Electronic device

Abstract

The utility model discloses an electronic device, and relates to the technical field of electrical components, the electronic device comprises a housing, a substrate, a pressure sensor and a voice sensor, the housing is provided with an accommodating cavity; the substrate is connected with the shell, and the substrate is provided with a mounting cavity and an opening communicated with the accommodating cavity; the pressure sensor comprises a pressure sensing chip and a pressure signal processing chip electrically connected with the pressure sensing chip, the pressure sensing chip is mounted in the accommodating cavity, the pressure signal processing chip is mounted in the mounting cavity, the pressure signal processing chip is provided with a bonding pad surface, and the bonding pad surface is electrically connected with the pressure signal processing chip. The bonding pad surface is arranged back to the accommodating cavity; the voice sensor is installed in the containing cavity, the voice sensor and the pressure sensing chip are arranged in a spaced mode, and the voice sensor corresponds to the open hole. According to the technical scheme provided by the utility model, the pickup effect of voice signals is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to electrical components technical field, especially electronic device. BACKGROUND

[0002] In the field of intelligent wearable devices, the two-in-one device integrating microphone and pressure sensor is widely concerned due to its function integration and miniaturization. However, this integrated design also brings technical challenges, especially in the solution of crosstalk problem. Specifically, the two-in-one device includes voice perception chip (microphone MEMS chip), voice signal processing chip (microphone ASIC chip), pressure perception chip (pressure sensor MEMS chip) and pressure signal processing chip (pressure sensor ASIC chip) are all placed in the accommodating cavity of a shell, and an opening is arranged in the shell and communicates with the accommodating cavity. These chips perceive the voice signal and pressure signal of the outside world through the opening.

[0003] Although this design realizes the integration of functions and miniaturization of the device, it puts forward higher requirements for the control of crosstalk. The crosstalk problem mainly manifests that when the pressure sensor works, its signal processing chip (pressure ASIC chip) will intermittently generate heat. This intermittent heat will cause disturbance of the air in the device accommodating cavity, causing the microphone MEMS chip to receive noise signals in addition to voice signals, thereby reducing the pickup effect of voice signals. CONTENT OF THE UTILITY MODEL

[0004] The main purpose of the utility model is to provide an electronic device, which aims to improve the pickup effect of voice signals.

[0005] To achieve the above purpose, the utility model provides an electronic device applied to intelligent wearable devices, which comprises:

[0006] A shell having an accommodating cavity;

[0007] A substrate connected with the shell, provided with a mounting cavity and an opening communicating with the accommodating cavity;

[0008] A pressure sensor comprising a pressure perception chip and a pressure signal processing chip electrically connected with the pressure perception chip, the pressure perception chip being installed in the accommodating cavity, and the pressure signal processing chip being installed in the mounting cavity, the pressure signal processing chip having a pad surface arranged to face away from the accommodating cavity; and

[0009] A voice sensor installed in the accommodating cavity and arranged to be spaced apart from the pressure perception chip, and the voice sensor is arranged to correspond to the opening.

[0010] In an embodiment, a heat insulation material is filled between the cavity wall of the mounting cavity and the outer wall of the pressure signal processing chip.

[0011] In an embodiment, the heat insulation material is heat insulation glue.

[0012] In an embodiment, a spacer is arranged between the housing and the substrate, and the pressure signal processing chip is fixed on the spacer and embedded in the mounting cavity.

[0013] In an embodiment, the pressure signal processing chip is arranged away from the opening.

[0014] In an embodiment, the side of the spacer connected with the pad surface is provided with a grid structure, and the pressure signal processing chip is fixed on the grid structure.

[0015] In an embodiment, the grid structure comprises a plurality of support columns and a net plate, the plurality of support columns are arranged on the side of the substrate away from the accommodating cavity, and the net plate is connected with the ends of the plurality of support columns away from the substrate; and the pressure signal processing chip is fixed on the net plate.

[0016] In an embodiment, the substrate is provided with at least two mounting holes and at least one ring groove, the ring groove is arranged around the periphery of the substrate, and the two mounting holes communicate the mounting cavity and the ring groove.

[0017] The pad surface is provided with at least two heat dissipation parts, and each heat dissipation part extends into one mounting hole.

[0018] In an embodiment, the two mounting holes and the ring groove are located on the side of the substrate away from the accommodating cavity.

[0019] In an embodiment, the pad surface is further provided with at least one extension part, the extension part is mounted in the ring groove and connected with the two heat dissipation parts.

