Silicon wafer guide device and silicon wafer production line

Abstract

The utility model relates to a silicon wafer guide device and a silicon wafer production line. The silicon wafer guide device comprises a base and a guide assembly. The at least one guide assembly is arranged on the base, the guide assembly comprises a guide block and a wear-resistant part arranged on the guide block, and the wear-resistant part is used for abutting against the side edge of the silicon wafer and is in linear contact with the side edge of the silicon wafer. In the use process, the wear-resistant part of the guide assembly abuts against the side edge of the silicon wafer and is in linear contact with the side edge of the silicon wafer, so that the stress area can be increased, the pressure applied to the wear-resistant part by the silicon wafer is reduced, the loss generated by the wear-resistant part in the process of guiding the silicon wafer by the guide assembly can be reduced, the yield of the silicon wafer is improved, and meanwhile, the service life can be prolonged; and the maintenance and replacement frequency of the silicon wafer guide device is reduced.

Description

Technical Field

[0001] This application relates to the field of photovoltaic technology, and in particular to a silicon wafer alignment device and a silicon wafer production line. Background Technology

[0002] With the rapid development of photovoltaic technology, automated equipment is becoming increasingly common in the manufacturing process of solar cells. As silicon wafers travel along the conveyor line, they are prone to shifting to either side of the line. A guiding device located on the side of the conveyor line is often needed to correct the position of the silicon wafers in order to achieve good process results and reduce the generation of defective products.

[0003] In related technologies, alignment devices typically include one or more cylindrical clamping sleeves with a circular axial cross-section. The outer wall of the clamping sleeve abuts against the side edge of the silicon wafer in a tangential manner, thereby guiding and correcting the wafer's alignment. However, after a period of use, the area on the outer wall of the clamping sleeve that contacts the silicon wafer is prone to wear and groove formation, thus failing to perform its alignment function. In some cases, it may even cause deformation and damage to the silicon wafer upon contact, increasing the wafer's defect rate.

[0004] Some have suggested wrapping the outer wall of the clamping sleeve with wear-resistant Teflon tape, which can increase the service life of the clamping sleeve. However, after a period of use, the parts of the clamping sleeve that contact the silicon wafer will still inevitably suffer significant wear due to prolonged friction. Therefore, it is necessary to replace and maintain the clamping sleeves that show signs of wear in a timely manner to ensure normal operation. Utility Model Content

[0005] Therefore, it is necessary to overcome the shortcomings of the existing technology and provide a silicon wafer straightening device and silicon wafer production line, which can reduce the losses generated during the silicon wafer straightening process, improve the silicon wafer yield, and extend the service life.

[0006] A silicon wafer alignment device, the silicon wafer alignment device comprising:

[0007] Base; and

[0008] A guiding assembly, wherein there is at least one guiding assembly and it is mounted on the base, the guiding assembly includes a guiding block and a wear-resistant component disposed on the guiding block, the wear-resistant component being used to abut against the side edge of the silicon wafer and to make line contact with the side edge of the silicon wafer.

[0009] In one embodiment, the wear-resistant component is made of rubber or PVC.

[0010] In one embodiment, the wear-resistant component is a wear-resistant sleeve that is sleeved and connected to the guide block in an annular shape, and the wear-resistant component can be adjusted in position on the guide block along its circumferential direction.

[0011] In one embodiment, the wear-resistant component is provided with a plurality of first positioning portions arranged sequentially at intervals along its circumferential direction, and the guide block is provided with at least one second positioning portion, the second positioning portion being capable of positioning and engaging with any one of the first positioning portions; and / or, the guide block is provided with a plurality of third positioning portions arranged sequentially at intervals along its circumferential direction, and the wear-resistant component is provided with at least one fourth positioning portion, the fourth positioning portion being capable of positioning and engaging with any one of the third positioning portions.

[0012] In one embodiment, all the first positioning portions are equally spaced on the wear-resistant part; and / or, all the third positioning portions are equally spaced on the guide block.

