Bar sticking device and production equipment
The automated positioning and alignment technology of the bonding device solves the problem of crystal rod length not meeting processing requirements, achieving a high-precision and stable bonding process, and improving production efficiency and safety.
Patent Information
- Application Number
- CN202520349188.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2035-02-28
AI Technical Summary
In existing technologies, the length of the crystal rod does not meet the processing requirements, which leads to additional rod bonding operations that increase the processing difficulty, complexity and time. Manual bonding has the problems of unstable precision and safety hazards, affecting product quality and production efficiency.
The device employs a rod bonding mechanism, including a positioning probe and a center positioner, to automatically align the silicon rods by center positioning. Combined with an adhesive application assembly and a clamping assembly, it achieves an automated bonding process, ensuring the alignment of the crystal rod centerline and bonding accuracy.
It improves the precision and stability of crystal rod bonding, reduces reliance on manual labor, increases production efficiency and equipment uptime, and reduces safety risks.
Smart Images

Figure CN223890265U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of sticking rod technology, and in particular to a sticking rod device and production equipment. Background Technology
[0002] Due to the production characteristics of crystal ingots, it is often difficult to obtain round ingots with the exact length required for processing. For example, the length of a crystal ingot is typically around 3600mm, while the required unit length is 810-830mm. After cutting, short round ingots of about 280mm in length remain, which do not meet processing requirements. Operators need to bond these short round ingots with other crystal ingots to make the silicon ingot length meet the processing requirements. This additional ingot bonding operation not only increases the difficulty and complexity of processing but also consumes a significant amount of production time and reduces equipment uptime.
[0003] Furthermore, the current rod-bonding process relies heavily on manual labor, requiring the round rods to be bonded to be manually aligned before applying adhesive. Manual operation is inherently unpredictable; under prolonged, high-intensity work conditions, it's difficult to guarantee the precision and stability of each bonding operation, potentially leading to inconsistent product quality and impacting the final product's performance and stability. Operators typically require a significant amount of time to complete the bonding process, especially under high-precision requirements, where meticulous adjustments to every detail are necessary. This drastically limits production efficiency and indirectly increases production costs. Additionally, manual operation increases safety hazards during production. Utility Model Content
[0004] The purpose of this invention is at least to provide a rod bonding device and production equipment that can accurately and efficiently align silicon rods automatically to meet the accuracy and stability requirements of silicon rod bonding.
[0005] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form to prepare for the more detailed descriptions that follow.
[0006] One embodiment of this utility model provides a sticking device for sticking a first crystal rod and a second crystal rod. The sticking device includes a positioning probe and a center locator. The positioning probe is disposed around the circumference of the first crystal rod or the second crystal rod. The center locator is used to locate the first center line of the first crystal rod and the second center line of the second crystal rod by means of the center. The positioning probe is used to support the first crystal rod and the second crystal rod. The length of the positioning probe in the vertical direction is adjustable so that the first center line and the second center line are aligned. The vertical direction is perpendicular to the center line of the sticking device.
[0007] In some embodiments, the sticking device includes a controller, a positioning probe is driven by a drive unit to extend and retract in the vertical direction, the controller is signal-connected to a central locator and the drive unit; the central locator has a central positioning line, the central positioning line is collinear with the centerline of the sticking device, the controller obtains the positions of the central positioning line, the first centerline and the second centerline determined by the central locator, and controls the drive unit to actuate so that the central positioning line coincides with the first centerline and the second centerline.
[0008] In some embodiments, the center locator includes at least one laser scanner for acquiring images of the first crystal rod and the second crystal rod.
[0009] In some embodiments, a plurality of positioning probes are distributed circumferentially on the first crystal rod and the second crystal rod, and a plurality of positioning probes are distributed along the centerline. The plurality of positioning probes are configured in one-to-one correspondence with the driving unit, and one driving unit drives one positioning probe.
[0010] In some embodiments, the sticking device includes an adhesive applicator disposed circumferentially on the first or second crystal rod, the adhesive applicator being used to identify the bonding surface of the first or second crystal rod and to dispense adhesive to the bonding surface.
[0011] In some embodiments, the adhesive application assembly includes an adhesive storage component and a moving component. The adhesive storage component stores adhesive and has an adhesive outlet that communicates with the inner cavity of the adhesive storage component. The moving component moves the adhesive storage component along the centerline. An image sensor is disposed around the adhesive outlet to identify the bonding surface. The adhesive stick device includes a controller that is signal-connected to the image sensor and the moving component. The controller acquires the detection signal from the image sensor and controls the moving component to stop the adhesive outlet at the bonding surface.
