Cooling system and server device

Abstract

The utility model provides a cooling system and a server device. According to one example of the application, the cooling system comprises: a pump device comprising at least two pump units, each pump unit comprising a driving assembly and a working chamber, the driving assembly being used for pressurizing a cooling liquid flowing through the working chamber; the working cavities of every two adjacent pump units communicate with each other. The control module is connected with the driving assembly of the pump unit; when the driving assembly of one pump unit breaks down, the control module is used for controlling the driving assembly of the other pump unit to work, so that cooling liquid can flow through the working cavities of the multiple adjacent pump units. The scheme can improve the reliability of the cooling system.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of server cooling, in particular to a cooling system and a server device. BACKGROUND

[0002] Many hardware components in a server system, such as central processing units (CPUs), graphics processing units (GPUs), motherboard chipsets, etc., will generate heat during operation. Cooling systems are used to carry away the heat generated by these heat-generating components so that the server system can operate at an appropriate temperature.

[0003] However, the pump device of the liquid cooling type cooling system is usually a single water pump. When the single water pump fails, the cooling liquid in the cooling system cannot circulate normally, so that the heat cannot be effectively conducted from the heat-generating components (such as CPUs, GPUs, etc.) to the heat sink for heat dissipation, resulting in over-temperature operation of the heat-generating components and affecting the normal operation of the server system. SUMMARY

[0004] The present application provides a cooling system and a server device, which can improve the reliability of the cooling system, so that the cooling liquid in the cooling system can circulate normally when a single water pump fails.

[0005] In a first aspect, the present application provides a cooling system, comprising:

[0006] A pump device comprising at least two pump units, the pump unit comprising a driving assembly and a working cavity, the driving assembly being used to pressurize the cooling liquid flowing through the working cavity; wherein the working cavities of two adjacent pump units are communicated;

[0007] A control module connected with the driving assembly of the pump unit; wherein when the driving assembly of one of the pump units fails, the control module is used to control the driving assembly of another pump unit to work, so that the cooling liquid can flow through the working cavities of adjacent pump units.

[0008] Optionally, the pump device comprises two pump units, the two pump units being a first pump and a second pump respectively, one inlet and outlet pump port of the first pump being connected in series with one inlet and outlet pump port of the second pump, so that the working cavity of the first pump and the working cavity of the second pump are communicated.

[0009] Optionally, the cooling system further comprises a liquid cooling plate, the liquid cooling plate being connected in series with the pump device, the liquid cooling plate, the first pump and the second pump being sequentially stacked along the thickness direction of the liquid cooling plate.

[0010] Optionally, the cooling system further comprises a liquid cooling plate, a heat exchanger and a delivery circuit, the liquid cooling plate, the heat exchanger and the pump device being sequentially connected in series in the delivery circuit.

[0011] Optionally, the cooling system further comprises a temperature sensor configured to detect temperature information of the cooling system.

[0012] The cooling system has a first working condition and a second working condition, and the control module is configured to control the cooling system to switch between the first working condition and the second working condition according to the temperature information.

[0013] When the temperature information is less than a preset temperature, the control module is configured to control the driving assembly of the pump unit to operate in a forward direction, so that the cooling system is in the first working condition, and the cooling liquid in the delivery circuit sequentially flows through the heat exchanger, the pump device and the liquid cooling plate.

[0014] When the temperature information is greater than or equal to the preset temperature, the control module is configured to control the driving assembly of the pump unit to operate in a reverse direction, so that the cooling system is in the second working condition, and the cooling liquid in the delivery circuit sequentially flows through the heat exchanger, the liquid cooling plate and the pump device.

[0015] Optionally, the temperature information of the cooling system comprises any one of the following:

[0016] The surface temperature of the liquid cooling plate, the temperature of the cooling liquid in the liquid cooling plate, the surface temperature of the heat exchanger, the temperature of the cooling liquid in the heat exchanger, the temperature of the cooling liquid in the delivery circuit, the temperature of the heat generating element, and the temperature of the cooling liquid at the inlet and outlet pump port positions of the pump unit.

[0017] Optionally, a wire placement space is formed between the first pump and the second pump in the thickness direction of the liquid cooling plate.

[0018] Optionally, at least one of the housing of the first pump and the housing of the second pump is provided with a groove, and the groove extends in the thickness direction of the liquid cooling plate to form the wire placement space.

[0019] Optionally, one side of the first pump is provided with one inlet and outlet pump port and two grooves, the two grooves are arranged in a spaced manner in a first direction, and the inlet and outlet pump port is located in the gap between the two grooves arranged in a spaced manner; the first direction is perpendicular to the thickness direction of the liquid cooling plate; and / or,

[0020] One side of the second pump is provided with one inlet and outlet pump port and two grooves, the two grooves are arranged in a spaced manner in a first direction, and the inlet and outlet pump port is located in the gap between the two grooves arranged in a spaced manner; the first direction is perpendicular to the thickness direction of the liquid cooling plate.

