Grinding disc cleaning device and chemical mechanical grinding equipment
By combining the sponge brush head and water outlet pipe design of the grinding disc cleaning device, the problem of cleaning residues and diamonds on the surface of the grinding disc is solved, thus protecting the wafer and improving the stability of the chemical mechanical polishing equipment.
Patent Information
- Application Number
- CN202520468348.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-17
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2035-03-17
AI Technical Summary
In existing chemical mechanical polishing (CMP) equipment, residues and loose diamonds on the polishing discs are difficult to clean effectively, leading to wafer scratches and affecting the stability of the polishing process.
A grinding disc cleaning device is designed, including a rotating disc and a cleaning head. The cleaning head consists of a sponge brush head and a water outlet pipe. The sponge brush head directly contacts the surface of the grinding disc and wipes away residues under the mechanical rotation of the rotating disc. The water outlet pipe is built into the sponge brush head for rinsing. The combination of mechanical brushing and rinsing enhances the cleaning effect.
It effectively removes residues and diamonds from the surface of the grinding disc, prevents wafer scratches, and improves the stability and cleaning effect of the grinding process.
Smart Images
Figure CN223885613U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of semiconductor manufacturing, more particularly, relate to a kind of polishing disc cleaning device and chemical mechanical polishing equipment. BACKGROUND
[0002] Chemical-mechanical polishing (CMP) is an important link in the production process of semiconductor wafer (wafer), and CMP is used to polish the surface of wafer by combining chemical corrosion and mechanical removal, aiming to achieve global planarization of wafer surface.
[0003] The polishing disc is a dresser used to trim the polishing pad of the chemical mechanical polishing equipment during the polishing process, and is a key consumable in the polishing process. Because the roughness of the polishing pad surface is reduced after polishing, and there are residues of complex compounds and chelates after chemical reaction, the polishing disc with high hardness and corrosion resistance can maintain the uniformity of the polishing pad surface and prolong the service life of the polishing pad. The semiconductor industry generally uses diamond in the polishing disc for trimming the polishing pad due to the hardness of diamond. However, the diamond falling from the polishing disc onto the polishing pad can cause scratches on the wafer, which can easily cause the wafer to be scrapped, causing great loss. Figure 1 The figure shows the wafer surface scratch defect, and the red dot represents the abnormal thickness position. Figure 2 The figure shows the wafer surface scratch defect, and the red dot represents the abnormal thickness position. Figure 1 The figure shows the wafer surface scratch defect, and the red dot represents the abnormal thickness position. Therefore, improving the cleaning effect of the polishing disc plays a very important role in ensuring the quality of the wafer.
[0004] At present, the CMP machine uses a fixed nozzle to flush the swing arm, top and surface of the polishing disc at the Home position. The water flow can flush away the complex compounds and chelate residues adhered to the polishing disc during trimming of the polishing pad, as well as the diamond falling off the surface of the polishing disc. However, the flushing ability of the water flow is limited, and the cleaning effect of the residues with strong adhesion or the diamond about to fall off is poor. The residues brought to the polishing pad can easily cause scratches on the wafer. UTILITY MODEL CONTENTS
[0005] The utility model aims to provide a kind of polishing disc cleaning device and chemical mechanical polishing equipment, the polishing disc cleaning device can directly contact polishing disc for cleaning, enhance cleaning effect, reduce or avoid the residues on the polishing disc to cause damage to wafer on the polishing pad.
[0006] To achieve the above purpose, the utility model adopts the technical scheme that the utility model provides a kind of polishing disc cleaning device, including rotary disc and cleaning head.
[0007] The cleaning head comprises sponge brush heads and water outlet pipes, water outlet ends of the water outlet pipes are located inside the sponge brush heads, the sponge brush heads are fixed to top surfaces of the rotating discs, the sponge brush heads and the water outlet pipes are both multiple in number, adjacent sponge brush heads are arranged at intervals, the water outlet ends of the water outlet pipes are lower than the top surfaces of the sponge brush heads, and water outlet directions of the water outlet pipes are perpendicular to the rotating discs.