[0012] In some embodiments, an automatic switch is provided on the connecting pipe between the dispensing port and the adhesive storage component. The automatic switch is connected to the controller signal. When the moving component stops the dispensing port at the bonding surface, the controller controls the automatic switch to turn on.
[0013] In some embodiments, the stick-adhesive device includes a clamping assembly, which includes at least two clamping heads that are movable along a centerline. The stick-adhesive device includes a controller, and the clamping heads are signal-connected to the controller. After the adhesive dispensing assembly discharges adhesive, the controller controls the clamping heads to push one of the first and second crystal rods to move closer to the other of the first and second crystal rods until the bonding surfaces of the first and second crystal rods abut against each other.
[0014] This specification also provides a production device, including the stick-adhesive device of any of the above embodiments. The production device includes a cutting device, a processing device, and a conveying device. The cutting device is connected to the processing device through the conveying device, and the cutting device is connected to the stick-adhesive device through the conveying device. The stick-adhesive device is connected to the processing device through the conveying device.
[0015] In some embodiments, the cutting device includes a measuring component for measuring the length of the cut crystal rod. If the length of the crystal rod meets a threshold, the crystal rod is conveyed to the processing device via a conveying device. If the length of the crystal rod is less than the threshold, the crystal rod is conveyed to the sticking device via a conveying device.
[0016] This utility model relates to an automatic rod bonding device. By employing a center locator and a center-positioning algorithm based on the locator, it can accurately identify and calibrate the centerline of the crystal rod, ensuring the accuracy of the rod bonding position and direction. This is crucial for subsequent processing and dimensional control, contributing to improved product quality and stability. By using a positioning probe, the position of the crystal rod is adjusted based on its centerline. Since the diameter of each crystal rod varies at different locations, when the rod is placed on the positioning probe, the probe adjusts its height to align the centerlines of at least two crystal rods into a straight line for bonding, significantly improving the precision of the bonding. Attached Figure Description
[0017] The above-described features and advantages of this invention can be better understood after reading the following detailed description of the embodiments of this disclosure in conjunction with the accompanying drawings. In the drawings, the components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals. Wherein:
[0018] Figure 1 This is a schematic diagram of the positioning probe structure according to some embodiments;
[0019] Figure 2 This is a structural schematic diagram of the adhesive rod device according to some embodiments. Detailed Implementation
[0020] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. It should be noted that the aspects described below with reference to the accompanying drawings and specific embodiments are merely exemplary and should not be construed as limiting the scope of protection of the present invention in any way.
[0021] It should be understood that the terms “system,” “device,” “unit,” and / or “module” used herein are one method of distinguishing different components, elements, parts, sections, or assemblies at different levels. However, if other words can achieve the same purpose, they may be replaced by other expressions.
[0022] It is understood that the technical terms that may be involved in the description of this specification, such as “center,” “longitudinal,” “lateral,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the implementation method and do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of the utility model.
[0023] It should be noted that the use of terms such as "first" and "second" to define features in this article is merely for the purpose of distinguishing the corresponding features. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.
[0024] In the description of this specification, it should also be noted that, unless otherwise expressly specified or limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, an integral connection, or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium, or a connection within two components, etc. Those skilled in the art can understand the specific meaning of the above terms in this specification according to the specific circumstances.
[0025] Figure 1 This is a schematic diagram of the positioning probe structure according to some embodiments; Figure 2 This is a structural schematic diagram of the adhesive rod device according to some embodiments.
[0026] This specification proposes a turbine active clearance control method. This device needs to have characteristics such as high-precision positioning, stable control, and intelligent operation to ensure that each sticking rod can achieve the preset accuracy requirements and maintain a high degree of consistency.
[0027] And because the diameter of each rod is inconsistent in different places,
[0028] like Figure 1 and Figure 2 As shown, the adhesive device includes a positioning probe 1 and a center locator (not shown) for bonding the first crystal rod 5 and the second crystal rod 6. It should be noted that the adhesive device can also be used for bonding the first crystal rod 5, the second crystal rod 6, and a third crystal rod, or even more crystal rods. This specification describes an embodiment using the adhesive device for bonding the first crystal rod 5 and the second crystal rod 6 as an example.
