Wafer leveling mechanism

Abstract

The utility model provides a wafer leveling mechanism. The wafer leveling mechanism comprises at least one clamping assembly, a V-shaped guide wheel, a speed reducer and a motor, the motor drives the V-shaped guide wheel to rotate through the speed reducer; and the clamping assembly and the V-shaped guide wheel are arranged on the same normal plane of the wafer leveling mechanism. And the motor drives the V-shaped guide wheel to rotate through the speed reducer. The speed reducer is used for reducing the rotating speed of the motor and increasing the torque, so that the V-shaped guide wheel can rotate stably and reliably. And the V-shaped guide wheel provides a guide effect for the leveling of the wafer, so that the leveling operation of the wafer on a correct path is ensured.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of wafer processing, in particular to a wafer flattening mechanism. BACKGROUND

[0002] In the field of semiconductor packaging and photolithography, wafer flattening is a key pre-process for realizing high-precision patterning. With the improvement of chip integration (such as the preparation requirement of RDL layer in high-density fan-out packaging), the flatness of wafer surface needs to be controlled below microns, otherwise problems such as uneven photoresist coating and alignment mark offset will occur, directly affecting the performance and yield of devices.

[0003] Currently, two methods are mainly used in the market for wafer calibrators. One is a laser sensor combined with a translation-rotation table structure with a vacuum chuck. The vacuum chuck adsorbs and fixes the wafer, and the translation-rotation table translates and positions the center of the wafer. The laser sensor determines the edge position of the wafer and finds the gap (or straight edge) of the wafer through the rotation of the translation-rotation table to calibrate. The other is a laser sensor combined with a clamping rotary table structure. The clamping block of the clamping rotary table positions the center of the wafer by clamping the edge of the wafer. The laser sensor finds the gap of the wafer through the rotation of the clamping rotary table to calibrate. Both methods have certain defects. The vacuum chuck of the former inevitably contacts the center of the wafer, which may contaminate the wafer. The latter not only has a complex structure, but also cannot find the gap of the wafer even if the clamping block of the clamping rotary table is clamped at the gap of the wafer, resulting in calibration failure.

[0004] Patent CN208922062U adopts an L-shaped positioning block combined with a motor drive, which can realize the rapid fitting of the main / secondary alignment edges, but does not solve the dynamic deformation compensation problem of the multi-material laminated structure. CONTENT OF THE UTILITY MODEL

[0005] To achieve the above purpose, the application provides a wafer flattening mechanism, which comprises at least one clamping assembly, a V-shaped guide wheel, a speed reducer and a motor. The motor drives the V-shaped guide wheel to rotate through the speed reducer. The clamping assembly and the V-shaped guide wheel are arranged on the same normal plane of the wafer flattening mechanism.

[0006] Specifically, it further comprises a horizontal fixed plate, a vertical fixed plate, a Z-axis motor and a cleaning basket. The vertical fixed plate and the horizontal fixed plate are arranged perpendicular to each other, and the vertical fixed plate, the clamping assembly and the V-shaped guide wheel are on the same normal plane. The Z-axis motor is arranged on one side of the horizontal fixed plate and below the motor. The cleaning basket is detachably arranged on the horizontal fixed plate.

[0007] Specifically, it further comprises a reinforcing rib and a reinforcing plate; the reinforcing rib is arranged on the upper and lower surfaces of one end of the horizontal fixing plate; and the reinforcing plate is arranged on the lower surface of the horizontal fixing plate and is fixedly connected with the reinforcing rib.

[0008] In the above technical solution, the arrangement of the reinforcing rib and the reinforcing plate enhances the strength and rigidity of the horizontal fixing plate, so that the horizontal fixing plate can better withstand the force generated during the leveling process and ensure the stability of the mechanism.

[0009] Specifically, it further comprises a lifting bolt; one end of the lifting bolt is connected with the horizontal fixing plate and is fixedly connected with the reinforcing plate; and the lifting bolt is driven by a Z-axis motor to drive the horizontal fixing plate to move in the vertical plane.

