Spraying equipment
By designing independent channels and vents in the spraying equipment to alternately introduce reactants and spacers, the problems of low production efficiency and poor quality in the existing technology have been solved, achieving a highly efficient coating process and improved product quality.
Patent Information
- Application Number
- CN202520055090.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-09
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2035-01-09
AI Technical Summary
Existing time-based atomic layer deposition equipment requires increased purging time to reduce residue when different reactive gases are introduced, resulting in low production efficiency and poor product quality.
A spraying device is designed, in which a first reactant and a spacer are introduced through a first channel and a second channel respectively. The spraying seat is provided with a first air hole and a second air hole that are spaced apart and adjacent, so that the reactant and the spacer are introduced alternately to avoid direct contact and mixing. The gas is uniformly distributed through a cover plate, a flow divider and a flow equalizer.
It improves production efficiency, avoids side reactions, ensures coating quality, and is applicable to coating processes of various reactants, thereby improving process cycle time and product quality.
Smart Images
Figure CN223906937U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor, especially relates to a spraying equipment. BACKGROUND
[0002] With the continuous improvement of chip integration, various component sizes are continuously shrinking, and the semiconductor industry technology node has entered the nanometer era. Correspondingly, people have put forward higher and higher requirements for nanometer film preparation technology compatible with semiconductor process.
[0003] ALD (Atomic layer deposition, atomic layer deposition) is a method that can absorb reactants in the form of single atoms on the substrate surface and react with other reactants, thereby realizing the plating of deposition on the substrate surface layer by layer. Compared with other deposition methods, atomic layer deposition can accurately control the film thickness, and in addition, the prepared thin film has good conformality, high purity and is more uniform, so it is favored in the field of thin film deposition.
[0004] In the semiconductor ALD film plating process, two or more gases are often introduced into the cavity at the same time for reaction, so different gases need to be separated before entering the cavity to avoid reaction in the non-reaction area and produce particulate matter to block the holes of the spraying device.
[0005] The existing time type atomic layer equipment usually uses the same spray head to introduce different reaction gases and purge gas alternately to achieve the separation effect. In order to reduce the residual amount of the front reaction gas in the channel and the spray head, it is necessary to increase the purge time, which causes the process cycle to be seriously lengthened, the production efficiency is low and the product quality is poor. UTILITY MODEL CONTENTS
[0006] The main purpose of the utility model is to provide a spraying equipment, which aims to solve the technical problem of how to ensure product quality while improving product production efficiency.
[0007] To achieve the above purpose, the utility model provides a spraying equipment, which comprises:
[0008] The first channel is used for introducing the first reactant or spacer;
[0009] The second channel is used for introducing the second reactant or spacer;
[0010] The spraying seat has a plurality of first gas holes communicating with the first channel and a plurality of second gas holes communicating with the second channel, each first gas hole and each second gas hole are arranged in intervals and adjacent to each other, each first gas hole is used for guiding the first reactant or the spacer to the semiconductor, and each second gas hole is used for guiding the second reactant or the spacer to the semiconductor;
[0011] wherein the first gas holes are connected to the first reactant, the second gas holes are connected to the spacer, and the second gas holes are connected to the second reactant.
[0012] In some embodiments, the showering apparatus further comprises:
[0013] a cover plate connected to a side of the showering seat facing away from the semiconductor, and the cover plate and the showering seat jointly defining a first accommodating cavity, each of the first gas holes being connected to the first accommodating cavity, and the first channel being connected to the first accommodating cavity.
[0014] In some embodiments, the showering apparatus further comprises a first connector for introducing the first reactant or the spacer into the first channel, the cover plate having a first interface and a first flow passage connected to the first interface, the first interface being connected to the first connector, and the first flow passage comprising a first main passage and a plurality of first sub-paths, each of the first sub-paths being connected to the first main passage and the first accommodating cavity, and each of the first sub-paths being spaced from each other.
[0015] In some embodiments, the showering apparatus comprises a first flow divider disposed in the first accommodating cavity, a first surface of the cover plate facing the showering seat, the first surface being penetrated by each of the first sub-paths, the first flow divider being disposed spaced from the first surface, and a projection of the first flow divider on a first projection plane covering each of the first sub-paths, the first projection plane being perpendicular to a direction in which the cover plate points to the showering seat.
