Lamination normalizing mechanism

Abstract

The utility model discloses a lamination normalizing mechanism, which comprises a bearing part, a first normalizing mechanism and a second normalizing mechanism, and is characterized in that the bearing part is configured to bear to-be-normalized laminations; the first normalizing mechanism comprises a first driving assembly and two first normalizing pieces capable of rotating, the first driving assembly is used for driving the two first normalizing pieces to get close to or away from each other so as to normalize the laminations borne by the bearing piece in the first horizontal direction, and the two first normalizing pieces rotate in the second horizontal direction under the counter-acting force of the laminations; the second normalizing mechanism is used for normalizing the laminations borne by the bearing part in the second horizontal direction. According to the lamination normalizing mechanism, the first normalizing mechanism is provided with the two first normalizing pieces capable of rotating, when the end corners of the inclined silicon wafers abut against the first normalizing pieces, the first normalizing pieces can rotate under pushing of the silicon wafers, counter-acting force borne by the silicon wafers can be decomposed at the same time, the silicon wafers are prevented from vertically colliding with the first normalizing pieces, and the silicon wafers are prevented from being damaged. And the risk of fragmentation of the silicon wafer is greatly reduced.

Description

Technical Field

[0001] This application belongs to the technical field of photovoltaic silicon wafer production equipment, and in particular relates to a wafer stacking and straightening mechanism. Background Technology

[0002] Silicon wafers are the starting point for manufacturing photovoltaic cells. After being sorted and qualified by a sorting machine, the silicon wafers are collected and stacked. In the industry, these stacked silicon wafer groups are called wafer stacks. The wafer stacks are then transported onto a conveyor belt between subsequent process stations. However, the silicon wafers released from the sorting machine are not necessarily neatly stacked, and the wafer stacks can become scattered during transport. To ensure the positional accuracy of the wafer stacks, it is necessary to straighten them on the conveyor belt.

[0003] Existing wafer stacking and straightening mechanisms first lift the wafers from the conveyor line using a lifting assembly, then straightening plates positioned around the lifting assembly push against the four sidewalls of the wafers to align them. To prevent the straightening plates from damaging the wafers, a flexible pad is attached to the pushing surface of the straightening plate to buffer the pushing force on the wafers. However, when there are wafers with a large skew angle in the stack, the skewed wafer corners will directly collide with the flexible pad of the straightening plate, still resulting in wafer corner breakage. In this case, the fragments from the broken wafers will become embedded in the flexible pad. When the stack leaves the straightening mechanism and the mechanism straightens the next set of wafers, the fragments on the flexible pad will collide with the stack, making the next set of wafers prone to breakage. Utility Model Content

[0004] The purpose of this application is to provide a wafer stacking and straightening mechanism to solve the problem that existing wafer stacking and straightening mechanisms are prone to causing silicon wafer breakage.

[0005] To achieve this objective, the following technical solution is adopted in this application:

[0006] This application discloses a lamination straightening mechanism, which includes a carrier, a first straightening mechanism, and a second straightening mechanism, wherein:

[0007] The carrier is configured to carry the stack of wafers to be regularized, which consists of several silicon wafers stacked one on top of the other;

[0008] The first straightening mechanism includes a first drive assembly and two self-rotating first straightening elements. The two first straightening elements are disposed on opposite sides of the carrier in a first horizontal direction. The drive end of the first drive assembly is connected to any one or both first straightening elements. The first drive assembly is configured to drive the two first straightening elements to move closer or further away from each other in a first horizontal direction to straighten the stacked pieces carried by the carrier in the first horizontal direction. The two first straightening elements rotate in a second horizontal direction under the reaction force of the stacked pieces.

[0009] The second straightening mechanism includes a second drive assembly and two second straightening elements. The two second straightening elements are disposed on opposite sides of the carrier in the second horizontal direction. The drive end of the second drive assembly is connected to any one or both second straightening elements. The second drive assembly is configured to drive the two second straightening elements to move closer or further away from each other in the second horizontal direction in order to straighten the stack of sheets carried by the carrier in the second horizontal direction. The first horizontal direction is perpendicular to the second horizontal direction.

[0010] The first alignment mechanism of the wafer stacking alignment mechanism proposed in this application is equipped with two self-rotating first alignment members. When the tip of the skewed silicon wafer comes into contact with the first alignment member, the first alignment member will rotate under the push of the silicon wafer, and the reaction force on the silicon wafer will also be decomposed at the same time, avoiding the silicon wafer from hitting the first alignment member perpendicularly, which greatly reduces the risk of silicon wafer breakage. Even if the silicon wafer breaks in a low probability case and the silicon wafer fragments get stuck in the first alignment member, since the first alignment member has moved forward, the fragments on the first alignment member will not come into contact with the next set of wafers when the first alignment mechanism aligns the next set of wafers. Moreover, by adopting the method of aligning the wafers on the carrier in the second horizontal direction after the first alignment mechanism has completed the alignment, the second alignment member can avoid contact with the tip of the silicon wafer, further reducing the risk of silicon wafer tip breakage.

