Notebook computer radiating seat

Abstract

The utility model relates to a notebook computer radiating seat, which comprises a seat body, a fan is arranged on the seat body, the fan is provided with a power line, a temperature equalizing plate is arranged on the seat body above the fan, the temperature equalizing plate comprises an upper plate and a lower plate, a rectangular groove is arranged on the upper surface of the lower plate, and the rectangular groove is covered by the upper plate. An upper capillary structure layer is arranged on the lower surface of the upper plate, a lower capillary structure layer is arranged on the bottom wall of the rectangular groove, a connecting capillary layer is arranged in the rectangular groove, the top of the connecting capillary layer is connected with the upper capillary structure layer, and the bottom of the connecting capillary layer is connected with the lower capillary structure layer. The temperature equalizing plate is arranged at the top of the heat dissipation seat, when a notebook computer is used, the temperature equalizing plate is in contact with the bottom of the computer, heat generated by all parts of the computer can be transmitted to the temperature equalizing plate, and the temperature equalizing plate has the function of uniformly distributing the temperature of all the parts, so that the temperature of all the parts can be kept uniform in the using process of the computer.

Description

Technical Field

[0001] This utility model belongs to the field of heat dissipation equipment, and in particular a laptop cooling pad. Background Technology

[0002] Laptops are small, lightweight, and portable, but due to limited internal space, the size of the cooling module is restricted, affecting cooling efficiency. Therefore, users usually configure a cooling pad to place the laptop on the cooling pad to promote heat dissipation.

[0003] Existing cooling pads typically include a support base with one or two small fans mounted on it. These fans connect to the laptop's USB port via a USB connector, allowing the laptop to power the fans. Specific examples include CN201621484882.4 (a laptop cooling pad) and CN201420760617.9 (a laptop cooling pad with adjustable fan position). In most existing cooling pads, the fans are fixed, making it difficult to cool the entire laptop base, resulting in uneven temperature distribution with some areas of the computer being cooler than others. While some cooling pads offer adjustable fan positions, this increases the structural complexity of the cooling pad and requires manual adjustment, making operation inconvenient. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a heat sink for laptops that can uniformly distribute the temperature of various parts of the laptop.

[0005] To solve the above problems, the technical solution adopted by this utility model is: a laptop cooling stand, including a base body, on which a fan is provided;

[0006] A heat spreader is provided on the base above the fan. The heat spreader includes an upper plate and a lower plate. A rectangular groove is provided on the upper surface of the lower plate, and the upper plate covers the rectangular groove. An upper capillary structure layer is provided on the lower surface of the upper plate, and a lower capillary structure layer is provided on the bottom wall of the rectangular groove. A connecting capillary layer is provided inside the rectangular groove. The top of the connecting capillary layer is connected to the upper capillary structure layer, and the bottom of the connecting capillary layer is connected to the lower capillary structure layer.

[0007] Furthermore, the center of the lower plate is recessed downwards, so that the distance from the bottom wall of the rectangular groove to the upper plate gradually decreases from the center to the edge; the fan is located below the center of the lower plate.

[0008] Furthermore, the base includes a base, and multiple mounting posts are provided on the edge of the upper surface of the base. The fan is fixed to the base, and the edge of the heat spreader is installed on the top of the mounting posts.

[0009] Furthermore, the edge of the heat spreader is connected to the mounting post by screws.

[0010] Furthermore, a computer support frame is provided on the edge of the upper surface of the base.

[0011] Furthermore, the top of the mounting column is provided with a central hole, a spring is provided in the central hole, the top of the spring is provided with a connecting column that slides with the central hole, and the edge of the heat equalization plate is fixedly connected to the connecting column.

[0012] Furthermore, the support frame includes a column and a support plate fixedly mounted on the top of the column.

[0013] Furthermore, an elastic pad is provided at the edge of the lower surface of the base.

