High-performance heat dissipation pcb (printed circuit board)

Abstract

The utility model discloses a high-performance heat dissipation pcb board, which comprises a circuit board body, auxiliary heat dissipation mechanisms, heat absorption mechanisms and a blowing heat dissipation mechanism, a plurality of ventilation heat dissipation holes are arranged on the circuit board body, the auxiliary heat dissipation mechanisms attached to the circuit board body are arranged on the circuit board body, the heat absorption mechanisms are fixedly arranged at four top corners of the circuit board body, and the blowing heat dissipation mechanism is arranged on the circuit board body. The heat absorption mechanism comprises a liquid storage shell, a base, a threaded hole and cooling liquid, the liquid storage shell is fixed to the circuit board body, the base is fixedly connected to the bottom of the liquid storage shell, the threaded hole is formed in the base, the cooling liquid is stored in the liquid storage shell, and a blowing heat dissipation mechanism is installed at the front end of the circuit board body. The blowing heat dissipation mechanism comprises a square pipe, a miniature fan and blowing pipes, the square pipe is fixedly mounted at the front end of the circuit board body, a plurality of blowing pipes communicated with the square pipe are fixed on the square pipe, and the miniature fan is fixedly mounted at the right end of the square pipe. According to the utility model, heat dissipation of the circuit board is assisted through various heat dissipation structures, and the heat dissipation effect is better.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field especially relates to a high performance heat dissipation pcb board. BACKGROUND

[0002] The name of circuit board has: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper plate, impedance board, PCB, super thin circuit board, super thin circuit board, printing (copper etching technology) circuit board etc.Circuit board makes circuit miniaturization, intuition, for the batch production of fixed circuit and the optimization of electric appliance layout important role.Circuit board can be called printed wiring board or printed circuit board, is with polyimide or polyester film as base material makes a kind of with high reliability, excellent flexible printed circuit board.

[0003] Circuit board is divided into single-sided board, double-sided board and multilayer board according to the number of layers.Single-sided board, because the wire only appears in one side, so this PCB is called single-sided board.Double-sided board is the extension of single-sided board, when single-layer wiring cannot meet the needs of electronic products, double-sided board is used.Multilayer board refers to the printed board with three or more conductive pattern layers and insulating materials between them laminated, and the conductive pattern is interconnected according to requirements.

[0004] The circuit board generates a lot of heat when running, and the existing circuit board heat dissipation means is single, often relying on natural heat dissipation, and the heat dissipation effect is poor, which is easy to cause overheating phenomenon, affecting the operation of the circuit board, therefore, in view of the above status, it is urgent to develop a kind of high performance heat dissipation pcb board, which can assist the circuit board to dissipate heat through multiple heat dissipation structures, so as to overcome the defects in the prior art and meet the current needs. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a kind of high performance heat dissipation pcb board to solve the problems in the above background.

[0006] In order to realize the above purpose, the utility model adopts the following technical scheme:

[0007] The utility model provides a high -performance heat dissipation pcb board, including circuit board body, auxiliary heat dissipation mechanism, heat absorbing mechanism and blow heat dissipation mechanism, a plurality of ventilation heat dissipation holes are arranged on the circuit board body, the auxiliary heat dissipation mechanism is installed with the adhesion on the circuit board body, the heat absorbing mechanism is fixedly installed in the four top corners of circuit board body, the heat absorbing mechanism includes: liquid storage casing, base, screw hole and cooling liquid, the liquid storage casing is fixed with circuit board body, the bottom fixedly connected with base of liquid storage casing is provided with screw hole on the base, the cooling liquid is stored in the liquid storage casing, the blow heat dissipation mechanism is installed at the front end of circuit board body, the blow heat dissipation mechanism includes: square tube, micro fan and blow pipe, the square tube is fixedly installed at the front end of circuit board body, a plurality of blow pipes are fixed with the intercommunication of square tube, micro fan is fixedly installed at the right -hand member of square tube.

[0008] Preferably, the top of the liquid storage casing is hemispherical.

[0009] Preferably, the blow pipe points to the circuit board body.

[0010] Preferably, the left end of the square tube is closed.

[0011] Preferably, the auxiliary heat dissipation mechanism includes: first heat-conducting adhesive strip, second heat-conducting adhesive strip and heat dissipation fin, the number of first heat-conducting adhesive strip is two, two first heat-conducting adhesive strips are fixedly installed on the left and right sides of circuit board body, a plurality of second heat-conducting adhesive strips are fixedly connected between two first heat-conducting adhesive strips, a plurality of second heat-conducting adhesive strips are respectively attached to the upper and lower sides of circuit board body, a plurality of heat dissipation fins are fixed on each first heat-conducting adhesive strip. When using, the heat on the circuit board body is conducted through the first heat-conducting adhesive strip and the second heat-conducting adhesive strip, and the heat is dissipated into the air through the plurality of heat dissipation fins, thereby reducing the temperature of the circuit board body.