[0011] Optionally, the first alignment component includes a first mounting base and an alignment belt, wherein:

[0012] The driving end of the first driving component is connected to the first mounting base of any one first alignment component or the first mounting base of two first alignment components.

[0013] Two rollers are vertically mounted on the first mounting base at intervals along the second horizontal direction and can rotate on their own. The straightening belt is fitted onto the two rollers.

[0014] The first drive assembly drives two first mounting seats to move closer to each other so as to straighten the stack of plates carried by the carrier in the first horizontal direction by two straightening belts, and the two straightening belts rotate in the second horizontal direction under the reaction force of the stack of plates.

[0015] By vertically mounting two rollers at intervals on the first mounting base, and fitting the straightening belt onto the two rollers, the straightening belt is rotatably mounted on the first mounting base. The first drive assembly drives the two first mounting bases to move closer to each other, thereby straightening the stacked pieces on the carrier in the first horizontal direction using the two straightening belts. This provides a first straightening component that straightens the stacked pieces using straightening belts, which has the advantages of simple structure, ability to buffer impacts and vibrations, and ease of installation and maintenance.

[0016] Optionally, the first straightening element further includes a limiting block, which is fixedly mounted on the first mounting base and extends along the second horizontal direction. The limiting block is located between the two sides of the straightening belt and is configured to support the inner side of the first side of the straightening belt to limit the degree of indentation of the first side of the straightening belt toward the limiting block. The first side is the belt of the straightening belt on the side closer to the carrier.

[0017] By setting a limiting block, the degree of indentation of the first side of the sizing belt toward the limiting block is limited, thereby improving the sizing effect and sizing accuracy of the sizing belt on the stacked pieces.

[0018] Optionally, the limiting block has several grooves on its side near the first side belt.

[0019] By setting several grooves on the side of the limiting block near the first side of the belt, the contact area between the aligning belt and the side of the limiting block near the first side of the belt can be reduced, thereby reducing the friction between the aligning belt and the limiting block. This is beneficial for the rotation of the aligning belt and prevents the aligning belt from being unable to continue rotating due to excessive friction between the aligning belt and the limiting block.

[0020] Optionally, the length of the first side of the straightening belt is greater than the length of the silicon wafer. When the two straightening belts straighten the stack in the first horizontal direction, the end corner of the skewed silicon wafer in the stack abuts against the first side of the corresponding straightening belt.

[0021] Alternatively, the length of the first side of the straightening belt is less than the length of the silicon wafer. When the two straightening belts straighten the stack in the first horizontal direction, the side of the skewed silicon wafer in the stack abuts against the corresponding straightening belt at the part where it abuts against the two rollers.

[0022] By setting the length of the first side of the straightening belt to be greater than the length of the silicon wafer, the corners of the skewed silicon wafers in the stack during straightening abut against the first side of the corresponding straightening belt, thus ensuring the rotation of the straightening belt and dispersing the reaction force on the silicon wafers. By setting the length of the first side of the straightening belt to be less than the length of the silicon wafer, the sides of the skewed silicon wafers in the stack during straightening abut against the corresponding straightening belt at the point where they are against the two rollers, avoiding direct collision between the corners of the silicon wafers and the straightening belt, further reducing the risk of silicon wafer breakage.

[0023] Optionally, the first straightening component includes a first mounting base and a plurality of straightening wheels, wherein: the driving end of the first driving assembly is connected to the first mounting base of any one of the first straightening components or the first mounting bases of two first straightening components; the plurality of straightening wheels are vertically mounted on the first mounting base at intervals along the second horizontal direction and are rotatable, and the wheel surface of the straightening wheels is covered with a flexible layer; the first driving assembly drives the two first mounting bases to move closer to each other, so as to straighten the stacked pieces carried by the carrier in the first horizontal direction through the plurality of straightening wheels on the two first mounting bases.

[0024] By vertically mounting a plurality of aligning wheels at intervals along the second horizontal direction on the first mounting base and allowing them to rotate, the first driving assembly drives the two first mounting bases to move closer to each other, thereby realizing the alignment of the stacked wafers on the carrier through the plurality of aligning wheels on the two first mounting bases. This provides a first alignment component that uses a plurality of aligning wheels to align the stacked wafers. During alignment, the aligning wheels make line contact with the silicon wafer, reducing the friction between the first alignment component and the silicon wafer. At the same time, the aligning wheels are easy to rotate, which can effectively decompose the reaction force on the silicon wafer. Moreover, the aligning wheels are covered with a flexible layer, which avoids hard contact between the aligning wheels and the silicon wafer, thus protecting the silicon wafer.

