Wafer bearing device
By setting a multi-size adaptable fixing groove and pressure relief port structure on the surface of the chuck of the wafer carrier device, the adsorption abnormality caused by wafer size adaptability and warpage in the prior art is solved, and the effect of multi-size adaptation and stable adsorption is achieved.
Patent Information
- Application Number
- CN202520338153.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2035-02-28
AI Technical Summary
Existing wafer carrier devices have limited applications and cannot adapt to wafers of different sizes. Furthermore, their excessive warpage leads to abnormal adsorption.
Design a wafer carrier device with a first fixing groove and a second fixing groove on the surface of the suction cup for fixing sealing rings of different sizes. The suction cup air passage is arranged radially and combined with a trapezoidal groove and pressure relief port structure to achieve multi-size adaptation and stable adsorption.
It increases the versatility of wafer carrier devices, improves the problem of abnormal wafer adsorption due to large warpage, reduces costs and simplifies the process.
Smart Images
Figure CN223885617U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of semiconductor manufacturing packaging structure especially relates to a wafer bearing device. BACKGROUND
[0002] High-speed rotating bearing chuck is often needed in wafer processing process, such as uniform glue process, developing process, cleaning process etc. With the design of chip product more and more complex, the design of wafer size more and more big, the warping degree of wafer that follows also more and more big, often because the warping degree is too big and leads to the chuck unable to adsorb the product in actual application, or adsorbs the product and cannot release the product in time preferably, leads to the abnormal product. Meanwhile, the type of chip product is also more and more, and the wafer size is also different, for different size wafers, usually match different chucks, and the cost of each kind of chuck is high, but the application is single. SUMMARY
[0003] One of the purposes of the utility model is to provide a wafer bearing device to at least solve the technical problem of single application of the wafer bearing device in the prior art.
[0004] To achieve the above-mentioned one of the purposes of the utility model, one embodiment of the utility model provides a wafer bearing device, which comprises a support structure, a chuck arranged on the support structure and a sealing ring arranged on the chuck, the support structure is provided with a vacuum extraction channel, the chuck is provided with a chuck air duct communicating with the vacuum extraction channel, a first fixing groove and a second fixing groove for fixing the sealing ring, the first fixing groove, the second fixing groove and the chuck are arranged with a common center; at least part of the chuck air duct is located on the inner side of the first fixing groove along the radial direction of the chuck, and the diameter of the first fixing groove is smaller than the diameter of the second fixing groove.
[0005] As a further improvement of one embodiment of the utility model, the longitudinal section of the first fixing groove and the second fixing groove is trapezoidal.
[0006] As a further improvement of one embodiment of the utility model, the chuck at least comprises a pressure relief port arranged in the first fixing groove, and the pressure relief port is wider than the first fixing groove.
[0007] As a further improvement of one embodiment of the utility model, the chuck air duct comprises a plurality of annular air ducts and a radial air duct communicating with the plurality of annular air ducts, and the radial air duct communicates with the vacuum extraction channel.
[0008] As a further improvement of one embodiment of the utility model, the annular air duct, the radial air duct, the first fixing groove and the second fixing groove penetrate the surface of the chuck away from the support structure.
[0009] As a further improvement of the embodiment of the present application, the first fixing groove is located between two adjacent annular air passages in the radial direction of the suction disc, and the second fixing groove is located outside the air passage of the suction disc.
[0010] As a further improvement of the embodiment of the present application, the suction disc is provided with a hollowing groove for weight reduction on the surface facing the support structure, the hollowing groove is annularly arranged, and the center of the hollowing groove coincides with the center of the suction disc.
[0011] As a further improvement of the embodiment of the present application, the suction disc is provided with a plurality of hollowing grooves for weight reduction on the surface facing the support structure, the plurality of hollowing grooves are uniformly and spaced arranged in a circular ring, and the center of the circular ring formed by the plurality of hollowing grooves coincides with the center of the suction disc.
[0012] As a further improvement of the embodiment of the present application, the support structure comprises a heat insulation disc and a support column, and the heat insulation disc is located between the support column and the suction disc.
[0013] As a further improvement of the embodiment of the present application, the vacuumizing passage comprises a through hole arranged at the center of the heat insulation disc and a hollow hole arranged at the support column.
[0014] Compared with the prior art, the wafer carrying device provided by the present application is provided with a first fixing groove and a second fixing groove on the surface of the suction disc, which are respectively used for fixing sealing rings of different sizes to cooperate with the sealing of wafers of different sizes, thereby improving the versatility of the wafer carrying device application, and the larger size wafer is equivalent to two sealing rings being fixed and adsorbed at the same time, thereby improving the adsorption abnormality caused by wafer warping. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 is a schematic view of the wafer carrying device in an embodiment of the present application.
