Device for adjusting flatness of long film of machine table

Abstract

A device for adjusting the flatness of a long film of a machine comprises a reaction cavity; the spraying head is used for introducing process gas into the reaction cavity; the heating disc is used for bearing and heating the wafer placed in the reaction cavity; the adjusting rod extends in the first direction, one end of the adjusting rod is fixedly connected with the heating disc, and the other end of the adjusting rod penetrates through the side wall of the reaction cavity and extends out of the reaction cavity; the adjusting plate is arranged outside the reaction cavity, and the adjusting plate is fixedly connected with the adjusting rod; the scale fine adjustment device is fixedly connected with the adjusting plate and the reaction cavity, and the scale fine adjustment device is used for adjusting the inclination amplitude of the heating disc. The inclination amplitude adjustment of the heating disc is realized by additionally arranging the scale fine adjustment device, so that each adjustment is supported by data with scales, the growth flatness of a wafer film is conveniently analyzed in the later period, and the quality problem that the growth flatness varies from person to person does not exist. And moreover, the maintenance machine can quickly stabilize the wafer film growth flatness value requirement, and the product production capacity is increased.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a device for adjusting the flatness of a long film on a machine. Background Technology

[0002] Chemical vapor deposition (CVD) and physical vapor deposition (PVD) are technologies widely used in the semiconductor industry for thin film deposition. CVD equipment, for example, includes a reaction chamber and a wafer heating plate. When two or more gaseous raw materials are introduced into the reaction chamber, they react chemically to form a new material, which is then deposited onto the surface of the heated wafer, creating a thin film.

[0003] However, existing technologies for adjusting the flatness of the long film on the machine still have many problems. Utility Model Content

[0004] The technical problem solved by this utility model is to provide a device for adjusting the flatness of the long film on the machine, so that each adjustment is supported by scale data.

[0005] To address the aforementioned problems, this utility model provides a device for adjusting the flatness of a long film on a production line, comprising: a reaction chamber; a spray head disposed within the reaction chamber for introducing process gas into the reaction chamber; a heating plate disposed within the reaction chamber for supporting and heating a wafer placed within the reaction chamber; an adjusting rod extending along a first direction perpendicular to the supporting surface of the heating plate, one end of the adjusting rod being fixedly connected to the heating plate, and the other end of the adjusting rod penetrating the side wall of the reaction chamber and extending to the outside of the reaction chamber; an adjusting plate disposed outside the reaction chamber and fixedly connected to the adjusting rod; and a fine-tuning device fixedly connected to both the adjusting plate and the reaction chamber, for adjusting the tilt angle of the heating plate.

[0006] Optionally, the scale fine-tuning device includes: a support member fixedly connected to the adjustment plate; a threaded rod extending along the first direction and fixedly connected to the reaction chamber; a scale adjustment component passing through the support member; and a drive gear fixedly connected to the end of the scale adjustment component and meshing with the threaded rod.

[0007] Optionally, the scale adjustment component has a self-locking structure.

[0008] Optionally, the scale adjustment component is a micrometer screw gauge.

[0009] Optionally, the support member includes: a support rod, one end of which is fixedly connected to the adjusting plate; and an intermediate member through which the scale adjusting component passes, and the intermediate member is fixedly connected to the other end of the support rod.

[0010] Optionally, the adjustment range of the scale fine-tuning device is in the millimeter range.

[0011] Optionally, the number of the scale fine-tuning devices is two, and the two scale fine-tuning devices are respectively arranged on both sides of the adjusting rod.

[0012] Optionally, the adjusting plate extends along a second direction, wherein the first direction and the second direction are perpendicular to each other.

[0013] Optionally, the spray head and the heating plate are arranged along the first direction.

[0014] Compared with the prior art, the technical solution of this utility model has the following advantages:

[0015] In the wafer flatness adjustment device of this utility model, the tilt amplitude of the heating plate is adjusted by adding a scale fine-tuning device. This ensures that each adjustment has scale data support, facilitating subsequent analysis of wafer film growth flatness and eliminating quality issues caused by human error. Furthermore, it maintains the machine's ability to quickly and stably meet wafer film growth flatness requirements, increasing production output.