[0016] In some embodiments, the showering apparatus further comprises a first flow uniformizer disposed between the first flow divider and the showering seat, the first flow uniformizer having a projection on the first projection plane covering each of the first gas holes, the first flow uniformizer having a plurality of adjacent gas slits, each of the gas slits being connected to the first accommodating cavity and the first gas holes.
[0017] In some embodiments, the showering apparatus further comprises a second connector for introducing the second reactant or the spacer into the second channel, and a second flow divider having a second flow passage connected to the second connector, the second flow divider being disposed on two sides of the cover plate adjacent to the showering seat, the second flow divider and the showering seat jointly defining a second accommodating cavity, the second accommodating cavity being connected to the second flow passage and the second gas holes.
[0018] In some embodiments, the second flow channel has a second main channel and a plurality of second sub-channels communicating with the second main channel, each of the second sub-channels is arranged at intervals with each other along the extension direction of the second main channel, and the second sub-channels communicate with the second accommodating cavity.
[0019] In some embodiments, the spraying device further comprises a second flow uniformizer arranged in the second accommodating cavity and at intervals with the second flow divider, the projection formed by the second projection plane on the second projection surface covers each of the second sub-channels, the second projection plane is perpendicular to the direction pointed by the second flow divider to the spraying seat, and there is a gap between the second flow uniformizer and the cavity wall of the second accommodating cavity to facilitate the second reactant or the spacer flowing from the second accommodating cavity into the second gas holes.
[0020] In some embodiments, the spraying seat has a plurality of cavities communicating with the second accommodating cavity, each of the cavities communicates with a plurality of the second gas holes, each of the second gas holes is arranged at intervals along the extension direction of the cavity, and the cavity is at intervals with the first gas holes.
[0021] In some embodiments, the spraying seat is provided with a sealing groove arranged around the outer circumferential side of the first accommodating cavity, and the spraying device comprises a sealing member clamped in the sealing groove and located between the cover plate and the spraying seat.
[0022] Compared with the prior art, the spraying device has the following beneficial effects:
[0023] In the technical scheme of the utility model, the spraying device comprises a first channel, a second channel and a spraying seat, wherein the first channel is used for introducing a first reactant or a spacer, and the second channel is used for introducing a second reactant or a spacer. The spraying seat has a plurality of first gas holes communicating with the first channel and a plurality of second gas holes communicating with the second channel. Each of the first gas holes is arranged at intervals and adjacent to each of the second gas holes. When the first gas holes introduce the first reactant, the second gas holes introduce the spacer, and when the second gas holes introduce the second reactant, the first gas holes introduce the spacer. Compared with the related art in which the reaction gas and the purge gas are introduced independently and sequentially, the present application eliminates the process of introducing the spacer alone, thereby improving the spraying efficiency. The design that the first gas holes and the second gas holes are at intervals, the first channel and the second channel are at intervals, and one of the first gas holes and the second gas holes introduces the reactant and the other introduces the spacer effectively prevents the direct contact and mixing of multiple reactants, thereby avoiding unnecessary side reactions and improving the quality of semiconductor film coating. BRIEF DESCRIPTION OF DRAWINGS
[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only show some of the embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from the structures shown in these drawings without any creative effort.
[0025] Figure 1 It is a structural schematic view of the first perspective of the spraying device in an embodiment of the present application.
[0026] Figure 2 It is a structural schematic view of the second perspective of the spraying device in an embodiment of the present application.
[0027] Figure 3 It is an enlarged schematic view of the local part A of the spraying device in an embodiment of the present application. Figure 2
[0028] Figure 4 It is an exploded schematic view of the spraying device in an embodiment of the present application.
[0029] Figure 5 It is a structural schematic view of the third perspective of the spraying device in an embodiment of the present application.
[0030] Figure 6 It is a sectional view of the spraying device in an embodiment of the present application along the direction of B-B. Figure 5
[0031] Figure 7 It is an enlarged schematic view of the local part C of the spraying device in an embodiment of the present application. Figure 6
[0032] Figure 8 It is a structural schematic view of the first perspective of the spraying seat in an embodiment of the present application.