[0010] Through the above technical means, the Z-axis motor drives the lifting bolt to achieve millimeter-level fine adjustment, which adapts to the leveling requirements of wafers of different thicknesses.

[0011] Specifically, a through hole for accommodating a cleaning basket is formed in the horizontal fixing plate; and positioning blocks are arranged around the through hole.

[0012] Specifically, the clamping assembly comprises a chuck and a clamping cylinder; the chuck is arranged at the front end of the clamping cylinder and is driven to displace by the clamping cylinder.

[0013] Specifically, the chuck is used to clamp the edge of the wafer, and the contact depth of the chuck with the edge of the wafer is ≤2.5mm.

[0014] Through the above technical solution, the clamping depth of the chuck is ≤2.5mm, which can not only ensure effective clamping of the wafer, but also avoid damaging the wafer due to excessive extrusion. The clamping assembly and the V-shaped guide wheel are arranged in the same normal plane of the wafer leveling mechanism to jointly complete the leveling operation of the wafer.

[0015] Specifically, the cleaning basket comprises a front baffle and a rear baffle; the front baffle and the rear baffle are connected by a support rod; and a rotatable rotating shaft is arranged between the front baffle and the rear baffle.

[0016] Specifically, the rotating shaft has a plurality of equidistantly arranged grooves.

[0017] Compared with the prior art, the beneficial effects are as follows:

[0018] Good leveling effect: the V-shaped guide wheel is driven to rotate by the motor and the speed reducer, and the wafer is accurately leveled by the effective clamping of the clamping assembly, thereby improving the flatness of the wafer.

[0019] Stable structure: the vertical arrangement of the vertical fixing plate and the horizontal fixing plate, as well as the application of the reinforcing rib and the reinforcing plate, enhances the overall strength and stability of the mechanism, thereby ensuring the reliability of the leveling process.

[0020] Equipped with cleaning function: The detachable cleaning basket design, along with the setting of the pivot and groove, facilitates the cleaning of wafers, improves production efficiency, and reduces additional cleaning steps.

[0021] Highly adjustable: The combination of the Z-axis motor and the lifting bolts allows the horizontal fixed plate to move in the vertical plane, and can be flexibly adjusted according to different process requirements. Attached Figure Description

[0022] The accompanying drawings are included to provide a further understanding of the embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and, together with the description, serve to explain the principles of this application. Other embodiments and many anticipated advantages of these embodiments will be readily recognized as they become better understood through reference to the following detailed description. Elements in the drawings are not necessarily to scale. The same reference numerals refer to corresponding similar parts.

[0023] Figure 1 This is a schematic diagram of a wafer leveling mechanism according to an embodiment of this application;

[0024] Figure 2 This is a schematic diagram of the structure of a clamping cylinder of a wafer leveling mechanism according to an embodiment of this application;

[0025] Figure 3 This is a schematic diagram of the structure of a cleaning basket of a wafer leveling mechanism according to an embodiment of this application;

[0026] Figure 4 This is a schematic diagram of the structure of a horizontal fixing plate of a wafer leveling mechanism according to an embodiment of this application;

[0027] Figure 5 This is a schematic diagram of the structure of a vertical fixing plate of a wafer leveling mechanism according to an embodiment of this application.

[0028] The meanings of the numbers in the diagram are as follows: 1. Z-axis motor; 2. Cleaning basket; 3. Clamping assembly; 4. V-shaped guide wheel; 5. Guide wheel lifting cylinder; 6. Reducer; 7. Motor; 8. Horizontal fixed plate; 9. Vertical fixed plate; 2a. Rotating shaft; 2b. Baffle; 2c. Support rod; 3a. Chuck; 3b. Clamping cylinder; 1a. Lifting bolt; 8a. Positioning block; 8b. Upper reinforcing rib; 8c. Lower reinforcing rib; 8d. Reinforcing plate. Detailed Implementation

[0029] In the following detailed description, reference is made to the accompanying drawings, which form part of the detailed description and illustrate illustrative specific embodiments in which the present application may be practiced. In this regard, directional terms such as “top,” “bottom,” “left,” “right,” “up,” “down,” etc., are used with reference to the orientation of the described figures. Because components of the embodiments can be positioned in several different orientations, directional terms are used for illustrative purposes and are by no means limiting. It should be understood that other embodiments may be utilized or logical changes may be made without departing from the scope of the present application. Therefore, the following detailed description should not be taken in a limiting sense, and the scope of the present application is defined by the appended claims.

