Wafer stripping device for detecting wafer stripping condition

Abstract

The utility model discloses a wafer stripping device for detecting the stripping condition of a wafer. The stripping device comprises a base, a conveying assembly and a stripping assembly, the conveying assembly comprises a conveying piece and two guide rails arranged in parallel. The two guide rails are arranged on the base and extend in the front-back direction. The transmission piece is slidably arranged on the guide rail, and a bottom support for bearing a crystal ingot is arranged on the top surface; the stripping assembly comprises a lifting assembly, a supporting piece, a clamp and correlation type optical sensors arranged on the left side and the right side of the conveying assembly respectively. The lifting assembly is at least partially arranged on the base; the supporting piece is at least partially arranged on the lifting assembly and can move in the vertical direction of the lifting assembly. The clamp is at least partially arranged on the bottom face of the supporting piece. The correlation type optical sensor is at least partially arranged at the bottom of the lifting assembly. Through the arrangement, when the stripping device is used for stripping the wafer, whether the crystal ingot is clamped by the clamp together with the crystal ingot to be separated from the tray or not can be detected, so that a worker can deal with the abnormal condition in time, and the influence on the subsequent process is avoided.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a wafer stripping device for detecting wafer stripping status. Background Technology

[0002] Laser technology plays a crucial role in wafer separation. First, the laser processes the material to form a modified layer and cracks, then physically separates the wafer from the ingot. This modified layer, through the high energy of the laser, forms tiny fracture zones or weakened regions on specific layers of the ingot, effectively reducing the bonding force between the ingot and the wafer, making the subsequent physical separation process smoother. The formation of the modified layer not only reduces mechanical damage during wafer separation but also improves separation accuracy and product yield. After the modified layer and cracks are formed inside the ingot, an external force perpendicular to the modified layer direction is applied to the ingot by the separation device, making the cracks easily propagate and completely connect, ultimately achieving wafer separation.

[0003] In the wafer stripping process, wafers are typically transported by robotic arms. To ensure smooth wafer manufacturing, the loading and unloading of ingots must be timely and stable. In existing technologies, if the ingot is not firmly attached to the support, causing it to detach from the support during stripping, and this phenomenon is not detected and addressed promptly when using a clamping device to pick up the wafer, it can lead to collisions between the clamping device and the ingot, affecting subsequent processes and causing significant losses. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, the purpose of this utility model is to provide a wafer stripping device for detecting wafer stripping status, which can detect whether the wafer ingot has detached from the base.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A wafer stripping device for detecting wafer stripping status, used to strip wafers from ingots, includes: a base, a transport assembly, and a stripping assembly; the transport assembly includes a transmission component and two parallel guide rails; the two guide rails are disposed on the base and extend in a front-rear direction; the transmission component is slidably disposed on the guide rails, and its top surface is provided with a base for supporting the ingot; the stripping assembly includes a lifting assembly, a support component, a clamp, and through-beam optical sensors disposed on the left and right sides of the transport assembly; the lifting assembly is at least partially disposed on the base; the support component is at least partially disposed on the lifting assembly and is movable in the vertical direction along the lifting assembly; the clamp is at least partially disposed on the bottom surface of the support component; the through-beam optical sensors are at least partially disposed on the bottom of the lifting assembly.

[0007] Furthermore, the lifting assembly includes a first guide member, a second guide member, a third guide member, and a fourth guide member arranged in a square array; the first and second guide members are arranged on the left side of the conveying assembly along the front-back direction; the third and fourth guide members are arranged on the right side of the conveying assembly along the front-back direction; the first, second, third, and fourth guide members respectively pass through the four corners of the support member, and the support member can move along the up-down direction of the guide members.

[0008] Furthermore, the bottom of the first guide and the fourth guide are respectively provided with brackets for fixing the through-beam optical sensor; when the jig peels the wafer off the ingot, the transmission element is at least partially disposed in the middle of the through-beam optical sensor.

[0009] Furthermore, the distance from the laser emission port of the through-beam optical sensor to the base is greater than the distance from the top surface of the base to the base, but less than the distance from the top surface of the crystal ingot to the base.

