Wafer bearing assembly and semiconductor processing equipment

Abstract

The utility model discloses a wafer bearing assembly and a semiconductor processing device. The wafer bearing assembly comprises a liftable pedestal; the bearing ring is positioned above the base and is provided with a first bearing surface for bearing a wafer; the bearing ring is also provided with a first opening in the circumferential direction, and the wafer is suitable for being placed on the first bearing surface through the first opening; the first supporting piece is fixed below the bearing ring and is used for supporting the bearing ring; the first supporting piece is provided with a first through hole with the aperture larger than the outer diameter of the base, and the base is provided with a second bearing face for bearing the bearing ring, so that the base penetrates through the first through hole to jack up the bearing ring on the first supporting piece, and the wafer is placed at the process position. Under the condition that the center of the base is not provided with an ejector pin hole for accommodating the ejector pin, the wafer transfer device can be matched with a mechanical arm to complete corresponding wafer transfer operation and ensure smooth process treatment of wafers, so that the preparation yield of the wafers is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a wafer carrier component and semiconductor processing equipment. Background Technology

[0002] In semiconductor processing equipment, wafer-carrying pedestals typically contain pins that can move up and down along the axial direction of the pedestal to lift or place the wafer onto the pedestal, thus cooperating with robotic arms to perform wafer transfer operations. For example, the robotic arm passes through a transfer port on the side wall of the reaction chamber to place the wafer onto a raised pin, and then a power source drives the pin to descend and place the wafer onto the pedestal, thereby completing the wafer transfer operation into the reaction chamber.

[0003] The above-mentioned wafer transfer method requires a pin hole to be opened in the center of the substrate to accommodate the pins. Since there is also a heater for heating the wafer inside the substrate, the setting of the pin hole will affect the uniformity of the temperature field, resulting in uneven temperature distribution of the substrate, which in turn leads to uneven temperature distribution of the wafer, ultimately causing uneven film deposition (referring to thickness or composition) on the wafer, affecting the wafer preparation yield. Utility Model Content

[0004] The purpose of this invention is to provide a wafer carrier component and semiconductor processing equipment. Without opening a pin hole in the center of the base to accommodate the pin, it can cooperate with a robotic arm to complete the corresponding wafer transfer operation and ensure the smooth progress of wafer processing, thereby improving the wafer preparation yield.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution:

[0006] A wafer carrier component, comprising:

[0007] Adjustable base;

[0008] A support ring, located above the base, has a first support surface for supporting the wafer; the support ring also has a first opening in its circumferential direction, and the wafer is adapted to be placed on the first support surface through the first opening;

[0009] A first support member is fixed below the bearing ring to support the bearing ring. The first support member has a first through hole with a diameter larger than the outer diameter of the base. The base has a second bearing surface that supports the bearing ring, such that the base passes through the first through hole to lift the bearing ring on the first support member to place the wafer in the process position.

[0010] Optionally, the centers of the first support member and the bearing ring are both located on the axis of the base.

[0011] Optionally, one of the first support member and the bearing ring is provided with a first protrusion, and the other is provided with a first recess to accommodate the first protrusion.

[0012] Optionally, the first bearing surface is the top surface of the bearing ring.

[0013] Optionally, the inner side of the bearing ring is provided with a plurality of second protrusions extending radially inward therein; the plurality of second protrusions are spaced apart circumferentially along the bearing ring, and the top surface of the plurality of second protrusions constitutes the first bearing surface.

[0014] Optionally, the base is provided with a second recess, and the bottom surface of the second recess is the second bearing surface;

[0015] When the base lifts the support ring, the support ring is placed inside the second recess, and the wafer is placed on the top surface of the base and does not contact the support ring.

[0016] Optionally, the height of the second recess is greater than the height of the second protrusion.

[0017] Optionally, the sidewall of the second recess is provided with an air blowing hole for introducing purging gas into the gap between the bearing ring and the base.

[0018] Optionally, the wafer carrier assembly further includes:

[0019] The second support member is fixed between the first support member and the process position;

[0020] A cover ring is disposed on the second support member;

[0021] The second support has a third bearing surface for supporting the cover ring and a second through hole through which the bearing ring and the base pass; the inner diameter of the cover ring is smaller than the outer diameter of the wafer, so that the base rises and drives the bearing ring through the second through hole to lift the cover ring and the cover ring is located above the wafer.