[0021] Optionally, the pump device comprises a connecting frame, and the connecting frame connects the liquid cooling plate and the second pump.

[0022] Optionally, the liquid cooling plate comprises a first inlet and outlet and a second inlet and outlet, the first inlet and outlet and the second inlet and outlet extend along the thickness direction of the liquid cooling plate, and the first pump is arranged against the first inlet and outlet and the second inlet and outlet.

[0023] Optionally, the pump device comprises a housing provided with a cooling flow channel, each pump unit is arranged in the housing, and the working cavity of each pump unit is located in the cooling flow channel.

[0024] Optionally, the pump device comprises two pump units, which are a first pump unit and a second pump unit respectively.

[0025] The drive assembly of the first pump unit comprises a first power shaft and a first rotor, the first rotor is rotatably arranged in the cooling flow channel and connected to the first power shaft.

[0026] The drive assembly of the second pump unit comprises a second power shaft and a second rotor, the second rotor is rotatably arranged in the cooling flow channel and connected to the second power shaft.

[0027] Optionally, the control module is configured to control the drive assemblies of the at least two pump units to alternately operate; or,

[0028] The control module is configured to control the drive assemblies of the at least two pump units to synchronously operate at a first power, wherein the first power is less than the maximum operating power of any drive assembly of the pump units.

[0029] Optionally, the control module is configured to obtain the operating states of the drive assemblies of the at least two pump units.

[0030] When the drive assemblies of the at least two pump units can normally operate, the control module is configured to control the drive assemblies of the at least two pump units to alternately operate or synchronously operate at a second power.

[0031] When one of the drive assemblies of the at least two pump units fails, the control module is configured to control the other of the drive assemblies of the at least two pump units to operate at a third power.

[0032] The third power is greater than the second power.

[0033] In a second aspect, the present application provides a server device, comprising:

[0034] A heat generating element;

[0035] The cooling system of any one of the above, further comprising a liquid cooling plate, a heat exchanger and a delivery circuit.

[0036] The liquid cooling plate is connected to the heat generating element, and the liquid cooling plate, the heat exchanger and the pump device are connected in series in the delivery circuit.

[0037] The cooling system and the server device provided by the present application have at least the following advantages:

[0038] When one of the pump units of the pump device fails, the control module can control the other at least one pump unit to continue to operate, so that the cooling liquid can flow through the working cavities of the adjacent pump units, and the normal pump unit can continue to pressurize the cooling liquid, thereby ensuring that the cooling liquid can circulate in the cooling system and improving the reliability of the cooling system. BRIEF DESCRIPTION OF DRAWINGS

[0039] Figure 1 FIG. 1 is a schematic structural diagram of a server device according to an embodiment;

[0040] Figure 2 FIG. 2 is a schematic structural diagram of a pump device according to an example embodiment;

[0041] Figure 3 FIG. 3 is a schematic structural diagram of an arrangement of the pump device and the liquid cooling plate according to an embodiment;

[0042] Figure 4 FIG. 4 is a schematic structural diagram of an arrangement of the pump device and the liquid cooling plate according to another embodiment;

[0043] Figure 5 FIG. 5 is a schematic structural diagram of a cooling system according to an embodiment;

[0044] Figure 6 FIG. 6 is a connection diagram of the cooling system according to an embodiment;

[0045] Figure 7 FIG. 7 is a structural diagram of the cooling system in a first working condition according to an embodiment;

[0046] Figure 8 FIG. 8 is a structural diagram of the cooling system in a second working condition according to an embodiment;

[0047] Figure 9 FIG. 9 is a schematic structural diagram of a server device according to another embodiment;

[0048] Figure 10 FIG. 10 is a perspective view of a pump device according to another embodiment;

[0049] REFERENCE SIGNS:

[0050] 10, pump device; 11, pump unit; 111, first and second pump ports; 12, first pump; 121, first pump port; 122, second pump port; 13, second pump; 131, third pump port; 132, fourth pump port; 14, groove; 15, first rotor; 16, second rotor; 20, liquid cooling plate; 21, first inlet and outlet; 22, second inlet and outlet; 30, heat exchanger; 40, delivery circuit; 50, heat generating element. DETAILED DESCRIPTION

[0051] The technical solutions in the embodiments (or, modes of implementation) of the present application will be described clearly and completely below with reference to the drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated.

[0052] If the application embodiments involve directional indications or positional relationships (such as up, down, left, right, front, back, inner, outer, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are used only to explain the relative positional relationship, movement, etc. between the components in a certain posture (as shown in the drawings); if the posture changes, the directional indications or positional relationships also change accordingly. In addition, the terms "first", "second", etc. in the application embodiments are used only for convenience of description, and cannot be understood as indicating or implying relative importance.

[0053] The present application provides a cooling system and a server device, which will be described in detail below with reference to the drawings. The features in the following embodiments and modes of implementation can be combined with each other without conflict.