[0008] In an embodiment, the abrasive disc cleaning device further comprises an anti-winding structure, the anti-winding structure comprises a stator end and a rotor end, the rotor end is fixed to the rotating disc, and the stator end is used to be connected with the water inlet pipe and the rotor end is used to be connected with the water outlet pipe.
[0009] In an embodiment, the area of the rotating disc is greater than the area of the abrasive disc.
[0010] In an embodiment, the abrasive disc cleaning device further comprises a first driving structure and a second driving structure, the first driving structure is used to drive the rotating disc to rotate, and the second driving structure is used to drive the rotating disc to move in a horizontal plane.
[0011] In an embodiment, the sponge brush head has a cylindrical outer contour, and the distance between adjacent sponge brush heads is greater than 2 mm.
[0012] In an embodiment, the water outlet pipe is a plastic water outlet pipe, and the distance between the water outlet end of the water outlet pipe and the top surface of the sponge brush head is greater than 2 mm.
[0013] In an embodiment, the sponge brush heads are arranged circumferentially with the center of the rotating disc as a center.
[0014] In an embodiment, the top surface of the rotating disc is provided with grooves, the sponge brush heads are arranged in the grooves, and the sponge brush heads are adhesively connected to the rotating disc.
[0015] In an embodiment, the top surface of the rotating disc is an inclined surface, and the thickness near the center of the rotating disc is greater than the thickness near the edge of the rotating disc.
[0016] The second aspect of the utility model provides a chemical mechanical grinding equipment, it is characterized by comprising the abrasive disc cleaning device as described above.
[0017] The cleaning device for the grinding disc provided by the utility model comprises a rotating disc and a cleaning head, the cleaning head comprises a sponge brush head and a water outlet pipe, the water outlet end of the water outlet pipe is located in the interior of the sponge brush head, the sponge brush head is fixed to the top surface of the rotating disc, the number of the sponge brush head and the water outlet pipe is multiple, the adjacent sponge brush heads are arranged at intervals, the water outlet end of the water outlet pipe is lower than the top surface of the sponge brush head, and the water outlet direction of the water outlet pipe is perpendicular to the rotating disc.
[0018] The chemical mechanical grinding equipment provided by the utility model comprises the cleaning device for the grinding disc, the sponge brush head of the cleaning device for the grinding disc can directly contact the surface of the grinding disc in the cleaning process of the grinding disc, the residues and diamonds on the surface of the grinding disc are wiped off under the action of the mechanical rotation of the rotating disc, the water outlet pipe is arranged in the sponge brush head, the surface of the grinding disc can be flushed while the sponge brush head wipes the grinding disc, the cleaning effect of the grinding disc is enhanced, the scratch of the wafer caused by the dropping of the diamonds in the grinding process of the chemical mechanical grinding equipment is prevented, and the stability of the grinding process is improved. BRIEF DESCRIPTION OF DRAWINGS
[0019] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained by those skilled in the art without creative labor on the basis of the drawings.
[0020] Figure 1 It is a schematic diagram of the scratch defect of the wafer surface, wherein the red dot represents the abnormal position of thickness;
[0021] Figure 2 It is a schematic diagram of the scratch defect of the wafer surface, wherein the red dot represents the abnormal position of thickness; Figure 1
[0022] Figure 3 It is a schematic diagram of the cleaning of the grinding disc by the cleaning device for the grinding disc provided by the embodiments of the utility model;
[0023] Figure 4 It is a schematic diagram of the structure of the cleaning head of the cleaning device for the grinding disc provided by the embodiments of the utility model;
[0024] Figure 5 The structural schematic diagram of the chemical mechanical polishing equipment is provided for the embodiments of the utility model.