[0022] Optionally, the centers of the second support and the cover ring are both located on the axis of the base.

[0023] Optionally, the third bearing surface is the top surface of the second support member.

[0024] Optionally, the inner side of the second support member is provided with a plurality of snap-fit ​​portions extending radially inward therein; the plurality of snap-fit ​​portions are spaced apart circumferentially along the second support member, and the top surface of the plurality of snap-fit ​​portions constitutes the third bearing surface.

[0025] Optionally, one of the covering ring and the bearing ring is provided with a third protrusion, and the other is provided with a third recess to accommodate the third protrusion.

[0026] Optionally, the height of the support ring is greater than the sum of the heights of the second recess and the wafer, so that there is a gap between the cover ring and the wafer when the support ring lifts the cover ring.

[0027] Optionally, the cover ring is provided with a third through hole, and the third through hole communicates with the gap between the cover ring and the wafer.

[0028] Optionally, the third through hole is an oblique hole.

[0029] Optionally, the inner surface of the covering ring is an annular inclined surface, and it is inclined inward from top to bottom.

[0030] Optionally, the first support member has a second opening corresponding to the first opening.

[0031] On the other hand, this utility model also provides a semiconductor processing apparatus, comprising:

[0032] A reaction chamber, one side of which is provided with a wafer transfer port for transferring the wafer; and

[0033] The wafer carrier assembly as described above; the base in the wafer carrier assembly is disposed at the bottom of the interior of the reaction chamber, the first support is fixedly connected to the inner sidewall of the reaction chamber; the first opening on the carrier ring is disposed opposite to the wafer transfer port, and the wafer is adapted to be placed on the first carrier surface through the wafer transfer port and the first opening.

[0034] Compared with the prior art, the present invention has the following advantages:

[0035] This invention provides a wafer carrier assembly and semiconductor processing equipment. Through the cooperation of a liftable base, a carrier ring, and a first support member, it can support the wafer to be processed, lift the wafer to be processed to the process position, and place the processed wafer onto the carrier ring supported by the first support member. The wafer carrier assembly provided by this invention can cooperate with a robotic arm to complete corresponding wafer transfer operations and ensure the smooth progress of wafer processing. Furthermore, compared to the prior art where wafers are lifted or lowered by ejector pins in cooperation with a robotic arm to complete wafer transfer operations, this invention does not require ejector pin holes in the center of the base to accommodate ejector pins. This ensures that the temperature field of the base remains unaffected, guaranteeing the uniformity of temperature distribution on the base, thereby ensuring the uniformity of temperature distribution on the wafer, and ultimately ensuring the uniformity of the wafer processing results, improving wafer fabrication yield.

[0036] In this invention, the base lifts the wafer by lifting the support ring, thus avoiding the situation in the prior art where the wafer is tilted due to a single ejector pin getting stuck or being lower than the other ejector pins. This ensures the levelness of the wafer surface, thereby guaranteeing the uniformity of the wafer processing results and improving the wafer fabrication yield.

[0037] In this invention, a second support is provided between the first support and the process position, and a cover ring is supported on the second support. The base rises, causing the support ring to pass through the second support and lift the cover ring, placing the cover ring above the wafer. This allows the cover ring to cover the edge area of ​​the wafer, thereby preventing film formation on the edge area and back side of the wafer during processing, thus meeting process requirements. Attached Figure Description

[0038] Figure 1 This is an exploded view of a wafer carrier assembly provided in one embodiment of the present invention;

[0039] Figure 2 This is a perspective view of a wafer carrier assembly in its initial state according to an embodiment of the present invention;

[0040] Figure 3 This is a schematic diagram of a robotic arm lifting a wafer above a support ring in one embodiment of the present invention;

[0041] Figure 4 This is a schematic diagram of a robotic arm placing a wafer on a support ring in one embodiment of the present invention;

[0042] Figure 5 This is a schematic diagram of a base supporting a bearing ring and a wafer in one embodiment of the present invention;

[0043] Figure 6 This is a schematic diagram of the structure of a cover ring and a second support member in a wafer carrier assembly according to an embodiment of the present invention;

[0044] Figure 7 This is a schematic diagram of a cover ring placed on a second support member in one embodiment of the present invention;

[0045] Figure 8 This is a schematic diagram of a base rising and causing the bearing ring to lift the covering ring in one embodiment of the present invention;

[0046] Figure 9 This is a cross-sectional view of a semiconductor processing device provided in an embodiment of the present invention, in which a wafer is placed on a support ring;

[0047] Figure 10 This is a cross-sectional view of a semiconductor processing device provided in an embodiment of the present invention, showing how the base rises to drive the bearing ring to lift the covering ring.