[0012] Preferably, the first heat-conducting adhesive strip and the second heat-conducting adhesive strip are made of acrylic heat-conducting adhesive, and the heat dissipation fins are made of copper or aluminum.

[0013] The utility model discloses a beneficial effect is: the high performance radiating pcb board, when using, the convenient airflow from the circuit board body passes through through the setting of the ventilation heat dissipation hole, improves the heat dissipation effect, and the heat on the circuit board body is conducted through the first heat conduction adhesive tape, the second heat conduction adhesive tape, and the heat is radiated to the air through a plurality of radiating fins, thereby reducing the temperature of the circuit board body, and the heat on the circuit board body is absorbed through the cooling liquid, and the air is blown into the square tube through the micro fan, and the airflow is blown to the circuit board body from a plurality of air blowing pipes, and the heat on the circuit board body is taken away through the airflow. In conclusion, the utility model discloses a plurality of heat dissipation structures to assist the circuit board heat dissipation, and the heat dissipation effect is better. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is the three-dimensional structure schematic diagram of the utility model.

[0015] Figure 2 It is the explosion drawing of the utility model.

[0016] Figure 3 It is the partial structure schematic diagram of the utility model Figure 1 .

[0017] Figure 4 It is the partial structure schematic diagram of the utility model Figure 2 .

[0018] Figure 5 It is the partial structure schematic diagram of the utility model Figure 3 .

[0019] Figure 6 It is the internal section view of the utility model Figure 5 .

[0020] Legend:

[0021] 1, circuit board body;101, ventilation heat dissipation hole;2, auxiliary heat dissipation mechanism;201, first heat conduction adhesive tape;202, second heat conduction adhesive tape;203, radiating fin;3, heat absorbing mechanism;301, liquid storage shell;302, base;303, screw hole;304, cooling liquid;4, air blowing heat dissipation mechanism;401, square tube;402, micro fan;403, air blowing pipe. DETAILED DESCRIPTION

[0022] The technical scheme in the utility model embodiment will be clearly and completely described below in combination with the drawings in the utility model embodiment, and apparently, the described embodiment is only a part of the embodiment of the utility model, not all the embodiment. Based on the embodiment in the utility model, all other embodiments obtained by the ordinary skill in the art without making the creative labor belong to the range of the utility model protection.

[0023] Specific embodiments are given below.

[0024] Referring to Figures 1-6 The utility model discloses an embodiment of high performance radiating pcb board, including circuit board body 1, auxiliary heat abstractor 2, heat absorption mechanism 3 and blow -off heat abstractor 4, be provided with a plurality of ventilation heat dissipation holes 101 on the circuit board body 1, the convenient airflow from the circuit board body 1 passes through the setting of ventilation heat dissipation hole 101, improve the heat dissipation effect, the circuit board body 1 is installed with the auxiliary heat abstractor 2 of being adhered to it, the four top corners of circuit board body 1 are all fixedly installed with heat absorption mechanism 3, heat absorption mechanism 3 includes: liquid storage casing 301, base 302, screw hole 303 and cooling liquid 304, the liquid storage casing 301 is fixed with circuit board body 1, the bottom fixedly connected of liquid storage casing 301 has base 302, be provided with screw hole 303 on base 302, the cooling liquid 304 is stored in liquid storage casing 301, the top of liquid storage casing 301 is semispherical shape, to promote the contact area of liquid storage casing 301 and air, improve its heat dissipation performance, cooling liquid 304 has higher specific heat capacity, can absorb a large amount of heat, the front end of circuit board body 1 is installed with blow -off heat abstractor 4, blow -off heat abstractor 4 includes: square tube 401, micro fan 402 and blow -off pipe 403, square tube 401 is fixedly installed at the front end of circuit board body 1, a plurality of blow -off pipe 403 are fixed on square tube 401 and are communicated with it, blow -off pipe 403 points to circuit board body 1, the right end of square tube 401 is fixedly installed with micro fan 402, the left end of square tube 401 is closed state, when using, through the air blowing of micro fan 402 to square tube 401, airflow is blown from a plurality of blow -off pipe 403 to circuit board body 1, and the heat on circuit board body 1 is taken away by airflow.