[0020] The technical scheme of the utility model discloses an electronic device which comprises a shell, a substrate, a pressure sensor and a voice sensor, the shell has a containing cavity, the substrate is connected with the shell, the substrate is provided with a mounting cavity and an opening communicating with the containing cavity, the pressure sensor comprises a pressure sensing chip and a pressure signal processing chip electrically connected with the pressure sensing chip, the pressure sensing chip is installed in the containing cavity, the pressure signal processing chip is installed in the mounting cavity, the pressure signal processing chip has a pad surface, and the pad surface is arranged to face away from the containing cavity, the voice sensor is installed in the containing cavity and is arranged to be spaced apart from the pressure sensing chip, heat of the pressure signal processing chip is effectively transmitted out through a flip chip mode, and the setting of the isolation sheet further reduces disturbance of residual heat on the voice sensor. The structural design not only improves the performance of the microphone, but also ensures that the pressure sensor and the microphone can work efficiently at the same time, realizes optimization of voice communication and high positioning function in the intelligent wearable device, can significantly reduce the influence of heat generated by the pressure sensor on the voice sensor when the pressure sensor works, and thus improves the voice signal pickup effect of the microphone. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to the structure shown in the drawings without creative labor.

[0022] Figure 1 The utility model provides an electronic device one embodiment's structural schematic diagram.

[0023] Explanation of reference numerals:

[0024] 10, shell; 10a, containing cavity; 20, substrate; 20a, opening; 30, pressure sensor; 31, pressure sensing chip; 32, pressure signal processing chip; 40, voice sensor; 50, heat insulation material; 60, isolation sheet.

[0025] The realization, functional characteristics and advantages of the utility model will be further explained by combining with the embodiments and referring to the drawings. DETAILED DESCRIPTION

[0026] The technical scheme in the embodiments of the utility model will be clearly and completely described below by combining with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only some embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0027] It should be noted that if the embodiments of the utility model have directionality indication (such as up, down, left, right, front, back, etc.), the directionality indication is only used to explain the relative position relationship, movement condition, etc. between components in a certain specific posture, if the specific posture changes, then the directionality indication also changes accordingly.

[0028] In addition, if the embodiments of the utility model have the description of "first", "second" and the like, the description of "first", "second" and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the whole text, its meaning includes three parallel schemes, for example, "A and / or B" includes A scheme, or B scheme, or A and B simultaneously satisfy the scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on that the ordinary skilled in the art can realize, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the utility model.

[0029] The utility model provides a kind of electronic device.

[0030] Please refer to Figure 1 In an embodiment of the utility model, the electronic device is applied to intelligent wearable equipment, and the electronic device includes shell 10, substrate 20, pressure sensor 30 and voice sensor 40, the shell 10 has containing cavity 10a;Substrate 20 is connected with shell 10, and substrate 20 is provided with mounting cavity and aperture 20a communicated with containing cavity 10a;Pressure sensor 30 includes pressure sensing chip 31 and pressure signal processing chip 32 electrically connected with pressure sensing chip 31, pressure sensing chip 31 is installed in containing cavity 10a, pressure signal processing chip 32 is installed in mounting cavity, and pressure signal processing chip 32 has pad surface, and pad surface is set back to containing cavity 10a;Voice sensor 40 is installed in containing cavity 10a, and is spaced apart from pressure sensing chip 31.

[0031] The housing 10 has a receiving cavity 10a for mounting the voice sensor 40 and the pressure sensing chip 31. The design of the housing 10 ensures the compactness and integration of the device. The substrate 20 is connected to the housing 10 and is provided with a mounting cavity and an opening 20a communicating with the receiving cavity 10a. The design of the substrate 20 allows the heat generated by the pressure signal processing chip 32 to be transferred away from the receiving cavity 10a. The pressure sensor 30 comprises the pressure sensing chip 31 and the pressure signal processing chip 32 electrically connected to the pressure sensing chip 31. The pressure sensing chip 31 is mounted in the receiving cavity 10a, and the pressure signal processing chip 32 is mounted in the mounting cavity, and the pressure signal processing chip 32 has a pad surface arranged to face away from the receiving cavity 10a. The design of the pressure sensor 30 aims to reduce the influence of heat on the voice sensor 40. The voice sensor 40 is mounted in the receiving cavity 10a and is arranged to be spaced apart from the pressure sensing chip 31. The design of the voice sensor 40 ensures that it can effectively pick up voice signals while reducing crosstalk.

