Interface connection structure
By designing a base for the interface connection structure and a heat dissipation connection structure, the problem of inconvenient connection between the interface device and the circuit board in the existing technology is solved, achieving stable connection and efficient heat dissipation.
Patent Information
- Application Number
- CN202520351653.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-03
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2035-03-03
AI Technical Summary
When existing interface devices are connected to circuit boards, they need to be secured with adapter plates and screws, which makes assembly and disassembly inconvenient and can easily lead to screws falling off and damaging the circuit boards.
An interface connection structure was designed, including a base and a heat dissipation connection structure. The detachable heat dissipation connection structure is directly connected to the circuit board. The movable connection and locking parts of the heat dissipation connection structure enable tool-free assembly and disassembly. The guide ribs reduce friction, and the heat dissipation efficiency is improved by combining thermally conductive materials and cooling devices.
It achieves a stable connection and convenient assembly/disassembly between the interface device and the circuit board, avoiding the risk of tool damage and improving heat dissipation efficiency and connection stability.
Smart Images
Figure CN223898631U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to a connecting structure, in particular to an interface connecting structure. BACKGROUND
[0002] Nowadays, when an interface device (for example, an M.2 interface card) is electrically connected to a circuit board, an adapter plate is needed to connect the interface device to a corresponding connector on the circuit board. The interface device is fastened to the adapter plate by screws, and the adapter plate is fastened to the circuit board by screws. This is not conducive to the assembly and disassembly of the interface device and the adapter plate. The screws need to be disassembled and assembled using a special tool, which is inconvenient to use. During the fastening process, problems such as screw falling, improper locking, and damage to the circuit board due to improper use of the tool may occur. CONTENT OF THE UTILITY MODEL
[0003] The present application provides an interface connecting structure, which makes the interface device convenient to connect to a circuit board.
[0004] The interface connecting structure of the present application is suitable for a circuit board. The circuit board has at least one connector, and each of the at least one connector has a slot. The slot extends along a plug-in direction, and the plug-in direction is perpendicular to the circuit board. The interface connecting structure includes a base and a heat dissipation connecting structure. The base is arranged on the circuit board, and the base includes at least one connector opening. The at least one connector is located in the at least one connector opening. The heat dissipation connecting structure is suitable for being detachably connected to the base along the plug-in direction. The heat dissipation connecting structure includes a first housing and a second housing, and the second housing is movably connected to the first housing and surrounds a containing space with the first housing. The first housing includes at least one connection opening, the containing space is suitable for arranging at least one interface device, and each of the at least one interface device has a connecting part. When the interface device is arranged in the containing space, the connecting part is exposed from the connection opening. The heat dissipation connecting structure is suitable for being connected to the base along the plug-in direction, so that the connecting part is inserted into the slot.
[0005] In an embodiment of the present application, the first housing described above includes a first part and a second part connected to each other. The second housing is movably connected to the first part, and the at least one connection opening is located in the second part. When the heat dissipation connecting structure is connected to the base, the second part is located in the base.
[0006] In an embodiment of the present application, the second housing described above includes a third part and a fourth part. The third part is rotatably connected to the first housing, and the fourth part is slidably connected to the third part. When the heat dissipation connecting structure is connected to the base, the fourth part is located in the base.
[0007] In one embodiment of the present application, the heat dissipation connecting structure further comprises a locking member, the third component comprises a first sliding slot, the fourth component comprises a second sliding slot, and the locking member is disposed on the first housing and comprises a head and a neck connected to each other, the head has a width greater than that of the neck, and when the second housing is closed to the first housing, the neck is disposed in the first sliding slot and the second sliding slot.
[0008] In one embodiment of the present application, when the fourth component is in the first position, the first sliding slot and the second sliding slot form a first through hole, the first through hole has a width greater than or equal to the width of the head, and when the fourth component is in the second position, the first sliding slot and the second sliding slot form a second through hole, the second through hole has a width less than the width of the head and greater than or equal to the width of the neck.