[0014] The beneficial effects of this invention are as follows: By setting a heat spreader on the top of the heat sink, when using a laptop, the heat spreader contacts the bottom of the laptop, allowing heat generated by various parts of the laptop to be transferred to the heat spreader. The heat spreader has the function of evenly distributing the temperature across all parts, thus ensuring uniform temperature distribution throughout the laptop during use and preventing some areas from being too hot while others are too cold. When a fan is used to dissipate heat from the heat spreader, it can carry away the heat from the heat spreader, indirectly dissipating heat from the laptop, thereby achieving heat dissipation. Furthermore, this heat sink has a simple structure and is easy to operate. Attached Figure Description

[0015] Figure 1 This is a top view of the laptop cooling pad of this utility model;

[0016] Figure 2 yes Figure 1 Schematic diagram of the cross section of AA;

[0017] Figure 3 yes Figure 1 Cross-sectional view of BB;

[0018] Reference numerals: 1—Base; 11—Base; 12—Mounting column; 13—Computer support frame; 14—Center hole; 15—Spring; 16—Connecting column; 17—Upright column; 18—Support plate; 19—Elastic pad; 2—Fan; 4—Heat distribution plate; 41—Upper plate; 42—Lower plate; 43—Upper capillary layer; 44—Lower capillary layer; 45—Connecting capillary layer. Detailed Implementation

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] This utility model relates to a laptop cooling pad, such as... Figure 1 , Figure 2 and Figure 3 As shown, the device includes a base 1, on which a fan 2 is mounted, and the fan 2 is equipped with a power cord. An existing fan can be used for the fan 2. The power cord is used to connect to a power source to supply power to the fan 2. An existing USB cable can be used, which can be directly connected to the USB port of a laptop computer, allowing the laptop to power the fan 2. After the computer is started, the fan 2 automatically powers on and runs, making it convenient to use.

[0021] A heat spreader 4 is provided on the base 1 above the fan 2. The heat spreader 4 includes an upper plate 41 and a lower plate 42. A rectangular groove is provided on the upper surface of the lower plate 42, and the upper plate 41 covers the rectangular groove. An upper capillary layer 43 is provided on the lower surface of the upper plate 41, and a lower capillary layer 44 is provided on the bottom wall of the rectangular groove. A connecting capillary layer 45 is provided inside the rectangular groove. The top of the connecting capillary layer 45 is connected to the upper capillary layer 43, and the bottom of the connecting capillary layer 45 is connected to the lower capillary layer 44.

[0022] The upper plate 41 and lower plate 42 are made of materials with high thermal conductivity, such as copper or aluminum plates. Both upper and lower plates 41 and 42 are rectangular plates, adapted to the shape of the bottom of the laptop. The edge of the upper plate 41 can be embedded in a rectangular groove, and the edge of the upper plate 41 is welded to the lower plate 42 to ensure the sealing of the rectangular groove. A vacuum is drawn into the rectangular groove, making it negative pressure at room temperature. At the same time, a working fluid, which can be pure water, is injected into the rectangular groove and absorbed by the upper capillary layer 43, the lower capillary layer 44, and the connecting capillary layer 45. The upper capillary layer 43, the lower capillary layer 44, and the connecting capillary layer 45 have strong capillary forces, which can absorb the working fluid and promote its uniform distribution in each capillary structure. The upper capillary layer 43 and the lower capillary layer 44 can be sintered metal powder layers, such as copper powder. The connecting capillary layer 45 can be a columnar capillary structure, with a gap between two adjacent columnar capillary structures, so that the rectangular groove has a cavity of a certain volume. Specifically, the connecting capillary layer 4 can be made of multiple metal wires with a diameter of about 0.03 mm.