[0033] Figure 9 It is a structural schematic view of the second perspective of the spraying seat in an embodiment of the present application.
[0034] Figure 10 It is a sectional view of the spraying seat in an embodiment of the present application along the direction of D-D. Figure 9
[0035] Figure 11 It is a structural schematic view of the second perspective of the spraying seat in another embodiment of the present application.
[0036] Figure 12 It is a sectional view of the spraying seat in an embodiment of the present application along the direction of D-D. Figure 11 A sectional view in the direction of E-E; wherein the spray seat has a cavity communicating with the second accommodating cavity, and the second air hole communicates with the cavity;
[0037] Figure 13 A structure schematic view of the cover plate in an embodiment of the utility model;
[0038] Figure 14 A structure schematic view of the cover plate in an embodiment of the utility model along Figure 13 A sectional view in the direction of F-F;
[0039] Figure 15 A structure schematic view of the cover plate in an embodiment of the utility model along Figure 14 A sectional view in the direction of E-E; wherein the cover plate has a first flow channel communicating with the first accommodating cavity, and the first flow channel has a first main channel and a plurality of first branch channels communicating with the first main channel.
[0040] Explanation of reference numerals:
[0041] The spray device 100;
[0042] The spray seat 110; the first air hole 111; the second air hole 112; the cavity 113; the sealing groove 114;
[0043] The cover plate 120; the first accommodating cavity 121; the first flow channel 122; the first main channel 1221; the first branch channel 1222; the first surface 123;
[0044] The first flow dividing member 130;
[0045] The first flow uniformizing member 140; the air slit 141;
[0046] The second flow dividing member 150; the second flow channel 151; the second accommodating cavity 152;
[0047] The second flow uniformizing member 160; the second connector 170.
[0048] The realization, functional features and advantages of the utility model will be further described with reference to the drawings in combination with embodiments. DETAILED DESCRIPTION
[0049] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.
[0050] Please refer to Figures 1 to 15The utility model provides a kind of spraying equipment 100, it is applicable to the semiconductor is sprayed to realize surface coating film accordingly.This spraying equipment 100 includes first channel, second channel and spraying seat 110.Wherein, first channel is used to let in first reactant or spacer, and second channel is used to let in second reactant or spacer.It needs to be explained, first reactant, second reactant can be the mixture of gas and solid.Spraying seat 110 is equipped with multiple first gas holes 111 and multiple second gas holes 112, each first gas hole 111 is communicated with first channel, each second gas hole 112 is communicated with second channel.Specifically, each first gas hole 111 and each second gas hole 112 are arranged in spraying seat 110 in the way of interval and adjacent, ensure when first gas hole 111 let in first reactant, second gas hole 112 can let in spacer;Conversely, when second gas hole 112 let in second reactant, first gas hole 111 let in spacer.This alternating mode of working, which let in first reactant and second reactant, can effectively prevent multiple reactants from directly contacting and mixing, thereby avoiding unnecessary side reactions, improve the selectivity and efficiency of reaction.
[0051] It needs to be explained, when first gas hole 111 let in first reactant, second gas hole 112 let in spacer can effectively avoid the situation that second channel is contaminated due to the backflow of first reactant from second gas hole 112 into second channel.And when second gas hole 112 let in second reactant, first gas hole 111 let in spacer, which can prevent second reactant from backflowing from first gas hole 111 to first channel.In the present application, second reactant can be let in while spacer is let in for purging, compared with the scheme in the prior art, which let in precursor, then let in purge gas for a long time, and then let in rear body, the present application effectively saves the time of spacer, thereby improving the process rhythm of semiconductor, and further improving production efficiency.Because first reactant and second reactant are respectively let in by independent first gas hole 111 and second gas hole 112, the side reaction of first reactant and second reactant in non-reaction area is effectively avoided, so that the contamination of first gas hole 111, second gas hole 112, first channel and second channel is avoided, and the coating quality of semiconductor is affected.