[0054] Please refer to Figure 1 , Figure 1 is a partial structure diagram of a server device according to an example embodiment.

[0055] The server device includes a heat generating element 50 and a cooling system.

[0056] The cooling system is used to absorb the heat generated by the heat generating element 50, thereby cooling the heat generating element 50. The heat generating element 50 can be, but is not limited to, a CPU or a GPU.

[0057] The cooling system includes a pump device 10, a liquid cooling plate 20, a heat exchanger 30, and a delivery circuit 40. The liquid cooling plate 20, the heat exchanger 30, and the pump device 10 are connected in series in the delivery circuit 40 to form a complete heat dissipation chain.

[0058] The conveying loop 40 can include multiple pipes to connect the liquid cooling plate 20, the heat exchanger 30 and the pump device 10 in series to form a closed circulation loop. The liquid cooling plate 20 is a component in direct contact with the heat generating element 50 and can quickly absorb the heat generated by the heat generating element 50 (such as CPU, GPU, etc. in a computer). The heat generating element 50 conducts heat to the liquid cooling plate 20, and the cooling liquid inside the liquid cooling plate 20 absorbs the heat and increases in temperature. The heat exchanger 30 is a heat exchange device, and the cooling liquid that has absorbed heat can transfer heat to an external medium (external air, etc.) at the heat exchanger 30, thereby achieving cooling of the cooling liquid itself to return to the liquid cooling plate 20 for heat absorption. The heat exchanger 30 can be a forced air cooling heat exchanger, including heat dissipation fins and a fan, and the fan can cool the cooling liquid on the heat dissipation fins with external air. The fan can be an exhaust fan or a suction fan, and the present application does not make specific limitations thereto. The pump device 10 is used to provide sufficient power for the cooling liquid to overcome the resistance in the conveying loop 40 and other factors, so that the cooling liquid can circulate between the liquid cooling plate 20 and the heat exchanger 30.

[0059] Please refer to Figure 2 and combine Figure 1 , Figure 2 is a structural schematic diagram of a pump device shown in an exemplary embodiment.

[0060] The cooling system further includes a control module (not shown).

[0061] The pump device 10 includes at least two pump units 11, each of which includes a driving assembly and a working cavity (not shown), and the driving assembly is used to pressurize the cooling liquid flowing through the working cavity, so that the cooling liquid can circulate in the cooling system. And the working cavities of the adjacent two pump units 11 are communicated, and the cooling liquid can flow through each pump unit 11. The control module is connected with the driving assembly of each pump unit 11; wherein when the driving assembly of one of the pump units 11 fails, the control module is used to control the driving assembly of another pump unit 11 to work, so that the cooling liquid can flow through the working cavities of the adjacent multiple pump units 11.

[0062] After being thus arranged, when one of the pump units 11 of the pump device 10 fails, the control module can control at least one other pump unit 11 to continue to operate, so that the cooling liquid can flow through the working cavities of the adjacent multiple pump units 11, and the normal pump unit 11 can continue to pressurize the cooling liquid, ensuring that the cooling liquid can circulate in the cooling system, and improving the reliability of the cooling system.

[0063] The pump unit 11 can be a separate pump structure or a partial structure of an integrated pump.

[0064] In one embodiment, each pump unit 11 is a single pump, and the inlet and outlet ports 111 of two adjacent pump units 11 are connected in series. The inlet and outlet ports 111 refer to the interface positions of each pump unit for the inflow and outflow of the coolant. Each pump unit 11 has two inlet and outlet ports 111. For example, when the pump device 10 is running in the forward direction, one of the two inlet and outlet ports 111 of the pump unit 11 can serve as an inlet port, and the other can serve as an outlet port; when the pump device 10 is running in the reverse direction, the inlet and outlet port 111 of the pump device 10 that serves as an inlet port when the pump device 10 is running in the forward direction now serves as an outlet port, and the inlet and outlet port 111 of the pump device 10 that serves as an outlet port when the pump device 10 is running in the forward direction now serves as an inlet port.

[0065] In this way, when a pump unit 11 fails, the technician can only disassemble and repair or replace the pump unit 11, without disassembling the entire pump device 10, which makes the maintenance and replacement operation relatively simple and helps to reduce the repair time.

[0066] It should be noted that when the pump unit 11 is a single pump structure, the pump unit 11 can refer to the related art, and the present application will not be repeated here.

[0067] In the embodiment shown in FIG. 1, Figure 2 In the embodiment shown in FIG. 1, the pump device 10 includes two pump units 11, which are a first pump 12 and a second pump 13, respectively, and the inlet and outlet ports 111 of the first pump 12 and the inlet and outlet ports 111 of the second pump 13 are connected in series to communicate the working chambers of the first pump 12 and the second pump 13. Here, "the inlet and outlet ports 111 of the first pump 12 and the inlet and outlet ports 111 of the second pump 13 are connected in series" means that one inlet and outlet port 111 of the first pump 12 and one inlet and outlet port 111 of the second pump 13 are connected in communication through a pipe or a connecting member, so that the coolant can flow from the working chamber of the first pump 12 to the working chamber of the second pump 13, or so that the coolant can flow from the working chamber of the second pump 13 to the working chamber of the first pump 12.