[0010] Furthermore, the transport assembly also includes a detection device for detecting whether the wafer is damaged, which is installed at the front end of the transport assembly.

[0011] Furthermore, the base is provided with a through hole extending in the front-to-back direction; the through hole is located between two guide rails and is used to accommodate the test piece.

[0012] This invention provides a wafer stripping device for detecting wafer stripping status. The stripping device has through-beam optical sensors on both sides of the conveying assembly; when the conveying assembly transports the wafer ingot to the underside of the fixture for wafer stripping, the through-beam optical sensors can detect whether the wafer ingot is picked up by the fixture along with the wafer and detached from the tray, so that the operator can deal with the abnormal situation in time and avoid affecting subsequent processes. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the wafer stripping device for detecting wafer stripping status according to the present invention. Detailed Implementation

[0014] The technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0015] In addition, to clearly illustrate the technical solution of this application, the following are also defined: Figure 1 The top, bottom, left, right, front, and back sides are shown.

[0016] like Figure 1 As shown, this application provides a wafer stripping device for detecting wafer stripping conditions. The wafer stripping device for detecting wafer stripping conditions includes a base 11, a transport assembly 12, and a stripping assembly 13.

[0017] The conveying assembly 12 includes a conveying component 121 and two parallel guide rails 122. The two guide rails 122 are mounted on the base 11 and extend in the front-back direction. The conveying component 121 is slidably mounted on the guide rails 122, and its top surface is provided with a base support 123 for supporting the crystal ingot.

[0018] The stripping assembly 13 includes a lifting assembly 131, a support member 132, a clamp 133, and a through-beam optical sensor 134. Specifically, the lifting assembly 131 is at least partially disposed on the base 11. The support member 132 is at least partially disposed on the lifting assembly 131 and is movable along the vertical direction of the lifting assembly 131. The clamp 133 is at least partially disposed on the bottom surface of the support member 132. The clamp may be an adsorption plate. The through-beam optical sensor 134 is at least partially disposed on the base 11 of the lifting assembly 131 and is located on both sides of the conveying assembly 12.

[0019] The specific stripping steps include: placing the ingot on the base 123 and conveying it to the underside of the stripping assembly 13 via the transport member 121. The lifting assembly 131 lowers the support member 132 so that the clamp 133 can grip the wafer from the ingot. Through-beam optical sensors 134 are located on both sides of the ingot and remain in the on state to detect whether the ingot has detached from the base 123.

[0020] With the above settings, the wafer stripping device for detecting wafer stripping status can detect in a timely manner whether the wafer ingot has detached from the base 123, so that the staff can deal with the abnormal state of wafer stripping in a timely manner and avoid affecting subsequent processes.

[0021] Specifically, the lifting assembly 131 includes a first guide member 1311, a second guide member 1312, a third guide member 1313, and a fourth guide member 1314 arranged in a square array. The first guide member 1311 and the second guide member 1312 are positioned along the front-to-back direction on the left side of the conveying assembly 12, and their bottoms are fixed to the base 11 via a first base plate 1315. The third guide member 1313 and the fourth guide member 1314 are positioned along the front-to-back direction on the right side of the conveying assembly 12, and their bottoms are fixed to the base 11 via a second base plate 1316. The first guide member 1311, the second guide member 1312, the third guide member 1313, and the fourth guide member 1314 pass through the four corners of the support member 132, allowing the support member 132 to move vertically along the guide members. The guide members can be configured as guide shafts, and the support member 132 can be connected to the guide members via bearings to reduce movement deviation of the support member 132. It is understood that the guide members can also be configured as telescopic cylinders or other devices capable of driving the support member 132 to move vertically.

[0022] More specifically, the bottoms of the first guide 1311 and the fourth guide 1314 are respectively provided with brackets 1317 for fixing the through-beam optical sensor 134. When the jig 133 peels the wafer off the ingot, the transfer member 121 is at least partially disposed in the middle of the through-beam optical sensor 134, so that whether the emitted laser is blocked can be used to determine whether the ingot has detached from the base 123. It is understood that brackets 1317 may also be provided at the bottoms of the second guide 1312 and the third guide 1313 to fix the through-beam optical sensor 134.