[0029] A center positioning device is used to locate the center position of a crystal rod (including a first crystal rod 5 and a second crystal rod 6). The center positioning device determines the first center line of the first crystal rod 5 and the second center line of the second crystal rod 6 through center positioning. The first center line refers to the central axis of the first crystal rod 5 along its axial direction, and the second center line refers to the central axis of the second crystal rod 6 along its axial direction. In some embodiments, the center positioning device can acquire an image of the crystal rod, process the image, and identify the center line (including the first and second center lines) of the crystal rod through a center positioning algorithm, such as Hough transform. In some embodiments, the center positioner includes at least one laser scanner, such as a lidar, used to acquire images of the first crystal rod 5 and the second crystal rod 6. In some embodiments, the laser scanner is mounted on the periphery of the first crystal rod 5 or the second crystal rod 6, or both the periphery of the first crystal rod 5 and the periphery of the second crystal rod 6 are provided with laser scanners. The laser scanner acquires axial images of the crystal rods, facilitating the determination of the center line of the crystal rod along its axial direction.
[0030] Positioning probe 1 is used to support the first crystal rod 5 and the second crystal rod 6. Positioning probe 1 is positioned on the circumferential side of the first crystal rod 5 or the second crystal rod 6. The first crystal rod 5 and the second crystal rod 6 are placed on positioning probe 1. Positioning probe 1 is positioned vertically (see...). Figure 1 The length of the positioning probe 1 is adjustable, thereby changing the height of the centerline of the crystal rod to align the first and second centerlines. The vertical direction is perpendicular to the centerline of the sticking device. In some embodiments, the positioning probe 1 includes a driving unit, which drives the positioning probe 1 to extend and retract vertically. For example, the positioning probe 1 can be an electrically operated retractable rod, and the driving unit is a linear motor. In some embodiments, since the diameter of the crystal rod varies at different axial positions, positioning probes 1 need to be set separately for adaptive adjustment to align the first and second centerlines. A plurality of positioning probes 1 are distributed circumferentially on the first crystal rod 5 and the second crystal rod 6, and a plurality of positioning probes 1 are distributed along the direction of the centerline of the sticking device. Each positioning probe 1 corresponds to a driving unit, with one driving unit driving one positioning probe 1. The centerline of the sticking device, as described in this specification, refers to the symmetrical centerline that roughly divides the sticking device into two symmetrical parts along the extension direction of the crystal rod.
[0031] In some embodiments, to facilitate the alignment of the first center line and the second center line, the center locator predetermines the center positioning line 4, which is collinear with the center line of the sticking device. By adjusting the first center line of the first crystal rod 5 and the second center line of the second crystal rod 6 onto the center positioning line 4 using the positioning probe 1, the alignment of the first center line and the second center line can be achieved.
[0032] In some embodiments, the adhesive stick device further includes a controller, and the driving units of the center locator and the positioning probe 1 are signal-connected to the controller. The controller acquires the positions of the center positioning line 4, the first center line, and the second center line determined by the center locator, determines the deviation between the center positioning line 4 and the first center line and the second center line, controls the driving units of the positioning probe 1 at each corresponding position to actuate, and drives the positioning probe 1 at each corresponding position to adjust its own length so that the first center line and the second center line coincide with the center positioning line 4.
[0033] The bonding device includes an adhesive applicator 2, which identifies the bonding surface 7 of the first crystal rod 5 or the second crystal rod 6 and dispenses adhesive (e.g., glue, hot melt adhesive, etc.) onto the bonding surface 7. In some embodiments, the adhesive applicator 2 is positioned circumferentially on the first crystal rod 5 or the second crystal rod 6. After the crystal rod is accurately positioned on the center positioning line 4, the adhesive applicator 2 begins to operate, automatically identifying the bonding surface 7 and performing the bonding process. In some embodiments, such as Figure 2 As shown, the adhesive application assembly 2 includes an adhesive storage unit 21 for storing adhesive. The adhesive storage unit 21 has an adhesive outlet 23, which communicates with the inner cavity of the adhesive storage unit 21. In some embodiments, the inner cavity of the adhesive storage unit 21 is connected to the adhesive outlet 23 via a connecting pipe. The adhesive in the adhesive storage unit 21 is discharged from the adhesive outlet 23 through the connecting pipe. In some embodiments, the adhesive application assembly includes a moving member 22 for moving the adhesive storage unit 21 along a centerline. The moving member 22 is connected to the adhesive storage unit 21, and by moving the adhesive storage unit 21, the moving member 22 moves the adhesive outlet 23 to the bonding surface 7. When the adhesive outlet 23 moves to the bonding surface 7, the adhesive outlet 23 discharges adhesive onto the bonding surface 7.
