Air inlet system and semiconductor process equipment
By introducing an intake and exhaust channel connected to the main intake module into the rapid intake module, and using the cavity of the main intake module for flow meter calibration, the problem of inaccurate calibration results of the rapid intake module is solved, and high-precision and consistent flow meter calibration is achieved.
Patent Information
- Application Number
- CN202520309962.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-25
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2035-02-25
AI Technical Summary
In existing intake systems, the rapid intake module uses a reaction chamber for flow correction, resulting in poor calibration accuracy. Furthermore, the calibration results of the main intake module and the rapid intake module have inherent errors.
By introducing an intake and exhaust channel connected to the main intake module into the rapid intake module, and using the cavity of the main intake module for flow meter calibration, closing the valve of the reaction chamber, using a pneumatic diaphragm valve to isolate the internal and external environments, and designing a variable diameter connection pipeline to improve calibration accuracy and consistency.
The calibration accuracy and consistency of the rapid air intake module flow meter have been improved, with the calibration error controlled within ±0.5, meeting process requirements.
Smart Images
Figure CN223884395U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor manufacturing equipment, in particular to an air inlet system and a semiconductor process equipment. BACKGROUND
[0002] The main components of the CCP etching machine include a reaction chamber, an air inlet system, upper and lower electrodes, etc. Among them, the air inlet system is responsible for transporting gas to the reaction chamber during the process, cooperating with the radio frequency system to form plasma, and etching the wafer.
[0003] In order to adapt to the high requirements of the process on the control accuracy of the inlet flow of some small range gases in the air inlet system, the existing air inlet system generally includes a main air inlet module (main-gasbox) and a quick air inlet module (Q-gasbox). Compared with the main air inlet module, the quick air inlet module has the advantages of being closer to the reaction chamber, controlling smaller and more accurate flow, and responding faster, which has a more accurate influence on the process result, so the accuracy of the gas flowing into the chamber in the quick air inlet module has a very important influence on the process result.
[0004] At present, the flow meter (MFC) calibration of the main air inlet module can be calibrated through the tank inside the main-gasbox, while the quick air inlet module has no tank inside and can only be calibrated through the reaction chamber. The volume of the reaction chamber is relatively large, such as about 80L, but the gas inside the quick air inlet module is generally controlled by a small range flow meter, such as a range not exceeding 400sccm. The use of a small range flow meter for calibration in a large volume reaction chamber is too disturbed and is extremely prone to cause inconsistent calibration results before and after calibration. SUMMARY
[0005] In view of the above technical problems, the present application provides an air inlet system and a semiconductor process equipment, which can improve the problem that the calibration accuracy is poor due to the use of the reaction chamber for flow calibration of the quick air inlet module (Q-gasbox) in the existing air inlet system.
[0006] To solve the above technical problems, in a first aspect, the present application provides an air inlet system for supplying air to a reaction chamber of a semiconductor process equipment, comprising:
[0007] a main air inlet module for connecting a first flow of gas source;
[0008] a quick air inlet module, which is internally provided with an air inlet channel and an air outlet channel in communication with each other, the air inlet channel is used to connect a second flow of gas source, and the air outlet channel is used to connect the reaction chamber, wherein the second flow is smaller than the first flow;
[0009] The first connecting pipeline has one end communicated with the main air inlet module and the other end communicated with the air outlet channel, and the first connecting pipeline is provided with a first valve;
[0010] The second connecting pipeline has one end communicated with the main air inlet module and the other end communicated with the air inlet channel, and the second connecting pipeline is provided with a second valve.
[0011] Optionally, the first valve is a pneumatic diaphragm valve, and / or the second valve is a pneumatic diaphragm valve.
[0012] Optionally, the first connecting pipeline is further provided with a filter, and the filter is arranged on the pipeline between the first valve and the main air inlet module.
[0013] Optionally, the air inlet system further comprises:
[0014] The third connecting pipeline has one end connected with the main air inlet module and the other end connected with one end of the first connecting pipeline close to the main air inlet module and connected with one end of the second connecting pipeline close to the rapid air inlet module.
[0015] Optionally, the diameter of the third connecting pipeline is greater than the diameter of the second connecting pipeline.
