Folding screen heat dissipation device and electronic equipment

Abstract

The utility model relates to the technical field of mobile terminals, in particular to a folding screen heat dissipation device and electronic equipment. Comprising a metal connecting piece and a heat dissipation piece. A flexible folding area is arranged in the middle of the metal connecting piece and extends in the length direction of the metal connecting piece. The two heat dissipation pieces are arranged on the two sides of the metal connecting piece in the width direction respectively, each heat dissipation piece comprises a heat dissipation main body and a heat dissipation connecting part, the heat dissipation connecting parts are arranged on the peripheral side of the heat dissipation main body in a surrounding mode and used for being connected with the middle frame, and the heat dissipation main bodies are connected with the metal connecting piece. Through the arrangement of the flexible folding area, the internal stress in the middle of the metal connecting piece during folding can be reduced, and the folding service life of the metal connecting piece is prolonged.

Description

Technical Field

[0001] This disclosure relates to the field of mobile terminal technology, and in particular to a foldable screen heat dissipation device and electronic device. Background Technology

[0002] As foldable phones become increasingly mainstream, consumers are paying more and more attention to their weight. A lightweight and thin foldable phone is more popular among consumers, and achieving a lightweight and thin foldable phone is a key technical challenge for mobile phone manufacturers.

[0003] Currently, the mid-frame shells of foldable phones are made of metal alloys with relatively high thermal conductivity and good strength, ensuring structural reliability while achieving good thermal conductivity. However, metal materials generally have high density, making it impossible to further reduce weight and thickness. This is where high-modulus, low-density non-metallic composite materials come into play. However, high-modulus, low-density non-metallic materials generally have low thermal conductivity, which cannot meet the thermal conductivity requirements. Furthermore, if both non-metallic composite mid-frames and metal thermal conductive components are used simultaneously, the lifespan of the metal thermal conductive components will be reduced. Summary of the Invention

[0004] To address the aforementioned technical problems, this disclosure provides a foldable screen heat dissipation device and an electronic device.

[0005] This disclosure provides a heat dissipation device for a foldable screen, including a metal connector and a heat sink;

[0006] The metal connector has a flexible folding area in the middle, and the flexible folding area extends along the length of the metal connector.

[0007] The two heat sinks are respectively disposed on both sides of the metal connector in the width direction. Each heat sink includes a heat sink body and a heat sink connecting part. The heat sink connecting part surrounds the periphery of the heat sink body and is used to connect with the middle frame. The heat sink body is connected to the metal connector.

[0008] Optionally, the metal connector has semi-etched areas on both sides near the heat sink, and the semi-etched areas extend along the length of the metal connector.

[0009] Optionally, the semi-etched area and the flexible folded area are spaced apart.

[0010] Optionally, a hollow area is formed between the heat dissipation body and the heat dissipation connection part.

[0011] Optionally, the material of the heat dissipation body is graphene, graphite, heat dissipation VC, or thermally conductive phase change material.

[0012] Optionally, the material of the heat dissipation connection is foam adhesive.

[0013] Optionally, the metal connector extends mounting portions on both sides along the width direction, the mounting portions being used to connect with the heat sink.

[0014] Optionally, the flexible folding area includes a plurality of mesh holes formed on the metal connector.

[0015] Optionally, an adhesive area is formed on the semi-etched area, the adhesive area being used for connection with the middle frame.

[0016] This disclosure also provides an electronic device including the foldable screen heat dissipation device described above.

[0017] The technical solution provided in this disclosure has the following advantages compared with the prior art:

[0018] This disclosure provides a foldable screen heat dissipation device, including a metal connector and two heat sinks. The metal connector is connected to the middle of the mid-frame, and two heat sinks are respectively disposed on both sides of the metal connector in the width direction. A flexible folding area is provided in the middle of the metal connector, extending along the length direction of the metal connector. The heat sink includes a heat dissipation body and a heat dissipation connecting part. The heat dissipation body is connected to the metal connector to dissipate heat from the mid-frame, while the heat dissipation connecting part surrounds the heat dissipation body and is used to bond to the mid-frame, thereby connecting the heat dissipation device in this embodiment to the mid-frame. The flexible folding area corresponds to the folding hinge and the folding area of ​​the flexible screen. By setting the flexible folding area, the internal stress in the middle of the metal connector can be reduced during folding, increasing the folding life of the metal connector. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0020] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is an overall structural diagram of the foldable screen heat dissipation device described in the embodiments of this disclosure;

[0022] Figure 2 This is an exploded view of the foldable screen heat dissipation device and mid-frame described in an embodiment of this disclosure;

[0023] Figure 3This is a rear view of the foldable screen heat dissipation device according to an embodiment of this disclosure.