[0023] Furthermore, the distance between the laser emission port of the through-beam optical sensor 134 and the base 11 is greater than the distance between the top surface of the base 123 and the base 11, but less than the distance between the top surface of the crystal ingot and the base 11, thereby ensuring that the laser emitted by the through-beam optical sensor 134 is not blocked by the base 123 and thus does not affect the detection results.

[0024] like Figure 1 As shown, the transport assembly 12 also includes a detection element 124 for detecting whether the wafer is damaged. The detection element 124 is mounted at the front end of the transport member 121 and connected to the bottom of the transport member 121 via a fixing member 125, for detecting whether the wafer held by the clamp 133 is damaged. The detection element 124 can be configured as a camera lens. Specifically, the base 11 has a through hole 111 extending in the front-rear direction. The through hole 111 is located between two guide rails 122 and is used to accommodate the detection element 124. When the transport member 121 moves along the extension direction of the guide rails 122, the detection element 124 can move within the through hole 111.

[0025] The above description of embodiments of the present invention, through which those skilled in the art are able to implement or use the present invention, will be readily apparent to those skilled in the art. Various modifications to these embodiments will be readily apparent to those skilled in the art. The general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novelty disclosed herein.

Claims

1. A wafer stripping device for detecting wafer stripping status, used to strip wafers from a wafer ingot, characterized in that, include: Base (11); The conveying assembly (12) includes a conveying component (121) and two parallel guide rails (122); the two guide rails (122) are disposed on the base (11) and extend in the front-back direction; the conveying component (121) is slidably disposed on the guide rails (122) and has a bottom support (123) on its top surface for supporting the crystal ingot. The peeling assembly (13) includes a lifting assembly (131), a support member (132), a clamp (133), and through-beam optical sensors (134) disposed on the left and right sides of the conveying assembly (12). The lifting assembly (131) is at least partially disposed on the base (11). The support member (132) is at least partially disposed on the lifting assembly (131) and can move along the vertical direction of the lifting assembly (131). The clamp (133) is at least partially disposed on the bottom surface of the support member (132). The through-beam optical sensor (134) is at least partially disposed on the bottom of the lifting assembly (131).

2. The wafer stripping apparatus for detecting wafer stripping status as described in claim 1, characterized in that, The lifting assembly (131) includes a first guide (1311), a second guide (1312), a third guide (1313), and a fourth guide (1314) arranged in a square array. The first guide (1311) and the second guide (1312) are arranged on the right side of the conveying assembly (12) in the front-back direction. The third guide (1313) and the fourth guide (1314) are arranged on the left side of the conveying assembly (12) in the front-back direction. The first guide (1311), the second guide (1312), the third guide (1313), and the fourth guide (1314) pass through the four corners of the support member (132), and the support member (132) can move along the up-down direction of the guide.

3. The wafer stripping apparatus for detecting wafer stripping status as described in claim 2, characterized in that, The bottom of the first guide (1311) and the fourth guide (1314) are respectively provided with brackets (1317) for fixing the through-beam optical sensor (134); when the jig (133) peels the wafer off the ingot, the transport member (121) is at least partially disposed in the middle of the through-beam optical sensor (134).

4. The wafer stripping apparatus for detecting wafer stripping status as described in claim 3, characterized in that, The distance from the laser emission port of the through-beam optical sensor (134) to the base (11) is greater than the distance from the top surface of the base (123) to the base (11), but less than the distance from the top surface of the ingot to the base (11).

5. The wafer stripping apparatus for detecting wafer stripping status as described in claim 1, characterized in that, The transport assembly (12) also includes a detection element (124) for detecting whether the wafer is damaged, the detection element (124) being mounted at the front end of the transport element (121).

6. The wafer stripping apparatus for detecting wafer stripping status as described in claim 5, characterized in that, The base (11) is provided with a through hole (111) extending in the front-back direction; the through hole (111) is disposed between the two guide rails (122) for accommodating the detection piece (124).

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