[0013] In one embodiment, the first positioning part is configured as a first positioning hole, and the second positioning part includes a positioning pin, positioning post, positioning rod, positioning protrusion, or locking member disposed on the guide block. The second positioning part is inserted into the first positioning part to position the wear-resistant part on the guide block; and / or

[0014] The third positioning part is configured as the first positioning hole, and the fourth positioning part includes a positioning pin, positioning post, positioning rod, positioning protrusion or locking member disposed on the wear-resistant part. The fourth positioning part is disposed in the third positioning part so that the wear-resistant part is positioned on the guide block.

[0015] In one embodiment, the outer peripheral surface of the guide block that abuts against the wear-resistant component includes a front surface facing the silicon wafer, a back surface facing away from the silicon wafer, a first transition surface connecting the top end of the front surface and the top end of the back surface, and a second transition surface connecting the bottom end of the front surface and the bottom end of the back surface; the front surface and the back surface are both planar, and the first transition surface and the second transition surface are both arc-shaped surfaces.

[0016] In one embodiment, the guiding block further includes two opposite end faces arranged along the running direction of the silicon wafer, each end face being connected to the outer peripheral surface, and each end face having a rounded corner or a chamfered corner at the connection point with the outer peripheral surface.

[0017] In one embodiment, there are multiple guiding components, which are arranged sequentially at intervals along the running direction of the silicon wafer. The wear-resistant parts of all the guiding components can synchronously abut against the side edge of the silicon wafer and are all in line contact.

[0018] A silicon wafer production line, the silicon wafer production line including the aforementioned silicon wafer alignment device.

[0019] In the aforementioned silicon wafer alignment device and silicon wafer production line, during use, the wear-resistant parts of the alignment component abut against the side edge of the silicon wafer, and the two are in line contact. This increases the force-bearing area and reduces the pressure exerted on the wear-resistant parts by the silicon wafer. As a result, the wear-resistant parts generated during the alignment process of the alignment component can be reduced, the silicon wafer yield can be improved, and the service life can be extended, thereby reducing the maintenance and replacement frequency of the silicon wafer alignment device. Attached Figure Description

[0020] Figure 1 This is a structural view of a silicon wafer alignment device according to an embodiment of this application.

[0021] Figure 2 for Figure 1 A schematic diagram of the working state of the structure shown.

[0022] Figure 3 for Figure 1 Another structural diagram of the structure shown.

[0023] Figure 4 for Figure 1 The diagram shows the structure of a guiding component in the structure shown.

[0024] Figure 5 for Figure 4 The exploded structure diagram shown.

[0025] 10. Base; 11. Base plate; 12. Support column; 20. Guiding assembly; 21. Guiding block; 211. Second positioning part; 2101. Front; 2102. Back; 2103. First transition surface; 2104. Second transition surface; 2105. End face; 22. Wear-resistant part; 221. First positioning part; 30. Silicon wafer; 31. Side edge. Detailed Implementation

[0026] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0027] As described in the background section, after a period of use, the clamping sleeve in the prior art is prone to wear and groove formation at the contact point between the outer wall of the clamping sleeve and the silicon wafer, thus failing to perform its correction function. In fact, it may even cause deformation and damage to the silicon wafer upon contact, increasing the defect rate of the silicon wafer. Furthermore, even if wear-resistant Teflon tape is wrapped around the outer wall of the clamping sleeve, it is still impossible to avoid a large amount of wear. The inventors have discovered that the reason for this problem is that the outer wall of the clamping sleeve in the related technology makes a tangential contact with the side edge of the silicon wafer to perform the correction function. During the correction process, the force on the outer wall of the clamping sleeve is only at the tangential point, which makes the force relatively concentrated. As a result, after wear and tear during daily use, pits will be generated, causing defects such as silicon wafer jamming.

[0028] Based on the above reasons, the present invention provides a silicon wafer straightening device and a silicon wafer production line, which can reduce the losses generated during the silicon wafer straightening process, improve the silicon wafer yield, and extend the service life.