[0034] In some embodiments, the position of the adhesive surface 7 is identified by a central locator. The moving part 22 is signal-connected to the controller. The controller obtains the position of the adhesive surface 7 from the central locator and controls the moving part 22 to move the dispensing nozzle 23 to the adhesive surface 7. In some embodiments, an image sensor may also be provided around the dispensing nozzle 23. The image sensor is used to identify the position of the adhesive surface 7. The image sensor is signal-connected to the controller. The controller obtains the detection signal from the image sensor, i.e., the position of the adhesive surface 7 detected by the image sensor, and controls the moving part 22 to move the dispensing nozzle 23 and stop it at the adhesive surface 7.
[0035] In some embodiments, an automatic switch 24 is provided on the connecting pipe between the dispensing port 23 and the adhesive storage component 21. The automatic switch 24 is connected to the controller signal. When the moving component 22 stops the dispensing port 23 at the bonding surface 7, the controller controls the automatic switch 24 to turn on. After a certain period of time, the automatic switch 24 automatically turns off.
[0036] In some embodiments, the adhesive applicator includes a clamping assembly with at least two clamping heads that are movable along a centerline and are signal-connected to a controller. The two clamping heads are respectively disposed on the end faces of the first crystal rod 5 and the second crystal rod 6. After the adhesive applicator discharges from the outlet 23, the controller controls the two clamping heads to move closer together and push one of the first crystal rod 5 and the second crystal rod 6 towards the other, until the adhesive surfaces of the first and second crystal rods abut against each other. After a certain period of contact, the two clamping heads move away from each other, releasing the first crystal rod 5 and the second crystal rod 6. As an example only, the two clamping heads move closer together and abut against the end faces of the first crystal rod 5 and the second crystal rod 6 respectively, and both clamping heads continue to move simultaneously until the adhesive surfaces of the first crystal rod 5 and the second crystal rod 6 approach and abut against each other. In some embodiments, the clamping head is equipped with a pressure sensor. When the pressure detected by the pressure sensor reaches a set threshold, it indicates that the bonding surface of the first crystal rod 5 and the bonding surface of the second crystal rod 6 are pressed together, and the two clamping heads no longer move.
[0037] In some embodiments, the rod bonding device further includes a housing 3, which surrounds the other components of the rod bonding device. The housing 3 provides a relatively enclosed environment for the operation of the rod bonding assembly, and is provided with a rod inlet and a rod outlet for feeding and discharging the crystal rods.
[0038] This specification also relates to a production device, including the stick-attaching device described in the above embodiments. The production device includes a cutting device, a processing device, and a conveying device. The cutting device is connected to the processing device via the conveying device, and the cutting device is connected to the stick-attaching device via the conveying device. The stick-attaching device is connected to the processing device via the conveying device.
[0039] The original production process involves cutting crystal ingots to standard sizes and then conveying them to processing equipment, such as squaring machines and grinding guides. Ingots smaller than the standard size are manually bonded and then repositioned to the processing equipment. This process is very time-consuming, reduces the uptime of the processing equipment, and the bonding stability and accuracy of manual bonding are low. Alternatively, ingots smaller than the standard size can be directly conveyed to the processing equipment, and the equipment parameters can be readjusted for processing. As shown in Table 1, taking the working efficiency of squaring machines and grinding guides as examples, the efficiency of squaring and grinding guides for standard-sized ingots is greater than that for ingots smaller than the standard size. Therefore, introducing a bonding process can avoid this efficiency difference, improving production efficiency and preventing reduced equipment uptime due to frequent parameter adjustments. Therefore, adding a bonding process to the original production process, automatically transferring ingots smaller than the standard size to a bonding device for bonding, improves bonding efficiency and accuracy, and ultimately increases the uptime of the processing equipment.
[0040]
[0041] Table 1
[0042] In some embodiments, the cutting device includes a measuring component for measuring the length of the cut crystal rod. If the length of the crystal rod meets a threshold (i.e., standard size), the crystal rod is conveyed to the processing device via a conveying device. If the length of the crystal rod is less than the threshold, the crystal rod is conveyed to the sticking device via a conveying device.
[0043] As an example only, in actual production, crystal ingots are cut into rods of approximately 830mm for processing, leaving relatively short rods. These short rods are conveyed to a rod-bonding device via a conveyor. The rod-bonding device is equipped with automatically adjusting positioning probes, which support and position the short rods according to a preset arrangement and density distribution. The short rods are then fixed to the positioning probes. A center locator calibrates the center of the short rods, ensuring that the centerlines of multiple short rods are aligned with the central positioning line, significantly improving the bonding accuracy. The rod-bonding device bonds multiple short rods into rods of approximately 830mm. Finally, the bonded crystal ingots are transferred to subsequent processing units via a conveyor, greatly improving the utilization rate of the processing units.