[0048] Figure 11 This is a cross-sectional view of a semiconductor processing device provided in another embodiment of the present invention, in which a wafer is placed on a carrier ring;

[0049] Figure 12 This is a cross-sectional view of a base support ring and a wafer in a semiconductor processing device provided by another embodiment of this utility model. Detailed Implementation

[0050] The following detailed description, in conjunction with the accompanying drawings and specific embodiments, provides a further detailed explanation of the wafer carrier component and semiconductor processing equipment proposed in this utility model. The advantages and features of this utility model will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, used only to facilitate and clearly illustrate the embodiments of this utility model. Please refer to the drawings to make the objectives, features, and advantages of this utility model more apparent and understandable. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by this utility model, should still fall within the scope of the technical content disclosed in this utility model.

[0051] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0052] Combined with appendix Figures 1-12 As shown, this embodiment provides a wafer carrier assembly, including: a liftable base 110, a carrier ring 130, and a first support member 120. The carrier ring 130 is located above the base 110, and the carrier ring 130 has a first carrier surface for carrying a wafer 101; the carrier ring 130 also has a first opening 131 in its circumferential direction, and the wafer 101 is adapted to be placed on the first carrier surface through the first opening 131. The first support member 120 is fixed below the carrier ring 130 for supporting the carrier ring 130; the first support member 120 has a first through hole 121 with a diameter larger than the outer diameter of the base 110, and the base 110 has a second carrier surface for carrying the carrier ring 130, such that the base 110 passes through the first through hole 121 to lift the carrier ring 130 on the first support member 120, so as to place the wafer 101 in a process position.

[0053] Specifically, such as Figure 2 As shown, in the initial state, the base 110 is located below the first support 120 (i.e., the base 110 is in a low position), and the bearing ring 130 is situated on the first support 120, but the bearing ring 130 does not support the wafer. Subsequently, as... Figure 3 As shown, the wafer 101 is lifted above the support ring 130 by a robotic arm 103, with the robotic arm 103 positioned above the first opening 131. Then, as... Figure 4 As shown, the robotic arm 103 descends through the first opening 131, placing the wafer 101 onto the first support surface of the support ring 130. After the wafer 101 is placed on the first support surface, the robotic arm is withdrawn radially outward through the first opening 131 along the support ring 130. Thereafter, as... Figure 5As shown, the base 110 rises upward, passes through the first through hole 121, and lifts the carrier ring 130 carrying the wafer 101 to place the wafer 101 in the process position, thereby performing process processing on the wafer 101.

[0054] Understandably, after the wafer 101 completes its processing, the base 110 lowers the support ring 130 and the processed wafer 101 together. During this descent, the support ring 130 is supported by the first support member 120, and the processed wafer 101 is supported by the first support surface of the support ring 130. Subsequently, the remaining base 110 continues to descend below the first support member 120 (i.e., the base 110 returns to its low position). Further, after the support ring 130 is supported by the first support member 120 and the processed wafer 101 is supported by the first support surface, the robotic arm 103 can be inserted through the first opening 131 and radially inward along the support ring 130 to below the processed wafer 101. Then, the robotic arm 103 rises through the first opening 131, lifting the processed wafer 101 above the support ring 130. Subsequently, the robotic arm 103 moves the processed wafer 101 from above the support ring 130 to a preset position. Optionally, the preset position is a wafer storage cassette, but this invention is not limited thereto.

[0055] As can be seen from the above, in this embodiment, the liftable base 110, the carrier ring 130, and the first support member 120 cooperate to support the wafer 101 to be processed, lift the wafer 101 to be processed to the process position, and place the processed wafer 101 on the carrier ring 130 supported by the first support member 120. Therefore, the wafer carrier assembly provided in this embodiment can not only cooperate with the robotic arm 103 to complete the corresponding wafer transfer operation, but also ensure the smooth processing of the wafer 101. Compared to existing technologies that use ejector pins to lift or lower wafers and cooperate with robotic arms to complete wafer transfer operations, this embodiment does not require ejector pin holes in the center of the base 110 to accommodate ejector pins. This ensures that the temperature field of the base 110 remains unaffected, thereby guaranteeing the uniformity of temperature distribution in the base 110 and the uniformity of temperature distribution in the wafer 101. Consequently, it ensures the uniformity of the wafer 101 processing results and improves the wafer 101 fabrication yield.

