Cleaning device with good cleaning effect for semiconductor material preparation

Abstract

The utility model belongs to the technical field of semiconductor processing, and particularly relates to a cleaning device for semiconductor material preparation, which is good in cleaning effect and comprises a cleaning tank, a stirring mechanism, a material loading mechanism and a power mechanism, a water injection flange connecting pipe is fixed at the top end of the outer side face of the cleaning tank, and a water drainage flange connecting pipe is fixed on the bottom face of the cleaning tank. The material carrying mechanism comprises a semiconductor tray, a plurality of containing grooves distributed in a linear array mode are machined in the semiconductor tray, and a water permeable hole is machined in each containing groove. The cover plate is hinged to the semiconductor tray, and a water permeable opening is formed in the cover plate; according to the semiconductor cleaning device, the semiconductor devices to be cleaned are borne through the material carrying mechanism, a plurality of semiconductors can be cleaned at the same time, the cleaning water does not need to be completely stopped during cleaning, the stirring mechanism can be used for stirring the cleaning water, the cleaning water is made to vibrate, impurities on the semiconductors can be washed away easily, and the cleaning efficiency is improved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor processing technology, and specifically relates to a cleaning device for semiconductor material preparation with good cleaning effect. Background Technology

[0002] Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Common semiconductor materials include silicon, germanium and gallium arsenide. Silicon is the most influential of all semiconductor materials in terms of application.

[0003] During semiconductor manufacturing, semiconductors need to be cleaned. Currently, the commonly used method is immersion cleaning, which involves using a special cleaning tank, injecting cleaning water and special cleaning agent into the tank, and then immersing the semiconductor components in the cleaning tank for cleaning after the cleaning agent and cleaning water are fully mixed.

[0004] For example, in the prior art, Chinese utility model patent with authorization announcement number CN221269108U discloses "a semiconductor cleaning device", which includes a cleaning box, a container for containing cleaning agent, an extraction device for extracting cleaning agent into the cleaning box, a placement component for easy handling of semiconductors, a stirring component rotatably connected in the cleaning box, and a driving device for driving the stirring component to rotate; the container is disposed on one side of the cleaning box; and the extraction device is disposed inside the container.

[0005] While existing semiconductor cleaning equipment, including those mentioned above, can meet general cleaning needs, they are generally only suitable for cleaning single semiconductors and have low efficiency. This is because the cleaning agent and cleaning water are still in a state of vibration after being mixed. If multiple semiconductors are cleaned at the same time, they will collide and be damaged. If cleaning is only started after the cleaning water has completely stopped, the cleaning efficiency will also be low.

[0006] To address the aforementioned problems, this utility model proposes a cleaning device for semiconductor material preparation with good cleaning effect. Utility Model Content

[0007] To address the aforementioned problems in the existing technology, this utility model provides a cleaning device for semiconductor material preparation with good cleaning effect, which is convenient to use, has high safety performance, and high cleaning efficiency.

[0008] To achieve the above objectives, this utility model provides the following technical solution: a cleaning device for semiconductor material preparation with good cleaning effect, comprising a cleaning tank and a stirring mechanism disposed within the cleaning tank for stirring the cleaning water, a water injection flange pipe fixed to the top of the outer side of the cleaning tank and a drain flange pipe fixed to the bottom, and further comprising a material loading mechanism and a power mechanism, wherein the material loading mechanism is movably disposed within the cleaning tank, the power mechanism is used to drive the material loading mechanism to move, and the material loading mechanism includes:

[0009] A semiconductor tray having multiple placement slots arranged in a linear array on it, and each placement slot having a water-permeable hole.

[0010] A cover plate hinged to the semiconductor tray, and having water inlets machined on the cover plate.

[0011] As a preferred embodiment of this invention, a connecting groove is further processed on the semiconductor tray to allow the plurality of placement slots to communicate with each other.

[0012] As a preferred technical solution of this utility model, it also includes:

[0013] A locking mechanism is provided, which locks the cover plate after it is closed.

[0014] As a preferred embodiment of this utility model, the locking mechanism includes:

[0015] A limiting block, which is fixed to the free end of the cover plate and has a notch machined on it;

[0016] A flip screw, which is hinged to one end of the semiconductor tray and passes through the notch;

[0017] A wing nut is installed on the extended end of the reversing screw by means of thread engagement.

[0018] As a preferred embodiment of this utility model, the power mechanism includes:

[0019] An inverted L-shaped fixing bracket is fixed to the outer wall of the cleaning tank;

[0020] A movable plate, the movable plate being fixed to the end of the semiconductor tray;

[0021] A threaded screw is rotatably mounted between the horizontal part of the inverted L-shaped fixing frame and the inner bottom surface of the cleaning tank, and the threaded screw passes through the moving plate and is connected to the moving plate by a threaded engagement.