[0052] In addition, the scheme of the present application can also be applied to the manufacture of semiconductors that require multiple (at least three) reactants for coating. Specifically, since the second gas hole 112 is used to introduce the second reactant, the first gas hole 111 is used to introduce the spacer, and under the purging action of the spacer, the first gas hole 111 and the first channel can effectively clean the first reactant remaining in the previous process (i.e., the process in which the first gas hole 111 is used to introduce the first reactant). Thus, after the second reactant is introduced, the first gas hole 111 can be used to introduce the third reactant, and the second gas hole 112 can be used to introduce the spacer, which can clean the second gas hole 112 and the second channel while preventing the reactant from flowing backward. When the third reactant is introduced, the second gas hole 112 can be used to introduce the fourth reactant, and the first gas hole 111 can be used to introduce the spacer, and so on. In this way, the spray device of the present application is more suitable and greatly improves the coating efficiency of the semiconductor.
[0053] In some implementations, in order to ensure uniform distribution of the gas flow, the first gas holes 111 can be arranged in a spiral or grid pattern to ensure that the gas can uniformly cover the surface of the semiconductor. The second gas holes 112 are spaced apart from the first gas holes 111, and the second gas holes 112 can also be arranged in a spiral or grid pattern. The first gas holes 111 and the second gas holes 112 can be arranged alternately. In addition, in order to further optimize the speed and direction of the gas flow, improve the contact effect between the reactant and the semiconductor, and thus improve the process quality, the size and spacing of each gas hole can be adjusted. In addition, a temperature sensor and a flow controller can be integrated into the spray seat 110 to realize real-time monitoring and adjustment of the temperature and flow of the introduced reactant. This not only helps to maintain stable process conditions, but also allows flexible adjustment of parameters according to actual needs to adapt to different types of semiconductor manufacturing needs.
[0054] Please refer to Figure 1 and Figure 4 In some embodiments, the spray device 100 further includes a cover plate 120 connected to the side of the spray seat 110 away from the semiconductor and defining a first containing cavity 121 together with the spray seat 110. All first gas holes 111 communicate with the first containing cavity 121, and the first channel also communicates with the first containing cavity 121, so that the first reactant or spacer can flow from the first channel and then be uniformly distributed onto the semiconductor through the first gas holes 111. The first containing cavity 121 plays a buffering and equalizing role, which can balance the pressure fluctuations of the first reactant or spacer introduced from the first channel, ensuring that the gas stably passes through each first gas hole 111 to the surface of the semiconductor. This helps to reduce the problem of uneven gas flow caused by pressure changes, ensuring the consistency of the process. The design of the cover plate 120 can provide an additional protective barrier to prevent external impurities from entering and affecting the spraying process.
[0055] In some embodiments, to enhance the sealing performance, an elastic sealing gasket or other forms of sealing device can be added between the cover plate 120 and the shower seat 110. Such sealing measures can effectively prevent external impurities from entering and internal gas from leaking, thus maintaining the cleanliness and safety of the working environment. In addition, it is also possible to consider using transparent materials to make part of the cover plate 120, so as to facilitate observation of the internal situation and timely discovery and solution of possible problems.
[0056] In some embodiments, the shower device 100 further comprises a first connector designed to be able to introduce a first reactant or spacer into the first channel. The cover plate 120 is provided with a first interface and a first flow channel 122 communicating with the first interface, which communicates with the first connector, ensuring that the substances provided from the outside can smoothly enter the inside of the system. Please refer to Figures 13 to 15 , the first flow channel 122 has a first main channel 1221 and a plurality of first branch channels 1222, wherein each first branch channel 1222 is connected to the first main channel 1221, and the first branch channel 1222 is ultimately communicated to the first containing cavity 121, and each first branch channel 1222 is arranged at intervals. Specifically, when the first connector introduces the first reactant or spacer, these substances will first enter the first main channel 1221, and then be uniformly distributed to each first branch channel 1222, and then flow from the first branch channel 1222 into the first containing cavity 121. This process ensures that the substances have been preliminarily homogenized before entering the first containing cavity 121, thereby improving the consistency and stability of the distribution of substances in the subsequent spraying process. In addition, such a multi-branch design also helps to reduce pressure loss, so that the shower device can maintain stable delivery performance even under high flow conditions.
