High-precision photoresist coating uniformity enhancing device

Abstract

The utility model relates to the technical field of photoresist coating, in particular to a high-precision photoresist coating uniformity enhancing device which comprises a bottom frame, a supporting plate is mounted at the top end in the bottom frame, a clamping mechanism is mounted at the top end of the supporting plate, a wafer is placed in the middle of the supporting plate, and a coating mechanism is mounted above the wafer; the clamping mechanism comprises a clamping plate, and a containing groove is formed in the middle of the top end of the supporting plate. The uniform-scraping device has the beneficial effects that the first gear and the electric heating rod are driven to rotate through meshing connection, so that the uniform-scraping plate rotates circumferentially on the surface of a wafer, the cooled and viscous photoresist is heated, the fluidity of the photoresist is improved, the uniform-scraping plate conveniently scrapes and uniformly coats the photoresist on the surface of the wafer, and the uniformity of the photoresist is improved. The coating uniformity of the photoresist is enhanced, and the situation that the cooled and thick photoresist cannot be uniformly coated on the surface of the wafer in a scraping manner is avoided.

Description

Technical Field

[0001] This utility model relates to the field of photoresist coating technology, and in particular to a high-precision photoresist coating uniformity enhancement device. Background Technology

[0002] Photoresist is an organic compound that plays a crucial role in semiconductor manufacturing. Its main function is to convert light information after diffraction and filtering in the photolithography system into chemical energy through photochemical reactions. There are many methods for coating photoresist, but the key point is to ensure that the photoresist forms a uniform and defect-free film on the wafer surface, regardless of the method.

[0003] Existing high-precision photoresist coating uniformity enhancement devices often result in uneven coating after photoresist is applied to the wafer. Furthermore, the photoresist tends to become viscous after cooling on the wafer, making it difficult to spread evenly and achieving uniform coating. In addition, the wafer is prone to shaking and instability during the coating and spreading process, failing to provide stable central clamping.

[0004] Therefore, a high-precision photoresist coating uniformity enhancement device is proposed. Utility Model Content

[0005] The purpose of this invention is to solve the problems in the prior art where uneven photoresist coating occurs after the wafer is coated, and the photoresist becomes viscous after cooling on the wafer, making it difficult to scrape the photoresist evenly and resulting in uneven photoresist coating. Therefore, a high-precision photoresist coating uniformity enhancement device is proposed.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A high-precision photoresist coating uniformity enhancement device is designed, comprising a base frame, a support plate mounted at the top of the base frame, a clamping mechanism mounted at the top of the support plate, a wafer placed in the middle of the support plate, and a coating mechanism mounted above the wafer; the clamping mechanism includes a clamping plate, a placement groove is formed in the middle of the top of the support plate, the wafer is placed in the middle of the placement groove, and the clamping plate movably clamps the wafer around it; the coating mechanism includes a coating cylinder, coating heads, and a scraping mechanism, a mounting plate is mounted above the support plate, the coating cylinder is mounted at both ends of the top of the mounting plate, the coating heads are arranged in a straight line below the coating cylinder, and the scraping mechanism is intermittently mounted on the top of the wafer.

[0008] Furthermore, the surface of the support plate has a sliding groove, a guide rod is fixed inside the sliding groove, a sliding block is fixed at the bottom of the clamping plate, a guide hole is opened in the middle of the sliding block, the sliding block is slidably installed inside the sliding groove, and the guide rod slides through the guide hole.

[0009] Furthermore, the sliding groove is a rectangular groove structure, distributed in a cross shape around the placement groove, the guide rod is horizontally arranged, the sliding block is recessed inside the sliding groove, and the clamping plate is slidably arranged inside the placement groove. It is an arc-shaped plate structure and is vertically arranged.

[0010] Furthermore, a drive plate is hinged to the bottom end of the sliding block, and a support column is fixed in the middle of the bottom end of the support plate. The surface of the support column is hinged to the bottom end of the drive plate, and a first electric push rod is installed at the bottom end of the support column. The first electric push rod is vertically installed in the middle of the bottom end of the bottom frame.

[0011] Furthermore, the support column is a cylindrical structure and is vertically arranged, with an adjustment groove inside. An adjustment rod is threaded into the adjustment groove, and a lifting plate is fixed to the top of the adjustment rod. A lifting groove is opened in the middle of the placement groove, and the lifting plate is slidably recessed inside the lifting groove.