[0022] A drive motor is fixed to the top surface of the horizontal part of the inverted L-shaped fixing frame and is used to drive the threaded screw to rotate.

[0023] As a preferred embodiment of this utility model, the power mechanism further includes:

[0024] Two guide posts are symmetrically fixed between the horizontal part of the inverted L-shaped fixing frame and the inner bottom surface of the cleaning tank, and the guide posts penetrate the moving plate.

[0025] As a preferred embodiment of this utility model, the power mechanism is symmetrically distributed in two groups.

[0026] As a preferred embodiment of this utility model, the stirring mechanism includes:

[0027] A stirring motor is fixed to the center of the bottom surface of the cleaning tank, and the bottom surface of the cleaning tank has a hole through which the output shaft of the stirring motor passes.

[0028] A rotating column, which is fixed on the output shaft of the stirring motor;

[0029] A stirring paddle, which is fixed on the rotating column.

[0030] Compared with the prior art, the beneficial effects of this utility model are:

[0031] In this invention, the semiconductor device to be cleaned is carried by a material carrier mechanism, which can clean multiple semiconductors at the same time. Moreover, during cleaning, it is not necessary to wait for the cleaning water to completely stop. The cleaning water can be stirred by a stirring mechanism to create oscillation, which helps to wash away impurities on the semiconductor and improves cleaning efficiency.

[0032] Other additional advantages and beneficial effects of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this invention. Attached Figure Description

[0033] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0034] Figure 1 This is a schematic diagram of the structure of this utility model;

[0035] Figure 2 This is a schematic diagram of the isometric structure of the semiconductor tray in this utility model;

[0036] Figure 3This is a schematic diagram of the isometric structure of the material loading mechanism in this utility model;

[0037] Figure 4 This utility model Figure 1 A schematic diagram of the enlarged structure of the power mechanism in the diagram;

[0038] Figure 5 This utility model Figure 3 A magnified schematic diagram of the locking mechanism in the diagram;

[0039] Figure 6 This is an isometric structural diagram of the stirring mechanism in this utility model.

[0040] In the diagram: 1. Cleaning tank; 11. Water injection flange connection; 12. Drainage flange connection; 2. Material loading mechanism; 21. Semiconductor tray; 211. Placement trough; 212. Water inlet; 213. Connecting trough; 22. Cover plate; 221. Water outlet; 23. Locking mechanism; 231. Limiting block; 2311. Notch; 232. Flip screw; 233. Wing nut; 3. Power mechanism; 31. Reverse L-shaped fixing frame; 32. Moving plate; 33. Threaded screw; 34. Drive motor; 35. Guide column; 4. Stirring mechanism; 41. Stirring motor; 42. Rotating column; 43. Stirring paddle. Detailed Implementation

[0041] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0042] Please see Figures 1-6 The present invention provides the following technical solution: a cleaning device for semiconductor material preparation with good cleaning effect, including a cleaning tank 1 and a stirring mechanism 4 disposed in the cleaning tank 1 for stirring the cleaning water. A water injection flange pipe 11 is fixed at the top of the outer side of the cleaning tank 1 and a drain flange pipe 12 is fixed at the bottom. It also includes a material loading mechanism 2 and a power mechanism 3. The material loading mechanism 2 is movably disposed in the cleaning tank 1. The power mechanism 3 is used to drive the material loading mechanism 2 to move. The material loading mechanism 2 includes a semiconductor tray 21 and a cover plate 22.

[0043] Furthermore, by Figure 1 and Figure 2As shown, in this embodiment, a plurality of placement slots 211 arranged in a linear array are processed on the semiconductor tray 21, and a water permeable hole 212 is processed in each placement slot 211. The cover plate 22 is hinged to the semiconductor tray 21, and a water permeable port 221 is processed on the cover plate 22. With the above scheme, in use, the power mechanism 3 is first started to drive the material loading mechanism 2 to rise to a higher position, then the cover plate 22 is opened, the semiconductor to be cleaned is placed in the placement slot 211, and then the cover plate 22 is closed. An appropriate amount of cleaning water is injected into the cleaning tank 1 through the water injection flange pipe 11. An appropriate amount of cleaning agent is injected, and then the stirring mechanism 4 is started to stir the cleaning water, so that the cleaning water and cleaning agent are fully mixed. After that, the power mechanism 3 is started to drive the material carrier 2 to move down, so that the semiconductor is immersed in the cleaning water. During this process, the stirring mechanism 4 does not need to be stopped, thus achieving the cleaning of the semiconductor. This utility model uses the material carrier 2 to carry the semiconductor device to be cleaned, which can clean multiple semiconductors at the same time. Moreover, during cleaning, it is not necessary to wait for the cleaning water to completely stop. The stirring mechanism 4 can be used to stir the cleaning water, so that the cleaning water will vibrate, which is beneficial to washing away impurities on the semiconductor and improving the cleaning efficiency.

