Reaction cavity and semiconductor processing equipment

Abstract

The utility model discloses a reaction chamber and semiconductor processing equipment. The reaction chamber comprises a base; a connecting hole is formed in the edge ring, and the edge ring is mounted on the surface of the base; a first connecting through hole is formed in the middle ring, and the middle ring is mounted between the edge ring and the base; a second connecting through hole is formed in the protection ring, and the protection ring is mounted on the surface of the side wall of the connecting hole; and the connecting part penetrates through the second connecting through hole and the first connecting through hole, so that the edge ring is fixedly connected with the middle ring. The protection ring is arranged in the connecting hole in the edge ring, so that the side wall of the connecting hole in the edge ring is prevented from being damaged in the fixed connection process, and the integrity of the edge ring is guaranteed; and the protection ring and the edge ring are separately and independently arranged and are connected during use, so that when the protection ring is damaged, only the protection ring needs to be replaced by a new protection ring, the edge ring does not need to be replaced, the manufacturing cost is reduced, and the working efficiency of the reaction cavity is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductors, and in particular to a reaction chamber and semiconductor processing equipment. Background Technology

[0002] Plasma processing equipment typically introduces reactive gases into a reaction chamber to generate plasma, which is then used to perform plasma deposition, etching, and other processes on the wafers placed within the chamber. Due to prolonged exposure to the plasma etching environment, the edge ring surrounding the substrate within the reaction chamber is gradually eroded over time, necessitating regular preventative maintenance to monitor the condition of the edge ring.

[0003] However, during preventative maintenance disassembly and assembly, repeated disassembly and assembly of the edge ring and middle ring can damage the threaded holes in the edge ring, requiring replacement or repair of the edge ring. This increases process costs and affects the performance and efficiency of the reaction chamber. Utility Model Content

[0004] The technical problem solved by this invention is how to reduce process costs and improve the performance and efficiency of the reaction chamber.

[0005] To solve the above-mentioned technical problems, this utility model provides a reaction chamber, including: a base; an edge ring having a connecting hole and being mounted on the surface of the base, with a portion of the edge ring surrounding the base; a middle ring having a first connecting through hole and being mounted between the edge ring and the base; a protective ring having a second connecting through hole and being mounted on the side wall surface of the connecting hole; and a connecting portion passing through the second connecting through hole and the first connecting through hole, so that the edge ring and the middle ring are fixedly connected.

[0006] Optionally, the material of the edge ring is different from the material of the protective ring, the material of the protective ring is the same as the material of the middle ring, and the material of the edge ring is the same as the material of the connecting portion.

[0007] Optionally, the edge ring is made of aluminum alloy, and the protective ring is made of stainless steel.

[0008] Optionally, the edge ring, the protective ring, the middle ring, and the connecting portion are all made of the same material.

[0009] Optionally, the edge ring is made of aluminum alloy.

[0010] Optionally, the number of connecting parts is three.

[0011] Optionally, the edge ring and the middle ring are fixedly connected by a threaded connection.

[0012] Optionally, the connecting part is a screw, and the sidewall of the second connecting through hole has threads.

[0013] Optionally, the edge ring and the middle ring are fixedly connected by a snap-fit ​​connection.

[0014] Optionally, the connecting part is a buckle, and the side wall of the second connecting through hole has a groove, and the shape of the groove matches the shape of the buckle.

[0015] Optionally, the protective ring is interference-fitted with the connecting hole in the edge ring.

[0016] Optionally, the diameter of the second connecting through hole is the same as that of the first connecting through hole.

[0017] Optionally, the diameter of the second connecting through hole ranges from 2 mm to 2.5 mm.

[0018] Optionally, the interference fit of the second connecting through hole is 0.5 mm to 1 mm.

[0019] Optionally, the reaction chamber further includes a reaction chamber body, wherein the base, the edge ring, the middle ring, the protective ring, and the connecting part are all installed in the reaction chamber body.

[0020] Optionally, the reaction chamber further includes: a positioning pin, which is mounted on the connecting part; and a positioning slot, located on the base, wherein the shape of the positioning pin matches the positioning slot.