[0016] Furthermore, the scale fine-tuning device includes: a support member fixedly connected to the adjusting plate; a threaded rod extending along the first direction and fixedly connected to the reaction chamber; a scale adjusting component penetrating the support member; and a drive gear fixedly connected to the end of the scale adjusting component, and meshing with the threaded rod. The scale fine-tuning device eliminates the need for a nut component; fine-tuning can be achieved simply by turning the scale adjusting component. This eliminates the need to loosen the nut during each adjustment, ensuring rapid adjustment and preventing process accidents caused by inconsistent nut tightness due to improper handling.

[0017] Furthermore, the scale adjustment component has a self-locking structure. After each adjustment, the self-locking structure allows the device to return to the final adjustment state, ensuring the stability of the wafer coating.

[0018] Furthermore, there are two fine-tuning devices, each positioned on one side of the adjusting rod. By using two fine-tuning devices, the tilt angle of the heating plate can be adjusted from both sides, ensuring flexibility and comprehensiveness in adjustment. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a device for adjusting the flatness of a long film on a machine platform;

[0020] Figure 2 This is a schematic diagram of the structure of the device for adjusting the flatness of the long film of the machine platform according to an embodiment of the present invention;

[0021] Figure 3 This utility model embodiment shows a schematic diagram of the scale adjustment component and drive gear in the device for adjusting the flatness of the long film of the adjustment machine.

[0022] Figure 4 This utility model embodiment shows a schematic diagram of the meshing structure of the drive gear and threaded rod in the device for adjusting the flatness of the long film of the machine platform.

[0023] Figure 5 This utility model embodiment presents a schematic diagram of the heating plate adjustment method in the device for adjusting the flatness of the long film on the machine platform.

[0024] Figure 6 A schematic diagram comparing the flatness of the coating before and after adjustment in the long film flatness adjustment device of this utility model embodiment. Detailed Implementation

[0025] As described in the background section, existing devices for adjusting the flatness of long films on machine platforms still have many problems. These will be explained in detail below with reference to the accompanying drawings.

[0026] Figure 1 This is a schematic diagram of a device for adjusting the flatness of a long film on a machine.

[0027] Please refer to Figure 1A device for adjusting the flatness of a long film on a production line includes: a reaction chamber 100; a spray head 101 disposed within the reaction chamber 100, the spray head 101 being used to introduce process gas into the reaction chamber 100; a heating plate 102 disposed within the reaction chamber 100, the heating plate 102 being used to support and heat a wafer placed within the reaction chamber 100; and an adjusting rod 103 extending along a first direction X, the first direction X being perpendicular to the supporting surface of the heating plate 102, one end of the adjusting rod 103 being connected to the heating plate 102. 02. Fixed connection: the other end of the adjusting rod 103 passes through the side wall of the reaction chamber 100 and extends to the outside of the reaction chamber 100; adjusting plate 104: the adjusting plate 104 is disposed outside the reaction chamber 100, and the adjusting plate 104 is fixedly connected to the adjusting rod 103; threaded rod 105: one end of the threaded rod 105 is fixedly connected to the reaction chamber 100, and the other end of the threaded rod 105 passes through the adjusting plate 104; adjusting nuts 106 are located on the upper and lower sides of the adjusting plate 104, and the adjusting nuts 106 are threadedly fitted onto the threaded rod 105.

[0028] Current vapor deposition processes are complex and diverse. During deposition, various factors can affect the uniformity of the film thickness. The relative horizontal position between the spray head 101 and the heating plate 102 determines the flatness of the wafer film thickness. The tilt of the heating plate 102 is achieved by turning the adjusting nut 106. Specifically, the tilt of the heating plate 102 is finely adjusted by turning the up and down position of the adjusting nut 106. This adjustment method lacks a scale control, and the adjustment often varies from person to person, resulting in errors. Each adjustment requires testing and measuring a whole wafer to determine if the adjustment meets the requirements. However, there is no scale record for the adjustment, making it impossible to create detailed tabular data for linear analysis. This makes it impossible to track the results later, and each adjustment requires a long time to correct in order to achieve the required film thickness flatness.

[0029] Based on this, the present invention provides a device for adjusting the flatness of the wafer growth plate. By adding the scale fine-tuning device, the tilt range of the heating plate can be adjusted, so that each adjustment has scale data support, which facilitates the subsequent analysis of wafer growth flatness and eliminates the quality problem of individual variations. Moreover, it maintains the rapid and stable wafer growth flatness value requirements of the machine, increasing product output.