[0056] Furthermore, in this embodiment, the base 110 lifts the wafer 101 by lifting the support ring 130. Therefore, this embodiment will not cause the wafer to become misaligned due to a stuck pin or being lower than other pins, as is the case in the prior art. This ensures the levelness of the surface of the wafer 101, thereby ensuring the uniformity of the wafer 101 processing results and improving the wafer 101 fabrication yield.

[0057] Please continue to refer to this. Figure 2 The centers of the first support member 120 and the bearing ring 130 are both located on the axis AA of the base 110 to ensure the concentricity of the first support member 120, the bearing ring 130 and the base 110. This ensures that when the base 110 rises to lift the wafer 101, the center of the wafer 101 is also located on the axis AA of the base 110, thereby allowing the base 110 to stably lift the wafer 101.

[0058] Please also refer to Figure 1 and Figure 10 One of the first support member 120 and the bearing ring 130 is provided with a first protrusion, and the other is provided with a first recess to accommodate the first protrusion. The cooperation of the first protrusion and the first recess fixes and centers the first support member 120 and the bearing ring 130, thereby enabling the first support member 120 to stably support the bearing ring 130 and the wafer 101. It is understood that centering here means that the center of the first support member 120 and the center of the bearing ring 130 are on the same vertical line (e.g., the axis AA of the base 110).

[0059] Optionally, the first bearing ring 130 is provided with the first protrusion 132 (e.g., Figure 1 and Figure 10 As shown), the first support member 120 is provided with the first recess 122 (as shown). Figure 10 (As shown). Optionally, the first protrusion 132 is disposed on the outer side wall of the bearing ring 130 and extends radially outward along the bearing ring 130, but the present invention is not limited thereto.

[0060] Optionally, in one embodiment, the first support member 120 is an annular structure having the first through hole 121. And as in... Figure 1In the preferred embodiment shown, the first support member 120 also has a second opening 123 corresponding to the first opening 131 in its circumferential direction; and the first opening 131 and the second opening 123 together form a space for the robotic arm 103 to move up and down; further, the robotic arm 103 descends through the first opening 131 and the second opening 123, thereby facilitating the placement of the wafer 101 on the first bearing surface of the bearing ring 130; in addition, the robotic arm 103 is also inserted into the lower part of the wafer 101 through the first opening 131 and the second opening 123 and radially inward along the bearing ring 130, and rises upward through the first opening 131 and the second opening 123, thereby facilitating the lifting of the wafer 101 from the first bearing surface to the upper part of the bearing ring 130.

[0061] It is understood that the inner diameter of the first bearing surface is smaller than the outer diameter of the wafer 101, so that the first bearing surface can support the wafer 101. At the same time, the outer diameter of the base 110 is larger than the inner diameter of the first bearing surface and smaller than the outer diameter of the bearing ring 130, so that the base 110 can lift the bearing ring 130, thereby lifting the wafer 101.

[0062] Specifically, in one embodiment, such as Figure 1 and Figure 9 As shown, the inner surface of the support ring 130 is provided with a plurality of second protrusions 133 extending radially inward; the plurality of second protrusions 133 are spaced apart circumferentially along the support ring 130, and the top surfaces of the plurality of second protrusions 133 constitute the first support surface; in this case, the inner diameter of the first support surface refers to the diameter of the circle in which the inner surfaces of the plurality of second protrusions 133 are located. Optionally, the number of second protrusions 133 is at least three, so that the first support surface formed by the top surfaces of the plurality of second protrusions 133 can stably support the wafer 101. Further, the provision of the second protrusions 133 can limit the wafer 101, thereby preventing the wafer 101 from moving on the support ring 130; at the same time, it can also center the wafer 101 and the support ring 130, so that the center of the wafer 101 and the center of the support ring 130 are located on the same vertical line (e.g., the axis AA of the base 110).