[0021] Optionally, the diameter of the edge ring is larger than the diameter of the base, the diameter of the middle ring is larger than the diameter of the base, and the diameter of the middle ring is smaller than the diameter of the edge ring.

[0022] Accordingly, this utility model also provides a semiconductor processing apparatus, including the reaction chamber described above.

[0023] Compared with the prior art, the technical solution of this utility model embodiment has the following beneficial effects:

[0024] In this invention, a protective ring is provided inside the connecting hole in the edge ring. During the subsequent fixing of the edge ring and the middle ring, the connecting part contacts the protective ring to secure the edge ring, preventing damage to the sidewall of the connecting hole in the edge ring during the fixing process. This ensures the integrity of the edge ring and improves the performance of the reaction chamber. Furthermore, the protective ring is separately and independently set from the edge ring, and is connected during use. Therefore, if the protective ring is damaged, only a new protective ring needs to be replaced, without replacing the edge ring, thereby reducing process costs and improving the efficiency of the reaction chamber.

[0025] Furthermore, the protective ring in this invention is made of stainless steel. By changing the material of the inner thread contact point of the protective ring, the hardness of the thread contact point is increased, ensuring the tightness of the connection and improving the working performance of the reaction chamber. Attached Figure Description

[0026] Figure 1 This is an exploded view of the reaction chamber structure described in an embodiment of this utility model;

[0027] Figure 2 This is a schematic diagram of the structure of the base described in one embodiment of the present invention;

[0028] Figure 3 This is a schematic diagram of the structure of the reaction chamber described in the embodiment of this utility model;

[0029] Figure 4 This is a schematic diagram of the structure of the base described in another embodiment of the present invention;

[0030] Figure 5 This is a schematic cross-sectional view of the reaction chamber in one embodiment of the present invention. Detailed Implementation

[0031] It should be noted that the terms "surface" and "on" in this specification are used to describe the relative spatial position and are not limited to whether there is direct contact.

[0032] The current reaction chamber structure includes: a base; an edge ring having a connecting hole and being mounted on the surface of the base, with a portion of the edge ring surrounding the base; a middle ring having a first connecting through hole and being mounted between the edge ring and the base; and screws passing through the connecting hole and the first connecting through hole to fix the edge ring and the middle ring together.

[0033] In this embodiment, the edge ring is made of aluminum alloy, and the screw is also made of aluminum alloy.

[0034] In the above scheme, since the reaction chamber needs to be regularly maintained for preventive maintenance to check the condition of the edge ring, the edge ring and the middle ring need to be repeatedly disassembled and reassembled. The edge ring and the screw are made of aluminum alloy, which has low density and strength. Repeated disassembly and reassembly will damage the threaded holes in the edge ring, which will affect the performance of the edge ring. A new edge ring needs to be replaced to ensure the performance of the edge ring, which increases the process cost and affects the performance and efficiency of the reaction chamber.

[0035] Furthermore, in order to improve the damage of the threaded holes in the edge ring, the edge ring is sent to a micromachining cleaning manufacturer after the threaded holes in the edge ring are damaged to repair the damaged threaded holes. This reduces the processing efficiency. Moreover, long-term cleaning of the edge ring will cause the diameter of the threaded holes in the edge ring to increase, affecting the subsequent fixed connection between the edge ring and the middle ring. This may lead to the edge ring and the middle ring falling off during the process, affecting the performance of the reaction chamber.

[0036] To solve the above-mentioned technical problems, this utility model provides a reaction chamber. By setting a protective ring in the edge ring, the connecting hole in the edge ring is protected, avoiding damage to the side wall of the connecting hole in the edge ring by the connecting part during repeated disassembly and assembly of the edge ring and the middle ring. This ensures the integrity of the edge ring and improves the working performance of the reaction chamber.

[0037] To make the above-mentioned objectives, features and beneficial effects of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0038] Figure 1 This is an exploded view of the reaction chamber structure described in an embodiment of this utility model.

