Heat dissipation type keyboard chip

Abstract

The utility model discloses a heat dissipation type keyboard chip which comprises a heat dissipation device body, the interior of the heat dissipation device body is a cavity, a chip is placed on the interior of the heat dissipation device body, a first clamping groove and a second clamping groove are formed in the two ends of the chip respectively, and a first clamping rod and a second clamping rod are arranged on the first clamping groove and the second clamping groove respectively. The two ends of the first clamping rod and the two ends of the second clamping rod are fixed to the side wall of the heat dissipation device body through bolts, the heat dissipation device body comprises a first bottom plate, a first vertical side plate, a second vertical side plate and a first transverse top plate, a first ventilation hole is formed in the bottom of the first bottom plate, a rotating baffle is arranged at the bottom of the first ventilation hole, and the first ventilation hole is located in the middle of the first bottom plate. A first through hole thread is arranged at one end of the rotating baffle, and a first blind hole thread matched with the first through hole thread is arranged beside the first ventilation hole. The beneficial effects of the utility model are that the dustproof effect of the chip is improved through the arrangement of the screen plate or the staggered arrangement of the positions of the heat dissipation device and the ventilation holes.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of chip processing, especially a heat dissipation type keyboard chip. BACKGROUND

[0002] Although the existing keyboard chip can be placed for heat dissipation, it still has defects: 1, although the existing keyboard chip can be placed in a heat dissipation container, the heat dissipation device is inconvenient to adjust due to different thicknesses of the chip, and the existing heat dissipation device cannot block external dust. UTILITY MODEL CONTENTS

[0003] The utility model aims at overcoming the defects of the prior art, and improves the dustproof effect of the chip by setting the position of the heat dissipation device and the ventilation hole.

[0004] The utility model discloses a heat dissipation type keyboard chip, including the heat dissipation device body, the inside of heat dissipation device body is empty cavity setting, and the inside of heat dissipation device body is placed chip, the both ends of chip are equipped with the slot one and the slot two respectively, the slot one and the slot two are equipped with the link rod one and the link rod two respectively,

[0005] Preferably, the both ends of the link rod one and the link rod two are fixed on the side wall of the heat dissipation device body by bolts, the heat dissipation device body includes a bottom plate one, a vertical side plate one, a vertical side plate two and a horizontal top plate one, and a ventilation hole one is arranged on the bottom of the bottom plate one, a rotating baffle is arranged on the bottom of the ventilation hole one, the ventilation hole one is located in the middle of the bottom plate one, a through hole thread one is arranged on one end of the rotating baffle, a blind hole thread one matched with the through hole thread one is arranged beside the ventilation hole one, and the through hole thread one fixes one end of the rotating baffle under the action of the bolt, and a heat dissipation device is arranged below the chip.

[0006] Preferably, the heat dissipation device is provided with a lifting rod one and a lifting rod two below, and the bottom of the lifting rod one and the lifting rod two is fixed on the bottom plate one, and the heat dissipation device further includes a cavity one, and vertical pipes one and two are arranged on the both ends of the cavity one.

[0007] Preferably, the vertical pipes one and two respectively penetrate the both ends of the cavity one, and butt joint pipes one and two are arranged on the vertical pipes one and two respectively, the height of the butt joint pipes one and two is at least two kinds, and a connecting pipe is arranged on the end part of the butt joint pipes one and two, and the connecting pipe is in sealed connection with the butt joint pipes one and two.

[0008] Preferably, the bottoms of the connecting pipe 1 and connecting pipe 2 are sealed to the vertical pipe 1 and vertical pipe 2. The side wall of the heat dissipation device body is provided with a feed pipe 1 and a discharge pipe 2 respectively. The feed pipe 1 and discharge pipe 2 are respectively provided with flexible connecting pipes between the vertical pipe 1 and vertical pipe 2. The connecting pipe 1, connecting pipe 2, vertical pipe 1, vertical pipe 2 and connecting pipe are all made of heat-absorbing material.

[0009] Preferably, an air inlet pipe is provided at the bottom of the cavity one, and an air inlet pipe two is provided on the base plate one. A flexible pipe is provided between the air inlet pipe one and the air inlet pipe two. An inclined mesh plate one and an inclined mesh plate two are provided on the top inside the heat dissipation device body, and the inclined mesh plate one and the inclined mesh plate two are fixed by bolts.

[0010] Preferably, the inclined mesh plate one and the inclined mesh plate two are provided with a plurality of ventilation holes two, and the diameter of the ventilation holes two is provided with at least two types. The vertical side plate one, the vertical side plate two and the horizontal top plate one are provided with ventilation holes three that cooperate with the inclined mesh plate one and the inclined mesh plate two.