[0032] In the electronic device, the design of the mounting cavity of the substrate 20 allows the heat generated by the pressure signal processing chip 32 to be transferred away from the receiving cavity 10a. The pressure signal processing chip 32 is embedded in the groove of the substrate 20 in a flip-chip manner, which prevents heat from being transferred from both sides of the groove of the substrate 20 to the receiving cavity 10a. The voice sensor 40 is arranged to be spaced apart from the pressure sensing chip 31 in the receiving cavity 10a, which ensures that the voice sensor 40 can effectively pick up voice signals while reducing the influence of air disturbance caused by the heat generated by the pressure sensor 30 on the voice sensor 40.

[0033] Through the above structural design, the heat generated by the pressure signal processing chip 32 of the electronic device is effectively transferred away in a flip-chip manner, and the isolation sheet 60 further reduces the disturbance of residual heat on the voice sensor 40. This structural design not only improves the performance of the microphone, but also ensures that the pressure sensor 30 and the microphone can work efficiently at the same time, realizes the optimization of voice communication and height positioning function in the smart wearable device, and can significantly reduce the influence of heat generated by the pressure sensor 30 on the voice sensor 40, thereby improving the voice signal pickup effect of the microphone.

[0034] Further, please refer to Figure 1 In the design of the substrate 20, high-thermal-isolation materials such as boron nitride or aluminum oxide ceramic are introduced, which have excellent thermal isolation performance and can further reduce the heat transfer from the pressure signal processing chip 32 to the receiving cavity 10a. The application of such materials will effectively reduce the influence of heat generated by the pressure sensor 30 on the voice sensor 40.

[0035] Further, please refer to Figure 1, the substrate 20 is a multi-layer substrate 20 structure, where each layer of the substrate 20 has a different function. The bottom layer of the substrate 20 is used to mount the pressure signal processing chip 32 and is connected to the external environment through a heat-conducting material to achieve effective heat dissipation. The middle layer of the substrate 20 is used to mount the isolation sheet 60 and the glue wrapping area to further isolate heat. The top layer of the substrate 20 is connected to the containing cavity 10a to ensure stable installation of the voice sensor 40.

[0036] Further, please refer to Figure 1 , a miniature thermocouple or temperature sensor is integrated in the substrate 20 to monitor the temperature of the pressure signal processing chip 32 in real time. Combined with miniature fan or heat pipe technology, dynamic adjustment of heat dissipation is achieved to ensure that the temperature in the substrate 20 and the containing cavity 10a is always at an optimal state. This dynamic thermal management system will significantly improve the voice signal pickup effect of the microphone and reduce noise caused by temperature changes.

[0037] In an embodiment, please refer to Figure 1 , the cavity wall of the mounting cavity is filled with thermal insulation material 50 between the outer wall of the pressure signal processing chip 32; the thermal insulation material 50 is thermal insulation glue.

[0038] The mounting cavity is a specific area on the substrate 20 for containing the pressure signal processing chip 32. The design of the mounting cavity allows the cavity wall to be filled with thermal insulation material 50 between the outer wall of the pressure signal processing chip 32 to reduce heat transfer.

[0039] The pressure signal processing chip 32 is part of the pressure sensor 30, responsible for processing signals from the pressure sensing chip 31. Its outer wall is filled with thermal insulation material 50 between the cavity wall of the mounting cavity to isolate heat. Thermal insulation glue is a material with high thermal resistance characteristics used to fill the gap between the cavity wall of the mounting cavity and the outer wall of the pressure signal processing chip 32. The application of this material can effectively reduce the heat transfer from the pressure signal processing chip 32 to the containing cavity 10a, thereby reducing the impact of heat generated by the pressure sensor 30 on the voice sensor 40.

[0040] In this electronic device, the pressure signal processing chip 32 generates heat when working. In order to reduce the impact of these heat on the voice sensor 40, the cavity wall of the mounting cavity is filled with thermal insulation glue between the outer wall of the pressure signal processing chip 32. The high thermal resistance characteristics of the thermal insulation glue effectively block the heat transfer path, so that heat cannot easily transfer to the containing cavity 10a. This design ensures that the voice sensor 40 can work in a lower crosstalk environment, thereby improving the pickup effect of the voice signal.

[0041] In an embodiment, please refer to Figure 1The isolation sheet 60 is arranged between the housing 10 and the substrate 20, and the pressure signal processing chip 32 is fixed to the isolation sheet 60 on the side away from the pad surface and embedded in the mounting cavity.

[0042] In the electronic device, the isolation sheet 60 is arranged between the housing 10 and the substrate 20, and plays a role of heat insulation and isolation. The pressure signal processing chip 32 generates heat during operation. In order to reduce the influence of the heat on the voice sensor 40, the pressure signal processing chip 32 is fixed to the isolation sheet 60 on the side away from the pad surface and embedded in the mounting cavity. The heat insulation property of the isolation sheet 60 effectively blocks the heat transfer path, so that the heat cannot easily be transmitted into the accommodation cavity 10a. This design ensures that the voice sensor 40 can work in a lower crosstalk environment, thereby improving the pickup effect of the voice signal.

