AC-DC power supply chip structure

Abstract

The utility model discloses an AC-DC power supply chip structure, and relates to the technical field of power supply chips. Comprising a mainboard provided with an alternating-current voltage reduction module, the top of the mainboard is connected with an installation substrate, one side of the top of the installation substrate is fixedly connected with a check block, the top of the installation substrate is provided with a chip body with the end attached to the check block, the check block is connected with a heat conduction plate pressed on the top of the chip body, and heat dissipation plates are evenly arranged on the top of the heat conduction plate. The mounting substrate comprises a bottom plate, connecting plates and an upper plate, the top of the bottom plate is fixedly connected with the connecting plates arranged at intervals, and the top ends of the connecting plates are connected with the upper plate. According to the AC-DC power supply chip structure, the chip body is arranged on the mounting substrate connected with the mainboard, the chip body is pressed by the heat conduction plate matched with the stop block, and the heat dissipation plates are uniformly arranged at the top of the heat conduction plate, so that the heat dissipation efficiency of the chip body can be improved, and heat dissipation of the chip body is facilitated.

Description

Technical Field

[0001] This utility model relates to the field of power chip technology, specifically to an AC-DC power chip structure. Background Technology

[0002] Power supply chips are responsible for the conversion, distribution, detection, and other power management of electrical energy in electronic equipment systems. They are mainly responsible for identifying the power supply amplitude of the CPU, generating corresponding short-torque waves, and driving the subsequent circuits to output power. AC / DC conversion is the conversion of alternating current to direct current, which is achieved by a chip that integrates multiple electronic components. Among them, the power management chip, which is a common semiconductor chip, plays a control role.

[0003] When power chips are soldered onto a board, they generate a lot of heat during high-speed operation. Currently used power chips are mainly through-hole or surface-mount types. Regardless of the mounting method, the power chip is close to the mounting board. Due to the high frequency of use of the power chip, the heat accumulated on the surface of the power chip cannot be dissipated in time, which leads to damage to the power chip. Utility Model Content

[0004] This invention provides an AC-DC power supply chip structure to solve the problems in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an AC-DC power chip structure, including a motherboard with an AC step-down module, a mounting substrate connected to the top of the motherboard, a stop block fixedly connected to one side of the top of the mounting substrate, a chip body with its end attached to the stop block mounted on the top of the mounting substrate, a heat-conducting plate pressed against the top of the chip body connected to the stop block, and a heat dissipation plate evenly provided on the top of the heat-conducting plate.

[0006] Furthermore, one end of the heat-conducting plate is connected to a heat-conducting end plate, and the heat-conducting end plate and the heat-conducting plate are L-shaped. The heat-conducting end plate is attached to the end of the chip body away from the block.

[0007] Furthermore, the heat sink extends to the heat-conducting end plate.

[0008] Furthermore, the heat sink has a notch.

[0009] Furthermore, the mounting base plate includes a base plate, a connecting plate, and a top plate, with the connecting plates fixedly connected at intervals to the top of the base plate, and the top of the connecting plate connected to the top plate.

[0010] Furthermore, the connecting plate and the upper plate are made of aluminum or copper.

[0011] Furthermore, the top height of the chip body is lower than the top height of the block, and a groove is provided at one bottom end of the heat-conducting plate to accommodate the end of the block.

[0012] Furthermore, the stop block and the mounting base plate are provided with corresponding mounting holes, the heat-conducting plate is provided with threaded holes that mate with the mounting holes, the main board is provided with countersunk holes that mate with the mounting holes, and the main board, the mounting base plate, and the heat-conducting plate are connected by connecting screws that pass through the countersunk holes and the mounting holes and are connected to the threaded holes.

[0013] Compared with the prior art, the present invention provides an AC-DC power chip structure with the following advantages: In this AC-DC power chip structure, the chip body is mounted on a mounting substrate connected to the motherboard, the chip body is pressed by a heat-conducting plate that cooperates with the baffle, and a heat dissipation plate is evenly arranged on the top of the heat-conducting plate, which can improve the heat dissipation efficiency of the chip body and facilitate heat dissipation of the chip body. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the chip body of this utility model;

[0016] Figure 3 This is a schematic diagram of the planar structure of the chip body of this utility model;

[0017] Figure 4 This is a schematic diagram of the structure of the heat-conducting plate of this utility model;

[0018] Figure 5 This is a schematic diagram of the structure of the present invention when the heat dissipation plate on the heat-conducting plate extends to the heat-conducting end plate.

[0019] In the diagram: 1. Mainboard; 2. Mounting substrate; 3. Stop block; 4. Chip body; 5. Heat-conducting plate; 6. Heat sink; 7. Base plate; 8. Connecting plate; 9. Top plate; 10. Heat-conducting end plate; 11. Notch; 12. Groove; 13. Threaded hole; 14. Mounting hole; 15. Countersunk hole; 16. Connecting screw. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-5This utility model discloses an AC-DC power chip structure, including a motherboard 1 with an AC step-down module, a mounting substrate 2 connected to the top of the motherboard 1, a stop block 3 fixedly connected to one side of the top of the mounting substrate 2, a chip body 4 with its end attached to the stop block 3 mounted on the top of the mounting substrate 2, a heat-conducting plate 5 pressed against the top of the chip body 4 connected to the stop block 3, and a heat dissipation plate 6 evenly provided on the top of the heat-conducting plate 5.