[0025] Optionally, the first mounting seats of the two first alignment members can be moved closer to or further away from the carrier in the first horizontal direction. The first drive assembly includes two sets of first drive members, each set of first drive members corresponding to a first mounting seat of a first alignment member. The first drive members are configured to drive the corresponding first mounting seat to move closer to or further away from the carrier in the first horizontal direction.

[0026] By setting two sets of first driving components, each set of first driving components drives the corresponding first mounting seat to move closer to or away from the carrier in the first horizontal direction, so that the corresponding first mounting seat can be independently controlled to move closer to or away from the carrier by the two sets of first driving components, which is flexible and easy to control.

[0027] Optionally, the second alignment component includes a second mounting base and an alignment plate, wherein:

[0028] The driving end of the second drive component is connected to the second mounting base of any one second alignment component or the second mounting base of two second alignment components.

[0029] The leveling plate is installed on the side of the second mounting base near the bearing member, and a flexible pad is installed on the side of the leveling plate near the bearing member.

[0030] The second drive assembly drives two second mounting bases to move closer to each other so as to straighten the stack of plates carried by the carrier in the second horizontal direction through two straightening plates.

[0031] By mounting the straightening plate on the second mounting base, and driving the two second mounting bases closer together, the two straightening plates straighten the stacked wafers carried by the carrier in the second horizontal direction. This provides a second straightening component that straightens the stacked wafers on the carrier using two straightening plates. The component has a simple structure, is easy to implement, and has high straightening accuracy. At the same time, flexible pads are provided on the sides of the straightening plates to avoid hard contact between the straightening plates and the silicon wafers during the straightening of the stacked wafers, thus protecting the silicon wafers.

[0032] Optionally, the leveling plate of at least one of the two leveling components can be floatably mounted on the corresponding second mounting base in the second horizontal direction via a floating component.

[0033] By floating the alignment plate of at least one of the two second alignment members on the second mounting base, the alignment plate makes floating contact with the stack when it performs alignment on the stack, thereby further protecting the stack.

[0034] Optionally, the stacking and straightening mechanism may also include a conveying mechanism and a third drive component, wherein:

[0035] The conveying mechanism has a regularization station on its conveying path. The conveying mechanism includes two conveying lines arranged parallel to each other along the first horizontal direction. The two conveying lines are configured to carry the stacked pieces to be regularized and convey the stacked pieces to be regularized to the regularization station. The two conveying lines are also configured to convey the regularized stacked pieces at the regularization station to the next station.

[0036] The carrier can be raised and lowered below the regular work station. The drive end of the third drive unit is connected to the carrier. The third drive unit is configured to drive the carrier to rise and fall to a high position or a low position.

[0037] The third drive unit drives the carrier to rise to a high position to push the stack of sheets to be straightened on the two conveyor lines away from the conveyor surfaces of the two conveyor lines. The first straightening mechanism and the second straightening mechanism are configured to straighten the stack of sheets to be straightened on the carrier at the high position.

[0038] The third drive unit drives the carrier to descend to a low position so that the neatly stacked pieces on the carrier overlap the conveyor surfaces of the two conveyor lines.

[0039] The conveying mechanism enables the automatic transport of stacked sheets to the straightening station. By setting the conveying mechanism as two parallel conveying lines along the first horizontal direction, it not only avoids the carrier but also has a simple structure, is energy-saving, and is easy to install and maintain. The carrier is driven to a high position by the third drive component, which, together with the first and second straightening mechanisms, enables online straightening of the stacked sheets, resulting in high work efficiency and a reasonable layout. Attached Figure Description

[0040] Figure 1This is a three-dimensional structural schematic diagram of the lamination straightening mechanism provided in the embodiments of this application;

[0041] Figure 2 This is a schematic diagram showing the positional relationship between the first straightening member and the carrier member of the lamination straightening mechanism provided in this application embodiment;

[0042] Figure 3 This is a three-dimensional structural schematic diagram of the first straightening element of the lamination straightening mechanism provided in the embodiments of this application;

[0043] Figure 4 This is a schematic diagram of the installation of the limiting block of the first straightening component of the stacking straightening mechanism provided in the embodiments of this application;

[0044] Figure 5 This is a three-dimensional structural diagram of the second straightening mechanism of the lamination straightening mechanism provided in the embodiments of this application.