[0023] The working principle of the heat spreader 4 is as follows: the upper plate 41 acts as a heat absorption plate and the lower plate 42 acts as a heat release plate. After the upper plate 41 absorbs heat, the medium in the upper capillary layer 43 absorbs heat and vaporizes, and then fills the cavity in the rectangular groove. When the gaseous working fluid comes into contact with the lower plate 42, which has a lower temperature, it cools and liquefies into a liquid working fluid. As the liquid working fluid in the upper capillary layer 43 evaporates and decreases, while the liquid working fluid in the lower capillary layer 44 condenses and increases, the amount of liquid working fluid in the upper capillary layer 43, the connecting capillary layer 45 and the lower capillary layer 44 decreases. Under the action of capillary action, the liquid working fluid in the lower capillary layer 44 will flow along the connecting capillary layer 45 to the upper capillary layer 43, realizing the circulation of the working fluid.

[0024] When using this heatsink, place the laptop on it with the bottom of the laptop in contact with the upper surface of the vapor chamber 4. When the laptop is running and generating heat, the heat is transferred to the vapor chamber 4. The vapor chamber 4 has the function of promoting even heat distribution, which can make the temperature distribution of various parts of the laptop more even and prevent some parts from overheating. After connecting the power cord of the fan 2, the fan 2 runs and dissipates heat from the lower surface of the vapor chamber 4, keeping the lower plate 42 at a lower temperature and promoting the liquefaction of the gaseous working fluid in the rectangular groove.

[0025] Generally, heat tends to accumulate more easily in the middle of a laptop. In order to promote the rapid flow of liquid working fluid to the upper capillary layer 43 at the center of the upper plate 41, the center of the lower plate 42 of this invention is recessed downwards, so that the distance from the bottom wall of the rectangular groove to the upper plate 41 gradually decreases from the center to the edge; the fan 2 is located below the center of the lower plate 42, and the air outlet of the fan 2 faces upwards. The center of the lower plate 42 is concave downwards, making the lower plate 42 arc-shaped. When the fan 2 blows air upwards, the airflow first reaches the center of the lower plate 42 and then flows along the lower surface of the lower plate 42 towards the edge, which can promote the orderly flow of air. At the same time, the temperature at the center of the lower plate 42 is lower, which can promote the liquefaction of the gaseous working fluid at the center of the lower plate 42, causing more liquid working fluid to accumulate at the center of the lower plate 42. The liquid working fluid at the center of the lower plate 42 then flows through the nearby connecting capillary layer 45 to the upper capillary structure layer 43 at the center of the upper plate 41. The flow path is short, which can quickly replenish the liquid working fluid in the upper capillary structure layer 43 at the center of the upper plate 41, promoting heat dissipation in the center of the computer.

[0026] The base 1 can adopt any existing base structure. Preferably, the base 1 includes a base 11, with multiple mounting posts 12 arranged along the edge of the upper surface of the base 11. The fan 2 is fixed to the base 1, and the edge of the heat spreader 4 is mounted on the top of the mounting posts 12. The base 1 can adopt a horizontal frame structure, specifically a plastic frame, and the fan 2 is mounted to the base 1 with bolts. The mounting posts 12 are vertically arranged to support the heat spreader 4, ensuring that the heat spreader 4 is at a suitable height and that there is a suitable distance between the fan 2 and the heat spreader 4.

[0027] The laptop can be directly supported using a heat spreader plate 4, which can be fixed to the mounting post 12 with screws. However, since the heat spreader plate 4 is relatively thin, it is prone to deformation under the weight of the laptop. Therefore, this invention provides a computer support frame 13 on the edge of the upper surface of the base 11. The computer support frame 13 can support the edge of the computer, playing a major supporting role and bearing most of the computer's weight. To ensure that the bottom of the computer can contact the heat spreader plate 4, a central hole 14 is provided at the top of the mounting post 12. A spring 15 is installed inside the central hole 14, and a connecting post 16 that slides and engages with the central hole 14 is provided at the top of the spring 15. The edge of the heat spreader plate 4 is fixedly connected to the connecting post 16. The computer stand 13 has a support surface for supporting the bottom of the computer. When no laptop is placed on it, the spring 15 is in an extended state, and the upper surface of the heat spreader 4 is slightly higher than the support surface of the computer stand 13. When the computer is placed on the computer stand 13, the bottom of the computer contacts the heat spreader 4 first. Under the weight of the computer, the spring 15 is compressed, causing the height of the computer to decrease until the computer stand 13 supports the computer. Because the heat spreader 4 can be raised and lowered, it only needs to bear a small amount of pressure, and most of the weight of the computer is borne by the computer stand 13, which effectively prevents the heat spreader 4 from deforming.