[0029] See Figure 1 and Figure 2 , Figure 1 A structural view of a silicon wafer alignment device according to an embodiment of this application is shown. Figure 2 It shows Figure 1 The diagram shows the working state of the structure. One embodiment of this application provides a silicon wafer alignment device, which includes a base 10 and an alignment component 20. The alignment component 20 is at least one and mounted on the base 10. The alignment component 20 includes an alignment block 21 and a wear-resistant member 22 disposed on the alignment block 21. The wear-resistant member 22 is used to abut against the side edge 31 of the silicon wafer 30 and to make line contact with the side edge 31 of the silicon wafer 30.

[0030] In the process of using the above-mentioned silicon wafer alignment device, the wear-resistant part 22 of the alignment component 20 abuts against the side edge 31 of the silicon wafer 30 and the two are in line contact, which can increase the force-bearing area and reduce the pressure of the silicon wafer 30 on the wear-resistant part 22. This can reduce the wear of the wear-resistant part 22 during the alignment of the silicon wafer 30 by the alignment component 20, improve the yield of the silicon wafer 30, extend the service life, and reduce the maintenance and replacement frequency of the silicon wafer alignment device.

[0031] The guide block 21 provides support for the wear-resistant component 22 mounted on it. The guide block 21 can be made of a material with relatively high hardness, including but not limited to metal blocks such as iron, copper, and aluminum blocks, or non-metallic blocks with relatively high hardness such as hard plastic or hard rubber components.

[0032] In some embodiments, the wear-resistant part 22 is made of rubber or PVC material, has high wear resistance, and makes flexible contact with the silicon wafer 30 rather than hard contact, so as to reduce damage to the silicon wafer 30 and improve the yield of the silicon wafer 30.

[0033] In this embodiment, the wear-resistant component 22 is specifically made of rubber material, which is the same material as the belt used to transport the silicon wafer 30. This material is not only low in cost, but also has relatively high wear resistance and a long service life.

[0034] In some embodiments, the wear-resistant component 22 is a ring-shaped wear-resistant sleeve fitted onto the guide block 21, and the wear-resistant component 22 can be adjusted in position on the guide block 21 along its circumferential direction. Thus, when wear occurs on the portion of the wear-resistant component 22 that contacts the side edge 31 of the silicon wafer 30, its position can be adjusted on the guide block 21 along its circumferential direction, allowing other unworn portions of the wear-resistant component 22 to abut against the side edge 31 of the silicon wafer 30. This extends the service life of the wear-resistant sleeve and increases the service life of the silicon wafer alignment device, significantly reducing the frequency of spare parts replacement.

[0035] As some alternative solutions, the wear-resistant component 22 is not limited to the wear-resistant sleeve in the above embodiment, but can be, for example, a wear-resistant sheet or wear-resistant plate that can be moved up and down on the guide block 21; or a wear-resistant sheet or wear-resistant plate that is fixedly set on the guide block 21, while the height position of the guide block 21 on the base 10 in the vertical direction is adjustable; or other structural forms, as long as the position of the side edge 31 of the wear-resistant component 22 that contacts the silicon wafer 30 can be adjusted, thereby increasing the service life of the same silicon wafer guiding device and reducing the frequency of spare parts replacement.

[0036] Since the annular wear-resistant sleeve can be moved and adjusted to abut against the side edge 31 of the silicon wafer 30 more often, and it is more convenient to perform position adjustment operations on the guide block 21, this embodiment will specifically take the wear-resistant part 22 as an example of being set on the guide block 21 in an annular shape.

[0037] Please see Figures 3 to 5In some embodiments, the wear-resistant component 22 is provided with a plurality of first positioning portions 221 arranged at intervals along its circumferential direction. Specifically, all the first positioning portions 221 are arranged at equal intervals on the wear-resistant component 22. The guide block 21 is provided with at least one second positioning portion 211, which can be positioned and engaged with any one of the first positioning portions 221. Thus, when it is necessary to adjust the position of the wear-resistant component 22 on the guide block 21, the first positioning portions 221 and the second positioning portions 211 are first separated from each other, and then the position of the wear-resistant component 22 is adjusted by rotating it along its circumferential direction. After the position is adjusted, the second positioning portion 211 is positioned with the corresponding first positioning portion 221, so that the wear-resistant component 22 is stably set on the guide block 21.