[0045] Figures 1 to 5 The following reference numerals are included:

[0046] Supporting component 10: base plate 11, lifting plate 12, first supporting plate 13, second supporting plate 14, guide rail 15, limiting block 16, locking screw 17, clearance groove 18;

[0047] First straightening mechanism 20: First drive assembly 21, first drive component 210, motor 2100, ball screw transmission pair 2101, sliding plate 2102, first straightening component 22, first mounting base 220, straightening belt 221, roller 222, rotating shaft 2220, sleeve 2221, limiting block 223, groove 224;

[0048] Second alignment mechanism 30: Second drive assembly 31, second alignment component 32, second mounting base 320, alignment plate 321, flexible pad 322;

[0049] Stacked pieces 40;

[0050] Third drive component 50. Detailed Implementation

[0051] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0052] Silicon wafers are the starting point for manufacturing photovoltaic cells. After being sorted and tested by a sorting machine, qualified silicon wafers are collected and stacked. In the industry, the collected and stacked silicon wafer groups are called wafer stacks. These stacks are then transported onto a conveyor belt between subsequent process stations. During collection and transport, the wafer stacks may experience positional shifts due to external forces. To ensure the positional accuracy of the wafer stacks, they need to be aligned on the conveyor belt.

[0053] Existing wafer stacking and straightening mechanisms first lift the wafers from the conveyor line using a lifting assembly, then straightening plates positioned around the lifting assembly push against the four sidewalls of the wafers to align them. To prevent the straightening plates from damaging the wafers, a flexible pad is attached to the pushing surface of the straightening plate to buffer the pushing force on the wafers. However, when there are wafers with a large skew angle in the stack, the skewed wafer corners will directly collide with the flexible pad of the straightening plate, still resulting in wafer corner breakage. In this case, the fragments from the broken wafers will become embedded in the flexible pad. When the stack leaves the straightening mechanism and the mechanism straightens the next set of wafers, the fragments on the flexible pad will collide with the stack, making the next set of wafers prone to breakage.

[0054] Therefore, this application provides a stacking and straightening mechanism; please refer to [link to relevant documentation]. Figure 1 As shown, the wafer straightening mechanism provided in this application embodiment includes a carrier 10, a first straightening mechanism 20, and a second straightening mechanism 30. The carrier 10 is configured to carry the wafers 40 to be straightened, and the wafers 40 are formed by stacking several silicon wafers vertically. The first straightening mechanism 20 includes a first driving component 21 and two rotatable first straightening elements 22, which are disposed on the carrier 10 in a first horizontal direction. Figure 1 On either side of the first drive assembly 21 in the X direction, the drive end of the first drive assembly 21 is connected to any one or both first straightening elements 22. The first drive assembly 21 is configured to drive the two first straightening elements 22 to move closer or further apart from each other in the first horizontal direction, so as to straighten the stacked pieces 40 carried by the carrier 10 in the first horizontal direction. Under the reaction force of the stacked pieces 40, the two first straightening elements 22 move along the second horizontal direction (in the X direction). Figure 1 The second straightening mechanism 30 includes a second drive assembly 31 and two second straightening elements 32. The two second straightening elements 32 are disposed on two opposite sides of the carrier 10 in the second horizontal direction. The drive end of the second drive assembly 31 is connected to any one or both second straightening elements 32. The second drive assembly 31 is configured to drive the two second straightening elements 32 to move closer or further away from each other in the second horizontal direction, so as to straighten the stacked pieces 40 carried by the carrier 10 in the second horizontal direction. The first horizontal direction is perpendicular to the second horizontal direction.

[0055] It should be noted that when the stacked pieces 40 on the carrier 10 are straightened, the stacked pieces 40 on the carrier 10 are first straightened in the first horizontal direction by the first straightening mechanism 20, and then the stacked pieces 40 on the carrier 10 are straightened in the second horizontal direction by the second straightening mechanism 30.

[0056] The first straightening mechanism 20 of the wafer stacking and straightening mechanism proposed in this application is provided with two self-rotating first straightening elements 22. When the tip of the skewed silicon wafer comes into contact with the first straightening element 22, the first straightening element 22 will rotate under the push of the silicon wafer, and the reaction force on the silicon wafer will also be decomposed at the same time, avoiding the silicon wafer from hitting the first straightening element 22 perpendicularly, which greatly reduces the risk of silicon wafer breakage. Even if the silicon wafer breaks in a low probability case and the fragments of the silicon wafer get stuck in the first straightening element 22, since the first straightening element 22 has moved forward, when the first straightening mechanism 20 straightens the next set of wafers 40, the fragments on the first straightening element 22 will not come into contact with the next set of wafers. Moreover, by using the method of straightening the wafers 40 on the support member 10 by the second straightening mechanism 30 after the first straightening mechanism 20 has completed the straightening, the second straightening element 32 can avoid contact with the tip of the silicon wafer, further reducing the risk of silicon wafer tip breakage.