[0068] The drive assemblies of the first pump 12 and the second pump 13 can pressurize the coolant, and when the drive assembly of one of the first pump 12 and the second pump 13 fails, the drive assembly of the other of the first pump 12 and the second pump 13 can continue to pressurize the coolant in the cooling system to circulate the coolant in the cooling system. At the same time, two pump units 11 can provide basic redundancy, and compared to more pump units 11 (the number of pump units 11 is greater than 2), two pump units 11 occupy less space and have lower cost. Therefore, by providing two pump units 11, the present application can achieve basic fault tolerance function without excessively increasing cost and occupying too much installation space, so that the entire cooling system has good economy and space adaptability while ensuring performance.

[0069] Further, please refer to Figure 3 and Figure 4 The liquid cooling plate 20 is connected in series with the pump device 10, and the liquid cooling plate 20, the first pump 12 and the second pump 13 are sequentially stacked along the thickness direction of the liquid cooling plate 20. Here, stacking means that the liquid cooling plate 20, the first pump 12 and the second pump 13 are arranged in layers along the thickness direction of the liquid cooling plate 20. In other words, the three components of the liquid cooling plate 20, the first pump 12 and the second pump 13 are arranged in layers along the direction of the thickness of the liquid cooling plate 20. That is, along the thickness direction of the liquid cooling plate 20: the liquid cooling plate 20 can be attached to the first pump 12, and the second pump 13 can be attached to the first pump 12; or the liquid cooling plate 20 can be partially attached to the first pump 12, and the second pump 13 can be partially attached to the first pump 12; or the liquid cooling plate 20 can have a gap with the first pump 12, and the second pump 13 can have a gap with the first pump 12.

[0070] In this way, compared with the disordered distribution of the liquid cooling plate 20, the first pump 12 and the second pump 13 in space, the liquid cooling plate 20, the first pump 12 and the second pump 13 in the present scheme are sequentially stacked to achieve a more compact layout, which can reduce the occupied space volume and leave more installation space for other hardware and the like. Moreover, this stacking mode shortens the distance between the pump device 10 and the liquid cooling plate 20, and reduces the pipeline length required for connecting the pump device 10 and the liquid cooling plate 20 in series.

[0071] It should be noted that the connection in series of the liquid cooling plate 20 and the pump device 10 can be the connection in series of the liquid cooling plate 20, the first pump 12 and the second pump 13 in order, or the connection in series of the liquid cooling plate 20, the second pump 13 and the first pump 12 in order.

[0072] In an embodiment, the pump device 10 further comprises a connecting frame (not shown) connecting the liquid cooling plate 20 and the second pump 13. The connecting frame can provide a reliable support platform for the second pump 13, so that the second pump 13 can be stably installed and worked. At the same time, when encountering vibration, the connecting frame can also absorb and disperse part of the vibration energy, play a certain shock absorption and buffering role, and reduce the impact of vibration on the second pump 13.

[0073] In a specific embodiment, the connecting frame comprises a top plate and two side plates connected to opposite sides of the top plate. The top plate is located between the first pump 12 and the second pump 13, and the second pump 13 is located on the top plate. The side plates extend from the edges of the top towards the liquid cooling plate 20 and are connected to the liquid cooling plate 20 to support the second pump 13 on the top plate.

[0074] Among them, the two side plates and the inlet and outlet pump ports 111 of the pump unit 11 are located on different sides of the top plate to avoid interference between the side plates and the inlet and outlet pump ports 111.

[0075] In one embodiment, the liquid cooling plate 20 further includes a first inlet / outlet 21 and a second inlet / outlet 22, which extend along the thickness direction of the liquid cooling plate 20. The first pump 12 abuts against the first inlet / outlet 21 and the second inlet / outlet 22. With this configuration, when installing the first pump 12, the first inlet / outlet 21 and the second inlet / outlet 22 of the liquid cooling plate 20 provide a positioning reference for the first pump 12. Installers can simply place the first pump 12 against the first inlet / outlet 21 and the second inlet / outlet 22 for installation, eliminating the need to specifically locate the installation position of the first pump 12. This helps improve the efficiency of the first pump 12 installation, making the installation process smoother and faster. Furthermore, the first inlet / outlet 21 and the second inlet / outlet 22 of the liquid cooling plate 20 also provide a limiting effect on the first pump 12, preventing the first pump 12 from shifting under external forces.

[0076] In one embodiment, a wiring space is formed between the first pump 12 and the second pump 13 along the thickness direction of the liquid cooling plate 20. During the actual installation and operation of the cooling system, various lines need to be connected, such as the power lines of the pump unit 11 drive assembly and the signal lines of sensors (for monitoring temperature, flow rate, etc.). The wiring space allows these lines to be arranged in an orderly manner, making the wiring neater and reducing encroachment on surrounding space.