[0030] To make the above-mentioned objectives, features, and advantages of this utility model more apparent and understandable, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0031] In the description of this utility model, it should be understood that the terms "upper," "lower," "top surface," "bottom surface," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the indicated position or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations of this utility model. Furthermore, the terms "first" and "second" are only used to distinguish an entity or operation from another entity or operation, and do not require or imply any actual relationship, order, or relative importance between these entities or operations.

[0032] Figure 2 This is a schematic diagram of the structure of the device for adjusting the flatness of the long film of the machine platform according to an embodiment of the present invention; Figure 3 This utility model embodiment shows a schematic diagram of the scale adjustment component and drive gear in the device for adjusting the flatness of the long film of the adjustment machine. Figure 4 This utility model embodiment shows a schematic diagram of the meshing structure of the drive gear and threaded rod in the device for adjusting the flatness of the long film of the machine platform. Figure 5 This utility model embodiment presents a schematic diagram of the heating plate adjustment method in the device for adjusting the flatness of the long film on the machine platform. Figure 6 A schematic diagram comparing the flatness of the coating before and after adjustment in the long film flatness adjustment device of this utility model embodiment.

[0033] Please refer to Figure 2A device for adjusting the flatness of a long film on a production line includes: a reaction chamber 200; a spray head 201 disposed within the reaction chamber 200, the spray head 201 being used to introduce process gas into the reaction chamber 200; a heating plate 202 disposed within the reaction chamber 200, the heating plate 202 being used to support and heat a wafer placed within the reaction chamber 200; and an adjusting rod 203 extending along a first direction X, the first direction X being perpendicular to the supporting surface of the heating plate 202. One end of the adjusting rod 203 is fixedly connected to the heating plate 202, and the other end of the adjusting rod 203 passes through the side wall of the reaction chamber 200 and extends to the outside of the reaction chamber 200; an adjusting plate 204 is disposed outside the reaction chamber 200 and is fixedly connected to the adjusting rod 203; a scale fine-tuning device 205 is fixedly connected to the adjusting plate 204 and the reaction chamber 200 respectively, and the scale fine-tuning device 205 is used to adjust the tilt of the heating plate 202.

[0034] By adding the scale fine-tuning device 205, the tilt range of the heating plate 202 can be adjusted, ensuring that each adjustment is supported by scale data. This facilitates subsequent analysis of wafer film growth flatness and eliminates quality issues caused by individual differences. Furthermore, it allows for rapid and stable maintenance of the machine to meet wafer film growth flatness requirements, increasing production output.

[0035] Please continue to refer to this. Figure 2 and refer to accordingly Figure 3 and Figure 4 In this embodiment, the scale fine-tuning device 205 includes: a support member 2051, which is fixedly connected to the adjusting plate 204; a threaded rod 2052, which extends along the first direction X and is fixedly connected to the reaction chamber 200; a scale adjusting component 2053, which passes through the support member 2051; and a drive gear 2054, which is fixedly connected to the end of the scale adjusting component 2053 and meshes with the threaded rod 2052.

[0036] Please refer to Figure 5 and Figure 6When the spray head 201 sprays process gas toward the heating plate 202, and the wafer supported on the heating plate 202 exhibits an uneven growth rate—with a slower growth rate on the left side and a faster growth rate on the right—it is necessary to raise the left side of the heating plate 202 so that the left side of the wafer can be closer to the spray head 201, thereby improving the growth rate of the film layer on the left side of the wafer. This requires rotating the scale adjustment component 2053 in the scale fine-tuning device 205 located on the left side.

[0037] Please continue to refer to this. Figures 2 to 4 The working principle of the scale fine-tuning device 205 is as follows: the rotation of the scale adjustment component 2053 drives the rotation of the drive gear 2054 at its end. Since the drive gear 2054 meshes with the threaded rod 2052, which is fixedly connected to the reaction chamber 200, the drive gear 2054 gradually moves upward as it rotates. This, in turn, drives the left side of the adjustment plate 204 to rise up and down through the support member 2051. Because the adjustment plate 204 and the heating plate 202 are fixedly connected through the adjustment rod 203, the left side of the heating plate 202 is ultimately raised through the intermediate transition of the adjustment rod 203. It should be noted that when adjusting the left side of the adjustment plate 204, the right side of the adjustment plate 204 remains fixed. The raising of the left side of the adjustment plate 204 is achieved by its own reasonable range of deformation.

