Transmission device

Abstract

The utility model provides a transmission device, which comprises a carrier plate provided with a plurality of silicon wafer placing positions; the adsorption positioning assembly is provided with a vacuum generation part and a plurality of adsorption units, the adsorption units are respectively communicated with the vacuum generation part, and each adsorption unit adsorbs the silicon wafer in one silicon wafer placing position; and the conveying part is used for conveying the carrier plate and the adsorption positioning assembly along the first direction X. The conveying device provided by the utility model improves the stability of high-speed silicon wafer conveying.

Description

TECHNICAL FIELD

[0001] The utility model belongs to photovoltaic manufacturing equipment technical field, more specifically, it relates to a kind of conveying device. BACKGROUND

[0002] With the rapid development of photovoltaic manufacturing industry, the market requirement for its automation equipment is also improved, and it is required to continuously improve equipment capacity and product yield to meet market demand.The function of plate type PECVD (plasma enhanced chemical vapor deposition) automatic transfer equipment is to realize the butt joint of plate type PECVD unloader and plate type PECVD loader.

[0003] The transmission mechanism of traditional plate type PECVD automatic transfer equipment is to transmit the carrier plate by roller for a long distance, and the cylinder and guide wheel are used to position the carrier plate at both ends of the taking piece position, and the silicon wafer is loaded and unloaded, the carrier plate is lifted by screw rod lifting mechanism, and the cycle of the carrier plate is completed from the lower reflow.

[0004] However, when using the traditional equipment to transmit the silicon wafer at high speed, the posture and position of the silicon wafer are easily changed, which affects the stability of the silicon wafer transmission. INVENTION CONTENTS

[0005] The utility model aims at providing a kind of conveying device, which can improve the stability of silicon wafer transmission.

[0006] To achieve the above purpose, the technical scheme adopted by the utility model is:

[0007] Provided is a kind of conveying device, characterized by comprising:

[0008] Carrier plate, with a plurality of silicon wafer placing positions;

[0009] Suction positioning assembly, with vacuum generating component and a plurality of suction units, a plurality of suction units are respectively communicated with the vacuum generating component, and each suction unit adsorbs a silicon wafer in the silicon wafer placing position;

[0010] Conveying component for conveying the carrier plate and the suction positioning assembly along the first direction X.

[0011] Further, the carrier plate is provided with a plurality of clamping positioning components, each clamping positioning component includes a plurality of clamping pieces, and a plurality of clamping pieces clamp a silicon wafer in a silicon wafer placing position.

[0012] Further, at least part of the clamping pieces in each clamping positioning component has a guide upper inclined surface, a vertical plane and a supporting lower inclined surface, and the guide upper inclined surface and the supporting lower inclined surface are located on the upper and lower sides of the vertical plane respectively.

[0013] Further, any two adjacent clamping positioning components share at least one clamping piece.

[0014] Further, the support assembly comprises a horizontal support plate and a plurality of vertical support plates, the horizontal support plate is arranged on the conveying component, the vertical support plates are arranged on the horizontal support plate and support the carrier plate together, and the adsorption positioning assembly is arranged on the horizontal support plate.

[0015] Further, the plurality of adsorption units are divided into groups along a second direction Y, the second direction Y is orthogonal to the first direction X in a horizontal plane, and each group of adsorption units is fixedly connected to the horizontal support plate through a mounting bracket.

[0016] Further, the vacuum generating component comprises a plurality of vacuum generators, and the plurality of vacuum generators are arranged on different sides of the horizontal support plate, respectively, and each group of adsorption units is connected to one vacuum generator.

[0017] Further, a pressure regulating valve is arranged on a connecting pipeline between each group of adsorption units and one vacuum generator.

[0018] Further, each adsorption unit has two vacuum suction cups.

[0019] Further, the conveying component is a linear motor module, the linear motor module has a slider that can move along the first direction X, and the carrier plate and the adsorption positioning assembly are arranged on the slider, respectively.

[0020] Compared with the prior art, the transmission device has the following beneficial effects:

[0021] 1. The adsorption positioning assembly is arranged on the transmission device, each adsorption unit in the adsorption positioning assembly adsorbs and fixes each silicon wafer, and the stability of high-speed transmission of the silicon wafer is improved.

[0022] 2. The clamping positioning components corresponding to the silicon wafer placing positions are arranged on the carrier plate, the movement of the silicon wafer is limited by the clamping positioning components, the positioning accuracy of the silicon wafer in the silicon wafer placing position is improved, and the stability of high-speed transmission of the silicon wafer is better improved.

