Integrated magnetic device and power supply device

Abstract

The embodiment of the utility model relates to the technical field of power supplies, and particularly discloses an integrated magnetic device and a power device.The integrated magnetic device comprises a first circuit board, a magnetic device, a power device and a radiator, and the magnetic device is fixed to the first circuit board and electrically coupled with the first circuit board; the radiator is fixed on the first circuit board and arranged on the outer side of the magnetic device, the radiator comprises a top plate and a side plate, a first heat-conducting medium is arranged between the magnetic device and the top plate and between the magnetic device and the side plate, and the power device is arranged on the side plate. Through the above mode, the heat of the magnetic device and the power device is dissipated through the radiator, so that the space utilization rate is improved, and the cost is reduced.

Description

TECHNICAL FIELD

[0001] The embodiment of the present application relates to the power supply technical field, in particular to an integrated magnetic device and a power supply device. BACKGROUND

[0002] With the rapid development of electronic technology, as a kind of high efficiency and high power density power conversion device, intermediate bus converter (IBC) is widely used in data centers, servers or communication equipment to meet the requirements of high efficiency and high density power supply. The intermediate bus converter is usually used to convert high-voltage direct current into intermediate bus voltage suitable for point of load (PoL) voltage regulator. The intermediate bus converter usually includes a transformer, an inductor and a power device, the transformer is used to realize the electrical isolation from input to output, and the inductor is used to realize the output filtering. At present, in the intermediate bus converter, a separate heat sink is usually provided for each device to dissipate heat.

[0003] In the process of implementing the present application, the inventor found that providing a separate heat sink for each device not only increases the complexity of the device, reduces the space utilization, but also increases the cost. CONTENT OF THE UTILITY MODEL

[0004] In view of the above problems, the embodiment of the present application provides an integrated magnetic device and a power supply device, which overcomes the above problems or at least partially solves the above problems.

[0005] To solve the above technical problems, one technical scheme adopted by the present application is to provide an integrated magnetic device, comprising a first circuit board, a magnetic device, a power device and a heat sink, the magnetic device is fixed to the first circuit board and electrically coupled with the first circuit board, the heat sink is fixed to the first circuit board and arranged outside the magnetic device, the heat sink comprises a top plate and a side plate, a first heat-conducting medium is arranged between the magnetic device and the top plate and the side plate, and the power device is arranged on the side plate.

[0006] In some embodiments, the power device comprises a power tube, the power tube is electrically coupled to the first circuit board, the power tube is attached to the side plate, and a second heat-conducting medium is arranged between the power tube and the side plate.

[0007] In some embodiments, the power device comprises a patch power device and a second circuit board, the patch power device is attached to the second circuit board, the second circuit board is electrically coupled with the first circuit board, the second circuit board is attached to the side plate, and a third heat-conducting medium is arranged between the second circuit board and the side plate.

[0008] In some embodiments, a plurality of heat dissipation fins are distributed on the top plate and / or the side plates, and the heat dissipation fins are spaced apart.

[0009] In some embodiments, the side plates include a first side plate and a second side plate, the first side plate and the second side plate are oppositely distributed, and one end of the first side plate and one end of the second side plate are respectively arranged at two ends of the top plate.

[0010] In some embodiments, at least one connector is arranged at one end of the first side plate away from the top plate and at one end of the second side plate away from the top plate, and the first side plate and the second side plate are inserted into the first circuit board through the connector.

[0011] In some embodiments, the integrated magnetic device further includes a main circuit board arranged at one side of the first circuit board, and the first circuit board and the main circuit board are electrically coupled; the heat sink is provided with at least one support, and two ends of the support are respectively connected to the heat sink and the main circuit board.

[0012] In some embodiments, the first circuit board is inserted into the main circuit board, and the first circuit board and the main circuit board are vertically distributed, the main circuit board is located at one side of the heat sink, and the heat sink and the main circuit board are supported and matched.

[0013] In some embodiments, the magnetic device includes a magnetic core, a coil support, a transformer coil, an inductor coil, and an isolation plate, the coil support is arranged inside the magnetic core, the transformer coil and the inductor coil are both wound on the coil support, and the transformer coil and the inductor coil are electrically coupled with the first circuit board, the isolation plate is arranged on the coil support, and the transformer coil and the inductor coil are isolated by the isolation plate.

[0014] To solve the above technical problems, another technical solution adopted by the present application is to provide a power supply device including the integrated magnetic device described above.