[0057] Please see Figures 1 to 4 As shown, in one embodiment, the first straightening component 22 includes a first mounting base 220 and a straightening belt 221. The driving end of the first driving assembly 21 is connected to the first mounting base 220 of any one of the first straightening components 22 or the first mounting base 220 of both first straightening components 22. Two rollers 222 are vertically mounted on the first mounting base 220 at intervals along the second horizontal direction and are rotatable. The straightening belt 221 is fitted onto the two rollers 222. The first driving assembly 21 drives the two first mounting bases 220 to move closer to each other so that the stacked pieces 40 carried by the carrier 10 can be straightened in the first horizontal direction by the two straightening belts 221. The two straightening belts 221 rotate in the second horizontal direction under the reaction force of the stacked pieces 40.

[0058] Specifically, the roller 222 includes a rotating shaft 2220 and a sleeve 2221. The rotating shaft 2220 is vertically mounted on the first mounting base 220, and the sleeve 2221 is rotatably mounted on the rotating shaft 2220 through bearings. The straightening belt 221 is fitted onto the two sleeves 2221 of the two rollers 222.

[0059] As can be seen, by vertically mounting two rollers 222 at intervals on the first mounting base 220, and fitting the straightening belt 221 onto the two rollers 222, the straightening belt 221 is rotatably mounted on the first mounting base 220. The first drive assembly 21 drives the two first mounting bases 220 to move closer to each other, thereby straightening the stacked pieces 40 on the carrier 10 in the first horizontal direction through the two straightening belts 221. This provides a first straightening component 22 that straightens the stacked pieces 40 using the straightening belt 221, which has the advantages of simple structure, ability to buffer impacts and vibrations, and ease of installation and maintenance.

[0060] In one embodiment, the first straightening member 22 further includes a limiting block 223, which is fixedly mounted on the first mounting base 220 and extends along the second horizontal direction. The limiting block 223 is located between the two sides of the straightening belt 221. The limiting block 223 is configured to support the inner side of the first side of the straightening belt 221 to limit the degree of indentation of the first side of the straightening belt 221 toward the limiting block 223. The first side is the side of the straightening belt 221 that is closer to the carrier member 10.

[0061] It can be seen that by setting the limiting block 223, the degree of indentation of the first side of the straightening belt 221 toward the limiting block 223 is limited, thereby improving the straightening effect and straightening accuracy of the straightening belt 221 on the stacked pieces 40.

[0062] In one implementation, the limiting block 223 has several grooves 224 on its side near the first side belt.

[0063] Specifically, several grooves 223 are arranged in parallel at intervals and extend along the second horizontal direction.

[0064] It can be seen that by setting several grooves 224 on the side of the limiting block 223 near the first side belt, the contact area between the sizing belt 221 and the side of the limiting block 223 near the first side belt can be reduced, thereby reducing the friction between the sizing belt 221 and the limiting block 223, which is conducive to the rotation of the sizing belt 221 and avoids the sizing belt 221 from being unable to continue rotating due to excessive friction between the sizing belt 221 and the limiting block 223.

[0065] In one implementation, the length of the first side of the straightening belt 221 is greater than the length of the silicon wafer. When the two straightening belts 221 straighten the stack 40 in the first horizontal direction, the end corner of the skewed silicon wafer in the stack 40 abuts against the first side of the corresponding straightening belt 221.

[0066] As can be seen, by setting the length of the first side of the straightening belt 221 to be greater than the length of the silicon wafer, the end corners of the skewed silicon wafers in the stack 40 during straightening abut against the first side of the corresponding straightening belt 221, thereby ensuring the rotation of the straightening belt 221 to decompose the reaction force on the silicon wafer.

[0067] In one implementation, the length of the first side of the straightening belt 221 is less than the length of the silicon wafer. When the two straightening belts 221 straighten the stack 40 in the first horizontal direction, the side of the skewed silicon wafer in the stack 40 abuts against the corresponding straightening belt 221 at the part that abuts against the two rollers 222.

[0068] As can be seen, by setting the length of the first side of the straightening belt 221 to be less than the length of the silicon wafer, the side of the skewed silicon wafer in the stack 40 during straightening abuts against the corresponding part of the straightening belt 221 that is attached to the two rollers 222, thus avoiding direct collision between the end corners of the silicon wafer and the straightening belt 221, and further reducing the risk of the silicon wafer breaking.

[0069] In one embodiment, the first straightening element 22 includes a first mounting base 220 and a plurality of straightening wheels. The driving end of the first driving component 21 is connected to the first mounting base 220 of any one of the first straightening elements 22 or the first mounting base 220 of both first straightening elements 22. The plurality of straightening wheels are vertically mounted on the first mounting base 220 at intervals along the second horizontal direction and are rotatable. The wheel surface of the straightening wheels is covered with a flexible layer. The first driving component 21 drives the two first mounting bases 220 to move closer to each other so that the plurality of straightening wheels on the two first mounting bases 220 can straighten the stacked pieces 40 carried by the carrier 10 in the first horizontal direction.