[0023] 3. The carrier plate reciprocally moves under the drive of the linear motor module to realize the conveying of the silicon wafer, the linear motor module has higher transmission speed, and the production capacity is improved. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or prior art description will be briefly introduced as follows. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained based on these drawings without any creative labor.

[0025] Figure 1 A perspective structural schematic view of the transmission device provided by the preferred embodiment of the present application is shown in the figure.

[0026] Figure 2 A side view structural schematic view of the transmission device after removing the transfer cover component provided by the preferred embodiment of the present application is shown in the figure.

[0027] Figure 3 A partial perspective structural schematic view of the transmission device provided by the preferred embodiment of the present application is shown in the figure.

[0028] Figure 4 A Figure 3 magnified view of position A in the figure.

[0029] Figure 5 A Figure 3 magnified view of position B in the figure.

[0030] Figure 6 A partial side view structural schematic view of the transmission device provided by the preferred embodiment of the present application is shown in the figure. Figure 1 ;

[0031] Figure 7 A side view structural schematic view of the transmission device provided by the preferred embodiment of the present application is shown in the figure. Figure 2 ;

[0032] In the figure, the main marks of the drawings are as follows:

[0033] 1, carrier plate; 121, clamping piece; 1211, guide upper inclined surface; 1212, vertical plane; 1213, support lower inclined surface;

[0034] 2, conveying component;

[0035] 31, vacuum generating component; 311, vacuum generator; 32, adsorption unit; 321, vacuum chuck; 33, mounting bracket; 34, pressure regulating valve;

[0036] 4, silicon wafer;

[0037] 51, horizontal support plate; 52, vertical support plate;

[0038] 6, transfer cover component. DETAILED DESCRIPTION

[0039] In order to make the technical problems, technical schemes and beneficial effects of the utility model clearer and more apparent, the utility model will be further described in detail below in combination with the drawings and examples.

[0040] With the rapid development of photovoltaic manufacturing industry, the market requirements for its automation equipment are also improved, and it is required to continuously improve the equipment capacity and product yield to meet the market demand. The function of the plate type PECVD automatic transfer equipment is to realize the butt joint of the plate type PECVD unloader and the plate type PECVD loader. The transmission mechanism of the traditional plate type PECVD automatic transfer equipment transmits the carrier plate through the roller for a long distance, and the carrier plate is positioned by the cylinder and the guide wheel at the two end piece taking positions, and the silicon wafer is loaded and unloaded, the carrier plate is lifted by the screw rod lifting mechanism, and the circulation of the carrier plate is completed from the lower reflow. The traditional equipment needs the transmission mechanism and the cylinder positioning, the lifting mechanism cooperation, at least the following disadvantages exist: 1) when the silicon wafer is transmitted at high speed, the posture and position change are easily caused, and the stability of the silicon wafer transmission is reduced; 2) due to the long transmission distance, the transmission mechanism is divided into multiple sections, and it is difficult to speed up, and it cannot meet the higher capacity demand. If the transmission speed is too fast, the carrier plate and the guide wheel are easily collided frequently, and the silicon wafer is damaged. 3) due to the heavy carrier plate, the carrier plate blocks the cylinder and the side pushing cylinder at the piece taking position, and the accurate positioning of the silicon wafer cannot be guaranteed. 4) the roller transmission causes the carrier plate to rub with the roller and the rubber ring for a long time, dust is generated, and the carrier plate and the rubber ring are slidably rubbed when the side pushing cylinder is positioned, dust is generated, the silicon wafer is polluted, the yield is affected, and the service life of the rubber ring is seriously reduced.

[0041] In order to solve the above series of problems, the utility model provides a new transmission device, which not only improves the stability of the silicon wafer transmission, but also improves the positioning accuracy of the silicon wafer in the transfer position, and meets the higher capacity demand.

[0042] Please see Figures 1 to 7 The transmission device provided by the preferred embodiment of the utility model comprises:

[0043] The carrier plate 1 has a plurality of silicon wafer placing positions;

[0044] The adsorption positioning assembly has a vacuum generating component 31 and a plurality of adsorption units 32, the plurality of adsorption units 32 are respectively communicated with the vacuum generating component 31, and each adsorption unit 32 adsorbs a silicon wafer 4 in each silicon wafer placing position;

[0045] The transmission component 2 is used for conveying the carrier plate 1 and the adsorption positioning assembly along the first direction X.