[0038] Optionally, the first positioning part 221 may be configured as a first positioning hole, and the second positioning part 211 may include, but is not limited to, positioning pins, positioning posts, positioning rods, positioning protrusions, or locking elements disposed on the guide block 21. The second positioning part 211 extends into the first positioning hole to achieve the positioning operation of the wear-resistant part 22. The locking element may include, but is not limited to, pins, rivets, screws, etc.

[0039] Furthermore, the second positioning part 211 is detachably mounted on the guide block 21, for example. Thus, when it is necessary to adjust the position of the wear-resistant part 22 on the guide block 21, the second positioning part 211 is removed from the guide block 21, thereby separating the second positioning part 211 from the first positioning part 221. This allows the wear-resistant part 22 to be rotated and adjusted in the circumferential direction. After the position adjustment is complete, the second positioning part 211 is then mounted on the positioning part, positioning the second positioning part 211 with the corresponding first positioning part 221.

[0040] It should be noted that the second positioning part 211 is not limited to one, but can also be two, three, four or more. When the second positioning part 211 is set to at least two, the number of the second positioning parts 211 is less than the number of the first positioning parts 221, and after rotating to adjust the position of the wear-resistant part 22, at least two first positioning parts 221 on the wear-resistant part 22 are respectively arranged in a one-to-one correspondence with at least two second positioning parts 211.

[0041] In some embodiments, the guide block 21 is provided with a plurality of third positioning portions arranged at intervals along its circumferential direction. Specifically, all the third positioning portions are arranged at equal intervals on the guide block 21. In addition, the wear-resistant part 22 is provided with at least one fourth positioning portion, which can be positioned and engaged with any of the third positioning portions. Thus, when it is necessary to adjust the position of the wear-resistant part 22 on the guide block 21, the third positioning portion and the fourth positioning portion are first separated from each other, and then the position of the wear-resistant part 22 is adjusted by rotating it along its circumferential direction. After the position adjustment is completed, the fourth positioning portion is positioned with the corresponding third positioning portion, so that the wear-resistant part 22 is stably set on the guide block 21.

[0042] Optionally, the third positioning part may be configured as the second positioning hole, and the fourth positioning part may include, but is not limited to, positioning pins, positioning rods, positioning protrusions or locking parts provided on the wear-resistant part 22. The fourth positioning part achieves the positioning operation of the wear-resistant part 22 by extending into the second positioning hole.

[0043] It should be noted that the fourth positioning part is not limited to one; it can also be two, three, four, or more. When there are at least two fourth positioning parts, the number of fourth positioning parts is less than the number of third positioning parts, and after rotating and adjusting the position of the wear-resistant part 22, at least two third positioning parts on the guide block 21 are respectively set to correspond one-to-one with at least two fourth positioning parts.

[0044] Furthermore, the fourth positioning part is, for example, detachably mounted on the wear-resistant part 22. Thus, when it is necessary to adjust the position of the wear-resistant part 22 on the guide block 21, the fourth positioning part is removed from the wear-resistant part 22, thereby separating the fourth positioning part from the third positioning part. This allows the wear-resistant part 22 to be rotated and adjusted in the circumferential direction. After the position adjustment is complete, the fourth positioning part is then mounted back onto the wear-resistant part 22, positioning it with the corresponding third positioning part.

[0045] In some embodiments, the guide block 21 includes, but is not limited to, being configured as a centrally symmetrical or axisymmetric structure, which facilitates the adjustment of the position of the wear-resistant component 22 on the guide block 21 along its circumferential direction and improves the stability of the wear-resistant component 22 on the guide block 21.