[0070] As can be seen, by vertically mounting a number of aligning wheels at intervals along the second horizontal direction on the first mounting base 220 and allowing them to rotate, the first driving assembly 21 drives the two first mounting bases 220 to move closer to each other, thereby realizing the alignment of the stacked wafers 40 on the carrier 10 by the number of aligning wheels on the two first mounting bases 220. This provides a first alignment component 22 that uses a number of aligning wheels to align the stacked wafers 40. The aligning wheels make line contact with the silicon wafer during alignment, reducing the friction between the first alignment component 22 and the silicon wafer. At the same time, the aligning wheels are easy to rotate, which can effectively decompose the reaction force on the silicon wafer. Moreover, the aligning wheels are covered with a flexible layer, which avoids hard contact between the aligning wheels and the silicon wafer, thus protecting the silicon wafer.

[0071] In one implementation, the first mounting bases 220 of the two first alignment members 22 can both move closer to or further away from the carrier member 10 along the first horizontal direction. The first drive assembly 21 includes two sets of first drive members 210, each set of first drive members 210 corresponding to a first mounting base 220 of a first alignment member 22. The first drive members 210 are configured to drive the corresponding first mounting base 220 to move closer to or further away from the carrier member 10 along the first horizontal direction.

[0072] Specifically, the first driving component 210 includes a motor 2100, a ball screw transmission pair 2101, and a sliding plate 2102. The driving end of the motor 2100 is connected to the ball screw of the ball screw transmission pair 2101. The screw nut of the ball screw transmission pair 2101 is fixedly installed on the sliding plate 2102. The first mounting seat 220 is fixedly installed on the sliding plate 2102. The motor 2100 drives the ball screw of the ball screw transmission pair 2101 to rotate along its own axis, thereby driving the sliding plate 2102 to move closer to or away from the carrier 10 in the first horizontal direction through the screw nut. Finally, the first mounting seat 220 is driven to move closer to or away from the carrier 10 in the first horizontal direction.

[0073] As can be seen, by setting two sets of first driving components 210, each set of first driving components 210 drives the corresponding first mounting base 220 to move closer to or away from the carrier 10 along the first horizontal direction, so that the corresponding first mounting base 220 can be independently controlled to move closer to or away from the carrier 10 by the two sets of first driving components 210, which is flexible and easy to control.

[0074] Please see Figure 1 and Figure 5 As shown, in one embodiment, the second alignment member 32 includes a second mounting base 320 and an alignment plate 321. The driving end of the second driving assembly 31 is connected to the second mounting base 320 of any one of the second alignment members 32 or the second mounting base 320 of both second alignment members 32. The alignment plate 321 is installed on the side of the second mounting base 320 near the support member 10, and a flexible pad 322 is installed on the side of the alignment plate 321 near the support member 10. The second driving assembly 31 drives the two second mounting bases 320 to move closer to each other so that the stacked pieces 40 supported by the support member 10 are aligned in the second horizontal direction by the two alignment plates 321.

[0075] Specifically, the second mounting base 320 is mounted on the carrier 10 via a sliding guide pair consisting of a linear guide rail and a slider, which can reciprocate along the second horizontal direction.

[0076] Specifically, the second drive component 31 is a linear module composed of a motor and a ball screw transmission pair.

[0077] As can be seen, by mounting the straightening plate 321 on the second mounting base 320, the second driving assembly 31 drives the two second mounting bases 320 to move closer to each other, and the two straightening plates 321 straighten the stacked wafers 40 carried by the carrier 10 in the second horizontal direction. This provides a second straightening component 32 that straightens the stacked wafers 40 on the carrier 10 using two straightening plates 321. The structure is simple, easy to implement, and has high straightening accuracy. At the same time, a flexible pad 322 is provided on the side of the straightening plate 321 to avoid hard contact between the straightening plate 321 and the silicon wafer when straightening the stacked wafers 40, thus protecting the silicon wafer.

[0078] In one embodiment, the leveling plate 321 of at least one of the two leveling members 32 can be floatingly mounted on the corresponding second mounting base 320 in the second horizontal direction via a floating member 323.

[0079] Specifically, the floating element 323 includes at least one spring installed between the second alignment element 32 and the second mounting base 320, with the first end of the spring abutting against the outer surface of the second alignment element 32 and the second end of the spring abutting against the inner surface of the second mounting base 320.

[0080] It can be seen that by floatingly mounting the straightening plate 321 of at least one of the two second straightening members 32 on the second mounting base 320, the at least one straightening plate 321 is in floating contact with the stacked piece 40 when straightening the stacked piece 40, which further protects the stacked piece 40.