[0046] Through the transmission device provided with the adsorption positioning assembly, each silicon wafer 4 is adsorbed and fixed by each adsorption unit 32 in the adsorption positioning assembly, and the stability of the high-speed transmission of the silicon wafer 4 is improved.

[0047] Please see Figure 2 , Figure 6 , Figure 7 In a preferred embodiment, the transmission device further includes a support assembly; the support assembly includes a horizontal support plate 51 and a plurality of vertical support plates 52, the horizontal support plate 51 is disposed on the transmission component 2, and the plurality of vertical support plates 52 are respectively erected on the horizontal support plate 51 and jointly support the carrier plate 1; the adsorption positioning assembly is disposed on the horizontal support plate 51.

[0048] The transmission device is equipped with a support component, which not only supports and fixes the carrier plate 1 and the adsorption positioning component, but also connects the carrier plate 1 and the adsorption positioning component to the transmission component 2 respectively. The overall structure is more simplified and compact, ensuring that the adsorption positioning component moves synchronously while the transmission component 2 transmits the carrier plate 1. Each silicon wafer 4 is adsorbed and fixed by each adsorption unit 32 in the adsorption positioning component, thereby improving the stability of high-speed transmission of silicon wafer 4.

[0049] It should be understood that this utility model will mention a first direction X and a second direction Y, wherein the first direction X is the conveying direction of the conveying component 2, and the second direction Y is orthogonal to the first direction X on the horizontal plane.

[0050] It should also be understood that the present invention does not limit the specific number and arrangement of the silicon wafer placement positions on the carrier plate 1, and can be flexibly adjusted according to the specific structure of the handling robot and the flower basket, etc. In addition, the silicon wafer placement positions on the carrier plate 1 can be receiving grooves, or receiving spaces formed by multiple snap-fit ​​pieces 121, or receiving spaces formed by the receiving grooves and multiple snap-fit ​​pieces 121.

[0051] Please see Figure 3 , Figure 4 , Figure 5 In a preferred embodiment, the carrier 1 has multiple silicon wafer placement positions, and each silicon wafer placement position contains one silicon wafer 4. All the silicon wafer placement positions of the carrier 1 are divided into multiple groups along the second direction Y, and each group of silicon wafer placement positions consists of two rows of silicon wafer placement positions, with each row of silicon wafer placement positions containing 12 silicon wafer placement positions.

[0052] It should be understood that the adsorption units 32 of the adsorption positioning assembly correspond one-to-one with the silicon wafer placement positions on the carrier plate 1. Please refer to... Figure 6 , Figure 7All adsorption units 32 of the adsorption positioning assembly are divided into multiple groups along the second direction Y. Each group of adsorption units 32 is fixedly connected to the transverse support plate 51 by a mounting bracket 33. Each group of adsorption units 32 consists of two rows of adsorption units 32, and each row of adsorption units 32 has 12 adsorption units 32. Each adsorption unit 32 has at least one vacuum chuck 321. The adsorption end of the vacuum chuck 321 passes through the carrier plate 1 from bottom to top and extends into the silicon wafer placement position. All the vacuum chucks 321 in each adsorption unit 32 jointly adsorb and fix one silicon wafer 4.

[0053] It should also be understood that the specific structure of the vacuum generating component 31 can be reasonably set according to the arrangement of all adsorption units 32 in the adsorption positioning assembly. For example, based on the above, the adsorption positioning assembly includes multiple sets of adsorption units 32 along the second direction Y, and the vacuum generating component 31 includes multiple vacuum generators 311, which are respectively arranged on different sides of the transverse support plate 51. Each set of adsorption units 32 is connected to one vacuum generator 311. At the same time, a pressure regulating valve 34 is provided on the connecting pipe between each set of adsorption units 32 and one vacuum generator 311.

[0054] By configuring a corresponding vacuum generator 311 and pressure regulating valve 34 for each adsorption unit 32, the adsorption force of each adsorption unit 32 can be controlled independently, and the adsorption capacity of each adsorption unit 32 can be better met.

[0055] In a preferred embodiment, such as Figure 3 , Figure 4 As shown, the carrier board 1 is provided with multiple snap-fit ​​positioning components. Each snap-fit ​​positioning component includes multiple snap-fit ​​pieces 121, and the multiple snap-fit ​​pieces 121 together snap-fit ​​a silicon wafer 4 in a silicon wafer placement position.