[0011] This utility model has the following advantages:

[0012] 1. The heat dissipation device body of this utility model has an internal cavity, and a chip is placed inside the heat dissipation device body. The chip has a slot 1 and a slot 2 at both ends, and a latching rod 1 and a latching rod 2 are respectively provided on the slot 1 and slot 2, so that the chip can be fixed.

[0013] The two ends of the first and second locking rods are fixed to the side wall of the heat dissipation device body by bolts. The heat dissipation device body includes a base plate, a vertical side plate, a vertical side plate, and a horizontal top plate. The bottom of the base plate is provided with a ventilation hole, and the bottom of the ventilation hole is provided with a rotating baffle. The ventilation hole is located in the middle of the base plate. One end of the rotating baffle is provided with a through-hole thread. Next to the ventilation hole is a blind hole thread that cooperates with the through-hole thread. The through-hole thread fixes one end of the rotating baffle under the action of bolts. A heat dissipation device is provided below the chip. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 for Figure 1 A magnified view of a portion of point A in the middle;

[0016] Figure 3 for Figure 1 A magnified view of a portion of point B in the middle;

[0017] Figure 4 for Figure 1 A magnified view of a portion of point C in the middle;

[0018] Figure 5 For Figure 1 a local enlarged view at D in the middle.

[0019] In the figure, the heat dissipation device body 1, the chip 2, the card slot one 3, the card slot two 4, the card rod one 5, the card rod two 6, the bottom plate one 7, the vertical side plate one 8, the vertical side plate two 9, the horizontal top plate one 10, the ventilation hole one 11, the rotating baffle 12, the ventilation hole one 13, the blind hole thread one 14, the lifting rod one 15, the lifting rod two 16, the cavity one 17, the heat dissipation device 18, the vertical pipe one 19, the vertical pipe two 20, the butt joint pipe one 21, the butt joint pipe two 22, the connecting pipe 23, the feeding pipe one 24, the discharging pipe two 25, the flexible connecting pipe 26, the air inlet pipe one 27, the air inlet pipe two 28, the inclined mesh plate one 29, the inclined mesh plate two 30, the ventilation hole two 31, the ventilation hole three 32. DETAILED DESCRIPTION

[0020] The utility model makes further description below combining with the drawing, the protection scope of the utility model is not limited to the following:

[0021] As Figures 1-5 shown, a heat dissipation type keyboard chip, including heat dissipation device body 1, the inside of heat dissipation device body 1 is cavity setting, and the inside of heat dissipation device body 1 is on chip 2, and the both ends of chip 2 are respectively equipped with card slot one 3 and card slot two 4, and card slot one 3 and card slot two 4 are respectively equipped with card rod one 5 and card rod two 6, so that card rod one 5 and card rod two 6 can be fixed;

[0022] In the embodiment, the both ends of card rod one 5 and card rod two 6 are fixed on the side wall of heat dissipation device body 1 by bolt, heat dissipation device body 1 includes bottom plate one 7, vertical side plate one 8, vertical side plate two 9 and horizontal top plate one 10, and the bottom of bottom plate one 7 is equipped with ventilation hole one 11, and the bottom of ventilation hole one 11 is equipped with rotating baffle 12, so that rotating baffle 12 can be shielded or loosened according to actual needs, ventilation hole one 11 is located in the middle of bottom plate one 7, one end of rotating baffle 12 is equipped with through hole thread one 13, blind hole thread one 14 that is matched with through hole thread one 13 is arranged beside ventilation hole one 13, and one end of rotating baffle 12 is fixed under the action of bolt through through hole thread one 13, and the lower side of chip 2 is equipped with heat dissipation device 18.

[0023] In the embodiment, the lower side of heat dissipation device 18 is equipped with lifting rod one 15 and lifting rod two 16, and the bottom of lifting rod one 15 and lifting rod two 16 is fixed on bottom plate one 7, and heat dissipation device 18 further includes cavity one 17, and the both ends of cavity one 17 are equipped with vertical pipe one 19 and vertical pipe two 20.

[0024] In the embodiment, the vertical pipe one 19 and the vertical pipe two 20 pass through two ends of the cavity one 17 respectively, and the vertical pipe one 19 and the vertical pipe two 20 are respectively provided with the butt joint pipe one 21 and the butt joint pipe two 22, the butt joint pipe one 21 and the butt joint pipe two 22 have at least two kinds of heights, and the end of the butt joint pipe one 21 and the butt joint pipe two 22 is provided with the connecting pipe 23, and the connecting pipe 23 is in sealed connection with the butt joint pipe one 21 and the butt joint pipe two 22.