[0044] It should be noted that when injecting an appropriate amount of cleaning agent into the cleaning tank 1, it is preferable to use a syringe or other graduated container to facilitate quantitative addition of the cleaning agent.

[0045] In actual use, the water injection flange connection 11 and the drain flange connection 12 are respectively connected to water pumps, which are used to inject an appropriate amount of cleaning water into the cleaning tank 1 and to extract the cleaning water.

[0046] Preferably, by Figure 1 and Figure 2 As shown in this embodiment, a connecting groove 213 for communicating with each other is also processed on the semiconductor tray 21. With the above design, cleaning water can quickly reach each placement groove 211 to immerse the semiconductor.

[0047] Preferably, by Figures 1-3 As shown, in this embodiment, it also includes a locking mechanism 23, which locks the cover plate 22 after it is closed, ensuring the stability of the cover plate 22 after it is closed.

[0048] Optionally, by Figures 1-3 , Figure 5As shown, in this embodiment, the locking mechanism 23 includes: a limiting block 231, a flip screw 232, and a wing nut 233. The limiting block 231 is fixed to the free end of the cover plate 22, and a notch 2311 is machined on the limiting block 231. The flip screw 232 is hinged to one end of the semiconductor tray 21 and passes through the notch 2311. The wing nut 233 is installed on the extended end of the flip screw 232 by thread engagement. With the above scheme, when the cover plate 22 is closed, the flip screw 232 is rotated upward to make the flip screw 232 pass through the notch 2311. Then, the wing nut 233 is tightened on the extended end of the flip screw 232 to lock the cover plate 22.

[0049] Optionally, by Figure 1 , Figure 2 and Figure 4 As shown, in this embodiment, the power mechanism 3 includes: an inverted L-shaped fixing frame 31, a movable plate 32, a threaded screw 33, and a drive motor 34. The inverted L-shaped fixing frame 31 is fixed to the outer wall of the cleaning tank 1, the movable plate 32 is fixed to the end of the semiconductor tray 21, the threaded screw 33 is rotatably installed between the horizontal part of the inverted L-shaped fixing frame 31 and the inner bottom surface of the cleaning tank 1, and the threaded screw 33 passes through the movable plate 32 and is connected to the movable plate 32 by threaded engagement. The drive motor 34 is fixed to the top surface of the horizontal part of the inverted L-shaped fixing frame 31 and is used to drive the threaded screw 33 to rotate. With the above scheme, when in use, the drive motor 34 is started to drive the threaded screw 33 to rotate. Under the threaded engagement, the semiconductor tray 21 rises and falls in the vertical direction.

[0050] Preferably, by Figure 1 , Figure 2 and Figure 4 As shown in this embodiment, the power mechanism 3 further includes: guide columns 35. Two guide columns 35 are symmetrically fixed between the horizontal part of the inverted L-shaped fixing frame 31 and the inner bottom surface of the cleaning tank 1, and the guide columns 35 penetrate the moving plate 32. After adopting the above solution, when in use, the two guide columns 35 are used to guide the semiconductor tray 21, which improves the stability of the semiconductor tray 21.

[0051] Preferably, by Figure 1 As shown in this embodiment, the power mechanism 3 is symmetrically distributed in two sets. After adopting the above scheme, the two sets of power mechanisms 3 drive the semiconductor tray 21 from both ends at the same time, resulting in higher stability.

[0052] Optionally, by Figure 1 and Figure 6As shown, in this embodiment, the stirring mechanism 4 includes: a stirring motor 41, a rotating column 42, and a stirring paddle 43. The stirring motor 41 is fixed in the middle of the bottom surface of the cleaning tank 1, and the bottom surface of the cleaning tank 1 has a hole through which the output shaft of the stirring motor 41 passes. The rotating column 42 is fixed on the output shaft of the stirring motor 41, and the stirring paddle 43 is fixed on the rotating column 42. With the above solution, when in use, the stirring motor 41 is started to drive the rotating column 42 to rotate, and the rotating column 42 drives the stirring paddle 43 to rotate to stir the cleaning water.

[0053] It should be noted that the drive motor 34 and the stirring motor 41 are both commercially available conventional equipment with built-in power switches. Those skilled in the art can make conventional selections according to their needs. Their working principles are common knowledge known to those skilled in the art and have been fully disclosed in the prior art, so they will not be elaborated on further in this article.

[0054] The circuit connection involved in this utility model is a common method used by those skilled in the art, and technical inspiration can be obtained through a limited number of experiments. It belongs to the widely used prior art.

[0055] Components not described in detail in this article are existing technologies.