[0057] In some embodiments, it is possible to consider adding a flow regulating device or a temperature control unit in the first flow channel 122 to adapt to different process condition requirements. For example, for some temperature-sensitive chemical substances, heating wires or cooling pipes can be installed in the first flow channel 122 to adjust their temperature; or adjustable valves can be set at the first branch channel 1222 to accurately regulate the flow rate ratio of each branch, achieving more precise process control.
[0058] Please refer to Figure 4In some embodiments, the showering apparatus 100 further comprises a first flow divider 130, which is located in the first accommodating cavity 121 and is spaced apart from the first surface 123 of the cover plate 120 facing the showering seat 110. The first surface 123 is penetrated by the first flow channels 1222, so that the first reactant or spacer can flow from the first flow channels 1222 into the first accommodating cavity 121. The first flow divider 130 completely covers the openings of all the first flow channels 1222 in the projection formed by the first projection surface. The first projection surface is perpendicular to the direction of the cover plate 120 pointing to the showering seat 110. Thus, the first flow divider 130 can further disperse the substance from the first flow channels 122 in the first accommodating cavity 121, so as to make it more evenly distributed on the showering seat 110. In this way, it can effectively avoid the phenomenon of local over-concentration, and ensure that each first gas hole 111 can obtain the same quality of substance supply. This not only helps to improve the showering efficiency, but also reduces the risk of product defects caused by uneven spraying.
[0059] In some embodiments, the cross-sectional shape of the first accommodating cavity 121 formed in the plane perpendicular to the extension direction of the first main channel 1221 includes but is not limited to trapezoidal, triangular, polygonal, and irregular shapes formed by splicing various geometric shapes. Alternatively, the first accommodating cavity 121 has two inclined surfaces arranged oppositely, and the two ends of the first flow divider 130 are respectively close to the two inclined surfaces and have gaps between the two inclined surfaces. Thus, after the first reactant or spacer flows out of the first flow channels 1222, it is blocked by the first flow divider 130 and flows to the showering seat 110 from the gap, thereby achieving the effect of uniformity again. In some embodiments, in order to avoid the reaction between the first reactant and the first flow divider 130, the first flow divider 130 can be made of metal material.
[0060] Please refer to Figure 4 and Figure 6In some embodiments, the shower device 100 further comprises a first flow uniformer 140. The first flow uniformer 140 is disposed between the first flow divider 130 and the shower seat 110, and the first flow divider 130 forms a projection covering all the first gas holes 111. Specifically, the first flow uniformer 140 is located in the first accommodating cavity 121, and has a plurality of adjacent and spaced gas slits 141 that communicate the first accommodating cavity 121 and the first gas holes 111. The design of the first flow uniformer 140 ensures that the material flowing from the first accommodating cavity 121 is evenly distributed to each of the first gas holes 111 through the gas slits 141. This helps to achieve the last homogenization process of the material before entering the shower seat 110, ensuring that each of the first gas holes 111 receives the same quality of material supply, thereby improving the consistency and reliability of the spraying process. In addition, the presence of the first flow uniformer 140 also plays a buffering role, which can reduce the flow fluctuations caused by sudden pressure changes, ensuring the stability of material delivery.
[0061] In some embodiments, the first flow uniformer 140 can be made of corrosion-resistant, high-precision metal or ceramic materials to adapt to different chemical environments and improve service life. For the design of the gas slits 141, the flow characteristics of the material can be adjusted by changing their width, length, or arrangement, such as using spiral, grid, or other special forms of gas slit 141 layout to meet specific process requirements. In addition, a fine adjustment mechanism can also be introduced to allow users to make subtle adjustments to the size of the gas slit 141 opening according to actual use, in order to better control the flow and distribution of the material.
[0062] Please refer to Figure 4 and Figure 6 In some embodiments, the shower device 100 further comprises a second joint 170 and a second flow divider 150. The second joint 170 is used to introduce a second reactant or spacer into the second channel, and the second flow divider 150 has a second flow channel 151 that communicates with the second joint 170. Among them, the second flow divider 150 is located on the adjacent two sides of the shower seat 110 with the cover plate 120, avoiding the mutual interference of the first flow channel 122 and the second flow channel 151, while making full use of the structure of the shower seat 110. The second flow divider 150 and the shower seat 110 together define a second accommodating cavity 152 that directly communicates the second flow channel 151 and the second gas holes 112.