[0043] The isolation sheet 60 reduces the influence of air disturbance caused by the heat generated by the pressure sensor 30 on the voice sensor 40. This structural design not only improves the performance of the microphone, but also ensures that the pressure sensor 30 and the microphone can work efficiently at the same time, realizing the optimization of the voice call and height positioning functions in the smart wearable device.

[0044] In an embodiment, referring to Figure 1 , the pressure signal processing chip 32 is arranged away from the opening 20a.

[0045] The opening 20a is arranged on the substrate 20 and communicates with the accommodation cavity 10a, and is used for transmitting voice signals and pressure signals. The design of the opening 20a needs to consider the efficiency of signal transmission and the control of crosstalk.

[0046] In order to reduce the influence of the heat on the voice signal transmission path, the pressure signal processing chip 32 is designed to be arranged away from the opening 20a. This layout ensures that the heat cannot be directly transmitted to the vicinity of the opening 20a, thereby reducing the influence of air disturbance caused by the heat on the voice sensor 40. The voice sensor 40 and the pressure sensing chip 31 are installed in the accommodation cavity 10a, and transmit signals with the outside through the opening 20a, and the away layout of the pressure signal processing chip 32 ensures the clarity of signal transmission.

[0047] In an embodiment, referring to Figure 1 , the side of the isolation sheet 60 connected with the pad surface is provided with a grid structure, and the pressure signal processing chip 32 is fixed to the grid structure.

[0048] The grid structure is located on the side of the isolation sheet 60 connected with the pad surface, and is composed of a plurality of small holes or grid units. This structural design helps to disperse heat and reduce the concentrated transmission of heat.

[0049] In the electronic device, in order to reduce the influence of the heat on the voice sensor 40, the pressure signal processing chip 32 is fixed on the isolation sheet 60 through a grid structure. The design of the grid structure helps to disperse the heat and reduce the concentrated transmission of the heat. Through the above arrangement, the heat insulation effect of the isolation sheet 60 is further improved, thereby improving the pickup effect of the voice signal.

[0050] In an embodiment, referring to Figure 1 , the grid structure includes a plurality of support columns and a net plate, the plurality of support columns are arranged on the side of the substrate 20 away from the accommodating cavity 10a, and the net plate is connected to the end of the plurality of support columns away from the substrate 20; the pressure signal processing chip 32 is fixed on the net plate.

[0051] The support column is a structure extending from the substrate 20 and used for supporting the net plate. The design of the support column ensures the stable connection between the net plate and the substrate 20 and provides additional mechanical support. The net plate is connected to the end of the plurality of support columns away from the substrate 20 to form a grid structure. The design of the net plate not only provides mechanical support but also increases the heat insulation effect, which helps to disperse the heat.

[0052] By arranging the plurality of support columns on the side of the substrate 20 away from the accommodating cavity 10a and connecting the net plate to the end of the plurality of support columns away from the substrate 20, the pressure signal processing chip 32 is fixed on the net plate, which can significantly reduce the influence of the heat generated by the pressure sensor 30 during operation on the voice sensor 40. The design of the net plate helps to disperse the heat and reduce the concentrated transmission of the heat, and the support column ensures the stability of the structure. This structural design not only improves the performance of the microphone but also ensures that the pressure sensor 30 and the microphone can work efficiently at the same time, thereby optimizing the voice communication and height positioning functions in the smart wearable device.

[0053] In an embodiment, referring to Figure 1 , the substrate 20 is provided with at least two mounting holes and at least one ring groove, the ring groove is arranged around the periphery of the substrate 20, and the two mounting holes communicate with the mounting cavity and the ring groove; the pad surface is provided with at least two heat dissipation parts, and each heat dissipation part extends into a mounting hole.

[0054] The mounting hole is arranged on the substrate 20 and communicates with the mounting cavity and the ring groove. The design of the mounting hole allows the heat dissipation part to extend into it to achieve effective heat conduction and dissipation. The ring groove is arranged around the periphery of the substrate 20 and plays a role in heat dissipation and structural reinforcement. The design of the ring groove helps to disperse the heat and reduce the concentrated transmission of the heat. The heat dissipation part is an extension of the pad surface and extends into the mounting hole. The design of the heat dissipation part aims to increase the heat dissipation area and improve the heat conduction efficiency, thereby reducing the influence of the heat generated by the pressure signal processing chip 32 during operation on other components.