[0025] The auxiliary heat abstractor 2 includes: first heat-conducting adhesive strip 201, second heat-conducting adhesive strip 202 and heat dissipation fin 203, the number of first heat-conducting adhesive strip 201 is two, two first heat-conducting adhesive strips 201 are fixedly installed on the left and right sides of circuit board body 1, a plurality of second heat-conducting adhesive strips 202 are fixedly connected between two first heat-conducting adhesive strips 201, a plurality of second heat-conducting adhesive strips 202 are attached to the upper and lower sides of circuit board body 1, a plurality of heat dissipation fins 203 are fixedly connected to each first heat-conducting adhesive strip 201, first heat-conducting adhesive strip 201 and second heat-conducting adhesive strip 202 are made of acrylic heat-conducting adhesive, and heat dissipation fin 203 is made of copper or aluminum, so that it has good heat conductivity. When in use, the heat on the circuit board body 1 is conducted by the first heat-conducting adhesive strip 201 and the second heat-conducting adhesive strip 202, and the heat is dissipated into the air by the plurality of heat dissipation fins 203, thereby reducing the temperature of the circuit board body 1.

[0026] Working principle: the high performance heat dissipation pcb board, when using, through the setting of the ventilation heat dissipation hole 101, the air current is convenient to pass through the circuit board body 1, improves the heat dissipation effect, through the first heat conduction adhesive tape 201, the second heat conduction adhesive tape 202 conducts the heat on the circuit board body 1, through multiple heat dissipation fins 203, the heat is dissipated to the air, thereby reducing the temperature of the circuit board body 1, through the cooling liquid 304, the heat on the circuit board body 1 is absorbed, through the micro fan 402, the air current is blown to the square tube 401, the air current is blown to the circuit board body 1 from multiple air blowing pipes 403, the heat on the circuit board body 1 is taken away by the air current.

[0027] The above is only the preferred specific implementation of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art, according to the technical scheme and the utility model concept of the present application, within the technical range disclosed by the present application, makes equivalent replacement or change, should be covered in the protection scope of the present application.

Claims

1. A high performance heat dissipating pcb board characterized by, The utility model provides a circuit board cooling device, including circuit board body (1), auxiliary heat dissipation mechanism (2), heat absorption mechanism (3) and blow heat dissipation mechanism (4), be provided with a plurality of ventilation heat dissipation hole (101) on the circuit board body (1), the auxiliary heat dissipation mechanism (2) of being consistent with being installed on the circuit board body (1), the heat absorption mechanism (3) is fixedly installed in the four top corners of circuit board body (1), the heat absorption mechanism (3) includes: liquid storage casing (301), pedestal (302), screw hole (303) and cooling liquid (304), the liquid storage casing (301) is fixed with circuit board body (1), the bottom fixed connection of liquid storage casing (301) has pedestal (302), the pedestal (302) is provided with screw hole (303), the cooling liquid (304) is stored in the liquid storage casing (301), the front end of circuit board body (1) is installed blow heat dissipation mechanism (4), blow heat dissipation mechanism (4) includes: square tube (401), micro fan (402) and blow pipe (403), square tube (401) is fixedly installed in the front end of circuit board body (1), a plurality of blow pipe (403) are fixed on the square tube (401) and are communicated, the right end of square tube (401) is fixedly installed with micro fan (402).

2. The high performance heat dissipating PCB board of claim 1, wherein, The top of the liquid storage casing (301) is semispherical.

3. The high performance heat dissipating PCB board of claim 1, wherein, The blow pipe (403) points to the circuit board body (1).

4. The high performance heat dissipating PCB board of claim 1, wherein, The left end of the square tube (401) is closed.

5. The high performance heat dissipating PCB board of claim 1, wherein, The auxiliary heat dissipation mechanism (2) includes: first heat-conducting adhesive strip (201), second heat-conducting adhesive strip (202) and heat dissipation fin (203), the number of first heat-conducting adhesive strip (201) is two, two first heat-conducting adhesive strips (201) are fixedly installed on the left and right sides of circuit board body (1), a plurality of second heat-conducting adhesive strips (202) are fixedly connected between two first heat-conducting adhesive strips (201), a plurality of second heat-conducting adhesive strips (202) are respectively attached to the upper and lower sides of circuit board body (1), a plurality of heat dissipation fins (203) are fixed on each first heat-conducting adhesive strip (201).

6. The high performance heat dissipating PCB board of claim 5, wherein, The first heat-conducting adhesive strip (201) and the second heat-conducting adhesive strip (202) are made of acrylic heat-conducting adhesive, and the heat dissipation fins (203) are made of copper or aluminum.

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