[0056] The carrier plate 1 is equipped with snap-fit ​​positioning components that correspond one-to-one with the silicon wafer placement positions. The snap-fit ​​positioning components restrict the movement of the silicon wafer 4, thereby improving the positioning accuracy of the silicon wafer 4 at the silicon wafer placement positions.

[0057] like Figure 4 , Figure 5 As shown, each snap-fit ​​positioning component includes at least one snap-fit ​​element 121, which has a guiding upper inclined surface 1211, a vertical plane 1212, and a supporting lower inclined surface 1213. The guiding upper inclined surface 1211 and the supporting lower inclined surface 1213 are located on the upper and lower sides of the vertical plane 1212, respectively. The angle between the guiding upper inclined surface 1211 and the supporting lower inclined surface 1213 is greater than 90 degrees.

[0058] The snap-fit ​​component 121 has an upper guiding slope 1211, a vertical plane 1212, and a lower supporting slope 1213. The upper guiding slope 1211 can guide the silicon wafer 4 to be aligned, ensuring that the silicon wafer 4 falls smoothly into the silicon wafer placement position along the vertical plane 1212. The lower supporting slope 1213 can contact the edge of the silicon wafer 4, thereby reducing the contact area between the silicon wafer 4 and the wafer while supporting it, thus reducing contamination of the silicon wafer 4 and reducing the defect rate.

[0059] To accommodate the small gap requirement between two adjacent silicon wafer placement positions and reduce costs, at least one snap-fit ​​component 121 can be shared by any two adjacent snap-fit ​​positioning components.

[0060] like Figure 3 , Figure 4 As shown, each snap-fit ​​positioning component includes eight snap-fit ​​pieces 121. The silicon wafer 4 is rectangular, and each side of the silicon wafer 4 abuts against two snap-fit ​​pieces 121. Taking every two rows of silicon wafers 4 as an example, two adjacent snap-fit ​​positioning components along the first direction X share two snap-fit ​​pieces 121, and two adjacent snap-fit ​​positioning components along the second direction Y also share two snap-fit ​​pieces 121.

[0061] In a preferred embodiment, such as Figure 1 As shown, the conveying component 2 is a linear motor module, which includes a linear motor, a guide rail, and a slider. The linear motor drives the slider to move linearly along the guide rail. The length direction of the guide rail is the conveying direction, which is also the first direction X. Furthermore, the carrier plate 1 and the adsorption positioning component are respectively mounted on the slider. When the linear motor drives the slider to move, it drives the carrier plate 1 and the adsorption positioning component to move synchronously, thereby achieving high-speed transmission of the carrier plate 1 while ensuring the stability of the carrier plate 1 during high-speed transmission.

[0062] The silicon wafer 4 is precisely transferred to the wafer picking position of the subsequent loading equipment by high-speed conveying of the carrier plate 1 via a linear motor module, completing the transfer process from silicon wafer 4 to the subsequent equipment. Compared with traditional equipment that uses rollers to transport the carrier plate 1 over long distances, the linear motor module has higher transmission speed and positioning accuracy.

[0063] In a preferred embodiment, such as Figure 1 , Figure 4 As shown, the transmission device also includes a transfer cover component 6, which covers the outside of the transmission component 2 to protect the internal transmission component 2, adsorption positioning assembly, carrier plate 1 and silicon wafer 4.

[0064] For ease of understanding, the overall structure of the transmission device provided in the preferred embodiment will be described in detail below with reference to the accompanying drawings:

[0065] Please see Figure 1The preferred embodiment of the transmission device includes a transfer cover component 6, a carrier plate 1 wrapped by the transfer cover component 6, a transmission component 2, an adsorption positioning component, and a support component.

[0066] The conveying component 2 uses a linear motor module, which has a slider that can move in a straight line.

[0067] like Figure 3 , Figure 4 As shown, the carrier 1 has multiple silicon wafer placement positions, and each silicon wafer placement position contains one silicon wafer 4. All the silicon wafer placement positions of the carrier 1 can be divided into three groups of silicon wafer placement positions along the second direction Y, and each group of silicon wafer placement positions consists of 2×12 silicon wafer placement positions.

[0068] like Figure 3 , Figure 4 , Figure 5 As shown, the carrier board 1 also has multiple snap-fit ​​positioning components. Each snap-fit ​​positioning component consists of eight snap-fit ​​pieces 121 surrounding a silicon wafer placement position, that is, each silicon wafer 4 is snapped and positioned by eight snap-fit ​​pieces 121. Each snap-fit ​​piece 121 has a guiding upper inclined surface 1211, a vertical plane 1212, and a supporting lower inclined surface 1213 connected in sequence on both sides.