[0012] Furthermore, the drive plate is inclined and evenly surrounds the support column, the adjustment groove is a threaded groove structure and is vertically arranged, the adjustment rod is a threaded rod structure and is vertically arranged, and the lifting plate is a circular plate structure and is horizontally arranged.

[0013] Furthermore, a mounting groove is formed in the middle of the side of the bottom frame, and a mounting rod is fixed in the middle of the side of the support plate. The mounting rod is slidably inserted into the mounting groove and fastened to the top of the bottom frame with a nut. The mounting groove has a U-shaped structure. The mounting rod is horizontally positioned. A second electric push rod is vertically installed at the top of the bottom frame and on both sides of the mounting groove. Lifting plates are fixed at both ends of the mounting plate. The two ends of the lifting plates are fixed to the top of the second electric push rod. Both the lifting plates and the mounting plate are horizontally positioned.

[0014] Furthermore, the scraping mechanism includes an electric heating rod and a scraping plate. The electric heating rod rotates through the mounting plate, and its bottom end is fixed to the middle of the top end of the scraping plate. A first gear is fixed on the surface of the electric heating rod at the top end of the mounting plate. A second gear that meshes with the first gear is rotatably mounted on the top end of the mounting plate. A motor is connected to the bottom end of the second gear.

[0015] Furthermore, the motor is fixedly installed at the bottom of the mounting plate, and a glue guide cylinder is installed below the mounting plate. A conduit is connected between the bottom end of the glue applicator and the top end of the glue guide cylinder. The glue guide cylinder is located on both sides of the electric heating rod. The glue applicator head is evenly connected to the bottom end of the glue guide cylinder and located above the scraper plate. The scraper plate has a rhomboid cross-section and a horizontal gap is set at the top of the wafer.

[0016] Compared with the prior art, the high-precision photoresist coating uniformity enhancement device proposed in this utility model has the following advantages:

[0017] 1. This utility model features a guide tube and a coating head arranged in a straight line at the bottom of a mounting plate, with an electric heating rod and a scraper plate rotatably mounted in the middle of the mounting plate. Therefore, during the photoresist coating process on a wafer placed on a support plate, the photoresist is applied to the wafer surface through the coating head. Simultaneously, a motor drives a second gear to rotate, which in turn drives the first gear and the electric heating rod to rotate. This causes the scraper plate to rotate circumferentially on the wafer surface, heating and increasing the fluidity of the cooled, viscous photoresist. This facilitates the scraper plate in evenly coating the photoresist onto the wafer surface, enhancing the uniformity of the photoresist coating and preventing the cooled, viscous photoresist from failing to be evenly coated onto the wafer surface.

[0018] 2. In this invention, a clamping plate is movably mounted on the top of the support plate via a guide rod and a sliding block. Therefore, the first electric push rod drives the drive plate upwards, driving the sliding block and clamping plate to move outwards along the guide rod. After the wafer is placed in the placement slot, the first electric push rod drives the drive plate downwards, thereby driving the four clamping plates to simultaneously apply the same clamping force to the sides of the wafer, maintaining a stable center position for the wafer. This facilitates accurate and stable coating and uniform scraping of photoresist on the wafer surface. Furthermore, after the wafer coating is completed, as the first electric push rod drives the drive plate upwards, the clamping plates release the wafer. Simultaneously, the support column, adjusting rod, and lifting plate lift the wafer upwards, facilitating its removal. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This utility model Figure 1 A schematic diagram of the top part of the support plate;

[0021] Figure 3 This utility model Figure 1 A schematic diagram of the bottom end of the support plate and the drive plate section;

[0022] Figure 4 This utility model Figure 1A schematic diagram of the drive plate and support column structure;

[0023] Figure 5 This utility model Figure 1 A schematic diagram of the coating mechanism.