[0016] Optionally, the diameter of the third connecting pipeline is 1 / 2 inch.
[0017] The diameter of the second connecting pipeline is 1 / 4 inch.
[0018] Optionally, the second connecting pipeline is connected by a 1 / 4 inch pipeline and a 1 / 2 inch pipeline from the second valve to the air inlet channel.
[0019] Optionally, when the flow meter of the rapid air inlet module is calibrated, the first valve is closed and the second valve is opened.
[0020] Optionally, when the semiconductor process equipment is processing, the first valve is opened and the second valve is closed.
[0021] In a second aspect, the embodiments of the present application further provide a semiconductor process equipment comprising a reaction cavity and an air inlet system as described in the above embodiments.
[0022] The reaction cavity is connected with the air outlet channel.
[0023] The intake system of the application can calibrate the flow meter of the rapid intake module by closing the first valve and opening the second valve, and the small flow gas entering the intake passage of the rapid intake module can enter the cavity of the main intake module from the second connecting pipeline for calibration. Since the volume of the cavity of the main intake module is much smaller than that of the reaction cavity, the calibration accuracy of the flow meter of the rapid intake module can be greatly improved, and since the flow meters of the main intake module and the rapid intake module use the same cavity for calibration, the consistency of the calibration results can be improved. BRIEF DESCRIPTION OF DRAWINGS
[0024] The drawings incorporated in and forming a part of the specification, illustrate preferred embodiments of the present application and, together with the description, serve to explain the principles of the application. In the drawings:
[0025] Figure 1 is a schematic diagram of a prior art intake system, wherein (a) is a schematic diagram of the whole, and (b) is a schematic diagram of a rapid intake module;
[0026] Figure 2 is Figure 1 is a schematic diagram of a connecting pipeline connecting the main intake module and the rapid intake module;
[0027] Figure 3 is a schematic diagram of a prior art intake system, wherein (a) is a schematic diagram of the whole, and (b) is a schematic diagram of a rapid intake module;
[0028] Figure 4 is a schematic diagram of a connecting pipeline connecting the main intake module and the rapid intake module;
[0029] Figure 5 is a measurement value deviation curve of the intake system provided by the comparative example for calibrating the flow meter of the rapid intake module;
[0030] Figure 6 is a measurement value deviation curve of the intake system provided by the comparative example for calibrating the flow meter of the rapid intake module;
[0031] The implementation, functional features and advantages of the application will be further described with reference to the embodiments and the accompanying drawings. The above drawings have shown the specific embodiments of the application, and will be described in more detail in the following. These drawings and textual descriptions are not intended to limit the scope of the concept of the application in any way, but to illustrate the concept of the application to those skilled in the art by referring to specific embodiments. Detailed Implementation
[0032] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.
[0033] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, components, features, and elements with the same names in different embodiments of this application may have the same meaning or different meanings, the specific meaning of which must be determined by its interpretation in that specific embodiment or further in conjunction with the context of that specific embodiment.
[0034] It should be further understood that the terms "comprising" or "including" indicate the presence of the stated features, steps, operations, elements, components, items, types, and / or groups, but do not exclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, types, and / or groups. The terms "or," "and / or," and "comprising at least one of the following," as used in this application, can be interpreted as inclusive, or mean any one or any combination thereof. For example, "comprising at least one of the following: A, B, C" means "any one of the following: A; B; C; A and B; A and C; B and C; A and B and C," and similarly, "A, B, or C" or "A, B, and / or C" means "any one of the following: A; B; C; A and B; A and C; B and C; A and B and C." Exceptions to this definition only occur when the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.
[0035] It should be understood that, although the terms first, second, third, etc. can be employed in this text to describe various information, the information should not be limited to these terms. These terms are only used to distinguish one type of information from another type of information. For example, without departing from the scope of this text, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information. Depending on the context, the singular forms "a", "an" and "the" used in this text are intended to include the plural forms, unless the context indicates the contrary.
[0036] It should be understood that the terms "top", "bottom", "upper", "lower", "vertical", "horizontal" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.
[0037] For the convenience of description, in the following embodiments, the orthogonal space determined by the horizontal plane and the vertical direction is taken as an example for description, which should not be understood as a limitation on the present application.