[0015] The beneficial effects of the embodiments of the present application are: different from the prior art, the embodiments of the present application provide an integrated magnetic device and a power supply device, the integrated magnetic device comprises a first circuit board, a magnetic device, a power device and a heat sink, the magnetic device is fixed to the first circuit board and is electrically coupled with the first circuit board, the heat sink is fixed to the first circuit board and is arranged outside the magnetic device, the heat sink comprises a top plate and a side plate, the first heat-conducting medium is arranged between the magnetic device and the top plate and the side plate, and the power device is arranged on the side plate. In the above manner, the magnetic device and the power device are both cooled by the heat sink, thereby improving the space utilization and reducing the cost. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments of the present application will be briefly introduced as follows. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can be obtained by the drawings without creative labor.

[0017] Figure 1 It is a perspective view of the integrated magnetic device provided by an embodiment of the present application.

[0018] Figure 2 It is an exploded view of the integrated magnetic device provided by an embodiment of the present application.

[0019] Figure 3 It is a perspective view of the heat sink provided by another embodiment of the present application.

[0020] Figure 4 It is a perspective view of the heat sink provided by another embodiment of the present application.

[0021] Figure 5 It is an exploded view of the magnetic device provided by an embodiment of the present application.

[0022] Figure 6 It is an exploded view of the integrated magnetic device provided by another embodiment of the present application.

[0023] Figure 7 It is a perspective view of the integrated magnetic device comprising a main circuit board provided by an embodiment of the present application. DETAILED DESCRIPTION

[0024] For the purpose of promoting an understanding of the principles of the application, the application will now be described in more detail with reference to the accompanying drawings and specific embodiments. It is to be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. When an element is referred to as being "second" another element, it can be second to the other element directly or intervening elements can also be present. The terminology used herein is for the purpose of describing specific embodiments only and is not intended to be limiting of the application.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for describing specific embodiments only and is not intended to be limiting of the application. The use herein of terms such as "and / or" includes a combination of one or more of the associated listed items.

[0026] Please refer to Figure 1 and Figure 2 , the integrated magnetic device 100 includes a first circuit board 1, a heat sink 2, a magnetic device 3 and a power device 4. The heat sink 2 and the magnetic device 3 are fixed to the first circuit board 1, the magnetic device 3 is electrically coupled to the first circuit board 1, the heat sink 2 is arranged outside the magnetic device 3, the power device 4 is arranged on the heat sink 2, and the magnetic device 3 and the power device 4 are both cooled by the heat sink 2.

[0027] In some embodiments, please refer to Figure 1 and Figure 2 , the heat sink 2 includes a top plate 21 and a side plate 22, the top plate 21 and the side plate 22 are both arranged outside the magnetic device 3, and the first heat-conducting medium 23 is arranged between the top plate 21 and the magnetic device 3 and between the side plate 22 and the magnetic device 3, the first heat-conducting medium 23 is used to transfer the heat generated by the magnetic device 3 to the heat sink 2 for cooling, achieving good thermal contact and enhancing the cooling effect.

[0028] In some embodiments, the power device 4 is arranged on the side plate 22, the power device 4 and the magnetic device 3 are cooled by the same heat sink 2, reducing the cost, and also forming a spatial separation with the magnetic device 3, optimizing the spatial structure.

[0029] In some embodiments, please refer to Figure 2The side plate 22 comprises a first side plate 221 and a second side plate 222, which are oppositely arranged, and one end of the first side plate 221 and one end of the second side plate 222 are arranged at two ends of the top plate 21, forming a "U"-shaped heat sink 2, which is simple in structure, easy to install, reduces heat accumulation, and improves heat dissipation efficiency.

[0030] In some embodiments, at least one connecting piece 24 is arranged at one end of the first side plate 221 and one end of the second side plate 222 away from the top plate 21, and the first side plate 221 and the second side plate 222 are inserted into the first circuit board 1 through the connecting piece 24, thereby enhancing the connection stability of the heat sink 2 and the first circuit board 1.

[0031] In other embodiments, referring to Figure 3 and Figure 4 a plurality of heat dissipation fins 25 are arranged on the top plate 21, and the heat dissipation fins 25 are arranged at intervals. The arrangement of the heat dissipation fins 25 on the top plate 21 is not limited to a specific direction, and can be determined according to actual heat dissipation requirements and air flow characteristics. In an example, referring to Figure 3 each heat dissipation fin 25 extends along the length direction of the top plate 21, and a plurality of heat dissipation fins 25 are arranged in sequence along the width direction of the top plate 21. In another example, referring to Figure 4 each heat dissipation fin 25 extends along the width direction of the top plate 21, and a plurality of heat dissipation fins 25 are arranged in sequence along the length direction of the top plate 21. The arrangement of the heat dissipation fins 25 increases the heat dissipation area of the top plate 21, and further enhances the heat dissipation efficiency.

[0032] In some embodiments, a plurality of heat dissipation fins are arranged on the side plate, and the heat dissipation fins are arranged at intervals. The arrangement of the heat dissipation fins on the side plate is not limited to a specific direction, and can be determined according to actual heat dissipation requirements and air flow characteristics.