[0077] Specifically, at least one of the housings of the first pump 12 and the second pump 13 is provided with a groove 14, which extends along the thickness direction of the liquid cooling plate 20 to form the aforementioned wiring space. This solution utilizes the housing structure itself to create the wiring space, eliminating the need for additional external space and making the overall spatial layout of the cooling system more compact. Furthermore, depending on the actual needs and layout constraints of different cooling systems, it is possible to choose to provide the groove 14 only on the housing of the first pump 12, or only on the housing of the second pump 13, or on both the housings of the first pump 12 and the second pump 13.

[0078] Furthermore, each of the first pump 12 and the second pump may have an inlet / outlet port 111 and two grooves 14 on one side, the two grooves 14 being along the first direction (reference). Figure 2 The plates are arranged in an X-direction, with the first direction X perpendicular to the thickness direction of the liquid cooling plate 20. The pump inlet / outlet 111 is located in the gap between two spaced-apart grooves 14.

[0079] With this configuration, the inlet and outlet pump ports 111 are used for the inflow and outflow of coolant, and the two recesses 14 are used to provide a separate wiring space. This integrates different functional requirements within a limited surrounding area, improves space utilization, and the recesses 14 provide wiring space for the lines at the inlet and outlet pump ports 111, avoiding messy and crossover of lines at the inlet and outlet pump ports 111, which would affect the pipe connection at the inlet and outlet pump ports 111.

[0080] In other embodiments, the inlet and outlet pump ports 111 and the two grooves 14 can be arranged on only one side of the first pump 12, or the inlet and outlet pump ports 111 and the two grooves 14 can be arranged on only one side of the second pump 13.

[0081] Further, as shown in the embodiment, Figures 2 to 4 the first pump 12 is provided with a first inlet and outlet pump port 121 and a second inlet and outlet pump port 122, the second pump 13 is provided with a third inlet and outlet pump port 131 and a fourth inlet and outlet pump port 132, the two grooves 14 of the first pump 12 are located on the opposite sides of the first inlet and outlet pump port 121, and the two grooves 14 of the second pump 13 are located on the opposite sides of the fourth inlet and outlet pump port 132; wherein the two grooves 14 of the first pump 12 are located on one side of the pump device 10, and the two grooves 14 of the second pump 13 are located on the other side of the pump device 10. That is, the two grooves 14 of the first pump 12 and the two grooves 14 of the second pump 13 are located on different sides of the pump device 10, which makes full use of the space on different sides of the pump device 10, and avoids the space congestion that may be caused by the concentration of all wiring on the same side. Moreover, the two grooves 14 of the first pump 12 can be used to arrange the wiring of the first pump 12, and the two grooves 14 of the second pump 13 can be used to arrange the wiring of the second pump 13, so that technicians can quickly locate the wiring of the corresponding pump, thereby facilitating installation and maintenance.

[0082] Please refer to Figure 5 and Figure 6 , and in combination with Figures 1 to 3 , the heat exchanger 30 includes a third inlet and outlet and a fourth inlet and outlet, and the communication relationship of the cooling system in the embodiment is specifically that the third inlet and outlet of the heat exchanger 30 is in communication with the first inlet and outlet 21 of the liquid cooling plate 20, the fourth inlet and outlet of the heat exchanger 30 is in communication with the second inlet and outlet 122 of the first pump 12, the first inlet and outlet 121 of the first pump 12 is in communication with the third inlet and outlet 131 of the second pump 13, and the fourth inlet and outlet 132 of the second pump 13 is in communication with the second inlet and outlet 22 of the liquid cooling plate 20.

[0083] Referring to Figure 7 and Figure 8 , the cooling system further includes a temperature sensor for detecting temperature information of the cooling system.

[0084] The cooling system has a first working condition and a second working condition, and the control module is configured to control the cooling system to switch between the first working condition and the second working condition according to the temperature information.

[0085] Specifically, when the temperature information is lower than a preset temperature, the control module is configured to control the driving assembly of the pump unit 11 to operate in a forward direction, so that the cooling system is in the first working condition, and the cooling liquid in the delivery circuit 40 flows through the heat exchanger 30, the pump device 10 and the liquid cooling plate 20 in sequence.

[0086] When the temperature information is greater than or equal to the preset temperature, the control module is configured to control the driving assembly of the pump unit 11 to operate reversely, so that the cooling system is in the second working condition, and the cooling liquid in the delivery circuit 40 flows through the heat exchanger 30, the liquid cooling plate 20 and the pump device 10 in sequence.