[0024] In the diagram: 1. Base frame; 2. Mounting rod; 3. Mounting slot; 4. Second electric push rod; 5. Support plate; 6. Conduit; 7. Glue applicator head; 8. Scraper plate; 9. Mounting plate; 10. Glue applicator tube; 11. Lifting plate; 12. Glue guide tube; 13. Wafer; 14. Lifting plate; 15. Lifting slot; 16. Placement slot; 17. Sliding slot; 18. Guide rod; 19. Clamping plate; 20. First electric push rod; 21. Support column; 22. Adjusting rod; 23. Drive plate; 24. Adjusting slot; 25. Guide hole; 26. Sliding block; 27. Second gear; 28. Motor; 29. ​​First gear; 30. Electric heating rod. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0026] For examples, please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 The high-precision photoresist coating uniformity enhancement device shown in the figure includes a base frame 1, a support plate 5 installed at the top of the interior of the base frame 1, a clamping mechanism installed at the top of the support plate 5, a wafer 13 placed in the middle of the support plate 5, and a coating mechanism installed above the wafer 13.

[0027] In detail, the clamping mechanism includes a clamping plate 19, and a placement groove 16 is opened in the middle of the top of the support plate 5. The wafer 13 is placed in the middle of the placement groove 16, and the clamping plate 19 is movably clamped around the wafer 13.

[0028] The surface of the support plate 5 has a sliding groove 17, and a guide rod 18 is fixed inside the sliding groove 17. A sliding block 26 is fixed at the bottom of the clamping plate 19. A guide hole 25 is opened in the middle of the sliding block 26. The sliding block 26 is slidably installed inside the sliding groove 17, and the guide rod 18 slides through the guide hole 25.

[0029] The sliding groove 17 is a rectangular groove structure, distributed in a cross shape around the placement groove 16. The guide rod 18 is set horizontally, the sliding block 26 is recessed inside the sliding groove 17, and the clamping plate 19 is slidably set inside the placement groove 16. It is an arc-shaped plate structure and is set vertically.

[0030] The bottom end of the sliding block 26 is hinged to the drive plate 23, and the bottom end of the support plate 5 is fixed with a support column 21. The surface of the support column 21 is hinged to the bottom end of the drive plate 23. The bottom end of the support column 21 is equipped with a first electric push rod 20, which is vertically installed in the middle of the bottom end of the bottom frame 1.

[0031] The support column 21 is a cylindrical structure and is set vertically. It has an adjustment groove 24 inside, and an adjustment rod 22 is threaded into the adjustment groove 24. A lifting plate 14 is fixed to the top of the adjustment rod 22. A lifting groove 15 is opened in the middle of the placement groove 16, and the lifting plate 14 slides and is recessed inside the lifting groove 15.

[0032] The first electric push rod 20 drives the drive plate 23 to rise, driving the sliding block 26 and the clamping plate 19 to move outward along the guide rod 18. After placing the wafer 13 in the placement slot 16, the first electric push rod 20 drives the drive plate 23 to fall, thereby driving the four clamping plates 19 to simultaneously apply the same clamping force to the sides of the wafer 13 and clamp it, keeping the center of the wafer 13 stably clamped and placed, which facilitates accurate and stable coating of photoresist on the surface of the wafer 13 and uniform scraping. Moreover, after the coating of the wafer 13 is completed, during the process of the first electric push rod 20 driving the drive plate 23 to rise, the clamping plates 19 release the wafer 13. At the same time, the support column 21, the adjusting rod 22 and the lifting plate 14 lift the wafer 13 upward, which facilitates the removal of the wafer 13.

[0033] The drive plate 23 is inclined and evenly surrounds the support column 21. The adjustment groove 24 is a threaded groove structure and is set vertically. The adjustment rod 22 is a threaded rod structure and is set vertically. The lifting plate 14 is a circular plate structure and is set horizontally.

[0034] Furthermore, the coating mechanism includes a coating cylinder 10, a coating head 7, and a scraping mechanism. A mounting plate 9 is installed above the support plate 5. The coating cylinder 10 is installed at both ends of the top of the mounting plate 9. The coating heads 7 are arranged in a straight line below the coating cylinder 10. The scraping mechanism is installed at the top of the wafer 13.

[0035] A mounting groove 3 is opened in the middle of the side of the bottom frame 1. A mounting rod 2 is fixed in the middle of the side of the support plate 5. The mounting rod 2 slides into the mounting groove 3 and is fastened to the top of the bottom frame 1 with a nut. The mounting groove 3 has a U-shaped structure. The mounting rod 2 is set horizontally. A second electric push rod 4 is vertically installed at the top of the bottom frame 1 and on both sides of the mounting groove 3. Lifting plates 11 are fixed at both ends of the mounting plate 9. The two ends of the lifting plates 11 are fixed to the top of the second electric push rod 4. Both the lifting plates 11 and the mounting plate 9 are set horizontally.