[0038] Please refer to Figure 1 and Figure 2 , Figure 1 is a schematic diagram of an intake system of related technology, wherein (a) is a schematic diagram of the whole, (b) is a schematic diagram of a rapid intake module, Figure 2 is Figure 1 a structure diagram of the connecting pipeline in the intake system, which includes a main intake module 10a, a rapid intake module 20a, and a connecting pipeline 30a connecting the main intake module 10a and the rapid intake module 20a, the gas outlet of the rapid intake module 20a is connected to a reaction chamber 100a, and the connecting pipeline 30a is provided with a filter 31a for filtering particulate impurities and a valve V1a for preventing gas backflow.
[0039] During the process, a large flow of gas is input from the main intake module 10a, flows through the connecting pipeline 30a and enters the reaction chamber 100a from the outflow channel 21a of the rapid intake module 20a, and a small flow of gas can be input from the gas inlet channel 22a of the rapid intake module 20a and enter the reaction chamber 100a through the outflow channel 21a.
[0040] When calibrating the MFC flow of the rapid intake module 20a, first, the gas flow into the reaction chamber 100a is set by the upper computer, the valve V1a is closed after waiting for a certain time t, the pressure of the reaction chamber 100a is read after the pressure of the reaction chamber 100a is stabilized, and the pressure change value ΔP before and after the gas is input is calculated, and the actual gas flow value Q is calculated according to the following formula (1), wherein V is the volume of the reaction chamber 100a, R is the gas constant, and T is the gas temperature.
[0041] Q = (V / RT) x (△P / t);
[0042] If Q is greater than the allowable error, the system alarms, if the Q value is less than the allowable error, the calibration process is completed, and it is considered that the flowmeter output is accurate.
[0043] However, as described above, the reaction cavity 100a is used to calibrate the flowmeter of the rapid air inlet module 20a. On the one hand, the reaction cavity 100a has a large volume, and the calibration accuracy is poor for small flow flowmeters, and is easily affected by the temperature change of the reaction cavity 100a, and the inflation time is too long to affect the efficiency of normal production. On the other hand, the main air inlet module 10a and the rapid air inlet module 20a use different detection methods. Specifically, the former uses the cavity inside the main air inlet module 10a for calibration, and the latter uses the reaction cavity 100a for calibration. This will introduce two different detection lines at the machine end, resulting in a natural error in the calibration results of the two MFCs. Based on this, the application provides an air inlet system and a semiconductor process equipment.
[0044] Please refer to Figure 3 and Figure 4 , Figure 3 is a schematic diagram of an air inlet system provided by an embodiment of the application, wherein (a) is a schematic diagram of the whole, and (b) is a schematic diagram of the rapid air inlet module, Figure 4 is a structural schematic diagram of a connecting pipeline connecting the main air inlet module and the rapid air inlet module. The air inlet system can be used to supply air to the reaction cavity 100 of the semiconductor process equipment, and the air inlet system comprises a main air inlet module 10, a rapid air inlet module 20, a first connecting pipeline 30 and a second connecting pipeline 40.
[0045] The main air inlet module 10 is used to connect a gas source with a first flow. The rapid air inlet module 20 is internally provided with an air outlet channel 21 and an air inlet channel 22 which are in communication with each other. The air inlet channel 22 is used to connect a gas source with a second flow, and the air outlet channel 21 is used to connect the reaction cavity 100. The second flow is smaller than the first flow. It can be understood that the first flow can correspond to a large flow of gas, and the second flow can correspond to a small flow of gas. When the small flow of gas is input, the flow needs to be accurately controlled to avoid a large impact on the process. In actual application, the main air inlet module 10 can connect multiple large flow of gas, and correspondingly, multiple MFCs are provided in the main air inlet module 10. Each MFC of the large flow of gas needs to be calibrated independently. Similarly, the rapid air inlet module 20 can connect multiple small flow of gas, and correspondingly, multiple MFCs are provided in the rapid air inlet module 20. Each MFC of the small flow of gas also needs to be calibrated independently. The application only takes one large flow of gas and one small flow of gas as an example for description.