[0009] In one embodiment of the present application, the heat dissipation connecting structure has a heat dissipation area and a connecting area, when the at least one interface device is disposed on the heat dissipation connecting structure, a part of the at least one interface device is located in the heat dissipation area and is thermally coupled to the heat dissipation connecting structure, and when the heat dissipation connecting structure is connected to the base, the connecting area is located in the base and the heat dissipation area is exposed.
[0010] In one embodiment of the present application, a part of the first housing and the second housing is located in the heat dissipation area, and another part of the first housing and the second housing is located in the connecting area, and the connecting opening is located in the connecting area.
[0011] In one embodiment of the present application, the interface connecting structure further comprises a cooling device, and the cooling device is disposed on the heat dissipation connecting structure and is thermally coupled to the at least one interface device when the at least one interface device is disposed on the heat dissipation connecting structure.
[0012] In one embodiment of the present application, the at least one connector of the circuit board is an M.2 connector, and the at least one interface device is an M.2 interface card.
[0013] In one embodiment of the present application, the base comprises a plurality of guide ribs extending in the insertion direction, and the plurality of guide ribs contact the heat dissipation connecting structure when the heat dissipation connecting structure is connected to the base.
[0014] Based on the above, the heat dissipation connecting structure of the interface connecting structure of the present application is used to hold the interface device, and the connecting part of the interface device is exposed to the heat dissipation connecting structure. The base of the interface connecting structure is disposed on the circuit board, and the heat dissipation connecting structure can be inserted into the base so that the connecting part of the interface device is directly and stably connected with the connector of the circuit board.
[0015] In order to make the above features and advantages of the present application more obvious and easy to understand, the following specific embodiments are described in detail below, and the drawings are as follows. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 is a schematic view of an interface connecting structure according to one embodiment of the present application;
[0017] Figure 2 is a cross-sectional view of the interface connection structure of Figure 1
[0018] Figure 3 is an exploded view of the interface connection structure of Figure 1
[0019] Figure 4 is a schematic view of the base of Figure 3
[0020] Figure 5 is a schematic view of the heat dissipation connection structure of Figure 3
[0021] Figure 6 is an exploded view of the heat dissipation connection structure of Figure 3
[0022] Figure 7 is a schematic view of the fourth component in the first position of Figure 6
[0023] Figure 8 is a partial enlarged view of the fourth component of Figure 7
[0024] Figure 9 is a schematic view of the fourth component in the second position of Figure 7
[0025] Figure 10 is a partial enlarged view of the fourth component of Figure 9 DETAILED DESCRIPTION
[0026] Figure 1 is a schematic view of the interface connection structure according to an embodiment of the present application. Figure 2 is a cross-sectional view of the interface connection structure of Figure 1 Figure 3 is an exploded view of the interface connection structure of Figure 1 Figure 4 is a schematic view of the base of Figure 3 Figure 5 is a schematic view of the heat dissipation connection structure of Figure 3 Figure 6 is an exploded view of the heat dissipation connection structure of Figure 3 Here, a first direction dl, a second direction d2 and a plug-in direction d3 perpendicular to each other are provided for the description of the components. Please refer to Figures 1 to 6 The interface connecting structure 100 is used for connecting at least one interface device 300 to the circuit board 200. The circuit board 200 has at least one connector 210. The interface connecting structure 100 includes a base 110 and a heat dissipation connecting structure 120. The base 110 is arranged on the circuit board 200 along a plugging direction d3 and includes at least one connector opening 111. The at least one connector 210 is located in the at least one connector opening 111. The heat dissipation connecting structure 120 is detachably connected to the base 110 along the plugging direction d3. The plugging direction d3 is perpendicular to a surface 220 of the circuit board 200. The number of the connectors 210 in the embodiment is three, and the number of the interface devices 300 is two, but is not limited thereto.