[0063] In another embodiment, such as Figure 11 As shown, the first bearing surface is the top surface of the bearing ring 130; at this time, the inner diameter of the first bearing surface refers to the inner diameter of the top surface of the bearing ring 130.

[0064] Please continue to refer to this. Figure 1 and Figure 9The base 110 has a second recess 111, and the bottom surface of the second recess 111 is the second bearing surface. When the base 110 lifts the bearing ring 130, the bearing ring 130 is placed inside the second recess 111, and the wafer 101 is placed on the top surface of the base 110 and does not contact the bearing ring 130 (e.g., Figure 10 and Figure 12 As shown in the figure, this ensures that the wafer 101 is completely supported by the base 110, thereby ensuring that the wafer 101 will not move during the process and thus ensuring the uniformity of the processing result of the wafer 101.

[0065] Specifically, such as Figure 10 and Figure 12 As shown, when the base 110 lifts the bearing ring 130, the lower surface of the bearing ring 130 contacts the bottom surface of the second recess 111 (i.e., the second bearing surface), and the first bearing surface of the bearing ring 130 (as shown) Figure 10 The top surface of the second protrusion 133, Figure 12 The top surface of the support ring 130 is lower than the top surface of the base 110 to ensure that the wafer 101 is placed on the top surface of the base 110 and does not contact the support ring 130.

[0066] It is understandable that, such as Figure 10 As shown, when the first bearing surface is composed of the top surfaces of a plurality of second protrusions 133, the height h1 of the second recess 111 is greater than the height h2 of the second protrusions 133, such that when the bearing ring 130 is placed in the second recess 111, the top surface of the second protrusions 133 (i.e., the first bearing surface) is lower than the top surface of the base 110. Figure 12 As shown, when the first bearing surface is the top surface of the bearing ring 130, the height h1 of the second recess 111 is greater than the height h3 of the bearing ring 130, so that when the bearing ring 130 is placed in the second recess 111, the top surface of the bearing ring 130 (i.e. the first bearing surface) is lower than the top surface of the base 110.

[0067] In addition, such as Figure 1 As shown, the shape of the second recess 111 matches the shape of the bearing ring 130, and no recess is provided on the base 110 at the position corresponding to the first opening 131, so that when the bearing ring 130 is placed in the second recess 111, the bearing ring 130 and the base 110 approximately form a complete circle in the circumferential direction (e.g., Figure 5As shown), this ensures a uniform flow field distribution during the process, thereby guaranteeing the uniformity of the wafer 101 processing result. It is understood that when the inner surface of the support ring 130 is provided with the second protrusion 133, the second recess 111 includes an inner recess 113 that matches the second protrusion 133 (e.g., ...). Figure 1 (as shown), but this utility model is not limited thereto.

[0068] Please continue to refer to this. Figure 1 , Figure 10 and Figure 12 The second recess 111 has a blow hole 112 on its side wall, which is used to introduce purging gas into the gap between the support ring 130 and the base 110 to prevent the gap from forming a dead zone and to prevent reaction byproducts in the process from accumulating in the dead zone, thereby ensuring the cleanliness of the gap and avoiding contamination of the wafer 101, thus ensuring the yield of the wafer 101.

[0069] Please continue to refer to this. Figure 6 , Figure 9 and Figure 10 When the top surfaces of the plurality of second protrusions 133 constitute the first bearing surface, the wafer bearing assembly further includes: a second support member 140 and a cover ring 150. The second support member 140 is fixed between the first support member 120 and the process position, and the cover ring 150 is disposed on the second support member 140. The second support member 140 has a third bearing surface for bearing the cover ring 150 and a second through hole 142 through which the bearing ring 130 and the base 110 pass (e.g., Figure 7 (As shown); the inner diameter of the cover ring 150 is smaller than the outer diameter of the wafer 101, causing the base 110 to rise and drive the support ring 130 through the second through hole 142 to lift the cover ring 150, and the cover ring 150 is located above the wafer 101 (as shown). Figure 8 and Figure 10 (As shown).

[0070] Specifically, such as Figure 7 As shown, in the initial state, the cover ring 150 sits on the second support member 140. Figure 8 As shown, after the base 110 rises and lifts the carrier ring 130 carrying the wafer 101, it continues to rise and drives the carrier ring 130 and the wafer 101 through the second through hole 142 to lift the cover ring 150, thereby placing the wafer 101 in the process position for process processing. More specifically, as... Figure 10As shown, after the support ring 130 lifts the cover ring 150, the cover ring 150 is located above the wafer 101, so that the cover ring 150 covers the edge area of ​​the wafer 101, thereby preventing film formation on the edge area and back side of the wafer 101 during the process of processing the wafer 101, so as to meet the process requirements.