[0046] One end of the first connecting pipeline 30 is in communication with the main air inlet module 10, and the other end is in communication with the air outlet channel 21 of the rapid air inlet module 20. The first connecting pipeline 30 is provided with a first valve V1. One end of the second connecting pipeline 40 is in communication with the main air inlet module 10, and the other end is in communication with the air inlet channel 22 of the rapid air inlet module 20. The second connecting pipeline 40 is provided with a second valve V2.
[0047] It should be noted that the first connecting pipeline 30 can be directly connected with the main air inlet module 10, or can be connected with the main air inlet module 10 through other pipelines. The second connecting pipeline 40 can also be independently selected as described above, and the embodiments of the present application are not particularly limited.
[0048] Exemplarily, the main air inlet module 10 is used to connect a large-flow gas source, and the rapid air inlet module 20 is used to connect a small-flow gas source. The large-flow gas flows through the first connecting pipeline 30 and then enters the reaction cavity 100 through the air outlet channel 21 of the rapid air inlet module 20. The small-flow gas directly enters from the air inlet channel 22 of the rapid air inlet module 20 and flows through the air outlet channel 21 to enter the reaction cavity 100. Compared with the main air inlet module 10, the rapid air inlet module 20 is directly connected with the reaction cavity 100 and is closer to the reaction cavity, and has the advantages of more accurate flow control and faster response speed, so that the process can be more accurately controlled.
[0049] In the air inlet system of the embodiment, the flow meters of the main air inlet module 10 and the rapid air inlet module 20 can be calibrated through the tank 11 inside the main air inlet module 10.
[0050] The calibration process of the main air inlet module 10 is as follows: the gas flow of the flow meter of the main air inlet module 10 can be set in the upper computer, then the valve V3 at the far end (close to the reaction cavity 100) of the flow meter of the main air inlet module 10 is closed, and the valve V4 at the near end (close to the air inlet side) of the flow meter of the main air inlet module 10 is opened. The large-flow gas enters the tank 11 (provided with a pressure sensor) of the main air inlet module 10, the air inlet valve is closed after a predetermined time, the change of the pressure meter reading of the tank 11 inside the main air inlet module 10 within the predetermined time is calculated, and then the actual gas flow value can be calculated according to the formula described above. If the flow value is greater than the allowable error, an alarm is issued to prompt that the output deviation of the flow meter is large; if the flow value is less than the allowable error, it is considered that the output of the flow meter is accurate, and the calibration process of the main air inlet module 10 is ended.
[0051] The calibration process of the rapid intake module 20 is as follows: the gas flow of the flow meter of the rapid intake module 20 can be set in the host computer, then the first valve V1 is closed and the second valve V2 is opened, and the small flow gas entering the intake passage 22 of the rapid intake module 20 can enter the cavity 11 of the main intake module 10 from the second connecting pipeline 40. Since the first valve V1 is closed, the small flow gas can be prevented from flowing back during calibration. After the preset time of ventilation, the intake valve is closed, the change of the pressure gauge reading of the cavity 11 inside the main intake module 10 within the preset time is calculated, and the actual gas flow value can be calculated according to the formula described above. If the flow value is greater than the allowable error, an alarm is issued to prompt that the output deviation of the flow meter is large; if the flow value is less than the allowable error, it is considered that the output of the flow meter is accurate, and the calibration process of the main intake module 10 is ended. It should be noted that when calibrating the flow meter of the rapid intake module 20, the valve (not shown in the figure) between the rapid intake module 20 and the reaction chamber 100 can be closed to block the small flow gas from entering the reaction chamber 100.
[0052] The flow meter of the rapid intake module 20 in the embodiment is also calibrated by the cavity 11 of the main intake module 10. Since the volume of the cavity 11 is much smaller than that of the reaction chamber 100, the calibration accuracy of the flow meter of the rapid intake module 20 can be greatly improved, and since the flow meters of the main intake module 10 and the rapid intake module 20 are calibrated by the same cavity 11, the consistency of the calibration results can be improved.
[0053] It should be noted that when calibrating the flow meter of the small flow gas, the proportional flow controller (FRC) V5 connected between the reaction chamber 100 and the rapid intake module 20 can be closed, so that the small flow gas only flows into the cavity 11 of the main intake module 10.