[0016] Figure 2 is a top view of the wafer carrying device in an embodiment of the present application.
[0017] Figure 3 is a bottom view of the suction disc in an embodiment of the present application.
[0018] Figure 4 is a sectional view of the wafer carrying device in an embodiment of the present application.
[0019] Figure 5 is an exploded view of the wafer carrying device in an embodiment of the present application.
[0020] Figure 6 is a sectional view of one of the sealing rings separated from the suction disc in an embodiment of the present application. DETAILED DESCRIPTION
[0021] The utility model will be described in detail below in combination with the specific embodiments shown in the drawings. However, these embodiments do not limit the utility model, and the changes in structure, method or function made by those skilled in the art based on these embodiments are all included in the protection scope of the utility model.
[0022] It should be noted that the term "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment. In addition, the terms "first", "second", "third", "fourth" and the like are only for descriptive purposes and cannot be understood as indicating or implying relative importance.
[0023] The term "connected", "connected to" or any other variant is intended to cover various relative positions of the connection relationship, so that it includes direct connection or indirect connection. Among them, the direct connection can be formed by the air path pipeline, the indirect connection can be the connection relationship formed by devices such as valve body, sensor, etc., can be the connection relationship formed by air path components such as brake control unit, or can be the connection relationship formed by any other medium such as air.
[0024] Please refer to Figure 1 A structure schematic view of a wafer bearing device 100 provided by an embodiment of the utility model is shown, the wafer bearing device 100 is used to adsorb and fix wafer, provides bearing force and adsorption force for wafer rotation, and can be optionally applied to wafer uniform glue, development, cleaning and other processes.
[0025] The wafer bearing device 100 includes a support structure 10, a suction cup 30 and a sealing ring 50, the suction cup 30 is arranged on the support structure 10, and the sealing ring 50 is arranged on the suction cup 30. The support structure 10 is provided with a vacuum extraction channel 101, the suction cup 30 is provided with a suction cup air duct 301, and the suction cup air duct 301 is communicated with the vacuum extraction channel 101. When the wafer bearing device 100 works, the suction cup air duct 301 is used to adsorb and fix wafer.
[0026] In combination with Figure 2As shown, the chuck 30 is provided with a first fixing groove 302 and a second fixing groove 303 for fixing the sealing ring 50, the first fixing groove 302, the second fixing groove 303 and the chuck 30 are coaxial, which means that the chuck 30 is coaxial with the wafer to be supported, so as to more stably and uniformly fix the wafer. At least part of the chuck air channel 301 is located inside the first fixing groove 302 along the radial direction of the chuck, and the diameter of the first fixing groove 302 is smaller than that of the second fixing groove 303.
[0027] In this way, the chuck 30 can be adapted to wafers of different sizes, improving the diversity of applications. For example, the size of the first fixing groove 302 matches a 6-inch or 8-inch wafer, that is, the sealing ring 50 in the first fixing groove 302 can seal the outer periphery of the 6-inch or 8-inch wafer, and the inner side of the 6-inch or 8-inch wafer is vacuum adsorbed by the chuck air channel 301, so that the smaller size wafer can rotate at high speed on the chuck 30.
[0028] For example, the size of the second fixing groove 303 matches a 10-inch or 12-inch wafer, that is, the sealing ring 50 in the second fixing groove 303 can seal the outer periphery of the 10-inch or 12-inch wafer, and it can be understood that at this time, the sealing ring 50 in the first fixing groove 302 can also be used to seal the 10-inch or 12-inch wafer, so that the larger size wafer can rotate at high speed on the chuck 30, and the problem of abnormal adsorption caused by the warping phenomenon of the larger size wafer is improved.
[0029] It can be understood that the above-mentioned first fixing groove 302 and second fixing groove 303 only need to meet the size of the relative size, and are not necessarily limited to the first fixing groove 302 being 6 or 8 inches in size and the second fixing groove 303 being 10 or 12 inches in size.
[0030] In one embodiment, the longitudinal section of the first fixing groove 302 and the second fixing groove 303 is trapezoidal. In combination with the above description of the sealing ring 50, the sealing ring 50 is clamped in the first fixing groove 302 and the second fixing groove 303, and the sealing ring 50 is in close contact with the inner wall of the first fixing groove 302 and the second fixing groove 303, so as to realize the sealing function of the sealing ring 50. Figure 4 and Figure 6 As shown, the first fixing groove 302 and the second fixing groove 303 have a structure of being narrow at the top and wide at the bottom, so as to clamp the sealing ring 50 on the chuck 30.
