by the frame.

[0007] Preferably, a plurality of the mounting plates are arranged sequentially in a line on the mounting plate.

[0008] Preferably, the arrangement direction of the plurality of mounting plates is along the moving direction of the frame.

[0009] Preferably, the mounting plate has a plurality of positioning pins that mate with the wafer cassette, the positioning pins being used to lock the position of the wafer cassette.

[0010] Preferably, the back of the mounting plate is further provided with several reinforcing members.

[0011] Preferably, it also includes a hanging profile and a boom, the boom connecting the hanging profile and the frame.

[0012] Preferably, the frame is suspended below the hanging profile.

[0013] The wafer cassette handling device of this application achieves the purpose of vibration reduction of the mounting plate during operation by setting shock-absorbing elements between the frame and the mounting plate, thereby effectively avoiding wafer defects caused by impact during wafer loading, unloading, transfer and conveying. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the wafer cassette handling device of this utility model.

[0015] Figure 2 This is a partial schematic diagram of the wafer cassette handling device of this utility model;

[0016] Figure 3 This is a schematic diagram of the mounting plate 2 of the wafer cassette handling device of this utility model;

[0017] Figure 4 This is a schematic diagram of the wafer cassette handling device of this utility model.

[0018] In the picture:

[0019] 1: Frame; 11: Hanging profile; 12: Crane arm; 2: Mounting plate; 21: Positioning pin; 22: Reinforcing member; 3: Shock-absorbing element; W: Wafer box. Detailed Implementation

[0020] The present patent type will be described in detail below with reference to the accompanying drawings and specific embodiments. In this specification, the dimensions in the drawings do not represent actual size ratios. The drawings are only used to illustrate the relative positional and connection relationships between the components. Components with the same name or the same reference numerals represent similar or identical structures and are limited to illustrative purposes.

[0021] Figure 1 This is a schematic diagram of the wafer cassette handling device of this application. Figure 2 The diagram shows a partial schematic. The structural schematic of the wafer cassette handling device of this application includes a frame 1, on which several mounting plates 2 are mounted for receiving wafer cassettes W. To reduce the impact on the wafer cassettes W during handling and transport, the mounting plates 2 are connected to the frame 1 via shock-absorbing elements 3. Several mounting plates 2 are generally installed at the bottom of the frame 1. The four corners of the mounting plates 2 are elastically supported on the frame 1 by the shock-absorbing elements 3, allowing the mounting plates 2 to float along their surface normal. The shock-absorbing elements 3 can be elastically deformable rubber pads disposed between the frame 1 and the mounting plates 2. The rubber pads can be installed below the four corners of the mounting plates 2, with one end of the rubber pad fixed to the frame 1 by bolts, and the other end fixed to the mounting plate 2 by bolts. The shock-absorbing device has good versatility; if one shock-absorbing pad is damaged, it can be replaced individually; when the weight of the wafer cassette W changes, rubber pads of different hardness can be replaced accordingly to achieve better cushioning and shock absorption effects.

[0022] Taking the placement of wafer cassette W as an example, the wafer cassette W is first transported by a robotic arm to the top of the mounting plate 2. To avoid interference, there is a slight gap between the wafer cassette W and the mounting plate 2. The wafer cassette W is then released and falls onto the surface of the mounting plate 2. During this process, the shock-absorbing element 3 is compressed, achieving a buffering and shock-absorbing effect. Several mounting plates 2 are arranged sequentially in a line on the frame 1, preferably along the direction of movement of the frame 1. All mounting plates 2 are preferably positioned within the envelope space formed by the frame 1. In this case, the frame 1 can provide a certain degree of protection during movement, thereby minimizing the risk of accidental collisions with the mounting plates 2 or the wafer cassette W during movement.

[0023] Figure 3 This is a schematic diagram of the mounting plate 2. The supporting surface of the mounting plate 2 has several positioning pins 21 that mate with the wafer cassette W to lock the position of the wafer cassette W during operation. Several reinforcing members 22 are also provided on the back side of the mounting plate 2 (i.e., the side opposite to the surface supporting the wafer cassette W) to ensure the structural strength of the mounting plate 2 and prevent deformation after supporting the wafer cassette W or after long-term use. The reinforcing members 22 can be bent sheet metal parts to improve the structural strength of the mounting plate 2.

[0024] Figure 4 This is a schematic diagram of the wafer cassette handling device of this application. It also includes a hanging profile 11 and a boom 12. The hanging profile 11 is used to suspend on the top conveyor belt (OHB) of the Automatic Material Handling System (AMHS) during transfer. The frame 1 and the hanging profile 11 are connected by several booms 12, and the frame 1 is suspended below the hanging profile 11.

[0025] The above description is merely a preferred embodiment of this patent type and is not intended to limit the scope of this patent type. Without departing from the design spirit of this patent type, all modifications and improvements made by those skilled in the art to the technical solutions of this patent type should fall within the protection scope defined by the claims of this patent type.

Claims

1. A wafer cassette handling device, characterized in that, The device includes a frame (1) and several mounting plates (2) disposed on the frame (1). The mounting plates (2) are used to support the wafer cassette (W). The mounting plates (2) are connected to the frame (1) by a damping element (3) so that the mounting plates (2) can float along the normal direction of the supporting surface.

2. The wafer cassette handling device as described in claim 1, characterized in that, Each of the mounting plates (2) is disposed within the envelope space formed by the frame (1).

3. The wafer cassette handling device as described in claim 1, characterized in that, Several of the mounting plates (2) are arranged in a row on the mounting plate (2).

4. The wafer cassette handling device as described in claim 3, characterized in that, The arrangement direction of several of the mounting plates (2) is along the moving direction of the frame (1).

5. The wafer cassette handling apparatus according to any one of claims 1-4, characterized in that, The mounting plate (2) has a plurality of positioning pins (21) that cooperate with the wafer cassette (W). The positioning pins (21) are used to lock the position of the wafer cassette (W).

6. The wafer cassette handling apparatus according to any one of claims 1-4, characterized in that, Several reinforcing members (22) are also provided on the back of the mounting plate (2).

7. The wafer cassette handling apparatus according to any one of claims 1-4, characterized in that, It also includes a hanging profile (11) and a boom (12), the boom (12) connecting the hanging profile (11) and the frame (1).

8. The wafer cassette handling device as described in claim 7, characterized in that, The frame (1) is suspended below the hanging profile (11).

Images