[0027] Each connector 210 has a slot 211 extending along the plugging direction d3. The heat dissipation connecting structure 120 includes a first shell 121 and a second shell 122. The second shell 122 is movably connected to the first shell 121 through a rotating shaft R and surrounds a containing space P1 with the first shell 121. The interface device 300 can be arranged in the containing space P1. Each interface device 300 has a connecting part 310. The first shell 121 includes at least one connecting opening 1211 communicating with the containing space P1. When the interface device 300 is arranged in the heat dissipation connecting structure 120, the connecting part 310 of the interface device 300 is exposed from the corresponding connecting opening 1211. At this time, the heat dissipation connecting structure 120 can be connected to the base 110 along the plugging direction d3, so that the connecting part 310 is inserted into the slot 211 of the corresponding connector 210.
[0028] Therefore, the interface device 300 is stably held in the heat dissipation connecting structure 120 and stably connected to the connector 210 of the circuit board 200 through the base 110. The interface device 300 is directly connected to the circuit board 200 through the interface connecting structure 100 without connecting the circuit board 200 through an adapter card (not shown). The heat dissipation connecting structure 120 and the base 110 can be connected and detached without using tools, so that tool-free assembly and disassembly can be achieved. The interface device 300 in the embodiment is an M.2 interface card, and the connector 210 of the circuit board 200 corresponds to an M.2 connector. The connector 210 can be an NVMe (NVM Express) connector.
[0029] As Figure 3As shown, the base 110 further includes a bottom surface 112, a side surface 113, and a plurality of guide ribs 114. The side surface 113 surrounds and is connected to the bottom surface 112, the connector openings 111 are located on the bottom surface 112, and the guide ribs 114 are connected to the side surface 113 and extend along the insertion direction d3. When the heat dissipation connector structure 120 is connected to the base 110, the guide ribs 114 contact the heat dissipation connector structure 120 to reduce the contact area between the base 110 and the heat dissipation connector structure 120, thereby reducing the friction between the base 110 and the heat dissipation connector structure 120, and avoiding that the friction is too high to easily insert or remove the heat dissipation connector structure 120.
[0030] As shown, Figures 1 to 3 The heat dissipation connector structure 120 has a heat dissipation area A1 and a connection area A2. The heat dissipation area A1 and the connection area A2 are divided according to the connection manner of the heat dissipation connector structure 120 and the base 110. When the heat dissipation connector structure 120 is connected to the base 110, the connection area A2 is located in the base 110, and the heat dissipation area A1 is exposed. A portion of the first housing 121 and the second housing 122 is located in the heat dissipation area A1, another portion of the first housing 121 and the second housing 122 is located in the connection area A2, and the connection opening 1211 is located in the connection area A2.
[0031] The material of the portion of the first housing 121 and the second housing 122 located in the heat dissipation area A1 can include a metal having better thermal conductivity, such as aluminum. When the interface device 300 is placed on the heat dissipation connector structure 120, a portion of the interface device 300 is located in the heat dissipation area A1 and is thermally coupled to the heat dissipation connector structure 120 to increase the heat dissipation area of the interface device 300 and improve the heat dissipation efficiency of the interface connector structure 100. The interface connector structure 100 can optionally further include a cooling device 130. The cooling device 130 is arranged in the heat dissipation area A1 of the heat dissipation connector structure 120. When the interface device 300 is arranged on the heat dissipation connector structure 120, the cooling device 130 is thermally coupled to the interface device 300 to improve the heat dissipation efficiency of the interface connector structure 100. The cooling device 130 can be arranged on the first housing 121 and / or the second housing 122. The cooling device 130 includes but is not limited to a heat dissipation fin and a fan. For example, the heat dissipation fin can be integrated with the heat dissipation connector structure 120, and the fan can be externally attached to the heat dissipation connector structure 120 by a fastener, but is not limited thereto.