[0081] Please see Figure 1 , Figure 2 and Figure 5 As shown, in one embodiment, the stacking and straightening mechanism further includes a conveying mechanism (not shown) and a third driving member 50. A straightening station is provided on the conveying path of the conveying mechanism. The conveying mechanism includes two conveying lines arranged parallel to each other along a first horizontal direction. The two conveying lines are configured to carry the stacked sheets 40 to be straightened and convey the carried stacked sheets 40 to the straightening station. The two conveying lines are also configured to convey the straightened stacked sheets at the straightening station to the next station. The carrying member 10 is vertically and flexibly arranged below the straightening station. The third driving member 50 is driven... The end-connected carrier 10 is connected to the third drive 50, which is configured to drive the carrier 10 to rise or fall to a high position or a low position. The third drive 50 drives the carrier 10 to rise to a high position to push the stacked pieces 40 to be straightened on the two conveyor lines away from the conveyor surfaces of the two conveyor lines. The first straightening mechanism 20 and the second straightening mechanism 30 are configured to straighten the stacked pieces 40 to be straightened on the carrier 10 at the high position. The third drive 50 drives the carrier 10 to fall to a low position so that the straightened stacked pieces 40 on the carrier 10 overlap the conveyor surfaces of the two conveyor lines.

[0082] Specifically, the carrier 10 includes a substrate 11, a lifting plate 12, a first carrier plate 13, and a second carrier plate 14. The lifting plate 12 is vertically and vertically disposed above the substrate 11. The driving end of the third driving member 50 is connected to the lifting plate 12. The third driving member 50 is configured to drive the lifting plate 12 to move up and down. The first carrier plate 13 and the second carrier plate 14 are spaced apart along the second horizontal direction on the lifting plate 12. The first carrier plate 13 and the second carrier plate 14 are configured to jointly support the stacked sheets 40.

[0083] Specifically, a number of guide components consisting of guide posts and guide sleeves are provided between the lifting plate 12 and the base plate 11.

[0084] Specifically, the first bearing plate 13 and the second bearing plate 14 are installed at adjustable intervals on the lifting plate 12 to accommodate stacked pieces of different specifications; the lifting plate 12 is provided with two guide rails 15 parallel to each other along the first horizontal direction, and two limiting blocks 16 are provided at intervals along the first horizontal direction on both the first bearing plate 13 and the second bearing plate 14. The limiting blocks 16 are provided with limiting grooves for the guide rails 15 to fit through, and each limiting block 16 is provided with a locking screw 17, which is used to lock or loosen the limiting block 16 and the corresponding guide rail 15.

[0085] Specifically, the first bearing plate 13, the second bearing plate 14, the second mounting base 320 and the straightening plate 321 are all provided with clearance grooves 18 for avoiding the conveyor line.

[0086] Specifically, the third drive component 50 is an electric cylinder.

[0087] As can be seen, the conveying mechanism enables the automatic transport of the stacked pieces 40 to the straightening station. By setting the conveying mechanism as two parallel conveying lines along the first horizontal direction, it not only avoids the carrier 10, but also has a simple structure, is energy-saving, and is easy to install and maintain. The carrier 10 is driven to rise to a high position by the third driving component 50, which, together with the first straightening mechanism 20 and the second straightening mechanism 30, enables the online straightening of the stacked pieces 40, resulting in high work efficiency and a reasonable layout.

[0088] The above embodiments merely illustrate the basic principles and characteristics of this application. This application is not limited to the above examples. Various changes and modifications can be made to this application without departing from the spirit and scope thereof, and all such changes and modifications fall within the scope of this application as claimed. The scope of protection of this application is defined by the appended claims and their equivalents.

Claims

1. A stacking and straightening mechanism, characterized in that, The lamination straightening mechanism includes a carrier, a first straightening mechanism, and a second straightening mechanism, wherein: The carrier is configured to carry a stack of wafers to be regularized, the stack being composed of several silicon wafers stacked one on top of the other. The first straightening mechanism includes a first drive assembly and two self-rotating first straightening elements. The two first straightening elements are disposed on two opposite sides of the carrier in a first horizontal direction. The drive end of the first drive assembly is connected to any one or both first straightening elements. The first drive assembly is configured to drive the two first straightening elements to move closer or further away from each other in the first horizontal direction to straighten the stack of sheets carried by the carrier in the first horizontal direction. The two first straightening elements rotate in a second horizontal direction under the reaction force of the stack of sheets. The second straightening mechanism includes a second drive assembly and two second straightening elements. The two second straightening elements are disposed on two opposite sides of the carrier in the second horizontal direction. The drive end of the second drive assembly is connected to either one or both of the second straightening elements. The second drive assembly is configured to drive the two second straightening elements to move closer or further away from each other along the second horizontal direction to straighten the stack of sheets carried by the carrier in the second horizontal direction. The first horizontal direction is perpendicular to the second horizontal direction.