[0022] Specifically, one end of the heat-conducting plate 5 is connected to a heat-conducting end plate 10, and the heat-conducting end plate 10 and the heat-conducting plate 5 are in an L-shape. The heat-conducting end plate 10 is attached to the end of the chip body 4 away from the block 3.

[0023] The heat sink 6 extends onto the heat-conducting end plate 10.

[0024] In this embodiment, when the end of the heat sink 6 extends onto the heat-conducting end plate 10, it forms an L-shape. The heat-conducting plate 5, the heat-conducting end plate 10, and the chip body 4 are attached together. In conjunction with the heat sink 6, the heat dissipation of the chip body 4 can be promoted.

[0025] Specifically, the heat sink 6 has a notch 11.

[0026] In this embodiment, the notch 11 on the heat sink 6 reduces the overall weight of the heat sink 6 without reducing its heat dissipation performance.

[0027] Specifically, the mounting base plate 2 includes a base plate 7, a connecting plate 8, and an upper plate 9. The top of the base plate 7 is fixedly connected to the connecting plates 8, which are spaced apart, and the top of the connecting plates 8 is connected to the upper plate 9.

[0028] The connecting plate 8 and the upper plate 9 are made of aluminum or copper.

[0029] In this embodiment, the upper plate 9 contacts the bottom of the chip body 4, so that the heat from the bottom of the chip body 4 can be transferred to the upper plate 9 and dissipated through the connecting plate 8, thereby promoting the heat dissipation of the chip body 4.

[0030] Specifically, the top height of the chip body 4 is lower than the top height of the block 3, and a groove 12 for accommodating the end of the block 3 is provided at one bottom end of the heat-conducting plate 5.

[0031] In this embodiment, since the top height of the chip body 4 is lower than the top height of the block 3, and the bottom of the heat-conducting plate 5 needs to be in contact with the top of the chip body 4, a groove 12 is provided at the end of the heat-conducting plate 5 to avoid the part of the block 3 protruding to the top of the chip body 4, so that the heat-conducting plate 5 can be in contact with the chip body 4.

[0032] The pins on the front and rear sides of the chip body 4 are Z-shaped, allowing them to pass over the mounting substrate 2 and be soldered to the motherboard 1.

[0033] Specifically, the stop block 3 and the mounting base plate 2 are provided with corresponding mounting holes 14, the heat conduction plate 5 is provided with threaded holes 13 that cooperate with the mounting holes 14, the main board 1 is provided with countersunk holes 15 that cooperate with the mounting holes 14, and the main board 1, the mounting base plate 2 and the heat conduction plate 5 are connected by a connecting screw 16 that passes through the countersunk holes 15 and the mounting holes 14 and connects to the threaded holes 13.

[0034] In this embodiment, the head of the connecting screw 16 is located inside the countersunk hole 15, and the connecting screw 16 connects the heat-conducting plate 5, the mounting base plate 2, and the main plate 1 together.

[0035] In summary, in this AC-DC power chip structure, the chip body 4 is mounted on the mounting substrate 2 connected to the motherboard 1. The chip body 4 is pressed down by the heat-conducting plate 5 that cooperates with the block 3. Furthermore, the heat dissipation plate 6 is evenly arranged on the top of the heat-conducting plate 5, which can improve the heat dissipation efficiency of the chip body 4 and facilitate heat dissipation of the chip body 4.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An AC-DC power supply chip structure, comprising a motherboard (1) equipped with an AC step-down module, characterized in that: The motherboard (1) is connected to a mounting base (2) at the top. A stop block (3) is fixedly connected to one side of the top of the mounting base (2). A chip body (4) with its end attached to the stop block (3) is mounted on the top of the mounting base (2). A heat-conducting plate (5) is connected to the stop block (3) and pressed on the top of the chip body (4). A heat dissipation plate (6) is uniformly provided on the top of the heat-conducting plate (5).

2. The AC-DC power supply chip structure according to claim 1, characterized in that: One end of the heat-conducting plate (5) is connected to a heat-conducting end plate (10), and the heat-conducting end plate (10) and the heat-conducting plate (5) are in an L-shape. The heat-conducting end plate (10) is attached to the end of the chip body (4) away from the block (3).

3. The AC-DC power supply chip structure according to claim 1, characterized in that: The heat sink (6) extends onto the heat-conducting end plate (10).

4. The AC-DC power supply chip structure according to claim 2, characterized in that: The heat sink (6) has a notch (11).

5. The AC-DC power supply chip structure according to claim 1, characterized in that: The mounting base plate (2) includes a base plate (7), a connecting plate (8), and an upper plate (9). The top of the base plate (7) is fixedly connected to the connecting plate (8) which is spaced apart, and the top of the connecting plate (8) is connected to the upper plate (9).

6. The AC-DC power supply chip structure according to claim 5, characterized in that: The connecting plate (8) and the upper plate (9) are made of aluminum or copper.

7. The AC-DC power supply chip structure according to claim 1, characterized in that: The top height of the chip body (4) is lower than the top height of the block (3), and a groove (12) for accommodating the end of the block (3) is provided at one bottom end of the heat-conducting plate (5).

8. The AC-DC power supply chip structure according to claim 1, characterized in that: The stop block (3) and the mounting base plate (2) are provided with corresponding mounting holes (14), the heat conduction plate (5) is provided with threaded holes (13) that mate with the mounting holes (14), the main plate (1) is provided with countersunk holes (15) that mate with the mounting holes (14), and the main plate (1), the mounting base plate (2), and the heat conduction plate (5) are connected by connecting screws (16) that pass through the countersunk holes (15), the mounting holes (14) and are connected to the threaded holes (13).

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