[0032] As shown, Figure 2 , Figure 5 and Figure 6As shown, the first housing 121 of the heat dissipation connecting structure 120 comprises a first part 1212 and a second part 1213 connected together, and the second housing 122 comprises a third part 1221 and a fourth part 1222. The third part 1221 of the second housing 122 is rotatably connected to one end E1 of the first part 1212 of the first housing 121. The connecting opening 1211 of the heat dissipation connecting structure 120 is located at the second part 1213 of the first housing 121, and the other end E2 of the first part 1212 is connected to the second part 1213 by fasteners. The fourth part 1222 is slidably connected to the third part 1221, and the second part 1213 and the fourth part 1222 are located at the connecting area A2. The materials of the first part 1212 and the third part 1221 of the present embodiment can be metals, such as aluminum, but are not limited thereto. The materials of the second part 1213 and the fourth part 1222 can be plastics, but are not limited thereto.
[0033] The first housing 121 can optionally comprise a plurality of positioning members 1214 and a plurality of guide posts 1215 arranged on the first part 1212. The guide posts 1215 are arranged along the plugging direction d3 to divide the accommodation space P1 into a plurality of accommodation subspaces P2. The interface device 300 can be arranged in the accommodation subspaces P2. The positioning members 1214 can stably position the corresponding interface device 300 arranged in the accommodation subspaces P2 in the heat dissipation connecting structure 120 by any known manner.
[0034] The heat dissipation connecting structure 120 further comprises a connecting member 124, the third part 1221 comprises a first sliding groove 1223, and the fourth part 1222 comprises a second sliding groove 1224 and an auxiliary sliding groove 1225. The first sliding groove 1223, the second sliding groove 1224, and the auxiliary sliding groove 1225 extend along the plugging direction d3. The second sliding groove 1224 is in the shape of a gourd, but is not limited thereto. The connecting member 124 is connected to the third part 1221 and passes through the auxiliary sliding groove 1225, so that the fourth part 1222 is movably connected to the third part 1221 and can be switched between a first position N1( Figure 7 ) and a second position N2( Figure 9 ) along the plugging direction d3. When the fourth part 1222 is located at different positions, different portions of the first sliding groove 1223 and the second sliding groove 1224 form corresponding through holes.
[0035] Figure 7 is a schematic view of the fourth part of Figure 6 at the first position. Figure 8 is a partial enlarged view of the fourth part of Figure 7 . Please refer to Figures 5 to 8In particular, the fourth component 1222 includes an opening 1226 extending along the plugging direction d3 and a limiting member 1227. The limiting member 1227 is connected to an inner side surface S1 of the opening 1226 and includes a groove recessed along the plugging direction d3. The opening 1226 and the groove of the limiting member 1227 jointly form a second sliding slot 1224. A first portion B1 of the second sliding slot 1224 has a width W1 perpendicular to the plugging direction d3 (the second direction d2) greater than a width W2 of a second portion B2 of the second sliding slot 1224 and equal to a width W3 of the opening 1226. The width W2 of the second portion B2 is equal to a width of the groove of the limiting member 1227. The limiting member 1227 has a thickness perpendicular to the plugging direction d3 (i.e., the first direction d1) less than a thickness of the opening 1226, but is not limited thereto.