[0063] When the second reactant or spacer is introduced into the system by the second joint 170, the substances will first pass through the second flow channel 151 and be guided into the second holding cavity 152, and then be uniformly dispersed and directed to the semiconductor through the second gas holes 112. Such a design not only simplifies the internal fluid path, but also helps to maintain stable fluid pressure, so that the reactants can be more smoothly delivered to the target position. In addition, the second flow divider 150 is separated from the cover plate 120 on different sides of the shower seat 110, which effectively avoids potential interference between different reactants, ensuring the safety and effectiveness of the spraying process.
[0064] In some embodiments, in order to enhance the flexibility and adaptability of the system, a flow monitoring device or temperature control system can be integrated in the second flow channel 151 to cope with different types of reactants or process conditions. For example, a flow sensor can be installed on the second flow divider 150 to monitor the flow state of the substances in real time; or a heating / cooling unit can be added to adjust the temperature of the substances to ensure optimal reaction conditions. At the same time, considering the need for cleaning and maintenance, the second flow divider 150 can also be designed as a modular component for easy disassembly and replacement, reducing the long-term maintenance cost.
[0065] In some embodiments, the second flow channel 151 includes a second main channel and a plurality of second branch channels connected to the second main channel. Each second branch channel is arranged separately along the extension direction of the second main channel, and each second branch channel is connected to the second holding cavity 152. Specifically, when the second reactant or spacer is introduced by the second joint 170, the substances first enter the second main channel, where they are preliminarily distributed, and then are guided into the second holding cavity 152 through each second branch channel. This multi-branch design ensures that the substances can be uniformly distributed before entering the second holding cavity 152, thereby improving the consistency and stability of the subsequent spraying process. In addition, such a layout helps to reduce pressure loss, so that stable delivery performance can be maintained even under high flow conditions.
[0066] In order to further improve the homogenization effect, a buffer zone or a mixer can be provided at the connection between the second main channel and the second branch channel to promote the thorough mixing of substances between different branches and ensure that each second gas hole 112 can obtain the same quality of substance supply.
[0067] In some embodiments, flow regulating devices or temperature control units can be added to the second flow channel 151 to adapt to different process condition requirements. For example, for certain temperature-sensitive chemical substances, heating wires or cooling tubes can be installed in the second flow channel 151 to adjust their temperature; or adjustable valves can be provided at the second branch channels to accurately regulate the flow rate ratio of each branch, achieving more precise process control.
[0068] Please refer to Figure 4 andFigure 7 In some embodiments, the showering apparatus 100 further comprises a second flow uniformizer 160. The second flow uniformizer 160 is located within the second accommodating cavity 152 and is spaced apart from the second flow divider 150. The second flow uniformizer 160 forms a projection covering all the openings of the second flow channels in a second projection plane, wherein the second projection plane is perpendicular to the direction pointed by the second flow divider 150 towards the showering seat 110. There is a gap between the second flow uniformizer 160 and the cavity wall of the second accommodating cavity 152, which facilitates the flow of the second reactant or spacer through the gap into the second gas holes 112. Specifically, there is a gap between the two sides of the second flow uniformizer 160 parallel to the direction pointed by the cover plate 120 towards the showering seat 110 and the cavity wall of the second accommodating cavity 152, and there is a gap between the side of the second flow uniformizer 160 facing away from the second flow divider 150 and the cavity wall of the second accommodating cavity 152, so that the second gas holes 112 can communicate with the second flow channels through these gaps. While the second reactant or spacer is blocked by the second flow uniformizer 160, the internal substances can be more uniform, and the gas flow can be buffered while the gas flow pressure entering each second gas hole 112 is equivalent.
[0069] In other words, the main function of the second flow uniformizer 160 is to further disperse the substances from the second flow channels 151 within the second accommodating cavity 152, so that they are more uniformly distributed on the showering seat 110. In this way, it can effectively avoid the phenomenon of local over-concentration, and ensure that each second gas hole 112 can obtain the same quality of substance supply. This not only helps to improve the spraying efficiency, but also reduces the risk of product defects caused by uneven spraying. In order to optimize the effect of the second flow uniformizer 160, materials with good corrosion resistance and mechanical strength can be selected to manufacture it, including but not limited to stainless steel, ceramics, etc. In addition, considering the maintenance cost of long-term use, the second flow uniformizer 160 can also be designed in a form that is easy to disassemble and replace, which facilitates regular cleaning or replacement of damaged parts. In this way, not only can the high-performance operation of the system be maintained, but also the difficulty and cost of maintenance can be reduced.