[0025] In the drawings, various reference signs:
[0026] 1 - polishing disc cleaning device, 2 - polishing disc, 3 - chemical mechanical polishing equipment, 4 - mounting seat, 11 - rotating disc, 121 - sponge brush head, 122 - water outlet pipe, 31 - polishing disc, 32 - polishing pad, 33 - polishing head. DETAILED DESCRIPTION
[0027] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.
[0028] In the description of the utility model, it should be understood that the terms "include" and "have" and any variations thereof used in this paper are intended to cover non-exclusive inclusion, for example, the process, method, system, product or equipment including a series of steps or units does not have to be limited to the clearly listed steps or units, but can include other steps or units not clearly listed or inherent to these processes, methods, products or equipment.
[0029] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.
[0030] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more features. It should be understood that the term "and / or" used in this paper is only a description of the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. In the description of the utility model, unless otherwise specified, the meaning of "multiple" is two or more.
[0031] Currently, CMP (Chemical Mechanical Polishing) machines use fixed nozzles at the Home position to rinse the swing arm, top, and surface of the polishing disc. Water flow removes complex and chelate residues that adhere to the polishing pad during polishing, as well as diamonds that have detached from the disc surface. However, the rinsing power of water flow is limited, and it is ineffective at cleaning strongly adhered residues or loose diamonds that are about to fall off. Residue carried onto the polishing pad can easily scratch the wafer. This application addresses these problems by providing a protective structure that solves the problem of contamination on the back side of the wafer during wafer etching or cleaning.
[0032] The grinding disc cleaning device and chemical mechanical grinding equipment provided by this utility model will be described in detail below with reference to specific embodiments.
[0033] Figure 3 This is a schematic diagram illustrating the cleaning process of a grinding disc using a grinding disc cleaning device provided in an embodiment of this utility model. Figure 4 Please refer to the schematic diagram of the cleaning head of the grinding disc cleaning device provided in this embodiment of the utility model. Figures 3-4 The first aspect of this embodiment provides a grinding disc cleaning device 1, including a rotating disc 11 and a cleaning head 12;
[0034] The cleaning head 12 includes a sponge brush head 121 and a water outlet pipe 122. The water outlet end of the water outlet pipe 122 is located inside the sponge brush head 121. The sponge brush head 121 is fixed to the top surface of the rotating disk 11. There are multiple sponge brush heads 121 and multiple water outlet pipes 122. Adjacent sponge brush heads 121 are spaced apart. The water outlet end of the water outlet pipe 122 is lower than the top surface of the sponge brush head 121. The water outlet direction of the water outlet pipe 122 is perpendicular to the rotating disk 11.
[0035] Please see Figure 3 Grinding disc 2 is a dressing device used to refurbish the grinding pads of chemical mechanical polishing equipment during the grinding process, and it is a key consumable in the grinding process. Because the surface roughness of the grinding pad is reduced after grinding, and there are residues of complexes and chelates from the chemical reaction, the high hardness and corrosion resistance of grinding disc 2 can maintain the uniform texture of the grinding pad surface and extend the life of the grinding pad. In the semiconductor industry, diamonds are typically used in grinding disc 2 to clean the grinding pads due to their hardness. However, diamonds falling from grinding disc 2 onto the grinding pad can scratch the wafer, easily leading to wafer failure and significant losses. Therefore, improving the cleaning effect of grinding disc 2 plays a crucial role in ensuring wafer quality.
[0036] The polishing pad cleaning device 1 of the embodiment comprises a rotating disc 11 and a cleaning head 12. The rotating disc 11 of the embodiment is a mounting carrier of the cleaning head 12. The size of the rotating disc 11 is not particularly limited in the embodiment. Exemplarily, the rotating disc 11 is a circular disc. The rotating disc 11 can translate in a horizontal plane during the cleaning of the polishing pad. The size of the rotating disc 11 is less than or equal to the size of the polishing pad.