[0071] Understandably, after the wafer 101 completes its processing, the base 110 lowers the cover ring 150, the support ring 130, and the processed wafer 101 together; during this descent, the cover ring 150 is supported by the second support member 140. Subsequently, the base 110 continues to lower the support ring 130 and the processed wafer 101; during this continued descent, the support ring 130 is supported by the first support member 120, and the processed wafer 101 is supported by the first bearing surface of the support ring 130. Afterward, only the base 110 remains, descending below the first support member 120.

[0072] Please also refer to Figure 7 and Figure 8 The centers of the second support member 140 and the covering ring 150 are both located on the axis AA of the base 110 to ensure the concentricity of the second support member 140, the covering ring 150 and the base 110, so that the covering ring 150 uniformly covers the edge area of ​​the wafer 101, thereby ensuring the uniformity of the processing result of the wafer 101.

[0073] It is understood that the inner diameter of the third bearing surface of the second support member 140 is smaller than the outer diameter of the cover ring 150, so that the third bearing surface can support the cover ring 150.

[0074] Specifically, in one embodiment, such as Figure 6 As shown, the inner side of the second support member 140 is provided with a plurality of snap-fit ​​portions 141 extending radially inward therein; the plurality of snap-fit ​​portions 141 are arranged circumferentially spaced along the second support member 140, and the top surface of the plurality of snap-fit ​​portions 141 constitutes the third bearing surface; at this time, the inner diameter of the third bearing surface refers to the diameter of the circle in which the inner sides of the plurality of snap-fit ​​portions 141 are located; and the inner diameter of the third bearing surface is larger than the outer diameter of the bearing ring 130, so that the base 110 rises and drives the bearing ring 130 through the inner diameter of the third bearing surface and the second through hole 142.

[0075] Optionally, the number of the snap-fit ​​portions 141 is at least three, so that the third bearing surface formed by the top surfaces of the plurality of snap-fit ​​portions 141 can stably support the cover ring 150. Further, the snap-fit ​​portions 141 can limit the position of the cover ring 150, thereby preventing the cover ring 150 from moving on the second support member 140; simultaneously, they can also center the cover ring 150 on the second support member 140, such that the center of the cover ring 150 and the center of the second support member 140 are located on the same vertical line (e.g., the axis AA of the base 110).

[0076] Furthermore, the outer surface of the cover ring 150 is provided with a plurality of extension portions 154 extending radially outward therefrom, and the plurality of extension portions 154 are spaced apart circumferentially along the cover ring 150; in this case, the outer diameter of the cover ring 150 refers to the diameter of the circle in which the outer surfaces of the plurality of extension portions 154 are located. Optionally, the extension portions 154 are provided in a one-to-one correspondence with the snap-fit ​​portions 141, and when the second support member 140 carries the cover ring 150, the extension portions 154 are in contact with the snap-fit ​​portions 141.

[0077] In another embodiment, the third bearing surface may also be the top surface of the second support member 140; in this case, the inner diameter of the third bearing surface refers to the inner diameter of the top surface of the second support member 140.

[0078] Please also refer to Figure 9 and 10 One of the covering ring 150 and the supporting ring 130 is provided with a third protrusion, and the other is provided with a third recess to accommodate the third protrusion. The cooperation of the third protrusion and the third recess secures and centers the covering ring 150 and the supporting ring 130, thereby allowing the supporting ring 130 to stably support the covering ring 150. It is understood that "centering" here means that the center of the covering ring 150 and the center of the supporting ring 130 are on the same vertical line (e.g., the axis AA of the base 110).

[0079] Optionally, such as Figure 9 As shown, the covering ring 150 is provided with the third protrusion 153, and the bearing ring 130 is provided with the third recess 134. Optionally, the third protrusion 153 is disposed on the lower surface of the covering ring 150 and extends downward along the axial direction of the covering ring 150, but the present invention is not limited thereto.