[0046] Please see Figure 2 , Figure 4 and Figure 5Based on the aforementioned embodiments, since the wear-resistant component 22 is a ring-shaped wear-resistant sleeve fitted onto the guide block 21, the guide block 21 correspondingly has an outer peripheral surface that abuts against the wear-resistant component 22. Specifically, the outer peripheral surface includes a front surface 2101 facing the silicon wafer 30, a back surface 2102 facing away from the silicon wafer 30, a first transition surface 2103 connecting the top end of the front surface 2101 and the top end of the back surface 2102, and a second transition surface 2104 connecting the bottom end of the front surface 2101 and the bottom end of the back surface 2102. The front surface 2101 and the back surface 2102 are, for example, planar, and the first transition surface 2103 and the second transition surface 2104 are, for example, arc-shaped. Thus, on the one hand, the front surface 2101 of the guide block 21 faces the silicon wafer 30, and the part of the wear-resistant component 22 located on the front surface 2101 is supported by the front surface 2101 and abuts against the side edge 31 of the silicon wafer 30, so that the contact with the side edge 31 of the silicon wafer 30 can be a line contact; on the other hand, during the process of adjusting the position of the wear-resistant component 22 on the guide block 21 along its circumferential direction, since the front surface 2101 and the back surface 2102 are flat, and the first transition surface 2103 and the second transition surface 2104 are arc surfaces, the interference force is small, so the position can be adjusted smoothly.

[0047] In one embodiment, the guide block 21 further includes two end faces 2105 disposed opposite to each other along the running direction of the silicon wafer 30. Each end face 2105 is connected to an outer peripheral surface, specifically to a plane, a back surface 2102, a first transition surface 2103, and a second transition surface 2104, respectively. Furthermore, each end face 2105 has a rounded corner or a chamfered corner formed at the connection point with the outer peripheral surface. Thus, on the one hand, at the initial moment when the silicon wafer 30 is about to contact the guide block 21, the rounded corner or chamfered corner contacts the silicon wafer 30 first and guides and corrects its deviation, preventing collisions that could damage the silicon wafer 30; on the other hand, a wear-resistant sleeve is also wrapped around the rounded corner or chamfered corner, stably fitting onto the guide block 21 and effectively preventing slippage relative to the guide block 21 along the running direction of the silicon wafer 30.

[0048] Of course, as some alternative solutions, rounded corners or chamfers may be formed only at the connection between one or two end faces 2105 and the front face 2101, and the other parts of the end face 2105 and the outer peripheral surface may not need to be rounded or chamfered.

[0049] In one embodiment, there are multiple guiding components 20, which are arranged sequentially and at intervals along the running direction of the silicon wafer 30. The wear-resistant parts 22 of all guiding components 20 can synchronously abut against the side edge 31 of the silicon wafer 30 and all make line contact. In this way, since the silicon wafer guiding device uses not just one guiding component 20, but multiple guiding components 20 with wear-resistant parts 22 to synchronously abut against the side edge 31 of the silicon wafer 30 and all make line contact, it has a better guiding effect. At the same time, it can reduce the pressure exerted by the silicon wafer 30 on the outer wall of the wear-resistant parts 22, thereby reducing wear, increasing service life, and reducing the maintenance and replacement frequency of the silicon wafer guiding device.

[0050] In some embodiments, the base 10 includes a base plate 11 and at least two support columns 12 mounted on the base plate 11. Each guide component 20 is correspondingly mounted on each support column 12. Specifically, the guide block 21 of each guide component 20 is, but is not limited to, correspondingly and detachably disposed on each support column 12.

[0051] In one embodiment, this embodiment also provides a silicon wafer production line, which includes the silicon wafer alignment device of any of the above embodiments.

[0052] In the aforementioned silicon wafer production line, the wear-resistant part 22 of the alignment component 20 abuts against the side edge 31 of the silicon wafer 30, and the two are in line contact. This increases the force-bearing area and reduces the pressure exerted by the silicon wafer 30 on the wear-resistant part 22. As a result, the wear of the wear-resistant part 22 during the alignment process of the alignment component 20 is reduced, the yield of the silicon wafer 30 is improved, and the service life is extended. This also reduces the maintenance and replacement frequency of the silicon wafer alignment device.

[0053] In some embodiments, the silicon wafer production line further includes a conveying device for transporting the silicon wafer 30, which includes, but is not limited to, various conveying elements such as belts, chains, and chain plates for transporting the silicon wafer 30.