[0087] As can be seen from the above description, the temperature of the cooling liquid flowing out of the heat exchanger 30 has just been subjected to cooling treatment, and the state of the cooling liquid is low-temperature cooling liquid. In the first working condition, since the collected temperature information is lower than the preset temperature value, it indicates that the heat dissipation demand of the heat generating element 50 is not large, and the low-temperature cooling liquid can first enter the pump device 10 to cool the driving assembly of the pump unit 11, so that the pump unit 11 can work in a lower temperature environment, reducing the risk of damage due to overheating. In the second working condition, since the collected temperature information is greater than or equal to the preset value, the heat generated by the heat generating element 50 is relatively large, and the heat dissipation demand of the heat generating element 50 is relatively large, and the low-temperature cooling liquid can first enter the liquid cooling plate 20 to cool the heat generating element 50, and then flow through the pump device 10, so as to preferentially ensure the normal heat dissipation of the heat generating element 50, and make the heat generating element 50 work normally.

[0088] In one embodiment, the temperature information of the cooling system includes any one of the following:

[0089] The surface temperature of the liquid cooling plate, the temperature of the cooling liquid in the liquid cooling plate, the surface temperature of the heat exchanger, the temperature of the cooling liquid in the heat exchanger, the temperature of the cooling liquid in the delivery circuit, the temperature of the heat generating element, and the temperature of the cooling liquid at the inlet and outlet pump port position of the pump unit. But not limited to this.

[0090] Specifically, when the temperature information is the surface temperature of the liquid cooling plate, the temperature sensor is arranged on the surface of the liquid cooling plate 20 to collect the surface temperature of the liquid cooling plate 20. When the temperature information is the temperature of the cooling liquid in the liquid cooling plate 20, the temperature sensor can be arranged at the inlet and outlet water port of the liquid cooling plate 20 or the internal flow channel of the liquid cooling plate 20. When the temperature information is the surface temperature of the heat exchanger 30, the temperature sensor can be arranged on the surface of the heat exchanger 30. When the temperature information is the temperature of the cooling liquid in the delivery circuit 40, the temperature sensor can be connected in series to the delivery circuit. When the temperature information is the temperature of the cooling liquid at the inlet and outlet pump port 111 of the pump unit 11, the temperature sensor can be arranged at the inlet and outlet pump port 111 of the pump unit 11. When the temperature information is the temperature of the heat generating element 50, the temperature sensor can be arranged at the heat generating element 50 to collect the temperature of the heat generating element 50.

[0091] The preset temperature can be specifically set according to the temperature information.

[0092] For example, when the temperature information is the temperature of the heat generating element, the preset temperature can be 50-80℃, for example, the preset temperature can be 50℃, 60℃, 70℃, 80℃.

[0093] Alternatively, when the temperature information is the outlet water temperature of the liquid cooling plate 20, the preset temperature can be 45-60°C, for example, the preset temperature can be 45°C, 50°C, 55°C, or 60°C.

[0094] Alternatively, in any case, the preset temperature can be 40-80°C. For example, the preset temperature can be 40°C, 45°C, 50°C, 55°C, 60°C, 65°C, 70°C, 75°C, or 80°C.

[0095] In one embodiment, the control module is configured to control the driving assemblies of the at least two pump units 11 to operate alternately. That is, the driving assemblies of the respective pump units 11 operate alternately at certain time intervals, and in each time interval, the driving assembly of one pump unit 11 operates. This alternating operation can reduce the excessive wear and fatigue of the pump units 11 caused by long-time continuous operation of a single pump unit 11. Each pump unit 11 has a "rest" time, which reduces the probability of damage to the pump units 11, prolongs the service life of the pump units 11, and thus ensures the long-term stable operation of the cooling system.

[0096] In another embodiment, the control module is configured to control the driving assemblies of the at least two pump units 11 to operate synchronously at a first power, wherein the first power is less than the maximum operating power of any of the driving assemblies of the pump units 11.

[0097] After such a setting, the driving assemblies of the plurality of pump units 11 operate synchronously at a first power less than their respective maximum operating power, which can effectively reduce the energy consumption of the entire cooling system. In many devices, the cooling system needs to operate for a long time, for example, the servers in a data center, whose cooling devices almost work uninterruptedly. If each pump unit 11 operates at the maximum operating power, even during periods when the heat generated by the device is not at the peak, a large amount of unnecessary electric energy will be consumed. By controlling them to operate synchronously at a smaller first power, the power output can be flexibly adjusted according to the actual heat dissipation demand, avoiding excessive waste of energy, so that the device can meet the heat dissipation requirements while significantly reducing the electric power cost. Moreover, operating the driving assemblies of the pump units 11 at a power less than the maximum operating power can reduce the working burden of the internal components of each pump unit 11, reduce the wear and damage risk of the components, and prolong the service life of the components, thereby reducing the frequency of maintenance and replacement of the pump units 11.

[0098] In one embodiment, the control module is configured to obtain the operating state of the driving assemblies of the at least two pump units 11.