[0033] In some embodiments, the height and width of each heat dissipation fin can be the same or different, which is determined according to actual heat dissipation requirements.

[0034] In some embodiments, the heat sink 2 is made of a heat-conducting material. In some examples, the heat sink 24 is made of aluminum or aluminum alloy.

[0035] In some embodiments, the top plate 21 and the side plate of the heat sink 2 are integrally formed. In other embodiments, the top plate 21 and the side plate are separate structures, and different specifications or top plates 21 or side plates provided with different heat dissipation fin structures can be replaced to adapt to integrated magnetic devices 3 with different power or heat dissipation requirements.

[0036] In some embodiments, referring to Figure 5The magnetic device 3 comprises a magnetic core 31, a coil support 32, a transformer coil 33, an inductor coil 34, and an isolation plate 35. The coil support 32 is arranged inside the magnetic core 31. The transformer coil 33 and the inductor coil 34 are both wound around the coil support 32, and are both electrically coupled to the first circuit board 1. The isolation plate 35 is arranged on the coil support 32, and the transformer coil 33 and the inductor coil 34 are isolated by the isolation plate 35. The magnetic device 3 is an integrated component, which effectively reduces the overall volume while ensuring the stability of the electromagnetic performance.

[0037] In some embodiments, the power device 4 further comprises a fixing member 36 arranged outside the magnetic core 31. The fixing member 36 is used to fix the magnetic core 31 and the components inside the magnetic core 31.

[0038] In some embodiments, please refer to Figure 1 and Figure 2 The power device 4 comprises a power tube 41 electrically coupled to the first circuit board 1. The power tube 41 is attached to the side plate, and a second heat-conducting medium (not shown in the figure) is arranged between the power tube 41 and the side plate. The second heat-conducting medium is used to transfer the heat generated by the power tube 41 to the side plate for heat dissipation.

[0039] In some embodiments, the number of power tubes 41 is multiple, and the multiple power tubes 41 are arranged on the first side plate 221 and / or the second side plate 222.

[0040] In some other embodiments, please refer to Figure 6 The power device 4 comprises a patch power component 42 and a second circuit board 43. The patch power component 42 is attached to the second circuit board 43, and the second circuit board 43 is attached to the second circuit board 43 and electrically coupled to the first circuit board 1. The second circuit board 43 is attached to the side plate. A third heat-conducting medium (not shown in the figure) is arranged between the second circuit board 43 and the side plate. The third heat-conducting medium is used to transfer the heat generated by the patch power component 42 and the second circuit board 43 to the side plate for heat dissipation.

[0041] In some embodiments, the number of patch power components 42 is multiple, and the multiple patch power components 42 are arranged on the first side plate 221 and / or the second side plate 222. The second circuit board 43 is arranged on the first side plate 221 and / or the second side plate 222. The number of patch power components 42 on one second circuit board 43 can be one or more.

[0042] It should be noted that the power device 4 can be, for example, a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), an IGBT (Insulated Gate Bipolar Transistor), a diode, or other types of semiconductor power devices 4, which are used to realize the conversion and control of electric energy.

[0043] In some embodiments, the first, second and third thermally conductive mediums are one or more of a thermally conductive glue, a thermally conductive silicone grease or other insulating thermally conductive material.

[0044] In some embodiments, referring to Figure 7 , the integrated magnetic device 100 further comprises a main circuit board 5 disposed on one side of the first circuit board 1, and the first circuit board 1 is electrically coupled to the main circuit board 5. The heat sink 2 is provided with at least one support 26, and the two ends of the support 26 are connected to the heat sink 2 and the main circuit board 5, respectively. The integrated magnetic device 100 is installed on the main circuit board 5 through the first circuit board 1, which improves the integration and maintainability of the integrated magnetic device 100. When the integrated magnetic device 100 needs to be removed for maintenance or replacement, the first circuit board 1 can be removed to complete the operation, which improves the work efficiency.

[0045] In some embodiments, the first circuit board 1 is plugged into the main circuit board 5, and the first circuit board 1 and the main circuit board 5 are vertically distributed, so that the integrated magnetic device 100 is vertically distributed on the main circuit board 5, saving the installation space on the main circuit board 5. The main circuit board 5 is located on one side of the heat sink 2. The support 26 is disposed between the heat sink 2 and the main circuit board 5 to support and cooperate the heat sink 2 and the main circuit board 5. Compared with the three-point support member disposed on the end of the heat sink 2 away from the first circuit board 1, the support 26 improves the installation convenience and further saves the installation space on the main circuit board 5.