[0054] It can be understood that when calibrating the flow meter of the rapid intake module 20, the first valve V1 is closed and the second valve V2 is opened. When the process is performed, the gas enters the reaction chamber 100 from the main intake module 10 and the rapid intake module 20, so the first valve V1 is opened and the second valve V2 is closed.
[0055] In one embodiment, the first valve V1 can be a pneumatic diaphragm valve, and the second valve V2 can also be a pneumatic diaphragm valve. The pneumatic diaphragm valve used in the embodiment can effectively isolate the internal and external environments and prevent corrosive gas from corroding the parts outside the valve.
[0056] In one embodiment, please continue to refer to Figure 3The filter 31 can filter impurities brought by the gas from the main air inlet module 10, so as to avoid the impurities directly entering the reaction cavity 100. Meanwhile, the gas flow direction of the filter 31 is one-way, which can prevent the gas from flowing reversely in the pipeline. For example, the gas in the first connecting pipeline 30 can only transmit downward (toward the one end of the fast air inlet module 20), but cannot transmit upward; the gas in the second connecting pipeline 40 can only transmit upward, but cannot transmit downward.
[0057] In an embodiment, please refer to Figure 4 The air inlet system can further include a third connecting pipeline 50, one end of the third connecting pipeline 50 is connected with the main air inlet module 10, the other end is connected with the one end of the first connecting pipeline 30 close to the main air inlet module 10, and is connected with the one end of the second connecting pipeline 40 close to the fast air inlet module 20. That is, in the embodiment, the first connecting pipeline 30 and the second connecting pipeline 40 are both communicated with the main air inlet module 10 through the third connecting pipeline 50. Figure 2 Compared with the connecting pipeline of , the embodiment increases the second connecting pipeline 40 and the third connecting pipeline 50, which constitute the calibration loop of the fast air inlet module 20, so as to realize the calibration of the flow meter of the fast air inlet module 20 by the cavity 11 in the main air inlet module 10.
[0058] Preferably, please refer to Figure 4 The pipe diameter of the third connecting pipeline 50 is greater than that of the second connecting pipeline 40, the third connecting pipeline 50 can adopt a pipeline with a normal gas supply diameter, and the pipe diameter of the second connecting pipeline 40 can be selected as a smaller size, so that the small flow gas can enter the cavity 11 in the main air inlet module 10 at a faster speed. Exemplarily, the pipe diameter of the third connecting pipeline 50 can be 1 / 2 inch, and the pipe diameter of the second connecting pipeline 40 can be 1 / 4 inch. The smaller pipe diameter of the second connecting pipeline 40 can improve the flow speed of the small flow gas.
[0059] In an embodiment, please refer to Figure 4 The second connecting pipeline 40 is connected by a 1 / 4 inch pipeline 41 and a 1 / 2 inch pipeline 42. The variable diameter design can increase the flow speed of the small flow gas entering the second connecting pipeline 40 during calibration.
[0060] The air inlet systems of Figure 1 (a comparative example, calibrated by the reaction cavity 100a) and Figure 3 (an embodiment of the present application, calibrated by the cavity 11) are respectively used to calibrate the flow meter of the fast air inlet module 20, wherein Table 1 and Figure 5 are the calibration results and the measurement value deviation curve of the comparative example, and Table 2 andFigure 6 The calibration results and the measurement value deviation curves of the embodiments of the present application are shown in the figure. The horizontal coordinate error 10% in the figure represents the error of the gas at 10% of the full scale (for example, if the full scale of the gas is 100 sccm, the point represents the calibration error of the MFC flow of 10 sccm, and the like), and the vertical coordinate represents the deviation range of the actual flow from the theoretical flow.
[0061] Table 1: Calibration results of the flowmeter of the rapid gas inlet module of the comparative example
[0062]
[0063] Table 2: Calibration results of the flowmeter of the rapid gas inlet module of the embodiment of the present application
[0064]
[0065] From the above Figure 5 and Figure 6 It can be seen that the calibration error of the comparative example is larger than that of the embodiment of the present application, and intuitively reflects that the curve fluctuation is larger. Taking C4F6 as an example, when the reaction chamber 100a is used for calibration, the error at the point of Error 10% is 7% away from the detection reference, but at the point of Error 30%, it is about -1% away from the detection reference, and the fluctuation range is between -1% and 7%. Such calibration accuracy obviously does not meet the needs of process use. The error fluctuation of the other three gases (CH2F2, CHF3, CH3F) is about 3% to 1%, 3% to 4%, and -2% to 5%. In the present application, the fluctuation range of C4F6 is about -6.5% to -5.5%, and the error fluctuation of the other three gases (CH2F2, CHF3, CH3F) is about 0% to 1.8%, -1% to 0%, and 1.8% to 2.2%.