[0038] The scale fine-tuning device 205 eliminates the need for a nut component, allowing fine-tuning to be achieved simply by turning the scale adjustment component 2053. This eliminates the need to loosen the nut during each adjustment, ensuring rapid adjustment and preventing process accidents caused by inconsistent nut tightness due to individual user preferences.

[0039] In this embodiment, the scale adjustment component 2053 has a self-locking structure 2055. After each adjustment, the self-locking structure 2055 can be used to return the device to its final adjustment state, ensuring the stability of the wafer coating.

[0040] In this embodiment, the scale adjustment component 2053 is a micrometer screw gauge.

[0041] Please continue to refer to this. Figure 2 In this embodiment, the support member 2051 includes: a support rod 20511, one end of which is fixedly connected to the adjusting plate 204; and an intermediate member 20512, through which the scale adjusting component 2053 passes, and the intermediate member 20512 is fixedly connected to the other end of the support rod 20511.

[0042] In this embodiment, the adjustment range of the scale fine-tuning device 205 is at the millimeter level.

[0043] Please continue to refer to this. Figure 2 In this embodiment, there are two scale fine-tuning devices 205, which are respectively disposed on both sides (i.e., the left and right sides) of the adjusting rod 203. By providing two scale fine-tuning devices 205, the tilt range of the heating plate 202 can be adjusted from both sides, ensuring the flexibility and comprehensiveness of the adjustment.

[0044] The adjustment process of the scale fine-tuning device 205 located on the right side can be referred to the adjustment process of the scale fine-tuning device 205 on the left side described above, and will not be repeated here.

[0045] Please continue to refer to this. Figure 2 In this embodiment, the adjustment plate 204 extends along the second direction Y, and the first direction X is perpendicular to the second direction Y, that is, the adjustment plate 204 and the heating plate 202 are arranged in parallel.

[0046] Please continue to refer to this. Figure 2 In this embodiment, the spray head 201 and the heating plate 202 are arranged along the first direction X.

[0047] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A device for adjusting the flatness of a long film on a machine platform, characterized in that, include: Reaction chamber; A spray head is disposed within the reaction chamber and is used to introduce process gas into the reaction chamber. A heating plate is disposed within the reaction chamber and is used to support and heat the wafer placed inside the reaction chamber. An adjusting rod extends along a first direction perpendicular to the bearing surface of the heating plate. One end of the adjusting rod is fixedly connected to the heating plate, and the other end of the adjusting rod penetrates the side wall of the reaction chamber and extends to the outside of the reaction chamber. An adjusting plate is disposed outside the reaction chamber and is fixedly connected to the adjusting rod; A fine-tuning device is fixedly connected to the adjusting plate and the reaction chamber, and the fine-tuning device is used to adjust the tilt of the heating plate.

2. The device for adjusting the flatness of the long film on the machine platform according to claim 1, characterized in that, The scale fine-tuning device includes: a support member fixedly connected to the adjustment plate; a threaded rod extending along the first direction and fixedly connected to the reaction chamber; a scale adjustment component passing through the support member; and a drive gear fixedly connected to the end of the scale adjustment component, and the drive gear meshing with the threaded rod.

3. The device for adjusting the flatness of the long film on the machine platform according to claim 2, characterized in that, The scale adjustment component has a self-locking structure.

4. The device for adjusting the flatness of the long film on the machine platform according to claim 3, characterized in that, The scale adjustment component is a micrometer screw gauge.

5. The device for adjusting the flatness of the long film on the machine platform according to claim 2, characterized in that, The support component includes: a support rod, one end of which is fixedly connected to the adjustment plate; and an intermediate component through which the scale adjustment component passes, and the intermediate component is fixedly connected to the other end of the support rod.

6. The device for adjusting the flatness of the long film on the machine platform according to claim 1, characterized in that, The adjustment range of the scale fine-tuning device is in the millimeter range.

7. The device for adjusting the flatness of the long film on the machine platform according to claim 1, characterized in that, The number of the scale fine-tuning devices is two, and the two scale fine-tuning devices are respectively arranged on both sides of the adjusting rod.

8. The device for adjusting the flatness of the long film on the machine platform according to claim 1, characterized in that, The adjustment plate extends along a second direction, and the first direction is perpendicular to the second direction.

9. The device for adjusting the flatness of the long film on the machine platform according to claim 1, characterized in that, The spray head and the heating plate are arranged along the first direction.

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