[0046] In some embodiments, the number of supports 26 is multiple. In one example, multiple supports 26 are disposed on the side of the top plate 21 facing the main circuit board 5. In another example, multiple supports 26 are disposed on the side of the side plate facing the main circuit board 5. In yet another example, multiple supports 26 are disposed on the side of the top plate 21 facing the main circuit board 5 and the side of the side plate facing the main circuit board 5, respectively. Multiple supports 26 provide multiple stress points, which help to disperse the pressure and improve the structural reliability.

[0047] It should be noted that the integrated magnetic device 100 can be applied to an AC-DC converter, a DC-DC converter or other types of power supply devices. In some embodiments, the integrated magnetic device 100 is applied to an intermediate bus converter, and the intermediate bus converter is used to convert 48V DC to other voltage levels required by the load point, such as 12V, 5V or 3.3V, etc. Among them, the transformer part in the magnetic device 3 is used to realize the electrical isolation from input to output, and the inductor part is used to realize the output filtering.

[0048] In the embodiment of the present application, the heat sink 2 is arranged outside the magnetic device 3, the heat sink 2 comprises a top plate 21 and a side plate, and the power device 4 is arranged on the side plate of the heat sink 2, so that the integration of the integrated magnetic device 3 is realized, and the magnetic device 3 and the power device 4 can be cooled by the same heat sink 2, thereby effectively improving the space utilization and reducing the cost.

[0049] The present application also provides an embodiment of a power supply device, which comprises the integrated magnetic device 100 described above, and the structure and functions of the integrated magnetic device 100 can be referred to the above embodiments, which will not be repeated here.

[0050] It should be noted that the preferred embodiments of the present application are given in the specification and drawings of the present application, but the present application can be implemented in many different forms, and is not limited to the embodiments described in the specification, and the embodiments are not additional limitations on the content of the present application, and the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive. Furthermore, the above technical features continue to be combined with each other, forming various embodiments not listed above, which are all considered to be within the scope of the present application. Furthermore, for those skilled in the art, the above description can be improved or changed, and all these improvements and changes should be within the scope of protection of the appended claims of the present application.

Claims

1. An integrated magnetic device, characterized in that, include: First circuit board; A magnetic device is fixed to the first circuit board and electrically coupled to the first circuit board; A heat sink is fixed to the first circuit board and disposed on the outside of the magnetic device; the heat sink includes a top plate and a side plate, and a first heat-conducting medium is disposed between the magnetic device and the top plate and the side plate; Power devices are disposed on the side plate.

2. The integrated magnetic device according to claim 1, characterized in that... , The power device includes a power transistor; The power transistor is electrically coupled to the first circuit board, the power transistor is attached to the side plate, and a second heat-conducting medium is disposed between the power transistor and the side plate.

3. The integrated magnetic device according to claim 1, characterized in that... , The power device includes a surface-mount power component and a second circuit board. The surface-mount power component is attached to the second circuit board, and the second circuit board is electrically coupled to the first circuit board. The second circuit board is attached to the side plate, and a third heat-conducting medium is disposed between the second circuit board and the side plate.

4. The integrated magnetic device according to any one of claims 1-3, characterized in that, Multiple heat dissipation fins are distributed on the top plate and / or the side plate, and the heat dissipation fins are spaced apart.

5. The integrated magnetic device according to any one of claims 1-3, characterized in that, The side plate includes a first side plate and a second side plate, which are distributed opposite to each other, and one end of the first side plate and one end of the second side plate are respectively disposed at both ends of the top plate.

6. The integrated magnetic device according to claim 5, characterized in that, At least one connector is provided at the end of the first side plate away from the top plate and at the end of the second side plate away from the top plate. The first side plate and the second side plate are both inserted into the first circuit board through the connector.

7. The integrated magnetic device according to claim 1, characterized in that, It also includes a main circuit board, which is disposed on one side of the first circuit board and electrically coupled to the first circuit board; the heat sink is provided with at least one support member, and the two ends of the support member are respectively connected to the heat sink and the main circuit board.

8. The integrated magnetic device according to claim 7, characterized in that, The first circuit board is inserted into the main circuit board and the first circuit board and the main circuit board are vertically distributed. The main circuit board is located on one side of the heat sink, and the heat sink and the main circuit board are supported and engaged.

9. The integrated magnetic device according to claim 1, characterized in that, The magnetic device includes a magnetic core, a coil support, a transformer coil, an inductor coil, and an isolation plate. The coil support is disposed inside the magnetic core. The transformer coil and the inductor coil are both wound around the coil support, and the transformer coil and the inductor coil are both electrically coupled to the first circuit board. The isolation plate is disposed on the coil support, and the transformer coil and the inductor coil are isolated by the isolation plate.

10. A power supply device, characterized in that, Including the integrated magnetic device as described in any one of claims 1-9.

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