[0030] Figure 1 This is a schematic diagram of a wafer leveling mechanism according to an embodiment of this application, as shown below. Figure 1 As shown, a wafer leveling mechanism includes: at least one clamping component 3, a V-shaped guide wheel 4, a reducer 6, and a motor 7; the motor 7 drives the V-shaped guide wheel 4 to rotate through the reducer 6; the clamping component 3 and the V-shaped guide wheel 4 are arranged on the same normal plane of the wafer leveling mechanism. The motor and reducer work together to drive the V-shaped guide wheel, providing stable rotational power and torque control. The coplanar arrangement of the clamping component and the guide wheel ensures precise alignment of the wafer leveling path and reduces mechanical interference.

[0031] Specifically, the system comprises a horizontal fixing plate 8, a vertical fixing plate 9, a Z-axis motor 1, and a cleaning basket 2. The vertical fixing plate 9 and the horizontal fixing plate 8 are arranged perpendicularly to each other, and the vertical fixing plate 9, the clamping assembly 3, and the V-shaped guide wheel 4 are on the same normal plane. The Z-axis motor 1 is located on one side of the horizontal fixing plate 8 and below the motor 7. The cleaning basket 2 is detachably mounted on the horizontal fixing plate 8. The vertical layout of the horizontal and vertical fixing plates achieves a compact structure, facilitating maintenance and functional expansion. Furthermore, the detachable design of the cleaning basket meets the requirement of integrating the leveling and cleaning processes, reducing the risk of wafer transport damage.

[0032] Figure 4 This is a schematic diagram of the structure of a horizontal fixing plate of a wafer leveling mechanism according to an embodiment of this application, as shown below. Figure 4 As shown, it also includes reinforcing ribs and reinforcing plates; upper reinforcing rib 8b and lower reinforcing rib 8c are disposed on the upper and lower surfaces of one end of the horizontal fixed plate 8; the reinforcing plate is disposed on the lower surface of the horizontal fixed plate 8 and is fixedly connected to the lower reinforcing rib 8c. The combination of reinforcing ribs and reinforcing plates improves the bending stiffness of the horizontal fixed plate, especially to avoid deformation when leveling high-hardness wafers; and the multi-point fixed design disperses stress and extends the equipment life.

[0033] A through hole is provided on the horizontal fixing plate 8 to accommodate the cleaning basket 2; and positioning blocks 8a are provided around the through hole. The positioning block design around the through hole enables the cleaning basket to be quickly aligned and installed with an error of ≤0.1mm, reducing the cost of manual calibration.

[0034] Figure 5 This is a schematic diagram of the structure of a vertical fixing plate of a wafer leveling mechanism according to an embodiment of this application, as shown below. Figure 5 As shown, it also includes a lifting bolt 1a; one end of the lifting bolt 1a is connected to the horizontal fixing plate 8 and fixed to the reinforcing plate, and the lifting bolt 1a is driven by the Z-axis motor 1, thereby driving the horizontal fixing plate 8 to move in the vertical plane. The Z-axis motor drives the lifting bolt to achieve millimeter-level fine adjustment, adapting to the leveling requirements of wafers of different thicknesses; combined with the reinforcing plate fixing design, it ensures the stability and repeatability of the lifting process.

[0035] Figure 2 This is a schematic diagram of the clamping cylinder of a wafer leveling mechanism according to an embodiment of this application, as shown below. Figure 2 As shown, the clamping assembly 3 includes: a chuck 3a and a clamping cylinder 3b; the chuck 3a is disposed at the front end of the clamping cylinder 3b and is driven to move by the clamping cylinder 3b.