[0039] Please refer to Figure 1 The reaction chamber includes: a base 100; an edge ring 102 having a connecting hole 1021 and mounted on the surface of the base 100, with a portion of the edge ring 102 surrounding the base 100; a middle ring 101 having a first connecting through hole 1011 and mounted between the edge ring 102 and the base 100; a protective ring 103 having a second connecting through hole 1031 and mounted on the sidewall surface of the connecting hole 1021; and a connecting portion 104 penetrating through the second connecting through hole 1031 and the first connecting through hole 1011, thereby fixing the edge ring 102 and the middle ring 101 together.

[0040] In some embodiments of this utility model, the material of the edge ring 102 is different from that of the protective ring 103, the material of the protective ring 103 is the same as that of the middle ring 101, and the material of the edge ring 102 is the same as that of the connecting portion 104.

[0041] In a specific embodiment, the edge ring 102 is made of aluminum alloy, and the protective ring 103 is made of stainless steel.

[0042] This invention uses stainless steel as the material for the protective ring 103. Due to the high strength and corrosion resistance of stainless steel, the connection between the protective ring 103 and the connecting part 104 is made wear-resistant, reducing damage to the connection. In addition, the edge ring 102 is made of aluminum alloy, which has good thermal conductivity and low cost, enabling rapid heating or cooling of the wafer to be processed, ensuring the process flow and reducing manufacturing costs.

[0043] The connection damage is characterized as wear on the sidewall of the second connection through hole 1031 in the protective ring 103 after repeated connection and disassembly of the protective ring 103 and the connection part 104.

[0044] In some other embodiments of this utility model, the materials of the edge ring 102, the protective ring 103, the middle ring 101, and the connecting portion 104 are all the same.

[0045] In a specific embodiment, the protective ring 103 is made of aluminum alloy, which has low cost and can withstand connection damage to the protective ring 103.

[0046] By making the protective ring 103 of aluminum alloy, this utility model can ensure the fixed connection between the edge ring 102 and the middle ring 101 by simply replacing the protective ring 103 when the connection of the protective ring 103 is damaged, thus reducing the manufacturing cost.

[0047] In some embodiments of this utility model, the protective ring 103 is interference-fitted with the connecting hole 1021 in the edge ring 102, and the diameter of the second connecting through hole 1031 is the same as that of the first connecting through hole 1011.

[0048] In a specific embodiment, the diameter of the second connecting through hole 1031 ranges from 2 mm to 2.5 mm, and the interference of the second connecting through hole 1031 ranges from 0.5 mm to 1 mm.

[0049] In some embodiments of this utility model, the outer contour shapes of the edge ring 102, the middle ring 101, and the protective ring 103 are matched with the base 100.

[0050] In a specific embodiment of this utility model, the base 100 is disc-shaped, and the edge ring 102, the middle ring 101, and the protective ring 103 are all annular.

[0051] In other embodiments of this utility model, the outer contour shapes of the edge ring 102, the middle ring 101, and the protective ring 103 do not match the base 100.

[0052] Of course, this utility model is not limited thereto, and other shapes of the base 100, the edge ring 102, the middle ring 101 and the protective ring 103 are all within the protection scope of this utility model.

[0053] In the above solution, by setting a protective ring 103 inside the connecting hole 1021 in the edge ring 102, the connecting part 104 contacts the protective ring 103 to fix the edge ring 102 during the subsequent fixed connection of the edge ring 102 and the middle ring 101, thereby fixing the edge ring 102 and avoiding damage to the sidewall of the connecting hole 1021 in the edge ring 102 during the fixed connection process. This ensures the integrity of the edge ring 102 and improves the performance of the reaction chamber. Furthermore, the protective ring 103 is set separately and independently from the edge ring 102 and connected during use. Therefore, if the protective ring 103 is damaged, only a new protective ring 103 needs to be replaced, without replacing the edge ring 102, thereby reducing process costs and improving the efficiency of the reaction chamber.

[0054] Figure 2 This is a schematic diagram of the structure of the base 100 in one embodiment of the present invention.

[0055] Please refer to Figure 2 The reaction chamber further includes: a positioning pin 1041, which is mounted on the connecting part 104; and a positioning slot 1001, which is located on the base 100, and the shape of the positioning pin 1041 matches the positioning slot 1001.

[0056] In some embodiments of this utility model, the positioning slot 1001 is located inside the base 100, and the depth of the positioning slot 1001 is less than the thickness of the base 100. The positioning slot 1001 is located on the side of the base 100 near the middle ring 101.