[0056] The working principle and usage process of this utility model: When using the cleaning device of this utility model, first start the drive motor 34 to drive the threaded screw 33 to rotate, so that the material loading mechanism 2 rises to a higher position. Then open the cover plate 22, place the semiconductor to be cleaned into the placement groove 211, close the cover plate 22, and lock it with the locking mechanism 23 to ensure the stability of the cover plate 22 after it is closed.

[0057] A suitable amount of cleaning water is injected into the cleaning tank 1 through the water injection flange pipe 11, and then a suitable amount of cleaning agent is injected. Then, the stirring motor 41 is started to drive the rotating column 42 to rotate. The rotating column 42 drives the stirring paddle 43 to rotate and stir the cleaning water, so that the cleaning water and cleaning agent are fully mixed.

[0058] Then, the drive motor 34 is started to drive the threaded screw 33 to rotate in the opposite direction, causing the material loading mechanism 2 to move down and immerse the semiconductor in the cleaning water. During this process, there is no need to stop the stirring mechanism 4. The cleaning water quickly reaches the semiconductor through the water inlet 212, the connecting groove 213 and the water outlet 221 to clean the semiconductor.

[0059] This invention uses a material carrier 2 to carry semiconductor devices to be cleaned, enabling the simultaneous cleaning of multiple semiconductors. Furthermore, during cleaning, it is not necessary to wait for the cleaning water to completely stop; the stirring mechanism 4 can be used to agitate the cleaning water, causing it to vibrate and thus helping to remove impurities from the semiconductors and improving cleaning efficiency.

[0060] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A cleaning apparatus for semiconductor material preparation with good cleaning effect, comprising a cleaning tank (1) and a stirring mechanism (4) disposed in the cleaning tank (1) for stirring the cleaning water, wherein a water injection flange pipe (11) is fixed to the top of the outer side of the cleaning tank (1) and a drain flange pipe (12) is fixed to the bottom, characterized in that, It also includes a loading mechanism (2) and a power mechanism (3), wherein the loading mechanism (2) is movably disposed within the cleaning tank (1), and the power mechanism (3) is used to drive the loading mechanism (2) to move, and the loading mechanism (2) includes: A semiconductor tray (21) has a plurality of placement slots (211) arranged in a linear array on the semiconductor tray (21), and a water-permeable hole (212) is formed in each placement slot (211). A cover plate (22) is hinged to the semiconductor tray (21) and has a water inlet (221) machined on it.

2. The cleaning apparatus for semiconductor material preparation with good cleaning effect according to claim 1, characterized in that: A connecting groove (213) is also machined on the semiconductor tray (21) to allow the plurality of placement slots (211) to communicate with each other.

3. The cleaning apparatus for semiconductor material preparation with good cleaning effect according to claim 1, characterized in that: Also includes: The cover plate (22) is locked by the locking mechanism (23) after it is closed.

4. The cleaning apparatus for semiconductor material preparation with good cleaning effect according to claim 3, characterized in that: The locking mechanism (23) includes: A limiting block (231) is fixed to the free end of the cover plate (22), and a notch (2311) is machined on the limiting block (231); A flip screw (232) is hinged to one end of the semiconductor tray (21) and passes through the notch (2311); A wing nut (233) is installed on the extended end of the reversing screw (232) by means of thread engagement.

5. The cleaning apparatus for semiconductor material preparation with good cleaning effect according to claim 1, characterized in that: The power mechanism (3) includes: An inverted L-shaped fixing bracket (31) is fixed to the outer wall of the cleaning tank (1); A movable plate (32) is fixed to the end of the semiconductor tray (21); A threaded screw (33) is rotatably mounted between the horizontal part of the inverted L-shaped fixing frame (31) and the inner bottom surface of the cleaning tank (1), and the threaded screw (33) passes through the moving plate (32) and is connected to the moving plate (32) by thread engagement. A drive motor (34) is fixed to the top surface of the horizontal part of the inverted L-shaped fixing bracket (31) and is used to drive the threaded screw (33) to rotate.

6. The cleaning apparatus for semiconductor material preparation with good cleaning effect according to claim 5, characterized in that: The power mechanism (3) also includes: Guide posts (35), two guide posts (35) are symmetrically fixed between the horizontal part of the inverted L-shaped fixing frame (31) and the inner bottom surface of the cleaning tank (1), and the guide posts (35) penetrate the moving plate (32).

7. The cleaning apparatus for semiconductor material preparation with good cleaning effect according to claim 1, characterized in that: The power mechanism (3) is symmetrically distributed in two groups.

8. The cleaning apparatus for semiconductor material preparation with good cleaning effect according to claim 1, characterized in that: The stirring mechanism (4) includes: A stirring motor (41) is fixed to the middle of the bottom surface of the cleaning tank (1), and the bottom surface of the cleaning tank (1) has a hole through which the output shaft of the stirring motor (41) passes. A rotating column (42) is fixed on the output shaft of the stirring motor (41); A stirring paddle (43) is fixed on the rotating column (42).

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