[0037] The cleaning head 12 of the embodiment comprises a sponge brush head 121 and a water outlet pipe 122. The water outlet end of the water outlet pipe 122 is located inside the sponge brush head 121. The sponge brush head 121 is fixed to the rotating disc 11. The sponge brush heads 121 of the embodiment are arranged at intervals on the rotating disc 11. The interval between the sponge brush heads 121 and the specific number of the sponge brush heads 121 are not particularly limited in the embodiment. Exemplarily, the sponge brush heads 121 of the embodiment are fixed to the rotating disc 11. The fixing mode of the sponge brush heads 121 to the rotating disc 11 is not particularly limited in the embodiment. Exemplarily, the sponge brush heads 121 are adhesively fixed to the rotating disc 11. The number of the sponge brush heads 121 and the water outlet pipe 122 is plural in the embodiment. The adjacent sponge brush heads 121 are arranged at intervals. The water outlet end of the water outlet pipe 122 is lower than the top surface of the sponge brush head 121. The water outlet end of the water outlet pipe 111 is perpendicular to the rotating disc 11. The adjacent sponge brush heads 121 are arranged at intervals in the embodiment. When the sponge brush head 121 wipes the residues on the surface of the polishing pad and the diamond is washed by the water sprayed through the water outlet pipe, the residues and the diamond fall on the rotating disc 11 through the gap between the adjacent sponge brush heads 121. The water outlet end of the water outlet pipe 122 of the embodiment is lower than the top surface of the sponge brush head 121. When the top surface of the sponge brush head 121 contacts the polishing pad, the water outlet pipe 122 can avoid contacting the surface of the polishing pad, thereby avoiding damaging the surface of the polishing pad.
[0038] The residues on the surface of the polishing pad 2 and the diamond that has fallen or is about to fall are generally cleaned by water spraying through a nozzle in the prior art. When the polishing pad 2 is cleaned by the polishing pad cleaning device 1 of the embodiment, the sponge brush head 121 can directly contact the surface of the polishing pad 2. When the rotating disc 11 rotates, the sponge brush head 121 wipes the residues on the surface of the polishing pad 2 under the action of mechanical rotation. In addition, the sponge brush head 121 is internally provided with a water outlet pipe, so that the cleaning device has the water flushing function and can flush the surface of the polishing pad 2. The polishing pad cleaning device 1 combines mechanical brushing and water flushing, which can enhance the cleaning effect, thereby preventing the wafer from being scratched due to the falling of the diamond from the polishing pad 2 during the wafer polishing process.
[0039] The grinding disc cleaning device provided by the embodiment comprises a rotating disc and a cleaning head, the cleaning head comprises a sponge brush head and a water outlet pipe, the water outlet end of the water outlet pipe is located inside the sponge brush head, the sponge brush head is fixed on the rotating disc, the number of the sponge brush head and the water outlet pipe is multiple, adjacent sponge brush heads are arranged at intervals, the water outlet end of the water outlet pipe is lower than the top surface of the sponge brush head, and the water outlet direction of the water outlet pipe is perpendicular to the rotating disc. The sponge brush head of the grinding disc cleaning device can directly contact the surface of the grinding disc during the cleaning process of the grinding disc, and can wipe off the residues and diamonds on the surface of the grinding disc under the action of the mechanical rotation of the rotating disc. The sponge brush head is provided with the water outlet pipe, so that the sponge brush head can wipe the grinding disc while washing the surface of the grinding disc, the cleaning effect of the grinding disc is enhanced, the scratch of the wafer caused by the falling of the diamond during the grinding process of the chemical mechanical grinding equipment is prevented, and the stability of the grinding process is improved.