[0025] In the embodiment, the bottom of the butt joint pipe one 21 and the butt joint pipe two 22 is in sealed connection with the vertical pipe one 19 and the vertical pipe two 20, the sidewall of the heat dissipation device body 1 is respectively provided with the feeding pipe one 24 and the discharging pipe two 25, the feeding pipe one 24 and the discharging pipe two 25 are respectively connected with an external water source and a collection container, the feeding pipe one 24 and the discharging pipe two 25 are respectively provided with the flexible connecting pipe 26 between the vertical pipe one 19 and the vertical pipe two 20, and the butt joint pipe one 21, the butt joint pipe two 22, the vertical pipe one 19, the vertical pipe two 20 and the connecting pipe 23 are all made of heat absorbing materials.

[0026] In the embodiment, the bottom of the cavity one 17 is provided with the air inlet pipe one 27, the bottom plate one 7 is provided with the air inlet pipe two 28, the flexible pipe is arranged between the air inlet pipe one 27 and the air inlet pipe two 28, the inner top of the heat dissipation device body 1 is provided with the inclined mesh plate one 29 and the inclined mesh plate two 30, and the inclined mesh plate one 29 and the inclined mesh plate two 30 are fixed by bolts.

[0027] In the embodiment, the inclined mesh plate one 29 and the inclined mesh plate two 30 are provided with a plurality of ventilation holes two 31, and the diameter of the ventilation holes two 31 has at least two kinds, the vertical side plate one 8, the vertical side plate two 9 and the horizontal top plate one 10 are provided with the ventilation holes three 32 matched with the inclined mesh plate one 29 and the inclined mesh plate two 30, so that the internal ventilation can prevent the pollution of the external dust to the internal chip.

[0028] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and not for limiting the present application, although the present application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, it still can be modified, or the equivalent replacement of part of the technical features recorded in the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A heat dissipating keyboard chip, characterized by: Including the heat dissipation device body, the inside of the heat dissipation device body is provided with a cavity, and a chip is placed on the inside of the heat dissipation device body, the two ends of the chip are respectively provided with a clamping groove one and a clamping groove two, and the clamping groove one and the clamping groove two are respectively provided with a clamping rod one and a clamping rod two; The two ends of the clamping rod one and the clamping rod two are fixed on the side wall of the heat dissipation device body by bolts, the heat dissipation device body includes a bottom plate one, a vertical side plate one, a vertical side plate two and a horizontal top plate one, and the bottom of the bottom plate one is provided with a ventilation hole one, the bottom of the ventilation hole one is provided with a rotating baffle, the ventilation hole one is located in the middle of the bottom plate one, one end of the rotating baffle is provided with a through hole thread one, the ventilation hole one is provided with a blind hole thread one matched with the through hole thread one, and the through hole thread one fixes one end of the rotating baffle under the action of the bolt, and the bottom of the chip is provided with a heat dissipation device.

2. The heat-dissipating keyboard chip according to claim 1, wherein: The bottom of the heat dissipation device is provided with a lifting rod one and a lifting rod two, and the bottom of the lifting rod one and the lifting rod two is fixed on the bottom plate one, and the heat dissipation device further includes a cavity one, and the two ends of the cavity one are provided with a vertical pipe one and a vertical pipe two.

3. The heat-dissipating keyboard chip according to claim 2, wherein: The vertical pipe one and the vertical pipe two respectively penetrate through the two ends of the cavity one, and the vertical pipe one and the vertical pipe two are respectively provided with a butt joint pipe one and a butt joint pipe two, the height of the butt joint pipe one and the butt joint pipe two is at least two kinds, and the end of the butt joint pipe one and the butt joint pipe two is provided with a connecting pipe, and the connecting pipe is sealingly connected with the butt joint pipe one and the butt joint pipe two.

4. The heat-dissipating keyboard chip according to claim 3, wherein: The bottom of the butt joint pipe one and the butt joint pipe two is sealingly connected with the vertical pipe one and the vertical pipe two, the side wall of the heat dissipation device body is respectively provided with an inlet pipe one and an outlet pipe two, the inlet pipe one and the outlet pipe two are respectively provided with a flexible connecting pipe between the vertical pipe one and the vertical pipe two, and the butt joint pipe one, the butt joint pipe two, the vertical pipe one, the vertical pipe two and the connecting pipe are made of heat absorbing material.

5. The heat-dissipating keyboard chip according to claim 2, wherein: The bottom of the cavity one is provided with an air inlet pipe one, and the bottom plate one is provided with an air inlet pipe two, the air inlet pipe one and the air inlet pipe two are provided with a flexible pipe therebetween, the inside top of the heat dissipation device body is provided with an inclined mesh plate one and an inclined mesh plate two, and the inclined mesh plate one and the inclined mesh plate two are fixed by bolts.

6. The heat-dissipating keyboard chip according to claim 5, wherein: The inclined mesh plate one and the inclined mesh plate two are provided with a plurality of ventilation holes two, and the diameter of the ventilation holes two is at least two kinds, and the vertical side plate one, the vertical side plate two and the horizontal top plate one are provided with ventilation holes three matched with the inclined mesh plate one and the inclined mesh plate two.

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