[0054] In some embodiments, multiple silicon wafer alignment devices are provided, for example, located on opposite left and right sides of the conveying device, to align and correct the silicon wafers 30 conveyed on the conveying device.

[0055] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0056] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0057] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0058] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0059] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0060] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0061] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A silicon wafer alignment device, characterized in that, The silicon wafer alignment device includes: Base (10); and A guiding component (20), wherein there is at least one guiding component (20) and it is mounted on the base (10). The guiding component (20) includes a guiding block (21) and a wear-resistant component (22) disposed on the guiding block (21). The wear-resistant component (22) is used to abut against the side edge (31) of the silicon wafer (30) and to have line contact with the side edge (31) of the silicon wafer (30).

2. The silicon wafer alignment device according to claim 1, characterized in that, The wear-resistant part (22) is made of rubber or PVC.

3. The silicon wafer alignment device according to claim 1, characterized in that, The wear-resistant component (22) is a wear-resistant sleeve that is sleeved and connected to the guide block (21) and is in the shape of an annulus. The wear-resistant component (22) can be adjusted in position on the guide block (21) along its circumferential direction.

4. The silicon wafer alignment device according to claim 3, characterized in that, The wear-resistant part (22) is provided with a plurality of first positioning parts (221) arranged sequentially at intervals along its circumferential direction, and the guide block (21) is provided with at least one second positioning part (211), the second positioning part (211) being able to position and cooperate with any one of the first positioning parts (221); and / or, the guide block (21) is provided with a plurality of third positioning parts arranged sequentially at intervals along its circumferential direction, and the wear-resistant part (22) is provided with at least one fourth positioning part, the fourth positioning part being able to position and cooperate with any one of the third positioning parts.

5. The silicon wafer alignment device according to claim 4, characterized in that, All of the first positioning parts (221) are equally spaced on the wear-resistant part (22); and / or, all of the third positioning parts are equally spaced on the guide block (21).

6. The silicon wafer alignment device according to claim 4, characterized in that, The first positioning part (221) is configured as a first positioning hole, and the second positioning part (211) includes a positioning pin, a positioning post, a positioning rod, a positioning protrusion, or a locking member disposed on the guide block (21). The second positioning part (211) is inserted into the first positioning part (221) so that the wear-resistant part (22) is positioned on the guide block (21); and / or, The third positioning part is configured as the first positioning hole, and the fourth positioning part includes a positioning pin, positioning post, positioning rod, positioning protrusion or locking member disposed on the wear-resistant part (22). The fourth positioning part is disposed in the third positioning part so that the wear-resistant part (22) is positioned on the guide block (21).

7. The silicon wafer alignment device according to claim 3, characterized in that, The outer peripheral surface of the guide block (21) that abuts against the wear-resistant part (22) includes a front surface (2101) facing the silicon wafer (30), a back surface (2102) facing away from the silicon wafer (30), a first transition surface (2103) connecting the top of the front surface (2101) and the top of the back surface (2102), and a second transition surface (2104) connecting the bottom of the front surface (2101) and the bottom of the back surface (2102); the front surface (2101) and the back surface (2102) are both planar, and the first transition surface (2103) and the second transition surface (2104) are both arc-shaped surfaces.

8. The silicon wafer alignment device according to claim 7, characterized in that, The guide block (21) also includes two end faces (2105) arranged opposite to each other along the running direction of the silicon wafer (30), each end face (2105) being connected to the outer peripheral surface, and each end face (2105) having a rounded corner or a chamfered corner at the connection between it and the outer peripheral surface.

9. The silicon wafer alignment device according to any one of claims 1 to 8, characterized in that, There are multiple guiding components (20), and the multiple guiding components (20) are arranged sequentially at intervals along the running direction of the silicon wafer (30). The wear-resistant parts (22) of all the guiding components (20) can synchronously abut against the side edge (31) of the silicon wafer (30) and are all in line contact.

10. A silicon wafer production line, characterized in that, The silicon wafer production line includes a silicon wafer alignment device as described in any one of claims 1 to 9.

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