[0036] Specifically, the chuck 3a is used to clamp the edge of the wafer, and the contact depth between the chuck 3a and the edge of the wafer is ≤2.5mm. This design can ensure effective clamping of the wafer while avoiding excessive compression and damage. The clamping assembly 3 and the V-shaped guide wheel are set on the same normal plane of the wafer leveling mechanism to jointly complete the wafer leveling operation.

[0037] Figure 3 This is a schematic diagram of the cleaning basket of a wafer leveling mechanism according to an embodiment of this application, as shown below. Figure 3 As shown, specifically, the cleaning basket 2 includes a front baffle 2b and a rear baffle 2b; the front baffle 2b and the rear baffle 2b are connected by a support rod 2c; and a rotatable shaft 2a is provided between the front baffle 2b and the rear baffle 2b. The shaft 2a has multiple equally spaced grooves. The design of the rotatable shaft and grooves makes the wafer evenly stressed in the cleaning solution, reducing residual contamination (cleaning efficiency is improved by 30%). The groove spacing accuracy is ±0.05mm to prevent wafer displacement and collision.

[0038] It is obvious that those skilled in the art can make various modifications and alterations to the embodiments of this application without departing from the spirit and scope of this application. In this way, this application also aims to cover such modifications and alterations if they fall within the scope of the claims and their equivalents. The word "comprising" does not exclude the presence of other elements or steps not listed in the claims. The simple fact that certain measures are described in mutually different dependent claims does not indicate that a combination of these measures cannot be used for profit. Any reference numerals in the claims should not be considered limiting in scope.

Claims

1. A wafer leveling mechanism, characterized in that, include: The wafer leveling mechanism includes at least one clamping component, a V-shaped guide wheel, a reducer, and a motor; the motor drives the V-shaped guide wheel to rotate via the reducer; the clamping component and the V-shaped guide wheel are disposed on the same normal plane as the wafer leveling mechanism.

2. The wafer leveling mechanism according to claim 1, characterized in that, Also includes: The system comprises a horizontal fixing plate, a vertical fixing plate, a Z-axis motor, and a cleaning basket; the vertical fixing plate and the horizontal fixing plate are arranged perpendicularly to each other, and the vertical fixing plate, the clamping assembly, and the V-shaped guide wheel are in the same normal plane; the Z-axis motor is located on one side of the horizontal fixing plate and below the motor; the cleaning basket is detachably mounted on the horizontal fixing plate.

3. A wafer leveling mechanism according to claim 2, characterized in that, It also includes reinforcing ribs and reinforcing plates; the reinforcing ribs are disposed on the upper and lower surfaces of one end of the horizontal fixing plate; the reinforcing plate is disposed on the lower surface of the horizontal fixing plate and is fixedly connected to the reinforcing ribs.

4. A wafer leveling mechanism according to claim 3, characterized in that, It also includes a lifting bolt; one end of the lifting bolt is connected to the horizontal fixing plate and fixed to the reinforcing plate, and the lifting bolt is driven by the Z-axis motor, thereby driving the horizontal fixing plate to move in the vertical plane.

5. A wafer leveling mechanism according to claim 2, characterized in that, The horizontal fixing plate has a through hole for accommodating the washing basket; and positioning blocks are provided around the through hole.

6. A wafer leveling mechanism according to claim 1, characterized in that, The clamping assembly includes: a chuck and a clamping cylinder; the chuck is disposed at the front end of the clamping cylinder and is driven to move by the clamping cylinder.

7. A wafer leveling mechanism according to claim 6, characterized in that, The chuck is used to clamp the edge of the wafer, and the contact depth between the chuck and the edge of the wafer is ≤2.5mm.

8. A wafer leveling mechanism according to claim 2, characterized in that, The cleaning basket includes a front baffle and a rear baffle; the front baffle and the rear baffle are connected by a support rod; and a rotatable shaft is provided between the front baffle and the rear baffle.

9. A wafer leveling mechanism according to claim 8, characterized in that, The rotating shaft has multiple equally spaced grooves.

Images