[0057] In some embodiments of this utility model, the connecting part 104 is a screw, that is, the positioning pin 1041 is a nut on the screw.

[0058] It should be noted that after the edge ring 102 and the middle ring 101 are fixedly connected, the positioning pin 1041, that is, the nut part of the screw, is exposed on the side near the middle ring 101. After the edge ring 102 and the middle ring 101 are fixedly connected, the positioning pin 1041 is set in the positioning slot 1001 to realize the connection between the edge ring 102, the middle ring 101 and the base 100.

[0059] In some embodiments of this utility model, the number of connecting holes 1021, the number of first connecting through holes 1011, the number of second connecting through holes 1031, and the number of connecting portions 104 are the same.

[0060] In embodiments of this utility model, the number of connecting portions 104 ranges from three.

[0061] In other embodiments, the number of connecting parts is greater than three.

[0062] The positions of the connecting hole 1021, the first connecting through hole 1011, and the second connecting through hole 1031 are in one-to-one correspondence. The connecting hole 1021 is evenly distributed on the edge ring 102, and the first connecting through hole 1011 is evenly distributed on the middle ring 101.

[0063] In some embodiments of this utility model, the connecting hole 1021 is located inside the edge ring 102, and the depth of the connecting hole 1021 is less than the thickness of the edge ring 102.

[0064] Wherein, the depth of the connecting hole 1021 is less than the thickness of the edge ring 102, that is, when the connecting part 104 is fixedly connected to the edge ring 102, the connecting part 104 is located inside the edge ring 102, so as to avoid the connecting part 104 penetrating the edge ring 102 and the connecting part 104 being higher than the surface of the edge ring 102, thus avoiding damage to the wafer to be processed and ensuring the integrity of the wafer to be processed.

[0065] In some embodiments of this invention, the base 100 is used to support and fix the wafer to be processed, and to ensure the uniformity and stability of the process.

[0066] In other embodiments of this utility model, the base 100 further includes a built-in heater for heating the wafer to be processed to the temperature required by the process; the base 100 also includes a cooling system for rapidly cooling the wafer to be processed after the process is completed to prevent damage caused by overheating of the wafer.

[0067] In other embodiments of this utility model, the bottom of the base 100 includes a rotating rod, so that the base 100 drives the wafer to be processed to rotate during the process, thereby improving the uniformity of the process; the base 100 also includes several temperature control zones to achieve independent temperature control in multiple areas and adapt to complex process requirements.

[0068] Figure 3 This is a schematic diagram of the reaction chamber described in an embodiment of the present invention.

[0069] Please refer to Figure 3 , Figure 3 This is a schematic diagram of the structure of the reaction chamber after the components are assembled. The edge ring 102 is located on the middle ring 101, and the edge ring 102 and the middle ring 101 are connected by the connecting part 104. The connecting part 104 has a positioning pin 1041, which is connected to the positioning slot 1001 on the base 100.

[0070] In some embodiments of this utility model, the edge ring 102 and the middle ring 101 are fixedly connected by a threaded connection. Specifically, the connecting part 104 is a screw, and the side wall of the second connecting through hole 1031 has threads.

[0071] In a specific embodiment, the protective ring 103 is made of stainless steel.

[0072] Of course, this utility model is not limited thereto, and other materials of the protective ring 103 are all within the protection scope of this utility model.

[0073] The protective ring 103 in this invention is made of stainless steel. By changing the material of the internal thread contact point of the protective ring 103, the hardness of the thread contact point is increased, ensuring the tightness of the connection and improving the working performance of the reaction chamber.

[0074] In some other embodiments of this utility model, the edge ring 102 and the middle ring 101 are fixedly connected by a snap-fit ​​connection. Specifically, the connecting part 104 is a snap-fit, and the side wall of the second connecting through hole 1031 has a groove, and the shape of the groove matches the shape of the snap-fit.

[0075] In other embodiments of this utility model, the edge ring 102 and the middle ring 101 are fixedly connected by magnetic attraction. Specifically, the material of the connecting part 104 is magnetically opposite to that of the protective ring 103, and the connecting part 104 penetrates the protective ring 103 to achieve a fixed connection.