[0080] Please continue to refer to this. Figure 10The height h4 of the support ring 130 is greater than the sum of the height h1 of the second recess 111 and the height of the wafer 101, so that when the support ring 130 lifts the cover ring 150, there is a gap between the cover ring 150 and the wafer 101, thereby making the cover ring 150 located above the wafer 101.

[0081] Specifically, the cover ring 150 is provided with a third through hole 151, and the third through hole 151 communicates with the gap between the cover ring 150 and the wafer 101, so that the purge gas introduced by the air blowing hole 112 flows out through the third through hole 151, thereby preventing the purge gas from accumulating between the cover ring 150 and the wafer 101 and affecting the flow field distribution. Optionally, the third through hole 151 is an oblique hole, so that the purge gas flows out from the third through hole 151 at a preset flow rate. This can not only prevent the purge gas from accumulating between the cover ring 150 and the wafer 101 and affecting the flow field distribution, but also prevent the purge gas from entering the gap between the cover ring 150 and the wafer 101 to a certain extent, thereby preventing film formation on the edge region and back side of the wafer 101.

[0082] Optionally, the inner side 152 of the cover ring 150 is an annular inclined surface and is inclined inward from top to bottom to prevent process gas from accumulating in the edge area of ​​the wafer 101, further preventing film formation in the edge area and back of the wafer 101, but the present invention is not limited thereto.

[0083] On the other hand, combining Figures 9 to 12 As shown, this embodiment also provides a semiconductor processing apparatus, including: a reaction chamber 100 and a wafer carrier assembly as described above. A transfer port 102 for transferring the wafer 101 is provided on one side of the reaction chamber 100. The base 110 of the wafer carrier assembly is disposed at the bottom interior of the reaction chamber 100, and the first support member 120 is fixedly connected to the inner sidewall of the reaction chamber 100; a first opening 131 on the carrier ring 130 is disposed opposite to the transfer port 102, and the wafer 101 is adapted to be placed on the first carrier surface through the transfer port 102 and the first opening 131.

[0084] Specifically, the top of the reaction chamber 100 is also provided with a spray head 104 opposite to the base 110, for introducing process gas into the reaction chamber 100 to process the wafer 101. It can be understood that the process position is located above the wafer transfer port 102.

[0085] Specifically, the robotic arm 103 can pass through the transfer port 102 to lift the wafer 101 to be processed above the support ring 130 and descend through the first opening 131, thereby placing the wafer 101 to be processed on the first support surface. Furthermore, the robotic arm 103 can also pass through the transfer port 102 and through the first opening 131 to insert below the processed wafer 101, thereby lifting the processed wafer 101 above the support ring 130; and passing through the transfer port 102 to move the processed wafer 101 from above the support ring 130 to the preset position.

[0086] In summary, the wafer carrier assembly and semiconductor processing equipment provided in this embodiment, through the cooperation of a liftable base, a carrier ring, and a first support member, can support the wafer to be processed, lift the wafer to be processed to the process position, and place the processed wafer on the carrier ring supported by the first support member. The wafer carrier assembly provided in this embodiment can not only cooperate with a robotic arm to complete the corresponding wafer transfer operation, but also ensure the smooth progress of wafer processing. Furthermore, compared with the prior art technology that uses ejector pins to lift or lower the wafer and cooperate with a robotic arm to complete the wafer transfer operation, this embodiment does not require ejector pin holes to accommodate ejector pins in the center of the base. This ensures that the temperature field of the base is not affected, thereby ensuring the uniformity of the temperature distribution of the base, which in turn ensures the uniformity of the temperature distribution of the wafer, and thus ensures the uniformity of the wafer processing results, improving the wafer fabrication yield. In this embodiment, the base lifts the wafer by supporting the support ring, thus avoiding the wafer tilting caused by a single ejector pin getting stuck or being lower than the other ejector pins, as is common in existing technologies. This ensures the levelness of the wafer surface, thereby guaranteeing the uniformity of the wafer processing results and improving the wafer fabrication yield. Furthermore, in this embodiment, a second support is provided between the first support and the process position, and a cover ring is supported on the second support. The base rises, causing the support ring to pass through the second support and lift the cover ring, placing the cover ring above the wafer. This allows the cover ring to cover the edge area of ​​the wafer, preventing film formation on the edge area and back side of the wafer during processing, thus meeting process requirements.