[0040] In a specific embodiment, the grinding disc cleaning device 1 further comprises an anti-winding structure, the anti-winding structure comprises a stator end and a rotor end, the rotor end is fixed with the rotating disc 11, the stator end is used for being connected with the water inlet pipe, and the rotor end is used for being connected with the water outlet pipe 122. Illustratively, the water outlet pipe 122 of the embodiment is connected with the water inlet pipe, and the water inlet pipe is connected with the stator end of the anti-winding structure and the water outlet pipe is connected with the rotor end of the anti-winding structure in order to prevent the water inlet pipe from winding during the rotation of the rotating disc 11. Illustratively, the anti-winding structure of the embodiment is a gas slip ring.
[0041] Illustratively, as shown in Figure 3 , the area of the rotating disc 11 is greater than the area of the grinding disc 2. The area of the rotating disc 11 of the embodiment is greater than the area of the grinding disc 2, the installation area of the cleaning head 12 is increased, and a larger number of cleaning heads 12 can be installed on the rotating disc 11.
[0042] Further, the grinding disc cleaning device 1 further comprises a first driving structure and a second driving structure, the first driving structure is used for driving the rotating disc 11 to rotate, and the second driving structure is used for driving the rotating disc 11 to move in the horizontal plane. In the embodiment, the first driving structure is arranged, and when the grinding disc cleaning device 1 is used, the first driving structure drives the rotating disc 11 to rotate, the sponge brush head 121 wipes and cleans the grinding disc 2 under the action of the mechanical rotation force, and the cleaning effect of the grinding disc 2 is enhanced. The specific form of the first driving structure is not particularly limited in the embodiment, and illustratively, the first driving structure is a motor. In the embodiment, the second driving structure is arranged, and when the grinding disc cleaning device 1 is used, the second driving structure drives the rotating disc 11 to move in the horizontal plane, and the cleaning efficiency of the cleaning device is improved. Illustratively, the second driving structure is a lead screw.
[0043] Preferably, as shown in Figure 4, the outer contour of the sponge brush head 121 is cylindrical, and the distance between adjacent sponge brush heads 121 is greater than 2mm. The outer contour of the sponge brush head 121 of the present embodiment is cylindrical, and the manufacturing method is simple. The distance between adjacent sponge brush heads 121 of the present embodiment is greater than 2mm, which can ensure that the residues and diamonds cleaned off the surface of the grinding disc 2 fall from the gap between adjacent sponge brush heads 121, avoiding the residues and diamonds cleaned off staying between the top of the sponge brush head 121 and the surface of the grinding disc 2 for a long time, scratching the surface of the grinding disc 2.
[0044] Further, the water outlet pipe 122 is a plastic water outlet pipe, and the distance between the water outlet end of the water outlet pipe 122 and the top surface of the sponge brush head 121 is greater than 2mm. The water outlet pipe 122 of the present embodiment is a plastic water outlet pipe, which has low cost and can avoid damaging the surface of the grinding disc 2 when accidentally hitting the surface of the grinding disc 2. Since the sponge brush head 121 is pressed in the direction of the grinding disc 2 when wiping the surface of the grinding disc 2, the distance between the water outlet end of the water outlet pipe 122 and the top surface of the sponge brush head 121 is greater than 2mm, which can avoid the water outlet end of the water outlet pipe 122 directly contacting the surface of the grinding disc 2 when the sponge brush head 121 is pressed in the direction of the grinding disc 2.
[0045] Optionally, referring to Figure 3 and Figure 4 , the sponge brush head 121 is arranged circumferentially around the center of the rotating disc 11. The sponge brush head of the present embodiment is arranged circumferentially around the center of the rotating disc 11 with the same spacing between adjacent sponge brush heads 121.
[0046] In a specific embodiment, the top surface of the rotating disc 11 is provided with a groove, the sponge brush head 121 is arranged in the groove, and the sponge brush head 121 is adhesively connected to the rotating disc 11. The present embodiment can improve the firmness of the installation of the sponge brush head 121 by arranging the sponge brush head 121 in the groove on the top surface of the rotating disc 11, avoiding the sponge brush head 121 from falling during the wiping process of the surface of the grinding disc 2. The sponge brush head 121 of the present embodiment is adhesively connected to the rotating disc 11, and the connection method of the sponge brush head 121 and the rotating disc 11 is simple.