[0076] Figure 4 This is a schematic diagram of the structure of the base 100 in another embodiment of the present invention.

[0077] Figure 5 This is a schematic cross-sectional view of the reaction chamber in one embodiment of the present invention.

[0078] Please refer to Figure 4 as well as Figure 5 The reaction chamber further includes a reaction chamber body 105, in which the base 200, the edge ring 102, the middle ring 101, the protective ring 103, and the connecting part 104 are all installed.

[0079] In some embodiments of the present invention, the edge of the base 200 further includes a notch 2001, the edge ring 102 and the middle ring 101 are located within the notch 2001 on the base 200, and part of the edge ring 102 is arranged around the base 100.

[0080] In some embodiments of this utility model, the diameter of the edge ring 102 is greater than the diameter of the base 200, the diameter of the middle ring 101 is greater than the diameter of the base 200, and the diameter of the middle ring 101 is smaller than the diameter of the edge ring 102.

[0081] The diameter of the middle ring 101 and the diameter of the edge ring 102 are characterized as the distance between the center of the middle ring 101 and the edge of the middle ring 101, and the distance between the center of the edge ring 102 and the edge of the edge ring 102, respectively.

[0082] In some embodiments of this utility model, the edge ring 102 is used to support and protect the wafer to be processed. Specifically, the edge ring 102 is used to ensure the process uniformity of the edge of the wafer to be processed, reduce edge effects, and prevent the edge of the wafer to be processed from being directly exposed to high-energy particles or plasma, thus avoiding damage to the wafer. In addition, the edge ring 102 can also help regulate the temperature of the edge of the wafer to be processed and maintain the overall temperature uniformity of the wafer to be processed.

[0083] In some embodiments of this utility model, the middle ring 101 is used to provide stable support for the wafer to be processed, preventing the wafer to be processed from moving or deforming during the process. Specifically, the middle ring 101 is used to ensure the process uniformity of the edge of the wafer to be processed, reduce edge effects, and prevent the edge of the wafer to be processed from being directly exposed to high-energy particles or plasma, thus avoiding damage to the wafer to be processed. In addition, the middle ring 101 can also help regulate the temperature of the edge of the wafer to be processed, keeping the overall temperature of the wafer to be processed uniform.

[0084] In the above scheme, the edge ring 102 and the middle ring 101 are located within the notch 2001 on the base 200, and part of the edge ring 102 is arranged around the base 100, which increases the contact area between the edge ring 102, the middle ring 101 and the base 200, thereby enabling the heat on the base 200 to be quickly transferred to the wafer to be processed, and to quickly dissipate heat from the wafer to be processed.

[0085] In some embodiments of this utility model, the reaction chamber is a core device in semiconductor manufacturing, used for processes such as thin film deposition and etching. Specifically, the working principle of the reaction chamber mainly involves gas control, plasma generation, temperature management, and vacuum environment.

[0086] In summary, this invention, by setting a protective ring inside the connecting hole in the edge ring, ensures that during the subsequent fixing of the edge ring and the middle ring, the connecting part contacts the protective ring to fix the edge ring, thus avoiding damage to the sidewall of the connecting hole in the edge ring during the fixing process, ensuring the integrity of the edge ring, and improving the performance of the reaction chamber. Furthermore, since the protective ring is separately and independently set from the edge ring and connected during use, if the protective ring is damaged, only a new protective ring needs to be replaced, without replacing the edge ring, thereby reducing process costs and improving the efficiency of the reaction chamber.

[0087] Accordingly, this utility model also provides a semiconductor processing apparatus, including the reaction chamber described above.

[0088] In some embodiments of this utility model, the semiconductor processing equipment is a plasma processing device used for processes such as thin film deposition, etching, cleaning, and surface modification. Its working principle is to achieve high-precision processing through the interaction between plasma and the material surface.