[0028] In this utility model, the temperature distribution plate 4 is connected to the connecting column 16 by screws.

[0029] In this invention, to ensure stable support for the computer, the support frame 13 includes columns 17 and a support plate 18 fixedly mounted on the top of the columns 17. Four support frames 13 can be provided. The base 11 is a rectangular seat, with a column 17 at each corner and a support plate 18 at the top of each column 17. The support plate 18 can be horizontally positioned and can be rectangular, arc-shaped, or triangular. To improve the stability of the computer's positioning, a vertical baffle can be provided at the edge of the support plate 18. The height of the baffle is less than the thickness of the laptop body when open, and the inner sidewall of the baffle can abut against the side of the laptop to prevent it from moving forward, backward, left, or right. Various sizes of cooling pads can be produced for different sizes of laptops, with each size corresponding to a specific laptop size.

[0030] In this invention, an elastic pad 19 is provided on the edge of the lower surface of the base 11. The elastic pad 19 can be a rubber pad, which serves to prevent slipping and reduce wear.

[0031] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A laptop cooling stand, comprising a base (1) and a fan (2) disposed on the base (1), characterized in that: A heat equalization plate (4) is provided on the base (1) above the fan (2). The heat equalization plate (4) includes an upper plate (41) and a lower plate (42). A rectangular groove is provided on the upper surface of the lower plate (42), and the upper plate (41) covers the rectangular groove. An upper capillary layer (43) is provided on the lower surface of the upper plate (41), and a lower capillary layer (44) is provided on the bottom wall of the rectangular groove. A connecting capillary layer (45) is provided inside the rectangular groove. The top of the connecting capillary layer (45) is connected to the upper capillary layer (43), and the bottom of the connecting capillary layer (45) is connected to the lower capillary layer (44).

2. The laptop cooling pad as described in claim 1, characterized in that: The center of the lower plate (42) is recessed downwards, so that the distance from the bottom wall of the rectangular groove to the upper plate (41) gradually decreases from the center to the edge; the fan (2) is located below the center of the lower plate (42).

3. The laptop cooling pad as described in claim 1, characterized in that: The base (1) includes a base (11), and multiple mounting posts (12) are provided on the edge of the upper surface of the base (11). The fan (2) is fixed on the base (1), and the edge of the heat spreader (4) is installed on the top of the mounting posts (12).

4. The laptop cooling pad as described in claim 3, characterized in that: A computer support frame (13) is provided on the edge of the upper surface of the base (11).

5. The laptop cooling pad as described in claim 4, characterized in that: The top of the mounting column (12) is provided with a central hole (14), a spring (15) is provided in the central hole (14), and a connecting column (16) is provided on the top of the spring (15) to slide with the central hole (14). The edge of the heat equalization plate (4) is fixedly connected to the connecting column (16).

6. The laptop cooling pad as described in claim 5, characterized in that: The temperature distribution plate (4) is connected to the connecting column (16) by screws.

7. The laptop cooling pad as described in claim 4, characterized in that: The support frame (13) includes a column (17) and a support plate (18) fixedly installed on the top of the column (17).

8. The laptop cooling pad as described in claim 3, characterized in that: An elastic pad (19) is provided on the edge of the lower surface of the base (11).

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