[0047] Optionally, the top surface of the rotating disc 11 is an inclined surface, and the thickness near the center of the rotating disc 11 is greater than the thickness near the edge of the rotating disc 11. The present embodiment arranges the rotating disc 11 as an inclined surface with the thickness near the center being greater than the thickness near the edge, which can make it easier for the residues and diamonds cleaned off the surface of the grinding disc 2 to fall off the rotating disc 11 under the scouring of the water flow.
[0048] The polishing disc cleaning device provided by the embodiment of the utility model includes a rotating disc and a cleaning head, the cleaning head includes a sponge brush head and a water outlet pipe, the water outlet end of the water outlet pipe is located inside the sponge brush head, the sponge brush head is fixed on the rotating disc, the number of the sponge brush head and the water outlet pipe is multiple, the adjacent sponge brush heads are arranged at intervals, the water outlet end of the water outlet pipe is lower than the top surface of the sponge brush head, and the water outlet direction of the water outlet pipe is perpendicular to the rotating disc.
[0049] Please refer to Figures 3-5 The second aspect of the embodiment provides a chemical mechanical polishing equipment 3 including the polishing disc cleaning device 1 as described in the above embodiment.
[0050] For example, the polishing disc cleaning device 1 of the embodiment includes a rotating disc 11 and a cleaning head 12.
[0051] The cleaning head 12 includes a sponge brush head 121 and a water outlet pipe 122, the water outlet end of the water outlet pipe 122 is located inside the sponge brush head 121, the sponge brush head 121 is fixed on the rotating disc 11, the number of the sponge brush head 121 and the water outlet pipe 122 is multiple, the adjacent sponge brush heads 121 are arranged at intervals, the water outlet end of the water outlet pipe 122 is lower than the top surface of the sponge brush head 121, and the water outlet end of the water outlet pipe 122 is perpendicular to the rotating disc 11.
[0052] For example, the chemical mechanical polishing equipment 3 of the embodiment includes a polishing disc 31, a polishing pad 32, a polishing head 33, a polishing disc 2 and a polishing disc cleaning device 1, the polishing disc 2 is a dresser used for dressing the polishing pad 32 of the chemical mechanical polishing equipment 1 in the polishing process, and is a key consumable in the polishing process. Because the roughness of the surface of the polishing pad 32 is reduced after polishing, and there are residues of complex compounds and chelates after chemical reaction, the polishing disc 2 with high hardness and corrosion resistance can keep the surface of the polishing pad 32 uniform, and prolong the service life of the polishing pad 32. The semiconductor industry generally uses diamond in the polishing disc 2 for dressing the polishing pad 32 due to the hardness of diamond, but the diamond falling from the polishing disc 2 onto the polishing pad 32 will cause scratches on the wafer, which will easily cause the wafer to be scrapped, causing great loss. Therefore, improving the cleaning effect of the polishing disc 2 plays a very important role in ensuring the quality of the wafer.
[0053] The prior art generally uses a spray head to spray water to clean the residues and the falling or about to fall diamonds on the surface of the polishing disc 2. The polishing disc cleaning device 1 of the embodiment can directly contact the surface of the polishing disc 2 when cleaning the polishing disc 2. The sponge brush head 121 can remove the residues and the diamonds on the surface of the polishing disc 2 under the action of the mechanical rotation of the rotating disc 11. In addition, the sponge brush head 121 is internally provided with a water outlet pipeline, so that the cleaning device has the water flushing capability and can flush the surface of the polishing disc 2. The polishing disc cleaning device 1 combines the mechanical brushing and the water flushing, can enhance the cleaning effect, and thus prevents the wafer from being scratched due to the falling diamonds of the polishing disc 2 in the wafer polishing process.