[0024] Among them, 1. Metal connector; 11. Flexible folding area; 12. Semi-etched area; 13. Adhesive area; 2. Heat sink; 21. Heat sink body; 22. Heat sink connection part. Detailed Implementation

[0025] To better understand the above-mentioned objectives, features, and advantages of this disclosure, the solutions disclosed herein will be further described below. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0026] Numerous specific details are set forth in the following description in order to provide a full understanding of this disclosure, but this disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some, and not all, of the embodiments of this disclosure.

[0027] This disclosure provides a foldable screen heat dissipation device, including a metal connector 1 and a heat dissipation component 2;

[0028] A flexible folding area 11 is provided in the middle of the metal connector 1, and the flexible folding area 11 extends along the length direction of the metal connector 1.

[0029] Two heat sinks 2 are respectively disposed on both sides of the metal connector 1 in the width direction. The heat sink 2 includes a heat sink body 21 and a heat sink connection part 22. The heat sink connection part 22 surrounds the periphery of the heat sink body 21 and is used to connect with the middle frame. The heat sink body 21 is connected with the metal connector 1.

[0030] like Figure 1 and Figure 2 As shown, this disclosure provides a foldable screen heat dissipation device, including a metal connector 1 and a heat sink 2. The metal connector 1 is connected to the middle of the frame, and two heat sinks 2 are provided, respectively disposed on both sides of the width direction of the metal connector 1. Specifically, the metal connector 1 has a flexible folding area 11 in its middle, which extends along the length direction of the metal connector 1. Since the middle of the metal connector 1 corresponds to the folding hinge and the folding area of ​​the flexible screen, the middle of the metal connector 1 is prone to internal stress during folding, causing damage to the metal connector 1.

[0031] To extend the lifespan of the metal connector 1, a flexible folding area 11 is provided in this embodiment. In some embodiments, the flexible folding area 11 can be uniformly distributed holes, while in other embodiments, it can be uniformly distributed rectangular grooves. By providing the flexible folding area 11, the internal stress in the middle of the metal connector 1 can be reduced during folding, thereby increasing the folding lifespan of the metal connector 1. Specifically, the heat dissipation component 2 includes a heat dissipation body 21 and a heat dissipation connecting part 22. The heat dissipation body 21 is connected to the metal connector 1 to dissipate heat from the middle frame, while the heat dissipation connecting part 22 surrounds the heat dissipation body 21 and is used to bond with the middle frame, thereby connecting the heat dissipation device in this embodiment to the middle frame.

[0032] In addition, in existing technologies, the folding area of ​​a flexible screen often contains complex components such as hinges. This area is not flat enough, and the flexible screen cannot be effectively supported. The metal connector can provide some support for the folding area of ​​the flexible screen, thereby ensuring the overall flatness.

[0033] Furthermore, the metal connector 1 has semi-etched areas 12 on both sides near the heat sink 2, and the semi-etched areas 12 extend along the length of the metal connector 1. Figure 1 As shown, this embodiment also includes semi-etched areas 12, which are located on both sides of the metal connector 1. The semi-etched areas 12 are regions formed on the metal connector 1 using a semi-etching process. This semi-etching process can rapidly and uniformly etch the metal surface, and the two semi-etched areas 12 are adjacent to the heat sink 21. In the area where the metal connector 1 and the heat sink 2 are close, during folding, there is a sudden, unbuffered transition between the flexible folding area 11 on the metal connector and the heat sink 2, leading to excessive stress in this transition area and potentially damaging the layered structure of the heat sink 2. The semi-etched areas 12 solve this problem. They provide a buffer for the transition area, preventing excessive stress caused by the sudden change. Specifically, the semi-etched areas 12 are regions formed on the metal connector 1 near the heat sink 2 using a semi-etching technique, and these areas extend along the length of the metal connector 1.

[0034] In addition, the semi-etched region 12 and the flexible folded region 11 are spaced apart. For example... Figure 1 As shown, in this embodiment, the semi-etched area 12 and the flexible folding area 11 are arranged alternately. This arrangement can satisfy the performance requirements of the semi-etched area 12 and the flexible folding area 11 respectively, and also improve the strength of the metal connector 1.

[0035] Specifically, for heat sink 2, a hollow area is formed between the heat sink body 21 and the heat sink connecting part 22. In this embodiment, the heat sink body 21 and the heat sink connecting part 22 are integrally formed. The heat sink connecting part 22 is used to adhere to the outer periphery of the middle frame, while the heat sink body 21 is set close to the metal sheet, thereby providing heat dissipation for the motherboard area of ​​the middle frame. Since the motherboard area is a high-heat area, the heat sink body 21 can quickly transfer the heat generated in the motherboard area of ​​the middle frame to the non-heat area, uniformly distributing the heat and achieving a heat dissipation effect.