[0099] When the driving assemblies of the at least two pump units 11 are in normal operation, the control module is configured to control the driving assemblies of the at least two pump units 11 to operate alternately or synchronously at a second power;

[0100] When one of the driving assemblies of the at least two pump units 11 fails, the control module is configured to control the other one of the driving assemblies of the at least two pump units 11 to operate at a third power;

[0101] The third power is greater than the second power.

[0102] In this way, when one of the driving assemblies of the at least two pump units 11 fails, the control module controls the normal pump unit 11 to operate at the third power, and the third power is greater than the second power, which is an effective emergency mechanism for failure. In a normal cooling system, each pump unit 11 bears a certain proportion of the driving task of the cooling liquid, and when one of them fails, the circulating power of the cooling liquid will suddenly decrease, and if it is not adjusted in time, the heat generating element 50 may be overheated and damaged due to insufficient heat dissipation. By allowing the non-failed pump unit 11 to operate at the third power, the reduced driving capacity of the cooling liquid due to the failure of the pump unit 11 can be compensated for, the circulating flow and pressure of the cooling liquid in the cooling system can be maintained as much as possible, and the basic heat dissipation function can be ensured.

[0103] In one embodiment, the control module is configured to determine whether the driving assembly of the pump unit 11 fails according to an electrical signal.

[0104] The electrical signal may be, but is not limited to, a current signal, a rotation speed signal, or a flow signal.

[0105] For example, the control module can determine whether the driving assembly of the pump unit 11 fails by monitoring the current of the driving assembly. Under normal circumstances, the current of the pump unit 11 will fluctuate within a relatively stable range under a stable working power. When a short circuit, an open circuit, or an abnormal increase in motor load occurs in the driving assembly, the current will change significantly, and at this time the control module can determine that the driving assembly of the pump unit 11 fails.

[0106] Alternatively, the control module can determine the operating state by detecting the rotation speed of a power shaft (such as a motor shaft) or a rotor (impeller) in the driving assembly of the pump unit 11. Under normal working conditions, the rotation speed of the pump unit 11 is determined by the power set by the control module and the load condition, and will fluctuate within a certain reasonable range. If the rotation speed is abnormal, such as a sudden drop in rotation speed or a rotation speed of 0, the control module can determine that the driving assembly of the pump unit 11 fails.

[0107] Alternatively, the control module indirectly determines the state of the drive assembly of the pump unit 11 by detecting the pressure and flow rate of the coolant in the working chamber. Normally, when the pump unit 11 is operating at a certain power, the coolant will generate a corresponding stable pressure and flow rate. If the pump unit 11 malfunctions, the flow rate of the cooling system will decrease significantly, and the control module can determine that the drive assembly of the pump unit 11 has failed.

[0108] With reference to Figure 9 and Figure 10 In some other embodiments, the pump unit 11 is part of an integrated pump structure, and the pump device 10 further comprises a housing provided with a cooling flow channel, each pump unit 11 is installed in the housing, and the working chamber of each pump unit 11 is located in the cooling flow channel, and the drive assembly of the pump unit 11 is used to pressurize the coolant in the cooling flow channel.

[0109] In this way, each pump unit 11 is part of the pump device 10, which can effectively save space compared with using multiple separate pumps. Specifically, separate pumps require their own installation space, and in order to connect the coolant pipes and other components, a certain space is also required for pipe layout. In the present scheme, the working chamber of each pump unit 11 is part of the cooling flow channel, and there is no need to separately set up pipes to connect the working chambers of adjacent pump units 11, reducing the space occupied by the connection between the pump units 11 and between the pump units 11 and other components, making the layout of the cooling system more compact inside the device, and leaving more space for other hardware components.

[0110] It should be noted that the pump device 10 in the present embodiment can be applied to the first working condition, the second working condition, and the control strategy involved by the control module.

[0111] In a specific embodiment, the pump device 10 comprises two pump units 11, which are respectively a first pump unit and a second pump unit;

[0112] The drive assembly of the first pump unit comprises a first power shaft and a first rotor 15, the first rotor 15 is movably installed in the cooling flow channel and connected to the first power shaft;

[0113] The drive assembly of the second pump unit comprises a second power shaft and a second rotor 16, the second rotor 16 is movably installed in the cooling flow channel and connected to the second power shaft.

[0114] The first power shaft can provide driving force to the first rotor 15 to pressurize the cooling liquid by the first rotor 15, and the second power shaft can provide driving force to the second rotor 16 to pressurize the cooling liquid by the second rotor 16. The control module can control the operation of the first power shaft and the second power shaft separately to control the operation of the first rotor 15 and the second rotor 16.

[0115] It should be noted that the first rotor 15 and the second rotor 16 can be axial impellers or rotary impellers, which are not limited in the present application.

[0116] The above only describes the preferred embodiments of the present application and is not used to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A cooling system, characterized by, include: A pump device includes at least two pump units, each pump unit comprising a drive assembly and a working chamber, the drive assembly being used to pressurize coolant flowing through the working chamber; wherein the working chambers of two adjacent pump units are connected. A control module is connected to the drive assembly of the pump unit; When the drive component of one of the pump units fails, the control module controls the drive component of another pump unit to operate so that coolant can flow through the working chambers of multiple adjacent pump units.