[0036] The heat dissipation connecting structure 120 further includes a locking member 123 disposed on the first component 1212 of the first housing 121. The locking member 123 includes a head portion 1231 and a neck portion 1232 connected to each other. The head portion 1231 has a width W4 perpendicular to the plugging direction d3 (the second direction d2) greater than a width W5 of the neck portion 1232. When the fourth component 1222 is located at the first position N1, the first sliding slot 1223 and the first portion B1 of the second sliding slot 1224 form a first through hole OP1. The first through hole OP1 has a width W6 (i.e., the width W3 of the first portion B1) greater than or equal to the width W4 of the head portion 1231 of the locking member 123. In this way, the locking member 123 releases the second housing 122, and the second housing 122 can rotate relative to the first housing 121. When the second housing 122 is closed to the first housing 121, the neck portion 1232 of the locking member 123 is disposed in the first through hole OP1 (i.e., the first sliding slot 1223 and the first portion B1 of the second sliding slot 1224), and the head portion 1231 of the locking member 123 is located in the opening 1226 of the second sliding slot 1224. The second component 1213 has a distance D from an end E3 of the second component 1213 away from the rotation axis R to an end E4 of the fourth component 1222 away from the rotation axis R, and the distance D is greater than zero.
[0037] Figure 9 is Figure 7 a schematic view of the fourth component at the second position. Figure 10 is Figure 9A partial enlarged view of the fourth component of the second housing. The fourth component 1222 can be forced to slide relative to the third component 1221 along the plugging direction d3 to a second position N2. When the fourth component 1222 is at the second position N2, the distance between the end E3 of the second component 1213 and the end E4 of the fourth component 1222 is zero. The first sliding groove 1223 and the second portion B2 of the second sliding groove 1224 form a second through hole OP2. The width W7 of the second through hole OP2 (i.e. the width W2 of the second portion B2) is smaller than the width W4 of the head 1231 and greater than or equal to the width W5 of the neck 1232. In this embodiment, the width W7 is greater than the width W4, but is not limited thereto. In this way, the head 1231 of the locking member 123 can limit the movement of the second housing 122 (the limiting member 1227) relative to the first housing 121 in the first direction d1 and the second direction d2, thereby limiting the rotation of the second housing 122 relative to the first housing 121, so that the second housing 122 is stably closed to the first housing 121.
[0038] The heat dissipation connecting structure 120 is connected to the base 110 Figure 1 When the heat dissipation connecting structure 120 is connected to the base 110 Figure 4 The fourth component 1222 can be moved to the second position N2 by the bottom surface 112 of the base 110 during the process of plugging into the base 110. Alternatively, the user can first move the fourth component 1222 to the second position N2, and then plug the heat dissipation connecting structure 120 into the base 110.
[0039] In addition, as shown in Figure 7 and Figure 9 , the fourth component 1222 of the second housing 122 further comprises an operation opening B3 and a recess 1228, and the third component 1221 of the second housing 122 further comprises a protrusion 1229. The user's finger can push the fourth component 1222 through the operation opening B3, and the cooperation of the protrusion 1229 and the recess 1228 can limit the sliding distance of the fourth component 1222 relative to the third component 1221.
[0040] As shown in Figure 3 and Figure 4 , the base 110 further comprises a first positioning hole 115, an auxiliary opening 116 and a second positioning hole 117, and the heat dissipation connecting structure 120 further comprises a first positioning protrusion 125 and a second positioning protrusion 126. The first positioning hole 115 and the auxiliary opening 116 are located on the side surface 113 of the base 110, and the auxiliary opening 116 is a U-shaped opening surrounding the first positioning hole 115. The second positioning hole 117 is located on the bottom surface 112 of the base 110. The first positioning protrusion 125 extends along the second direction d2, and the second positioning protrusion 126 extends along the plugging direction d3. The first positioning protrusion 125 and the second positioning protrusion 126 are located on the second component 1213 of the first housing 121 and correspond to the first positioning hole 115 and the second positioning hole 117, respectively.
[0041] When the heat dissipation connecting structure 120 is connected to the base 110, the first positioning protrusion 125 is located in the first positioning hole 115 and the second positioning protrusion 126 is located in the second positioning hole 117, so that the heat dissipation connecting structure 120 can be more stably connected to the base 110. When the heat dissipation connecting structure 120 is to be detached from the base 110, the portion of the side surface 113 of the base 110 in which the first positioning hole 115 is provided can be slightly deformed through the auxiliary opening 116, so that the first positioning protrusion 125 is separated from the first positioning hole 115, and the heat dissipation connecting structure 120 can be smoothly moved away from the base 110.