[0055] By arranging at least two mounting holes and at least one ring groove on the substrate 20, and making the heat dissipation part of the pad surface extend into the mounting hole, the design of the mounting hole and the ring groove helps to achieve effective heat conduction and heat dissipation, and the extension design of the heat dissipation part increases the heat dissipation area and improves the heat conduction efficiency. This structural design not only improves the performance of the microphone, but also ensures that the pressure sensor 30 and the microphone can work efficiently at the same time, and realizes the optimization of the voice call and height positioning function in the smart wearable device.

[0056] In an embodiment, please refer to Figure 1 The two mounting holes and the ring groove are located on the side of the substrate 20 away from the accommodating cavity 10a.

[0057] By arranging two mounting holes and a ring groove on the side of the substrate 20 away from the accommodating cavity 10a, by arranging the mounting hole and the ring groove on the side of the substrate 20 away from the accommodating cavity 10a, the heat generated by the pressure signal processing chip 32 can be effectively guided away from the voice sensor 40. This layout reduces the influence of heat on the voice sensor 40 in the accommodating cavity 10a, thereby reducing air disturbance and noise signals caused by heat.

[0058] In an embodiment, please refer to Figure 1 The pad surface is also provided with at least one extension part, the extension part is mounted in the ring groove and connected with the two heat dissipation parts.

[0059] The extension part on the pad surface is mounted in the ring groove and connected with the two heat dissipation parts. The extension part increases the surface area of the pad surface, thereby improving the heat dissipation efficiency. Through the extension part, heat can be more effectively conducted from the pressure signal processing chip 32 to the ring groove, and then dissipated to the external environment, preventing the chip from overheating.

[0060] The design of the extension part helps to guide the heat away from the accommodating cavity 10a, further reducing the influence of heat on the voice sensor 40 in the accommodating cavity 10a. This thermal isolation effect reduces air disturbance and noise signals caused by heat, improving the pickup quality of the voice signal.

[0061] The above is only an exemplary embodiment of the present application, and does not limit the patent scope of the present application, any equivalent structural transformation made by using the contents of the present application specification and drawings, or direct / indirect application in other related technical fields is included in the patent protection scope of the present application.

Claims

1. An electronic device used in smart wearable devices, characterized in that, The electronic device comprises: a housing having a receiving cavity; a substrate connected to the housing, the substrate being provided with a mounting cavity and an opening communicating with the receiving cavity; a pressure sensor comprising a pressure sensing chip and a pressure signal processing chip electrically connected to the pressure sensing chip, the pressure sensing chip being mounted in the receiving cavity, the pressure signal processing chip being mounted in the mounting cavity, the pressure signal processing chip having a pad surface arranged to face away from the receiving cavity; and a voice sensor mounted in the receiving cavity and arranged to be spaced apart from the pressure sensing chip, the voice sensor being arranged to correspond to the opening.

2. Electronic device according to claim 1, characterized in that A cavity wall of the mounting cavity and an outer wall of the pressure signal processing chip are filled with a heat insulation material; And / or, the heat insulation material is heat insulation glue.

3. The electronic device of claim 1, wherein, An isolation sheet is arranged between the housing and the substrate, the pressure signal processing chip is fixed to the isolation sheet on a side facing away from the pad surface and is embedded in the mounting cavity.

4. Electronic device according to claim 3, characterized in that The pressure signal processing chip is arranged to be away from the opening.

5. The electronic device of claim 3, wherein the first and second conductive layers are formed of a conductive material selected from the group consisting of silver, gold, copper, aluminum, and combinations thereof. A side of the isolation sheet connected to the pad surface is provided with a grid structure, and the pressure signal processing chip is fixed to the grid structure.

6. Electronic device according to claim 5, characterized in that The grid structure comprises a plurality of support columns arranged on a side of the substrate facing away from the receiving cavity and a net plate connected to one end of the plurality of support columns away from the substrate, and the pressure signal processing chip is fixed to the net plate.

7. The electronic device of claim 1, wherein, The substrate is provided with at least two mounting holes and at least one ring groove, the ring groove is arranged around the periphery of the substrate, and the two mounting holes communicate the mounting cavity and the ring groove. The pad surface is provided with at least two heat dissipation portions, each of which extends into one of the mounting holes.

8. Electronic device according to claim 7, characterized in that The two mounting holes and the ring groove are located on a side of the substrate away from the receiving cavity.

9. The electronic device of claim 7, wherein the first and second conductive layers are formed of a conductive material selected from the group consisting of silver, gold, copper, aluminum, and combinations thereof. The pad surface is further provided with at least one extension portion, the extension portion is mounted in the ring groove and is connected to the two heat dissipation portions.

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