[0036] The scraping mechanism includes an electric heating rod 30 and a scraping plate 8. The electric heating rod 30 rotates through the mounting plate 9, and its bottom end is fixed to the middle of the top of the scraping plate 8. A first gear 29 is fixed on the surface of the electric heating rod 30 at the top of the mounting plate 9. A second gear 27 that meshes with the first gear 29 is rotatably mounted on the top of the mounting plate 9. A motor 28 is connected to the bottom of the second gear 27.

[0037] The motor 28 is fixedly installed at the bottom of the mounting plate 9. A glue guide cylinder 12 is installed below the mounting plate 9. A guide tube 6 is connected between the bottom of the glue applicator 10 and the top of the glue guide cylinder 12. The glue guide cylinder 12 is located on both sides of the electric heating rod 30.

[0038] During the photoresist coating process on the support plate 5, the photoresist is applied to the surface of the wafer 13 through the coating head 7. At the same time, the motor 28 drives the second gear 27 to rotate, which in turn drives the first gear 29 and the electric heating rod 30 to rotate through meshing. This causes the scraper plate 8 to rotate circumferentially on the surface of the wafer 13, heating and increasing the fluidity of the cooled and viscous photoresist. This makes it easier for the scraper plate 8 to scrape and evenly coat the photoresist on the surface of the wafer 13, enhancing the uniformity of the photoresist coating and preventing the cooled and viscous photoresist from being unable to be evenly coated on the surface of the wafer 13.

[0039] The glue applicator 7 is evenly connected to the bottom end of the glue guide tube 12 and is located above the scraper plate 8. The scraper plate 8 has a diamond-shaped cross-section and the horizontal gap is set at the top of the wafer 13.

[0040] Operating principle: The guide tube 12 and the coating head 7 are arranged in a straight line at the bottom of the mounting plate 9. The electric heating rod 30 and the scraper plate 8 are rotated and installed in the middle of the mounting plate 9. Therefore, when the wafer 13 is placed on the support plate 5 for photoresist coating, the photoresist is coated on the surface of the wafer 13 through the coating head 7. At the same time, the motor 28 drives the second gear 27 to rotate, which drives the first gear 29 and the electric heating rod 30 to rotate through meshing. This causes the scraper plate 8 to rotate circumferentially on the surface of the wafer 13, heating and increasing the fluidity of the cooled and viscous photoresist. This makes it easier for the scraper plate 8 to scrape and evenly coat the photoresist on the surface of the wafer 13, enhancing the uniformity of photoresist coating and preventing the cooled and viscous photoresist from being unable to be evenly coated on the surface of the wafer 13.

[0041] At the top of the support plate 5, the clamping plate 19 is movably mounted via the guide rod 18 and the sliding block 26. Therefore, the first electric push rod 20 drives the drive plate 23 to rise, driving the sliding block 26 and the clamping plate 19 to move outward along the guide rod 18. After placing the wafer 13 in the placement slot 16, the first electric push rod 20 drives the drive plate 23 to fall, thereby driving the four clamping plates 19 to simultaneously apply the same clamping force to the sides of the wafer 13 and clamp it, keeping the center of the wafer 13 stably clamped and placed, which facilitates accurate and stable coating of photoresist on the surface of the wafer 13 and uniform scraping. Moreover, after the wafer 13 is coated, during the process of the first electric push rod 20 driving the drive plate 23 to rise, the clamping plates 19 release the wafer 13. At the same time, the support column 21, the adjusting rod 22 and the lifting plate 14 lift the wafer 13 upward, which facilitates the removal of the wafer 13.

[0042] The above are merely preferred embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this utility model, based on the technical solution and inventive concept of this utility model, should be included within the scope of protection of this utility model.

Claims

1. A high-precision photoresist coating uniformity enhancement device, comprising a base frame (1), characterized in that: A support plate (5) is installed at the top of the inner part of the bottom frame (1), a clamping mechanism is installed at the top of the support plate (5), a wafer (13) is placed in the middle of the support plate (5), and a coating mechanism is installed above the wafer (13). The clamping mechanism includes a clamping plate (19), and a placement groove (16) is opened in the middle of the top of the support plate (5). The wafer (13) is placed in the middle of the placement groove (16), and the clamping plate (19) is movably clamped around the wafer (13). The coating mechanism includes a coating cylinder (10), a coating head (7), and a scraping mechanism. A mounting plate (9) is installed above the support plate (5). The coating cylinder (10) is installed at both ends of the top of the mounting plate (9). The coating heads (7) are arranged in a straight line below the coating cylinder (10). The scraping mechanism is installed at the top of the wafer (13) with gaps between them.