[0054] The polishing disc cleaning device of the chemical mechanical polishing equipment of the embodiment comprises a rotating disc and a cleaning head. The cleaning head comprises a sponge brush head and a water outlet pipeline. The water outlet end of the water outlet pipeline is located in the interior of the sponge brush head. The sponge brush head is fixed to the rotating disc. The number of the sponge brush heads and the number of the water outlet pipelines are both plural. The adjacent sponge brush heads are arranged at intervals. The water outlet end of the water outlet pipeline is lower than the top surface of the sponge brush head. The water outlet direction of the water outlet pipeline is perpendicular to the rotating disc. The sponge brush head of the polishing disc cleaning device can directly contact the surface of the polishing disc in the polishing disc cleaning process. The sponge brush head can remove the residues and the diamonds on the surface of the polishing disc under the action of the mechanical rotation of the rotating disc. The sponge brush head is internally provided with the water outlet pipeline. The sponge brush head can flush the surface of the polishing disc while wiping the polishing disc. The cleaning effect of the polishing disc is enhanced. Thus, the wafer is prevented from being scratched due to the falling diamonds of the polishing disc in the polishing process of the chemical mechanical polishing equipment. The stability of the polishing process is improved.
[0055] In the above description, the description of the terms "an embodiment", "some embodiments", "an example", "a specific example" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples without contradiction.
[0056] The above embodiments are only used to illustrate the technical solutions of the present application, rather than limit them. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to some or all of the technical features. The modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A grinding disc cleaning device, characterized in that: a rotating disc and a cleaning head are included; the cleaning head includes a sponge brush head and a water outlet pipe, the water outlet end of the water outlet pipe is located inside the sponge brush head, the sponge brush head is fixed to the top surface of the rotating disc, the number of the sponge brush head and the water outlet pipe is multiple, adjacent sponge brush heads are arranged at intervals, the water outlet end of the water outlet pipe is lower than the top surface of the sponge brush head, and the water outlet direction of the water outlet pipe is perpendicular to the rotating disc. 2.The grinding disc cleaning device according to claim 1, characterized in that: the grinding disc cleaning device further includes an anti-winding structure, the anti-winding structure includes a stator end and a rotor end, the rotor end is fixed with the rotating disc, and the stator end is used to be connected with a water inlet pipe, and the rotor end is used to be connected with the water outlet pipe. 3.The grinding disc cleaning device according to claim 2, characterized in that: the area of the rotating disc is larger than the area of the grinding disc. 4.The grinding disc cleaning device according to claim 2, characterized in that: the grinding disc cleaning device further includes a first driving structure and a second driving structure, the first driving structure is used to drive the rotating disc to rotate, and the second driving structure is used to drive the rotating disc to move in the horizontal plane. 5.The grinding disc cleaning device according to claim 4, characterized in that: the outer contour of the sponge brush head is cylindrical, and the distance between adjacent sponge brush heads is greater than 2mm. 6.The grinding disc cleaning device according to claim 4, characterized in that: the water outlet pipe is a plastic water outlet pipe, the distance between the water outlet end of the water outlet pipe and the top surface of the sponge brush head is greater than 2mm.
7. The abrasive-dish cleaning apparatus of claim 1, wherein: the sponge brush head is arranged circumferentially with the center of the rotating disc as the center.
8. The abrasive-dish cleaning apparatus according to any one of claims 1 to 7, characterized by: the top surface of the rotating disc is provided with a groove, the sponge brush head is arranged in the groove, and the sponge brush head is adhesively connected with the rotating disc.
9. The abrasive-dish cleaning apparatus of claim 8, wherein: the top surface of the rotating disc is an inclined surface, the thickness near the center of the rotating disc is greater than the thickness near the edge of the rotating disc.
10. A chemical mechanical polishing apparatus characterized by comprising: the grinding disc cleaning device according to any one of claims 1-9 is included.