2. The cooling system of claim 1, wherein, The pump device includes two pump units, namely a first pump and a second pump. One inlet and outlet of the first pump are connected in series with one inlet and outlet of the second pump so that the working chamber of the first pump is connected to the working chamber of the second pump.

3. The cooling system of claim 2, wherein, The cooling system also includes a liquid cooling plate, which is connected in series with the pump device. The liquid cooling plate, the first pump, and the second pump are stacked sequentially along the thickness direction of the liquid cooling plate.

4. The cooling system of claim 1, wherein, The cooling system also includes a liquid cooling plate, a heat exchanger, and a delivery circuit, wherein the liquid cooling plate, the heat exchanger, and the pump are connected in series in the delivery circuit.

5. The cooling system of claim 4, wherein, The cooling system also includes a temperature sensor, which is used to detect the temperature information of the cooling system. The cooling system has a first operating condition and a second operating condition, and the control module is used to control the cooling system to switch between the first operating condition and the second operating condition according to the temperature information; When the temperature information is less than the preset temperature, the control module is used to control the drive component of the pump unit to run in the forward direction, so that the cooling system is in the first working condition, and the coolant in the delivery circuit flows through the heat exchanger, the pump device and the liquid cooling plate in sequence. When the temperature information is greater than or equal to the preset temperature, the control module controls the drive component of the pump unit to run in reverse, so that the cooling system is in the second working condition, and the coolant in the delivery circuit flows sequentially through the heat exchanger, the liquid cooling plate and the pump device.

6. The cooling system of claim 5, wherein, The temperature information of the cooling system includes any one of the following: The surface temperature of the liquid cooling plate, the temperature of the coolant in the liquid cooling plate, the surface temperature of the heat exchanger, the temperature of the coolant in the heat exchanger, the temperature of the coolant in the delivery circuit, the temperature of the heating element, and the temperature of the coolant at the inlet and outlet of the pump unit.

7. The cooling system of claim 3, wherein, A wiring space is formed between the first pump and the second pump along the thickness direction of the liquid cooling plate.

8. The cooling system of claim 7, wherein, At least one of the housings of the first pump and the second pump is provided with a groove, which extends along the thickness direction of the liquid cooling plate to form the wiring space.

9. The cooling system of claim 8, wherein, The first pump has an inlet / outlet and two grooves on one side, the two grooves being spaced apart along a first direction, and the inlet / outlet located in the gap between the two spaced-apart grooves; the first direction is perpendicular to the thickness direction of the liquid cooling plate; and / or, One side of the second pump is provided with one inlet and outlet port and two grooves, the two grooves are arranged in a first direction, and the inlet and outlet port is located in the gap between the two grooves.

10. The cooling system of claim 3, wherein, The pump device comprises a connecting frame, and the connecting frame connects the liquid cooling plate and the second pump.

11. The cooling system of claim 3, wherein, The liquid cooling plate comprises a first inlet and outlet and a second inlet and outlet, the first inlet and outlet and the second inlet and outlet extend along the thickness direction of the liquid cooling plate, and the first pump abuts against the first inlet and outlet and the second inlet and outlet.

12. The cooling system of claim 1, wherein, The pump device comprises a shell, the shell is provided with a cooling flow channel, each pump unit is installed in the shell, and the working cavity of each pump unit is located in the cooling flow channel.

13. The cooling system of claim 12, wherein, The pump device comprises two pump units, which are a first pump unit and a second pump unit. The drive assembly of the first pump unit comprises a first power shaft and a first rotor, the first rotor is rotatably installed in the cooling flow channel and connected to the first power shaft. The drive assembly of the second pump unit comprises a second power shaft and a second rotor, the second rotor is rotatably installed in the cooling flow channel and connected to the second power shaft.

14. The cooling system of claim 1, wherein, The control module is used to control the drive assemblies of the at least two pump units to alternately run; or, The control module is used to control the drive assemblies of the at least two pump units to synchronously run at a first power, wherein the first power is less than the maximum running power of the drive assembly of any pump unit.

15. The cooling system of claim 1, wherein, The control module is used to obtain the running state of the drive assemblies of the at least two pump units. When the drive assemblies of the at least two pump units can normally run, the control module is used to control the drive assemblies of the at least two pump units to alternately run or synchronously run at a second power. When one of the drive assemblies of the at least two pump units fails, the control module is used to control the other of the drive assemblies of the at least two pump units to run at a third power. The third power is greater than the second power.

16. A server apparatus characterized by comprising: It comprises: A heat generating element; The cooling system of any one of claims 1 to 15, further comprising a liquid cooling plate, a heat exchanger and a delivery circuit; The liquid cooling plate is connected to the heat generating element, and the liquid cooling plate, the heat exchanger and the pump device are connected in series in the delivery circuit.

Images