[0036] Specifically, the material of the heat dissipation body 21 can be graphene, graphite, heat dissipation VC (vapor chamber), or a thermally conductive phase change material. The heat dissipation VC, also known as a vapor chamber, is a vacuum cavity with a finely structured inner wall. All of these materials are highly thermally conductive, allowing heat generated by the middle frame to be rapidly transferred to non-heat-generating areas, thus achieving heat dissipation. Furthermore, the material of the heat dissipation body 21 is not limited to the above-mentioned materials; it can also be other highly thermally conductive materials. Further, such as... Figure 1 and Figure 2 As shown, the heat dissipation body 21 in this embodiment is square in shape, which is a preferred shape to adapt to a certain model. However, the shape of the heat dissipation body 21 is not limited to square, and its shape can be determined according to different heat source distribution sizes.

[0037] Furthermore, the material of the heat dissipation connection part 22 is foam adhesive. In this embodiment, the heat dissipation connection part 22 is a frame structure formed by foam, which allows the heat sink 2 to be bonded to the middle frame shell, and also allows the flexible screen to be bonded. Of course, the material of the heat dissipation connection part 22 is not limited to foam adhesive; other flexible materials can also be used in conjunction with adhesive for bonding.

[0038] Regarding the connection between the metal connector 1 and the heat sink 2, the metal connector 1 extends mounting portions on both sides along its width direction, and these mounting portions are used to connect with the heat sink 2. The metal connector 1 in this embodiment is not limited to the type shown. Figure 1 As shown, the part containing the heat sink 2 also includes a mounting section. The heat sink body 21 in the heat sink 2 can be bonded to the upper or lower surface of the mounting section, thereby completing the connection between the heat sink 2 and the metal connector 1. The specific size and shape of the mounting section need to be determined according to the size and shape of the heat sink 2. Taking a square heat sink 2 as an example, the size and shape of the mounting section can be the same as the size and shape of the square heat sink 2.

[0039] In this embodiment, the flexible folding area 11 includes a plurality of textured holes formed on the metal connector 1. The textured holes can reduce the internal stress of the metal connector during folding, making it more adaptable to various folding conditions and extending its folding life. Moreover, the flexible folding area 11 is not limited to being formed by etching textured holes; it can also be a rectangular groove or a serrated hole, and all of the above shapes can meet the requirements of the flexible folding area 11.

[0040] In addition, such as Figure 3 As shown, an adhesive area is formed on the semi-etched area 12, which is used to connect with the middle frame. The adhesive area is located on the side of the semi-etched area 12 near the middle frame, thereby bonding the metal connector 1 to the middle frame. Moreover, the metal connector 1 is only connected to the middle frame through the semi-etched area 12, and no other adhesive areas are provided to bond it to the middle frame, so that it can be folded freely and unrestricted along with the folding hinge and flexible screen.

[0041] This embodiment also provides an electronic device, including the foldable screen heat dissipation device described above. This heat dissipation device has the same structure and the same effect or function as the heat dissipation device described above. Specific electronic devices may include foldable screen mobile phones, computers, etc.

[0042] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0043] The above description is merely a specific embodiment of this disclosure, enabling those skilled in the art to understand or implement it. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not to be limited to the embodiments described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A foldable screen heat dissipation device, characterized in that, It includes a metal connector (1) and a heat sink (2); The metal connector (1) has a flexible folding area (11) in the middle, and the flexible folding area (11) extends along the length direction of the metal connector (1). Two heat sinks (2) are respectively disposed on both sides of the metal connector (1) in the width direction. Each heat sink (2) includes a heat sink body (21) and a heat sink connection part (22). The heat sink connection part (22) surrounds the periphery of the heat sink body (21) and is used to connect with the middle frame. The heat sink body (21) is connected to the metal connector (1).

2. The foldable screen heat dissipation device according to claim 1, characterized in that, The metal connector (1) has semi-etched areas (12) on both sides near the heat sink (2), and the semi-etched areas (12) extend along the length of the metal connector (1).

3. The foldable screen heat dissipation device according to claim 2, characterized in that, The semi-etched area (12) and the flexible folded area (11) are spaced apart.

4. The foldable screen heat dissipation device according to claim 1, characterized in that, A hollow area (23) is formed between the heat dissipation body (21) and the heat dissipation connection part (22).

5. The foldable screen heat dissipation device according to claim 1, characterized in that, The heat dissipation body (21) is made of graphene, graphite, heat dissipation VC, or thermally conductive phase change material.

6. The foldable screen heat dissipation device according to claim 1, characterized in that, The material of the heat dissipation connection part (22) is foam adhesive.

7. The foldable screen heat dissipation device according to claim 1, characterized in that, The metal connector (1) extends into mounting portions on both sides along the width direction, and the mounting portions are used to connect with the heat sink (2).

8. The foldable screen heat dissipation device according to claim 1, characterized in that, The flexible folding area (11) includes a plurality of mesh holes formed on the metal connector (1).

9. The foldable screen heat dissipation device according to claim 2, characterized in that, An adhesive area (13) is formed on the semi-etched area (12), and the adhesive area (13) is used to connect with the middle frame.

10. An electronic device, characterized in that, Includes the foldable screen heat dissipation device as described in any one of claims 1 to 9.

Images