2. The stacking and straightening mechanism according to claim 1, characterized in that, The first alignment component includes a first mounting base and an alignment belt, wherein: The driving end of the first driving component is connected to the first mounting base of any one of the first straighteners or the first mounting bases of both of the first straighteners. Two rollers are vertically mounted on the first mounting base at intervals along the second horizontal direction and are rotatable, and the straightening belt is fitted onto the two rollers; The first drive assembly drives the two first mounting seats to move closer to each other so as to straighten the stack of pieces carried by the carrier in the first horizontal direction by the two straightening belts, and the two straightening belts rotate in the second horizontal direction under the reaction force of the stack.

3. The stacking and straightening mechanism according to claim 2, characterized in that, The first straightening component further includes a limiting block, which is fixedly mounted on the first mounting base and extends along the second horizontal direction. The limiting block is located between the two sides of the straightening belt and is configured to support the inner side of the first side of the straightening belt to limit the degree of indentation of the first side of the straightening belt toward the limiting block. The first side is the side of the straightening belt closer to the carrier.

4. The stacking and straightening mechanism according to claim 3, characterized in that, The limiting block has several grooves on its side near the first side belt.

5. The stacking and straightening mechanism according to claim 3, characterized in that, The length of the first side of the straightening belt is greater than the length of the silicon wafer. When the two straightening belts straighten the stacked wafers in the first horizontal direction, the end corner of the skewed silicon wafer in the stack abuts against the first side of the corresponding straightening belt. Alternatively, the length of the first side of the straightening belt is less than the length of the silicon wafer. When the two straightening belts straighten the stack of wafers in the first horizontal direction, the side of the skewed silicon wafer in the stack abuts against the corresponding part of the straightening belt that abuts against the two rollers.

6. The stacking and straightening mechanism according to claim 1, characterized in that, The first alignment component includes a first mounting base and a plurality of alignment wheels, wherein: The driving end of the first driving component is connected to the first mounting base of any one of the first straighteners or the first mounting bases of both of the first straighteners. The plurality of regularized wheels are vertically mounted on the first mounting base at intervals along the second horizontal direction and are rotatable, and the wheel surface of the regularized wheels is covered with a flexible layer; The first drive assembly drives the two first mounting seats to move closer to each other, so as to straighten the stack of pieces carried by the carrier in the first horizontal direction by a plurality of straightening wheels on the two first mounting seats.

7. The stacking and straightening mechanism according to claim 2 or 6, characterized in that, Both first mounting bases of the first alignment members can move closer to or further away from the carrier in the first horizontal direction. The first drive assembly includes two sets of first drive members, each set of first drive members corresponding to a first mounting base of the first alignment member. The first drive members are configured to drive the corresponding first mounting base to move closer to or further away from the carrier in the first horizontal direction.

8. The stacking and straightening mechanism according to claim 1, characterized in that, The second alignment component includes a second mounting base and an alignment plate, wherein: The drive end of the second drive component is connected to the second mounting base of any one of the second alignment components or the second mounting bases of both second alignment components; The leveling plate is installed on the side of the second mounting base near the support member, and a flexible pad is installed on the side of the leveling plate near the support member; The second drive assembly drives the two second mounting bases to move closer to each other so as to straighten the stack of sheets carried by the carrier in the second horizontal direction by means of the two straightening plates.

9. The stacking and straightening mechanism according to claim 8, characterized in that, The leveling plate of at least one of the two second leveling components can be floatably mounted on the corresponding second mounting base along the second horizontal direction via a floating component.

10. The stacking and straightening mechanism according to claim 1, characterized in that, The stacking and straightening mechanism further includes a conveying mechanism and a third driving component, wherein: The conveying mechanism has a regularization station on its conveying path. The conveying mechanism includes two conveying lines arranged parallel to each other along the first horizontal direction. The two conveying lines are configured to carry the stacked pieces to be regularized and convey the stacked pieces to be regularized to the regularization station. The two conveying lines are also configured to convey the regularized stacked pieces at the regularization station to the next station. The carrier can be vertically and vertically disposed below the regularized work station, and the driving end of the third driving member is connected to the carrier. The third driving member is configured to drive the carrier to rise or fall to a high position or a low position. The third driving member drives the carrier to rise to the high position, so as to push the stack of pieces to be straightened carried on the two conveyor lines away from the conveyor surfaces of the two conveyor lines. The first straightening mechanism and the second straightening mechanism are configured to straighten the stack of pieces to be straightened on the carrier at the high position. The third driving member drives the carrier to descend to the low position, so that the neatly arranged stacked pieces on the carrier overlap the conveying surfaces of the two conveying lines.

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