[0069] like Figure 1 , Figure 6 , Figure 7 As shown, the support assembly includes a horizontal support plate 51 and multiple vertical support plates 52. The horizontal support plate 51 is fixedly connected to the slider of the conveying component 2, and the multiple vertical support plates 52 stand upright on the horizontal support plate 51 and jointly support the carrier plate 1.

[0070] like Figure 1 , Figure 6 , Figure 7 As shown, the adsorption positioning assembly includes a vacuum generating component 31 and multiple adsorption units 32. The vacuum generating component 31 includes three vacuum generators 311, which are respectively disposed on the three sides of the transverse support plate 51. All adsorption units 32 of the adsorption positioning assembly can be divided into three groups of adsorption units 32 along the second direction Y. Each group of adsorption units 32 is fixedly connected to the transverse support plate 51 by a mounting bracket 33. Each group of adsorption units 32 consists of 2×12 adsorption units 32, and each adsorption unit 32 has two vacuum suction cups 321 for adsorbing a silicon wafer 4. At the same time, each group of adsorption units 32 is connected to a vacuum generator 311 through a connecting pipe, and a pressure regulating valve 34 is provided on the connecting pipe.

[0071] Compared with the prior art, the transmission device provided by this utility model has the following beneficial effects:

[0072] 1. The transmission device is equipped with an adsorption positioning component, which uses each adsorption unit in the adsorption positioning component to adsorb and fix each silicon wafer, thereby improving the stability of the silicon wafer during high-speed transmission.

[0073] 2. The carrier board is equipped with snap-fit ​​positioning components that correspond one-to-one with the silicon wafer placement positions. These snap-fit ​​positioning components restrict the movement of the silicon wafers, improve the positioning accuracy of the silicon wafers in their placement positions, and better enhance the stability of high-speed silicon wafer transmission.

[0074] 3. The carrier board moves reciprocally under the drive of the linear motor module to transport the silicon wafers. The use of the linear motor module has a higher transmission speed and improves production capacity.

[0075] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A transmission device, characterized in that, include: Carrier board with multiple silicon wafer placement positions; An adsorption positioning component has a vacuum generating component and multiple adsorption units, wherein the multiple adsorption units are respectively connected to the vacuum generating component, and each adsorption unit adsorbs a silicon wafer in the silicon wafer placement position. A conveying component for conveying the carrier plate and the adsorption positioning assembly along a first direction X.

2. The transmission device as described in claim 1, characterized in that, The carrier board is provided with multiple snap-fit ​​positioning components, each of which includes multiple snap-fit ​​pieces, and the multiple snap-fit ​​pieces together snap a silicon wafer in one of the silicon wafer placement positions.

3. The transmission device as described in claim 2, characterized in that, At least some of the snap-fit ​​components in each of the snap-fit ​​positioning components have a guiding upper inclined surface, a vertical plane, and a supporting lower inclined surface, wherein the guiding upper inclined surface and the supporting lower inclined surface are located on the upper and lower sides of the vertical plane, respectively.

4. The transmission device as described in claim 2, characterized in that, Any two adjacent snap-fit ​​positioning components share at least one snap-fit ​​component.

5. The transmission device as claimed in claim 1, characterized in that, It also includes a support assembly, which includes a horizontal support plate and multiple vertical support plates. The horizontal support plate is disposed on the conveying component, and the multiple vertical support plates are respectively erected on the horizontal support plate and jointly support the carrier plate. The adsorption positioning assembly is disposed on the horizontal support plate.

6. The transmission device as described in claim 5, characterized in that, The adsorption units are divided into multiple groups along the second direction Y, which is orthogonal to the first direction X on the horizontal plane. Each group of adsorption units is fixedly connected to the transverse support plate by a mounting bracket.

7. The transmission device as described in claim 6, characterized in that, The vacuum generating component includes multiple vacuum generators, which are respectively arranged on different sides of the transverse support plate. Each group of adsorption units is connected to one of the vacuum generators.

8. The transmission device as claimed in claim 7, characterized in that, A pressure regulating valve is provided on the connecting pipeline between each adsorption unit and one of the vacuum generators.

9. The transmission device as claimed in claim 1, characterized in that, Each of the adsorption units has two vacuum suction cups.

10. The transmission device as claimed in claim 1, characterized in that, The conveying component is a linear motor module, which has a slider that can move along the first direction X. The carrier plate and the adsorption positioning component are respectively disposed on the slider.

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