[0066] After further correction by software, the calibration results of the comparative example and the embodiment of the present application are shown in Table 1 and Table 2, respectively. The calibration results of the comparative example are basically controlled within ±1, while the calibration results of the embodiment of the present application can be controlled within ±0.5, and the calibration results have been obviously improved.
[0067] Please continue to refer to Figure 3 The present application also provides a semiconductor process equipment, which can include a reaction chamber 100 and a gas inlet system as described in the above embodiments. The reaction chamber 100 is connected with the gas outlet channel 21 of the rapid gas inlet module 20.
[0068] For other working principles and processes of the semiconductor process equipment of the present embodiment, please refer to the above description of the gas inlet system of the embodiments of the present application, which will not be repeated here.
[0069] The above describes in detail a gas inlet system and a semiconductor process equipment provided by the application. The principles and implementation manners of the application are described by using specific examples. It should be noted that the descriptions of the various embodiments in the application are each focused on. The parts not described or recorded in a certain embodiment can be seen from the related descriptions of other embodiments.
[0070] The above is only the preferred embodiment of the application, and does not limit the patent scope of the application. Each technical feature of the technical solution of the application can be combined arbitrarily. In order to make the description simple, each technical feature in the above embodiments is not described in all possible combinations. Any equivalent structure or equivalent flow conversion using the content of the specification and drawings, or direct or indirect application in other related technical fields, as long as the combination of these technical features does not exist contradictory, is also included in the patent protection scope of the application.
Claims
1. A gas inlet system for supplying a reaction chamber of a semiconductor processing apparatus with a gas, characterized in that The gas inlet system comprises: a main gas inlet module for connecting a first flow of gas source; a fast gas inlet module, which is internally provided with an inlet channel and an outlet channel in communication with each other, the inlet channel being used for connecting a second flow of gas source, and the outlet channel being used for connecting the reaction chamber, wherein the second flow is less than the first flow; a first connecting pipeline, one end of which is in communication with the main gas inlet module, and the other end of which is in communication with the outlet channel, and the first connecting pipeline is provided with a first valve; a second connecting pipeline, one end of which is in communication with the main gas inlet module, and the other end of which is in communication with the inlet channel, and the second connecting pipeline is provided with a second valve.
2. The air intake system of claim 1, wherein, The first valve is a pneumatic diaphragm valve; and / or the second valve is a pneumatic diaphragm valve.
3. The air intake system of claim 1, wherein, The first connecting pipeline is further provided with a filter, which is arranged on the pipeline between the first valve and the main gas inlet module.
4. The air intake system of claim 1, wherein, Further comprising: a third connecting pipeline, one end of which is connected with the main gas inlet module, and the other end of which is connected with one end of the first connecting pipeline close to the main gas inlet module, and connected with one end of the second connecting pipeline close to the fast gas inlet module.
5. The air intake system of claim 4, wherein, The pipe diameter of the third connecting pipeline is greater than that of the second connecting pipeline.
6. The air intake system of claim 5, wherein, The pipe diameter of the third connecting pipeline is 1 / 2 inch; The pipe diameter of the second connecting pipeline is 1 / 4 inch.
7. The air intake system of claim 1, wherein The pipeline from the second valve to the inlet channel of the second connecting pipeline is connected by a 1 / 4 inch pipeline and a 1 / 2 inch pipeline.
8. The air intake system of claim 1, wherein, When the flow meter of the fast gas inlet module is calibrated, the first valve is closed, and the second valve is opened.
9. The air intake system of claim 1, wherein, When the semiconductor process equipment is processing, the first valve is opened, and the second valve is closed.
10. A semiconductor process apparatus, characterized by, The reaction chamber is connected with the outlet channel. The reaction chamber is connected with the outlet channel.