2. The high-precision photoresist coating uniformity enhancement device according to claim 1, characterized in that: The surface of the support plate (5) has a sliding groove (17), and a guide rod (18) is fixed inside the sliding groove (17). The bottom end of the clamping plate (19) is fixed with a sliding block (26), and a guide hole (25) is opened in the middle of the sliding block (26). The sliding block (26) is slidably installed inside the sliding groove (17), and the guide rod (18) slides through the guide hole (25).

3. The high-precision photoresist coating uniformity enhancement device according to claim 2, characterized in that: The sliding groove (17) is a rectangular groove structure, distributed in a cross shape around the placement groove (16). The guide rod (18) is horizontally arranged. The sliding block (26) is recessed inside the sliding groove (17). The clamping plate (19) is slidably arranged inside the placement groove (16). It is an arc-shaped plate structure and is vertically arranged.

4. The high-precision photoresist coating uniformity enhancement device according to claim 2, characterized in that: The bottom end of the sliding block (26) is hinged to a drive plate (23), and a support column (21) is fixed in the middle of the bottom end of the support plate (5). The surface of the support column (21) is hinged to the bottom end of the drive plate (23). A first electric push rod (20) is installed at the bottom end of the support column (21). The first electric push rod (20) is vertically installed in the middle of the bottom end of the bottom frame (1).

5. The high-precision photoresist coating uniformity enhancement device according to claim 4, characterized in that: The support column (21) is a cylindrical structure and is vertically arranged. It has an adjustment groove (24) inside. An adjustment rod (22) is threaded into the adjustment groove (24). A lifting plate (14) is fixed to the top of the adjustment rod (22). A lifting groove (15) is opened in the middle of the placement groove (16). The lifting plate (14) is slidably recessed into the lifting groove (15).

6. The high-precision photoresist coating uniformity enhancement device according to claim 5, characterized in that: The drive plate (23) is inclined and evenly surrounds the support column (21). The adjustment groove (24) is a threaded groove structure and is vertically arranged. The adjustment rod (22) is a threaded rod structure and is vertically arranged. The lifting plate (14) is a circular plate structure and is horizontally arranged.

7. The high-precision photoresist coating uniformity enhancement device according to claim 1, characterized in that: The bottom frame (1) has a mounting groove (3) in the middle of its side. The support plate (5) has a mounting rod (2) fixed in the middle of its side. The mounting rod (2) slides into the mounting groove (3) and is fastened to the top of the bottom frame (1) with a nut. The mounting groove (3) is a U-shaped structure. The mounting rod (2) is set horizontally. The bottom frame (1) is vertically installed at the top and on both sides of the mounting groove (3). The mounting plate (9) has lifting plates (11) fixed at both ends. The lifting plates (11) are fixed at both ends to the top of the second electric push rod (4). The lifting plates (11) and the mounting plate (9) are both set horizontally.

8. The high-precision photoresist coating uniformity enhancement device according to claim 7, characterized in that: The scraping mechanism includes an electric heating rod (30) and a scraping plate (8). The electric heating rod (30) rotates through the mounting plate (9) and its bottom end is fixed to the middle of the top end of the scraping plate (8). A first gear (29) is fixed on the surface of the electric heating rod (30) at the top end of the mounting plate (9). A second gear (27) that meshes with the first gear (29) is rotatably mounted on the top end of the mounting plate (9). A motor (28) is connected to the bottom end of the second gear (27).

9. The high-precision photoresist coating uniformity enhancement device according to claim 8, characterized in that: The motor (28) is fixedly installed at the bottom of the mounting plate (9). A guide tube (12) is installed below the mounting plate (9). A conduit (6) is connected between the bottom of the glue coating tube (10) and the top of the guide tube (12). The guide tube (12) is located on both sides of the electric heating rod (30). The glue coating head (7) is evenly connected to the bottom of the guide tube (12) and located above the scraping plate (8). The scraping plate (8) has a rhomboid cross-section and a horizontal gap is set at the top of the wafer (13).

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