[0042] In summary, the heat dissipation connecting structure of the interface connecting structure is used for holding the interface device, and the connecting portion of the interface device is exposed outside the heat dissipation connecting structure. The base of the interface connecting structure is arranged on the circuit board, and the heat dissipation connecting structure can be inserted into the base so that the connecting portion of the interface device is directly and stably connected with the connector of the circuit board.
[0043] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the above embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. An interface connection structure, characterized in that, Suitable for circuit boards having at least one connector, each of the at least one connector having a slot extending along a mating direction perpendicular to the circuit board, the interface connection structure includes: A base, disposed on the circuit board, the base including at least one connector opening, the at least one connector being located within the at least one connector opening; and A heat dissipation connection structure is adapted to be detachably connected to the base along the insertion direction. The heat dissipation connection structure includes a first housing and a second housing. The second housing is movably connected to the first housing and together with the first housing, encloses an accommodating space. The first housing includes at least one connection opening. The accommodating space is adapted to provide at least one interface device, and each of the at least one interface device has a connection portion. When the at least one interface device is disposed in the accommodating space, the connecting portion is exposed from the at least one connecting opening, and the heat dissipation connecting structure is adapted to be connected to the base along the insertion direction, so that the connecting portion is inserted into the slot.
2. The interface connection structure according to claim 1, characterized in that, The first housing includes a first component and a second component connected together. The second housing is movably connected to the first component. The at least one connection opening is located in the second component. When the heat dissipation connection structure is connected to the base, the second component is located inside the base.
3. The interface connection structure according to claim 1, characterized in that, The second housing includes a third component and a fourth component. The third component is rotatably connected to the first housing, and the fourth component is slidably connected to the third component. When the heat dissipation connection structure is connected to the base, the fourth component is located inside the base.
4. The interface connection structure according to claim 3, characterized in that, The heat dissipation connection structure further includes a locking member, the third component includes a first slide groove, the fourth component includes a second slide groove, the locking member is disposed on the first housing and includes a connected head and neck, the width of the head is greater than the width of the neck, and when the second housing is closed on the first housing, the neck passes through the first slide groove and the second slide groove.
5. The interface connection structure according to claim 4, characterized in that, When the fourth component is in the first position, the first slide groove and the second slide groove form a first through hole, the width of the first through hole being greater than or equal to the width of the head. When the fourth component is in the second position, the first slide groove and the second slide groove form a second through hole, the width of the second through hole being less than the width of the head and greater than or equal to the width of the neck.
6. The interface connection structure according to claim 1, characterized in that, The heat dissipation connection structure has a heat dissipation area and a connection area. When the at least one interface device is placed on the heat dissipation connection structure, a portion of the at least one interface device is located in the heat dissipation area and thermally coupled to the heat dissipation connection structure. When the heat dissipation connection structure is connected to the base, the connection area is located inside the base, and the heat dissipation area is exposed.
7. The interface connection structure according to claim 6, characterized in that, The first housing and a portion of the second housing are located in the heat dissipation area, and another portion of the first housing and the second housing are located in the connection area, with the connection opening located in the connection area.
8. The interface connection structure according to claim 1, characterized in that, It also includes a cooling device, which is disposed on the heat dissipation connection structure. When the at least one interface device is disposed on the heat dissipation connection structure, the cooling device is thermally coupled to the at least one interface device.
9. The interface connection structure according to claim 1, characterized in that, The circuit board has at least one connector that is an M.2 connector and at least one interface device that is an M.2 interface card.
10. The interface connection structure according to claim 1, characterized in that, The base includes a plurality of guide ribs extending along the insertion direction. When the heat dissipation connection structure is connected to the base, the plurality of guide ribs contact the heat dissipation connection structure.