[0044] The basic concepts have been described above. It is clear that the detailed disclosure above is merely illustrative and does not constitute a limitation of this specification, especially for those skilled in the art. Furthermore, unless expressly stated in the claims, the order of elements and sequences, the use of numbers and letters, or other names in this specification are not intended to limit the order of the processes and methods described herein. Although various examples of utility model embodiments that are currently considered useful have been discussed in the foregoing disclosure, it should be understood that such details are for illustrative purposes only, and the appended claims are not limited to the disclosed embodiments. Rather, the claims are intended to cover all modifications and equivalent combinations that conform to the substance and scope of the embodiments described herein.
Claims
1. An adhesive stick device, characterized in that, For bonding a first crystal rod and a second crystal rod, the bonding device includes a positioning probe and a center positioner, wherein the positioning probe is disposed in the circumferential direction of the first crystal rod or the second crystal rod; The center locator is used to locate the first center line of the first crystal rod and the second center line of the second crystal rod by means of the center of the circle; The positioning probe is used to support the first crystal rod and the second crystal rod. The length of the positioning probe in the vertical direction is adjustable so that the first center line and the second center line are aligned. The vertical direction is perpendicular to the center line of the sticking device.
2. The adhesive rod device according to claim 1, characterized in that, The adhesive stick device includes a controller, the positioning probe is driven by a drive unit to extend and retract along the vertical direction, and the controller is signal-connected to the central locator and the drive unit; The central locator has a central positioning line, which is collinear with the centerline of the adhesive stick device. The controller obtains the positions of the central positioning line, the first centerline, and the second centerline determined by the central locator, and controls the drive unit to actuate so that the central positioning line coincides with the first centerline and the second centerline.
3. The adhesive rod device according to claim 2, characterized in that, The central locator includes at least one laser scanner for acquiring images of the first crystal rod and the second crystal rod.
4. The adhesive rod device according to claim 2, characterized in that, The first crystal rod and the second crystal rod have a plurality of positioning probes distributed in the circumferential direction and a plurality of positioning probes distributed in the direction along the center line. The plurality of positioning probes are configured in one-to-one correspondence with the driving unit, and one driving unit drives one positioning probe.
5. The adhesive rod device according to claim 1, characterized in that, The sticking device includes an adhesive application component disposed on the circumferential direction of the first or second crystal rod. The adhesive application component is used to identify the bonding surface of the first or second crystal rod and to discharge adhesive to the bonding surface.
6. The adhesive rod device according to claim 5, characterized in that, The adhesive application assembly includes an adhesive storage component and a moving component. The adhesive storage component is used to store the adhesive, and an adhesive outlet is provided on the adhesive storage component. The adhesive outlet communicates with the inner cavity of the adhesive storage component where the adhesive is stored. The moving component is used to drive the adhesive storage component to move along the direction of the centerline. An image sensor is disposed around the glue outlet. The image sensor is used to identify the bonding surface. The adhesive stick device includes a controller. The controller is signal-connected to the image sensor and the moving part. The controller acquires the detection signal from the image sensor and controls the moving part to stop the glue outlet at the bonding surface.
7. The adhesive rod device according to claim 6, characterized in that, An automatic switch is installed on the connecting pipe between the glue outlet and the glue storage component. The automatic switch is signal-connected to the controller. When the moving component stops the glue outlet at the bonding surface, the controller controls the automatic switch to turn on.
8. The adhesive rod device according to claim 5, characterized in that, The sticking device includes a clamping assembly, the clamping assembly includes at least two clamping heads, the clamping heads are movable along the centerline, and the sticking device includes a controller, the clamping heads being signal-connected to the controller; After the adhesive coating assembly discharges the adhesive, the controller controls the clamping head to push one of the first crystal rod and the second crystal rod to move closer to the other of the first crystal rod and the second crystal rod, until the bonding surfaces of the first crystal rod and the second crystal rod come into contact.
9. A production equipment, characterized in that, The adhesive stick device includes any one of claims 1-8, wherein the production equipment includes a cutting device, a processing device, and a conveying device, wherein the cutting device is connected to the processing device via the conveying device, the cutting device is connected to the adhesive stick device via the conveying device, and the adhesive stick device is connected to the processing device via the conveying device.
10. The production equipment according to claim 9, characterized in that, The cutting device includes a measuring component for measuring the length of the cut crystal rod. If the length of the crystal rod meets a threshold, the crystal rod is conveyed to the processing device via the conveying device. If the length of the crystal rod is less than the threshold, the crystal rod is conveyed to the sticking device via the conveying device.