[0070] Please refer to Figure 8 and Figure 12 In some embodiments, the showering seat 110 has a plurality of cavities 113 communicating with the second accommodating cavity 152. Each cavity 113 communicates with a plurality of second gas holes 112, which are spaced apart along the extension direction of the cavity 113 and are spaced apart from the first gas holes 111. This design ensures that the substances flowing from the second accommodating cavity 152 can be uniformly distributed to each second gas hole 112 through the cavity 113, and then directed to the semiconductor surface.
[0071] Specifically, after the second reactant or spacer is introduced by the second joint 170, it sequentially passes through the second flow channel 151, the second flow uniformizing member 160, and the second accommodating cavity 152, and finally enters the cavity 113 in the shower seat 110. Since each cavity 113 is connected to a plurality of second gas holes 112, further dispersion of the substance (second reactant or spacer) can be achieved, ensuring that each second gas hole 112 can obtain stable and consistent supply of the substance. Such a layout helps to improve the consistency and reliability of the spraying process, while avoiding the problems of local over-concentration or uneven distribution, thereby improving the quality control level of the process.
[0072] To optimize the substance flow path, a flow guide plate can be arranged inside the cavity 113 or its geometry can be adjusted, for example, by using different cross-sectional designs such as circular, elliptical, or polygonal shapes, to adapt to specific process requirements. In addition, it is also possible to consider opening small auxiliary holes on the wall surface of the cavity 113 for pressure balance adjustment, to prevent flow fluctuations caused by sudden pressure changes and ensure smooth operation of the entire system.
[0073] Please refer to Figures 8 to 12 In some embodiments, the shower seat 110 is provided with a sealing groove 114 surrounding the outer peripheral side of the first accommodating cavity 121. The shower device 100 further includes a sealing member clamped in the sealing groove 114 and located between the cover plate 120 and the shower seat 110. The design of the sealing groove 114 and the sealing member is intended to ensure the sealing of the first accommodating cavity 121, prevent impurities from the external environment from entering and internal substances from leaking, and maintain the purity and stability of the system.
[0074] Specifically, the sealing groove 114 can be designed in the shape of a ring or other appropriate shapes around the first accommodating cavity 121. The sealing member can be made of materials with good elasticity and chemical corrosion resistance, including but not limited to rubber, silicone, or other special elastomers. When installed, the sealing member tightly fits in the sealing groove 114, forming an effective barrier to prevent any factors that may affect the process from invading. In addition, the sealing member also has a certain compression recovery ability, which can maintain good sealing effect after being subjected to a certain pressure, even under harsh conditions such as high temperature and high pressure, to ensure reliable operation of the system.
[0075] In order to further improve the sealing performance, a lubricant or coating can be added between the sealing groove 114 and the sealing member to reduce friction resistance and prolong service life. At the same time, a double or even multiple sealing structure can also be used, that is, multiple sealing members are arranged at the same position to provide a higher level of protection and ensure that there is no risk of leakage. The sealing groove 114 can adopt an asymmetric structure or a form with a guide slope to facilitate the installation and removal of the sealing member. In this way, not only the assembly efficiency can be improved, but also various complex working conditions can be better adapted to ensure that the spraying device 100 is always in the best working state.
[0076] In some embodiments, the circumferential side of the second accommodating cavity 152 is also provided with a sealing structure, which can adopt a structure of a sealing ring matched with a groove, or other structures with sealing effect.
[0077] It should be noted that if the embodiments of the utility model have directionality indications (such as up, down, left, right, front, back, etc.), the directionality indications are only used to explain the relative position relationship, movement condition, etc. between the components in a certain posture, and if the certain posture changes, the directionality indications also change accordingly.