[0089] In some other embodiments of this utility model, the semiconductor processing equipment further includes: a gas distribution system, a vacuum system, a plasma generation system, a temperature control system, a waste gas treatment system, and a control system. Specifically, the working principle of the semiconductor processing equipment is as follows: the reaction gas is introduced into the reaction chamber through the gas distribution system, the vacuum system reduces the pressure inside the chamber to the required range, the gas is excited in the plasma generation system by means of radio frequency, microwave or inductive coupling to generate plasma, the plasma reacts with the surface material of the wafer to be processed for processing, after the reaction is completed, the by-products and unreacted gases are discharged through the waste gas treatment system, and the process parameters are adjusted in real time by the control system to ensure process stability and consistency.

[0090] In this invention, the semiconductor processing equipment employs a reaction chamber with a protective ring. This allows the connecting part to contact the protective ring during the subsequent fixing of the edge ring and the middle ring, thus securing the edge ring and preventing damage to the sidewall of the connecting hole in the edge ring during the fixing process. This ensures the integrity of the edge ring and improves the performance of the reaction chamber. Furthermore, the protective ring and the edge ring are separately and independently configured, connected during use. Consequently, if the protective ring is damaged, only the new protective ring needs to be replaced, without replacing the edge ring, thereby reducing process costs and improving the efficiency of the reaction chamber.

[0091] Although the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A reaction chamber, characterized in that, include: Base; An edge ring having a connecting hole is mounted on the surface of the base, and a portion of the edge surrounds the base. A middle ring, wherein the middle ring has a first connecting through hole, and the middle ring is installed between the edge ring and the base; A protective ring having a second connecting through hole, and the protective ring being mounted on the side wall surface of the connecting hole; The connecting portion extends through the second connecting through hole and the first connecting through hole, so that the edge ring and the middle ring are fixedly connected.

2. The reaction chamber as described in claim 1, characterized in that, The material of the edge ring is different from that of the protective ring, the material of the protective ring is the same as that of the middle ring, and the material of the edge ring is the same as that of the connecting part.

3. The reaction chamber as described in claim 2, characterized in that, The edge ring is made of aluminum alloy, and the protective ring is made of stainless steel.

4. The reaction chamber as described in claim 1, characterized in that, The edge ring, the protective ring, the middle ring, and the connecting part are all made of the same material.

5. The reaction chamber as described in claim 4, characterized in that, The edge ring is made of aluminum alloy.

6. The reaction chamber as described in claim 1, characterized in that, The number of connecting parts is 3.

7. The reaction chamber as described in claim 1, characterized in that, The edge ring and the middle ring are fixedly connected by a threaded connection.

8. The reaction chamber as described in claim 7, characterized in that, The connecting part is a screw, and the sidewall of the second connecting through hole has threads.

9. The reaction chamber as described in claim 1, characterized in that, The edge ring and the middle ring are fixedly connected by a snap-fit ​​connection.

10. The reaction chamber as described in claim 9, characterized in that, The connecting part is a buckle, and the side wall of the second connecting through hole has a groove, and the shape of the groove matches the shape of the buckle.

11. The reaction chamber as claimed in claim 1, characterized in that, The protective ring is interference-fitted with the connecting hole in the edge ring.

12. The reaction chamber as described in claim 11, characterized in that, The diameter of the second connecting through hole is the same as that of the first connecting through hole.

13. The reaction chamber as described in claim 12, characterized in that, The diameter of the second connecting through hole ranges from 2 mm to 2.5 mm.

14. The reaction chamber as described in claim 12, characterized in that, The interference fit of the second connecting through hole ranges from 0.5 mm to 1 mm.

15. The reaction chamber as claimed in claim 1, characterized in that, Also includes: The reaction chamber, the base, the edge ring, the middle ring, the protective ring, and the connecting part are all installed in the reaction chamber.

16. The reaction chamber as described in claim 1, characterized in that, Also includes: A positioning pin is installed on the connecting part; a positioning slot is located on the base, and the shape of the positioning pin matches the positioning slot.

17. The reaction chamber as claimed in claim 1, characterized in that, The diameter of the edge ring is larger than the diameter of the base, the diameter of the middle ring is larger than the diameter of the base, and the diameter of the middle ring is smaller than the diameter of the edge ring.

18. A semiconductor processing apparatus, characterized in that, Includes the reaction chamber as described in any one of claims 1 to 17.

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