[0087] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above content. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A wafer carrier component, characterized in that, include: Adjustable base; A support ring, located above the base, has a first support surface for supporting the wafer; The support ring is further provided with a first opening in its circumferential direction, and the wafer is adapted to be placed on the first support surface through the first opening; The first support member is fixed below the bearing ring and is used to support the bearing ring; The first support member has a first through hole with a diameter larger than the outer diameter of the base, and the base has a second bearing surface that supports the bearing ring, such that the base passes through the first through hole to lift the bearing ring on the first support member to place the wafer in the process position.

2. The wafer carrier assembly as described in claim 1, characterized in that, The centers of the first support member and the bearing ring are both located on the axis of the base.

3. The wafer carrier assembly as described in claim 1, characterized in that, One of the first support member and the bearing ring is provided with a first protrusion, and the other is provided with a first recess to accommodate the first protrusion.

4. The wafer carrier assembly as described in claim 1, characterized in that, The first bearing surface is the top surface of the bearing ring.

5. The wafer carrier assembly as described in claim 1, characterized in that, The inner side of the bearing ring is provided with a plurality of second protrusions extending radially inward therein; the plurality of second protrusions are spaced apart circumferentially along the bearing ring, and the top surface of the plurality of second protrusions constitutes the first bearing surface.

6. The wafer carrier assembly as described in claim 5, characterized in that, The base is provided with a second recess, and the bottom surface of the second recess is the second bearing surface; When the base lifts the support ring, the support ring is placed inside the second recess, and the wafer is placed on the top surface of the base and does not contact the support ring.

7. The wafer carrier assembly as described in claim 6, characterized in that, The height of the second recess is greater than the height of the second protrusion.

8. The wafer carrier assembly as described in claim 6, characterized in that, The second recess has an air hole on its side wall for introducing purging gas into the gap between the bearing ring and the base.

9. The wafer carrier assembly as described in claim 6, characterized in that, Also includes: The second support member is fixed between the first support member and the process position; A cover ring is disposed on the second support member; The second support has a third bearing surface for supporting the cover ring and a second through hole through which the bearing ring and the base pass; the inner diameter of the cover ring is smaller than the outer diameter of the wafer, so that the base rises and drives the bearing ring through the second through hole to lift the cover ring and the cover ring is located above the wafer.

10. The wafer carrier assembly as described in claim 9, characterized in that, The centers of the second support member and the cover ring are both located on the axis of the base.

11. The wafer carrier assembly as claimed in claim 9, characterized in that, The third bearing surface is the top surface of the second support member.

12. The wafer carrier assembly as described in claim 9, characterized in that, The inner side of the second support member is provided with a plurality of snap-fit ​​portions extending radially inward therein; the plurality of snap-fit ​​portions are spaced apart circumferentially along the second support member, and the top surface of the plurality of snap-fit ​​portions constitutes the third bearing surface.

13. The wafer carrier assembly as described in claim 9, characterized in that, One of the covering ring and the bearing ring is provided with a third protrusion, and the other is provided with a third recess to accommodate the third protrusion.

14. The wafer carrier assembly as claimed in claim 9, characterized in that, The height of the support ring is greater than the sum of the heights of the second recess and the wafer, so that there is a gap between the cover ring and the wafer when the support ring lifts the cover ring.

15. The wafer carrier assembly as described in claim 14, characterized in that, The cover ring has a third through hole, and the third through hole is connected to the gap between the cover ring and the wafer.

16. The wafer carrier assembly as described in claim 15, characterized in that, The third through hole is an oblique hole.

17. The wafer carrier assembly as claimed in claim 9, characterized in that, The inner surface of the cover ring is an annular inclined surface, and it is inclined inward from top to bottom.

18. The wafer carrier assembly as claimed in claim 1, characterized in that, The first support member has a second opening corresponding to the first opening.

19. A semiconductor processing apparatus, characterized in that, include: A reaction chamber, wherein a wafer transfer port for transferring the wafer is provided on one side of the reaction chamber; as well as The wafer carrier assembly as described in any one of claims 1 to 18; the base of the wafer carrier assembly is disposed at the bottom of the interior of the reaction chamber, the first support is fixedly connected to the inner sidewall of the reaction chamber; the first opening on the carrier ring is disposed opposite to the wafer transfer port, and the wafer is adapted to be placed on the first carrier surface through the wafer transfer port and the first opening.

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