[0078] In addition, if the embodiments of the utility model have descriptions of "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one of the features. In addition, if "and / or", "and / or", or "and / or" appears throughout the text, it means that the three parallel schemes are included, for example, "A and / or B" includes A scheme, or B scheme, or A and B simultaneously satisfy the scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary skilled persons in the art, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist and is not within the scope of protection of the utility model.
[0079] The above is only the preferred embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structural transformation made by the utility model specification and the drawings, or direct / indirect application in other related technical fields under the utility model concept of the utility model is included in the patent protection range of the utility model.
Claims
1. A sprinkler apparatus, characterized by, Suitable for semiconductor, comprising: a first channel for feeding a first reactant or a spacer; a second channel for feeding a second reactant or a spacer; a shower seat having a plurality of first air holes communicating with the first channel and a plurality of second air holes communicating with the second channel, each of the first air holes and each of the second air holes are arranged in a spaced and adjacent manner, each of the first air holes is used to guide the first reactant or the spacer to the semiconductor, and each of the second air holes is used to guide the second reactant or the spacer to the semiconductor; wherein the first air holes are fed with the first reactant while the second air holes are fed with the spacer, and the second air holes are fed with the second reactant while the first air holes are fed with the spacer.
2. The shower apparatus of claim 1, wherein Further comprising: a cover plate connected to a side of the shower seat away from the semiconductor, and the cover plate and the shower seat jointly define a first accommodating cavity, each of the first air holes communicates with the first accommodating cavity, and the first channel communicates with the first accommodating cavity.
3. The shower device of claim 2, wherein the shower device further comprises a first connector for feeding the first reactant or the spacer to the first channel, the cover plate has a first interface and a first flow channel communicating with the first interface, the first interface communicates with the first connector, and the first flow channel comprises a first main channel and a plurality of first branch channels, each of the first branch channels communicates with the first main channel and the first accommodating cavity, and each of the first branch channels is spaced from each other.
4. The shower device of claim 3, wherein the shower device comprises a first flow divider arranged in the first accommodating cavity, a first surface of the cover plate faces the shower seat, the first surface is penetrated by each of the first branch channels, the first flow divider is arranged in a spaced manner with the first surface, and a projection of the first flow divider on a first projection plane covers each of the first branch channels, the first projection plane is perpendicular to a direction pointing from the cover plate to the shower seat.
5. The shower device of claim 4, wherein the shower device further comprises a first flow uniformizer arranged between the first flow divider and the shower seat, a projection of the first flow uniformizer on the first projection plane covers each of the first air holes, and the first flow uniformizer has a plurality of adjacent air slits, each of the air slits communicates with the first accommodating cavity and the first air holes.
6. The shower device of claim 2, wherein the shower device further comprises a second connector for feeding the second reactant or the spacer to the second channel and a second flow divider, the second flow divider has a second flow channel communicating with the second connector, the second flow divider is arranged on two sides of the cover plate adjacent to the shower seat, and the second flow divider and the shower seat jointly define a second accommodating cavity, the second accommodating cavity communicates with the second flow channel and the second air holes.
7. The shower device of claim 6, wherein The second flow channel has a second main channel and a plurality of second sub-channels communicating with the second main channel, each of the second sub-channels being arranged apart from each other along the extension direction of the second main channel, and the second sub-channels communicating with the second accommodating cavity.
8. The shower device according to claim 7, wherein The shower device further comprises a second flow uniformizer arranged in the second accommodating cavity and spaced apart from the second flow divider, the second flow uniformizer forms a projection on a second projection plane, the projection covers each of the second sub-channels, the second projection plane is perpendicular to the direction of the second flow divider pointing to the shower seat, and a gap exists between the second flow uniformizer and the cavity wall of the second accommodating cavity to facilitate the second reactant or the spacer flowing from the second accommodating cavity into the second gas holes.
9. The shower device according to claim 8, wherein The shower seat has a plurality of cavities communicating with the second accommodating cavity, each of the cavities communicates with a plurality of the second gas holes, each of the second gas holes is arranged apart along the extension direction of the cavity, and the cavity is spaced apart from the first gas hole.
10. The shower device according to claim 2, wherein The shower seat is provided with a sealing groove arranged around the outer circumferential side of the first accommodating cavity, and the shower device comprises a sealing member clamped in the sealing groove and located between the cover plate and the shower seat.