[0031] The chuck air channel 301, the first fixing groove 302 and the second fixing groove 303 penetrate the surface of the chuck 30 away from the support structure 10. In other words, the chuck air channel 301, the first fixing groove 302 and the second fixing groove 303 are upwardly open, the chuck air channel 301 is upwardly open to vacuum adsorb the wafer, and the first fixing groove 302 and the second fixing groove 303 are upwardly open to facilitate the installation of the sealing ring 50.
[0032] The suction cup 30 at least comprises a pressure relief port 304 arranged in the first fixing groove 302, and the pressure relief port 304 is wider than the first fixing groove 302. In combination with Figure 2 and Figure 5 As shown, the sealing ring 50 located in the pressure relief port 304 will expand to completely fill the pressure relief port 304 under vacuum, so that the pressure relief port 304 will not leak. When the vacuum is stopped, the vacuum between the wafer and the suction cup 30 is gradually broken, the sealing ring 50 gradually returns to its original shape, and the pressure relief port 304 will start to leak, accelerating the breaking of the vacuum. In this way, the pressure relief port 304 can replace the active pressure relief valve in the prior art, reducing cost and having a simple structure and process.
[0033] In specific embodiments, the second fixing groove 303 also has a pressure relief port 304. The first fixing groove 302 has at least two symmetrically arranged pressure relief ports 304, and the second fixing groove 303 has at least two symmetrically arranged pressure relief ports 304. The pressure relief ports 304 corresponding to the first fixing groove and the pressure relief ports 304 corresponding to the second fixing groove 303 are uniformly and circumferentially arranged, so that the pressure relief is faster and more uniform.
[0034] In one embodiment, the suction cup air duct 301 comprises a plurality of annular air ducts 305 and a plurality of radial air ducts 306 communicating with the annular air ducts 305, and the radial air ducts 306 communicate with the vacuum suction channel 101. The annular air ducts 305 are arranged with the same center as the suction cup 30, and the radial air ducts 306 pass through the center hole of the suction cup 30. In this case, the center hole of the suction cup 30 penetrates in the thickness direction, and the suction cup 30 does not have additional air flow channels in the thickness direction. The vacuum suction channel 101 communicates with the center hole of the suction cup 30, and the radial channel 306 passes through the center of the suction cup 30. Therefore, the radial channel 306 communicates with the vacuum suction channel 101 and the annular air duct 305, realizing the overall vacuum suction function of the suction cup air duct 301.
[0035] The annular air duct 305 and the radial air duct 306 penetrate the surface of the suction cup 30 away from the support structure 10. In this case, the suction cup air duct 301 is a groove on the surface of the suction cup 30. When the wafer is placed on the surface of the suction cup 30, the outer periphery of the wafer is further sealed by the sealing ring 50, and a vacuum suction channel is formed between the wafer and the suction cup 30.
[0036] In the radial direction of the suction cup, the first fixing groove 302 is located between two adjacent annular air ducts 305, and the second fixing groove 303 is located outside the suction cup air duct 301. It can be understood that "at least part of the suction cup air duct 301 is located inside the first fixing groove 302 in the radial direction of the suction cup 30", which means that the annular air duct 305 located inside the first fixing groove 302 and part of the radial air duct 306 communicating with the inside annular air duct 305.
[0037] In a specific embodiment, the second fixed groove 303 has no annular air channel 305 on the outer side, and the outermost annular air channel 305 is located between the first fixed groove 302 and the second fixed groove 303. The radial air channel 306 only communicates with the outermost annular air channel 305, and it can be seen that the radial air channel 306 does not communicate with the second fixed groove 303.
[0038] In a specific embodiment, the chuck air channel 301 includes two radial air channels 306 arranged in a cross shape, and the pressure relief port 304 of the first fixed groove 302 is arranged at a distance from the radial air channel 306 to prevent the radial air channel 306 from being blocked. The pressure relief port 304 arranged in the second fixed groove 303 has no specific position limitation.
[0039] In one embodiment, the chuck 30 has a hollowed-out groove 31 for weight reduction on the surface facing the support structure 10. The hollowed-out groove 31 is arranged in a ring shape, and the center of the hollowed-out groove 31 coincides with the center of the chuck 30. In order to meet the weight requirement of the wafer carrier during high-speed rotation of the wafer, the chuck 30 is provided with a plurality of hollowed-out grooves 31 for weight reduction. The hollowed-out grooves 31 are arranged away from the chuck air channel 301 and do not communicate with the chuck air channel 301. The hollowed-out groove 31 can be an entire ring, and the hollowed-out groove 31 needs to have a common center with the chuck 30 to ensure the uniformity of the weight of the chuck 30.
[0040] In one embodiment, the chuck 30 has a plurality of hollowed-out grooves 31 for weight reduction on the surface facing the support structure 10. The plurality of hollowed-out grooves 31 are arranged in a circular ring shape and are uniformly spaced. The center of the circular ring formed by the plurality of hollowed-out grooves 31 coincides with the center of the chuck 30. Figure 3 As shown, the hollowed-out groove 31 can also be a plurality of circular grooves, and the plurality of circular grooves should be uniformly spaced around the center of the chuck 30 to ensure the uniformity of the weight of the chuck 30.
[0041] The support structure 10 includes a heat insulation disc 11 and a support column 13, and the heat insulation disc 11 is located between the support column 13 and the chuck 30. The heat insulation disc 11 has heat insulation performance to prevent heat conduction from the support column 13 to the surface of the chuck 30. Usually, the support column 13 is also provided with a vacuum pumping device, and the vacuum pumping device generates heat when working, which is conducted to the wafer and affects the performance of the wafer.
[0042] The vacuum pumping channel 101 includes a through hole 110 arranged at the center of the heat insulation disc 11 and a hollow hole 130 arranged in the support column 13. It can be seen that the vacuum pumping device starts to pump gas in the hollow hole 130, and the hollow hole 130 communicates with the through hole of the heat insulation disc 11, and then communicates with the radial air channel 306 and the annular air channel 305 of the chuck 30, thereby realizing the vacuum adsorption function of the present application.
[0043] The utility model have beneficial effect at: the surface of sucking disc 30 sets up first fixed groove 302 and second fixed groove 303, is respectively used to fix different size's sealing ring 50, to cooperate the sealing wafer of different size, improve the diversity of wafer bearing device 100 application, and the wafer of size is bigger equivalent to two sealing rings 50 adsorption fixation simultaneously, improve the adsorption abnormality caused by wafer warping.
[0044] Any of the technical solutions provided in the foregoing can be formed, which will not be repeated here.
[0045] It should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the specification is described only for clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be combined appropriately to form other embodiments that those skilled in the art can understand.
[0046] The series of detailed descriptions listed above are only specific descriptions of the feasible embodiments of the utility model, and they are not used to limit the protection scope of the utility model, and any equivalent embodiments or changes made without departing from the spirit of the utility model art should be included in the protection scope of the utility model.
Claims
1. A wafer carrier device, characterized in that, The support structure is provided with a vacuum extraction channel, the suction disc is provided with a suction disc air duct communicating with the vacuum extraction channel, a first fixing groove and a second fixing groove for fixing the sealing ring, and the first fixing groove, the second fixing groove and the suction disc are coaxially arranged; at least part of the suction disc air duct is located on the inner side of the first fixing groove in the radial direction of the suction disc, and the diameter of the first fixing groove is smaller than the diameter of the second fixing groove.
2. The wafer carrier apparatus of claim 1, wherein, The longitudinal section of the first fixing groove and the second fixing groove is in the shape of a trapezoid.
3. The wafer carrier apparatus of claim 1, wherein, The suction disc comprises a pressure relief port arranged in the first fixing groove, and the pressure relief port is wider than the first fixing groove.
4. The wafer carrier apparatus of claim 1, wherein, The suction disc air duct comprises a plurality of annular air ducts and a radial air duct communicating with the plurality of annular air ducts, and the radial air duct communicates with the vacuum extraction channel.
5. The wafer carrier apparatus of claim 4, wherein, The annular air duct, the radial air duct, the first fixing groove and the second fixing groove penetrate the surface of the suction disc away from the support structure.
6. The wafer carrier apparatus of claim 4, wherein, In the radial direction of the suction disc, the first fixing groove is located between two adjacent annular air ducts, and the second fixing groove is located on the outer side of the suction disc air duct.
7. The wafer carrier apparatus of claim 1, wherein, The suction disc is provided with a hollowing-out groove for weight reduction on the surface facing the support structure, the hollowing-out groove is arranged in the shape of a ring, and the center of the hollowing-out groove coincides with the center of the suction disc.
8. The wafer carrier apparatus of claim 1, wherein, The suction disc is provided with a plurality of hollowing-out grooves for weight reduction on the surface facing the support structure, the plurality of hollowing-out grooves are arranged in the shape of a ring and are uniformly spaced, and the center of the ring formed by the plurality of hollowing-out grooves coincides with the center of the suction disc.
9. The wafer carrier apparatus of claim 1, wherein, The support structure comprises a heat insulation disc and a support column, and the heat insulation disc is located between the support column and the suction disc.
10. The wafer carrier apparatus of claim 9, wherein, The vacuum extraction channel comprises a through hole arranged at the center of the heat insulation disc and a hollow hole arranged at the support column.